CN101514806A - 路灯用led发光单元 - Google Patents
路灯用led发光单元 Download PDFInfo
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- CN101514806A CN101514806A CNA2009101056906A CN200910105690A CN101514806A CN 101514806 A CN101514806 A CN 101514806A CN A2009101056906 A CNA2009101056906 A CN A2009101056906A CN 200910105690 A CN200910105690 A CN 200910105690A CN 101514806 A CN101514806 A CN 101514806A
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- colloidal silica
- luminescent wafer
- led light
- led
- emitting unit
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 35
- 239000008119 colloidal silica Substances 0.000 claims abstract description 30
- 239000000463 material Substances 0.000 claims abstract description 11
- 238000002347 injection Methods 0.000 claims description 5
- 239000007924 injection Substances 0.000 claims description 5
- 239000000741 silica gel Substances 0.000 claims description 5
- 229910002027 silica gel Inorganic materials 0.000 claims description 5
- 230000000694 effects Effects 0.000 claims description 4
- 235000017060 Arachis glabrata Nutrition 0.000 claims description 3
- 241001553178 Arachis glabrata Species 0.000 claims description 3
- 235000010777 Arachis hypogaea Nutrition 0.000 claims description 3
- 235000018262 Arachis monticola Nutrition 0.000 claims description 3
- 235000020232 peanut Nutrition 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000005266 casting Methods 0.000 abstract 1
- 238000004020 luminiscence type Methods 0.000 description 14
- 238000009826 distribution Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 229920005439 Perspex® Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 235000019504 cigarettes Nutrition 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
- G02B19/0028—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed refractive and reflective surfaces, e.g. non-imaging catadioptric systems
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
- G02B19/0061—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
- F21W2131/10—Outdoor lighting
- F21W2131/103—Outdoor lighting of streets or roads
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
一种路灯用LED发光单元,包括支架和设置在支架一侧的LED发光晶片;在所述LED发光晶片所在的支架一侧设置有由硅胶材料压注而成的硅胶体,所述硅胶体包覆所述LED发光晶片且与所述支架结合为一体,该硅胶体沿其长度方向的两端向该硅胶体中部位置逐渐平滑凹陷形成中部低、两端高且沿该硅胶体的中部位置对称分布的长条形曲面,在所述长条形曲面作用下,所述LED发光晶片所发出光线转化为长方形或椭圆型的光斑。本发明能实现自动化生产,且具有出光效率高、节约能源等优点。
Description
技术领域
本发明涉及一种路灯用部件,尤其是一种用于路灯的LED发光单元。
背景技术
传统路灯用LED发光单元包括支架和设置在所述支架一侧且由透明塑胶材料制成的透明罩体,在所述支架和透明罩体内设置有LED发光晶片,透明罩体通过注胶的方式与所述支架连接;在使用时,通常要在LED发光单元外侧配置一个透镜,对LED发光单元进行二次配光,以满足道路照明的要求。
上述传统路灯用LED发光单元,虽然经过二次配光,能满足道路照明的要求,但这种结构形式的LED发光单元与透镜存在间隙,且LED发光单元与透镜之间存在多个界面层,在光束传输过程中,能量损失较大,出光效率低,且由于透明塑胶罩体耐热性差,在加工过程中,无法过回流焊,加工效率很低。因此,有必要对该种结构形式的路灯用LED发光单元进行改进。
发明内容
本发明要解决的技术问题是提供一种路灯用LED发光单元,该路灯用LED发光单元不需经透镜二次配光,就能满足道路照明的要求且出光效率高、节约能源。
为解决上述技术问题,本发明采用下述技术方案:该路灯用LED发光单元包括支架和设置在支架一侧的LED发光晶片,在所述LED发光晶片所在的支架一侧设置有由硅胶材料压注而成的硅胶体,所述硅胶体包覆所述LED发光晶片且与所述支架结合为一体,该硅胶体沿其长度方向的两端向该硅胶体中部位置逐渐平滑凹陷形成中部低、两端高且沿该硅胶体的中部位置对称分布的长条形曲面,在所述长条形曲面作用下,所述LED发光晶片所发出光线转化为长方形或椭圆型的光斑。
根据本发明的设计构思,在靠近所述支架的中部位置设置有安装孔,在该安装孔中固定设置有用以向大气中散发LED发光晶片所发热量的散热块,所述LED发光晶片设置在所述散热块的侧面处。
根据本发明的设计构思,所述长条形曲面呈花生壳体状。
