CN101533819A - 半导体封装构造、应用于半导体封装构造的导线架及导电件 - Google Patents
半导体封装构造、应用于半导体封装构造的导线架及导电件 Download PDFInfo
- Publication number
- CN101533819A CN101533819A CN200810085425A CN200810085425A CN101533819A CN 101533819 A CN101533819 A CN 101533819A CN 200810085425 A CN200810085425 A CN 200810085425A CN 200810085425 A CN200810085425 A CN 200810085425A CN 101533819 A CN101533819 A CN 101533819A
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- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 74
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 72
- 239000004020 conductor Substances 0.000 claims description 33
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 241000252506 Characiformes Species 0.000 description 16
- 239000000463 material Substances 0.000 description 11
- 238000005516 engineering process Methods 0.000 description 8
- 238000004020 luminiscence type Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000011265 semifinished product Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
Claims (15)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008100854251A CN101533819B (zh) | 2008-03-14 | 2008-03-14 | 半导体封装构造、应用于半导体封装构造的导线架及导电件 |
US12/213,217 US20090230421A1 (en) | 2008-03-14 | 2008-06-17 | Semiconductor package structure, lead frame and conductive assembly for the same |
JP2008176824A JP2009224752A (ja) | 2008-03-14 | 2008-07-07 | 半導体パッケージ構造と、これのためのリードフレーム及び伝導性組立品 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008100854251A CN101533819B (zh) | 2008-03-14 | 2008-03-14 | 半导体封装构造、应用于半导体封装构造的导线架及导电件 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101533819A true CN101533819A (zh) | 2009-09-16 |
CN101533819B CN101533819B (zh) | 2013-01-16 |
Family
ID=41062051
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008100854251A Active CN101533819B (zh) | 2008-03-14 | 2008-03-14 | 半导体封装构造、应用于半导体封装构造的导线架及导电件 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20090230421A1 (zh) |
JP (1) | JP2009224752A (zh) |
CN (1) | CN101533819B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102938439A (zh) * | 2011-08-15 | 2013-02-20 | 苏州君耀光电有限公司 | 一种食人鱼led |
CN109524529A (zh) * | 2018-11-28 | 2019-03-26 | 佛山科学技术学院 | 一种led结构及其应用 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3214662B1 (en) * | 2010-01-29 | 2018-09-26 | Japan Aviation Electronics Industry, Ltd. | Light-emitting apparatus |
CN101820045B (zh) * | 2010-04-09 | 2014-02-05 | 江苏伯乐达光电科技有限公司 | Led的封装支架、led封装方法及利用该方法制作的led |
CN103201863B (zh) | 2010-11-19 | 2016-04-13 | 皇家飞利浦电子股份有限公司 | 用于发光器件的岛状载体 |
DE102012216956A1 (de) * | 2012-09-21 | 2014-03-27 | Osram Gmbh | Leadframe für eine Leuchtvorrichtung |
CN103280515B (zh) * | 2013-05-27 | 2016-01-13 | 广东深莱特科技股份有限公司 | 具有分散电极引线周边应力的led封装器件及其制造方法 |
JP6487626B2 (ja) * | 2014-03-24 | 2019-03-20 | スタンレー電気株式会社 | 半導体装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH081354Y2 (ja) * | 1990-01-31 | 1996-01-17 | 株式会社藤井合金製作所 | 配管端末接続構造 |
TW498561B (en) * | 2000-05-04 | 2002-08-11 | Mu-Jin You | Light emitting diode, manufacturing method and metal substrate for the same |
US6476549B2 (en) * | 2000-10-26 | 2002-11-05 | Mu-Chin Yu | Light emitting diode with improved heat dissipation |
JP2002314143A (ja) * | 2001-04-09 | 2002-10-25 | Toshiba Corp | 発光装置 |
TW594950B (en) * | 2003-03-18 | 2004-06-21 | United Epitaxy Co Ltd | Light emitting diode and package scheme and method thereof |
JP2006086178A (ja) * | 2004-09-14 | 2006-03-30 | Toshiba Corp | 樹脂封止型光半導体装置 |
CN2831425Y (zh) * | 2005-07-01 | 2006-10-25 | 光宝科技股份有限公司 | 一种半导体封装结构 |
US20070096133A1 (en) * | 2005-11-02 | 2007-05-03 | Lee Kian S | System and method for LED manufacturing |
JP4942331B2 (ja) * | 2005-11-25 | 2012-05-30 | スタンレー電気株式会社 | 半導体発光装置 |
JP5091421B2 (ja) * | 2006-04-07 | 2012-12-05 | 株式会社東芝 | 半導体発光装置 |
-
2008
- 2008-03-14 CN CN2008100854251A patent/CN101533819B/zh active Active
- 2008-06-17 US US12/213,217 patent/US20090230421A1/en not_active Abandoned
- 2008-07-07 JP JP2008176824A patent/JP2009224752A/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102938439A (zh) * | 2011-08-15 | 2013-02-20 | 苏州君耀光电有限公司 | 一种食人鱼led |
CN109524529A (zh) * | 2018-11-28 | 2019-03-26 | 佛山科学技术学院 | 一种led结构及其应用 |
Also Published As
Publication number | Publication date |
---|---|
CN101533819B (zh) | 2013-01-16 |
US20090230421A1 (en) | 2009-09-17 |
JP2009224752A (ja) | 2009-10-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: GUANGBAO ELECTRIC UANGZHOU) CO., LTD. Free format text: FORMER NAME: SILITEK ELECTRONIC (GUANGZHOU) CO., LTD. |
|
CP03 | Change of name, title or address |
Address after: 510663 Guangzhou science and Technology Development Zone, Guangzhou City, Guangdong Province Science City West Road, No. 25 Patentee after: Lite-On Electronic (Guangzhou) Co., Ltd. Patentee after: Lite-On Technology Corporation Address before: 510663 Guangzhou science and Technology Development Zone, Guangdong high tech Industrial Zone, No. 25 West spectrum Patentee before: Xuli Electronics (Guangzhou) Co., Ltd. Patentee before: Lite-On Technology Corporation |
|
ASS | Succession or assignment of patent right |
Owner name: LITE-ON TECHNOLOGY (CHANGZHOU) CO., LTD. Free format text: FORMER OWNER: GUANGBAO ELECTRIC UANGZHOU) CO., LTD. Effective date: 20131212 Owner name: GUANGBAO ELECTRIC UANGZHOU) CO., LTD. GUANGBAO SC Free format text: FORMER OWNER: GUANGBAO SCIENCE + TECHNOLOGY CO., LTD. Effective date: 20131212 |
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C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 510663 GUANGZHOU, GUANGDONG PROVINCE TO: 213166 CHANGZHOU, JIANGSU PROVINCE |
|
TR01 | Transfer of patent right |
Effective date of registration: 20131212 Address after: 213166 Wujin high tech Industrial Development Zone, Jiangsu Province, Yang Lake Road, No. 88 Patentee after: LITE-ON TECHNOLOGY (CHANGZHOU) CO., LTD. Patentee after: Lite-On Electronic (Guangzhou) Co., Ltd. Patentee after: Lite-On Technology Corporation Address before: 510663 Guangzhou science and Technology Development Zone, Guangzhou City, Guangdong Province Science City West Road, No. 25 Patentee before: Lite-On Electronic (Guangzhou) Co., Ltd. Patentee before: Lite-On Technology Corporation |