根据本发明的设计构思,在LED发光晶片外表面还均匀的涂敷有荧光材料。
与现有技术相比,本发明具有下述有益效果:(1)由于本发明在支架上压注形成有硅胶体,该硅胶体与所述LED发光单元的支架压注为一体,其加工工艺简单,且硅胶可过回流焊,实现自动化生产,从而提高了LED发光单元的生产效率;(2)由于该硅胶体包覆LED发光晶片,LED发光晶片与硅胶体之间没有间隙,因此,在LED发光晶片所发出的光线在传输过程中,不会因存在多个界面层,而造成能量损失,具有出光效率高、节约能源等优点;且该硅胶体表面为长条形曲面,该长条形曲面的硅胶体不需经过二次配光,就能直接把LED发光晶片所发出光线转化为长方形或椭圆型的光斑,进而满足道路照明的要求;(3)由于本发明还设置有散热块,LED发光晶片所发出的热量经该散热块可散发到空气中,防止了由于LED发光晶片温度过高容易损坏现象的发生,进而提高了LED发光单元的使用寿命;(4)由于在LED发光晶片外表面还均匀的涂敷有荧光材料,因此,该LED发光单元发光比较均匀柔和。
附图说明
图1为本发明的立体结构示意图;
图2为本发明的俯视结构示意图;
图3为图2的A-A阶梯剖视结构示意图。
具体实施方式
参见图1,本发明的路灯用LED发光单元,包括支架1、LED发光晶片2(图3示出);其中;在所述LED发光晶片2所在的支架1一侧设置有由硅胶材料压注而成的硅胶体3,在LED发光晶片2外表面均匀的涂敷有荧光材料,该荧光材料优选荧光粉。
所述硅胶体3为一个实体,硅胶体3包覆所述LED发光晶片2且与所述支架1结合为一体;这样,在加工LED发光单元时,由于硅胶可过回流焊,因此其在加工过程中,可实现自动化生产,提高了LED发光单元的生产效率。
参见图2和图3,在靠近所述支架1的中部位置设置有安装孔,在该安装孔中固定设置有散热块4,所述LED发光晶片2设置在散热块4的侧面处;其中,该散热块4用以向大气中扩散LED发光晶片2所散发出的热量。
在该散热块4的作用下,LED发光晶片2所发出的热量能及时地扩散到空气中,防止了由于LED发光晶片2温度过高容易损坏现象的发生,进而提高了LED发光单元2的使用寿命。
一并参考图1、图2和图3,本发明的硅胶体3在沿其长度方向的两端向该硅胶体3中部位置逐渐平滑凹陷形成中部低、两端高的长条形曲面,该长条形曲面烟该沿该硅胶体3的中部位置对称设置,即该硅胶体3大致呈花生壳体状;在所述长条形曲面作用下,所述LED发光晶片2所发出光线转化为长方形或椭圆型的光斑。
由于长条形曲面的硅胶体3能把LED发光晶片2所发出光线转化为长方形或椭圆型的光斑;因此,其在使用过程中,不需经过二次配光,就能满足道路照明的要求;结构简单,成本较低。
Claims (4)
1.一种路灯用LED发光单元,包括支架和设置在支架一侧的LED发光晶片;其特征在于,在所述LED发光晶片所在的支架一侧设置有由硅胶材料压注而成的硅胶体,所述硅胶体包覆所述LED发光晶片且与所述支架结合为一体,该硅胶体沿其长度方向的两端向该硅胶体中部位置逐渐平滑凹陷形成中部低、两端高且沿该硅胶体的中部位置对称分布的长条形曲面,在所述长条形曲面作用下,所述LED发光晶片所发出光线转化为长方形或椭圆型的光斑。
2.如权利要求1所述的路灯用LED发光单元,其特征在于,在靠近所述支架的中部位置设置有安装孔,在该安装孔中固定设置有用以向大气中散发LED发光晶片所发热量的散热块,所述LED发光晶片设置在所述散热块的侧面处。
3.如权利要求1或2所述的路灯用LED发光单元,其特征在于,所述长条形曲面呈花生壳体状。
4.如权利要求3所述的路灯用LED发光单元,其特征在于,在LED发光晶片外表面还均匀的涂敷有荧光材料。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNA2009101056906A CN101514806A (zh) | 2009-03-04 | 2009-03-04 | 路灯用led发光单元 |
PCT/CN2009/072151 WO2010099675A1 (zh) | 2009-03-04 | 2009-06-05 | 路灯用led发光单元 |
CN2009901005965U CN202084571U (zh) | 2009-03-04 | 2009-06-05 | 路灯用led发光单元 |
AU2010100192A AU2010100192A4 (en) | 2009-03-04 | 2010-03-03 | LED light module for street lamp and method of manufacturing same |
JP2010001338U JP3159471U (ja) | 2009-03-04 | 2010-03-03 | 街路灯用のled発光ユニット |
EP10002167.4A EP2226553A3 (en) | 2009-03-04 | 2010-03-03 | LED light module for street lamp and method of manufacturing same |
US12/717,087 US8293548B2 (en) | 2009-03-04 | 2010-03-03 | LED light module for street lamp and method of manufacturing same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNA2009101056906A CN101514806A (zh) | 2009-03-04 | 2009-03-04 | 路灯用led发光单元 |
Publications (1)
Publication Number | Publication Date |
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CN101514806A true CN101514806A (zh) | 2009-08-26 |
Family
ID=41039365
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNA2009101056906A Pending CN101514806A (zh) | 2009-03-04 | 2009-03-04 | 路灯用led发光单元 |
CN2009901005965U Expired - Lifetime CN202084571U (zh) | 2009-03-04 | 2009-06-05 | 路灯用led发光单元 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
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CN2009901005965U Expired - Lifetime CN202084571U (zh) | 2009-03-04 | 2009-06-05 | 路灯用led发光单元 |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP2226553A3 (zh) |
JP (1) | JP3159471U (zh) |
CN (2) | CN101514806A (zh) |
AU (1) | AU2010100192A4 (zh) |
WO (1) | WO2010099675A1 (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103782402A (zh) * | 2011-07-21 | 2014-05-07 | 克利公司 | 用于改进的化学抗性的发光体器件封装、部件和方法、以及相关方法 |
CN107546309A (zh) * | 2016-06-24 | 2018-01-05 | 东贝光电科技股份有限公司 | 具矩形光型的一次光学发光源 |
US10686107B2 (en) | 2011-07-21 | 2020-06-16 | Cree, Inc. | Light emitter devices and components with improved chemical resistance and related methods |
US11563156B2 (en) | 2011-07-21 | 2023-01-24 | Creeled, Inc. | Light emitting devices and components having improved chemical resistance and related methods |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2975656A1 (en) * | 2014-07-16 | 2016-01-20 | Lumenmax Optoelectronics Co., Ltd. | An emitting device of wide-angle led |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004042561A1 (de) * | 2004-07-20 | 2006-02-16 | Osram Opto Semiconductors Gmbh | Optisches Element |
US7452737B2 (en) * | 2004-11-15 | 2008-11-18 | Philips Lumileds Lighting Company, Llc | Molded lens over LED die |
US7674018B2 (en) * | 2006-02-27 | 2010-03-09 | Illumination Management Solutions Inc. | LED device for wide beam generation |
RU2456503C2 (ru) * | 2007-04-05 | 2012-07-20 | Конинклейке Филипс Электроникс Н.В. | Формирователь светового луча |
CN100583473C (zh) * | 2007-07-27 | 2010-01-20 | 李氏工业有限公司 | Led晶片封装方法 |
CN100563035C (zh) * | 2007-09-29 | 2009-11-25 | 鹤山丽得电子实业有限公司 | 一种大功率led的封装工艺 |
CN201100597Y (zh) * | 2007-11-22 | 2008-08-13 | 广州市鸿利光电子有限公司 | 一种贴片式led灯 |
CN201184556Y (zh) * | 2008-01-17 | 2009-01-21 | 宁波燎原灯具股份有限公司 | Led路灯配光*** |
CN101334147A (zh) * | 2008-07-07 | 2008-12-31 | 曾庆雯 | 贴片式双向发光角度并可产生矩形光斑的led |
CN101373048B (zh) * | 2008-08-05 | 2010-08-25 | 安徽泽润光电有限公司 | 一种led光源结构 |
-
2009
- 2009-03-04 CN CNA2009101056906A patent/CN101514806A/zh active Pending
- 2009-06-05 CN CN2009901005965U patent/CN202084571U/zh not_active Expired - Lifetime
- 2009-06-05 WO PCT/CN2009/072151 patent/WO2010099675A1/zh active Application Filing
-
2010
- 2010-03-03 EP EP10002167.4A patent/EP2226553A3/en not_active Withdrawn
- 2010-03-03 JP JP2010001338U patent/JP3159471U/ja not_active Expired - Fee Related
- 2010-03-03 AU AU2010100192A patent/AU2010100192A4/en not_active Expired
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103782402A (zh) * | 2011-07-21 | 2014-05-07 | 克利公司 | 用于改进的化学抗性的发光体器件封装、部件和方法、以及相关方法 |
US10490712B2 (en) | 2011-07-21 | 2019-11-26 | Cree, Inc. | Light emitter device packages, components, and methods for improved chemical resistance and related methods |
US10686107B2 (en) | 2011-07-21 | 2020-06-16 | Cree, Inc. | Light emitter devices and components with improved chemical resistance and related methods |
US11563156B2 (en) | 2011-07-21 | 2023-01-24 | Creeled, Inc. | Light emitting devices and components having improved chemical resistance and related methods |
CN107546309A (zh) * | 2016-06-24 | 2018-01-05 | 东贝光电科技股份有限公司 | 具矩形光型的一次光学发光源 |
Also Published As
Publication number | Publication date |
---|---|
WO2010099675A1 (zh) | 2010-09-10 |
EP2226553A2 (en) | 2010-09-08 |
JP3159471U (ja) | 2010-05-20 |
CN202084571U (zh) | 2011-12-21 |
AU2010100192A4 (en) | 2010-04-08 |
EP2226553A3 (en) | 2014-01-08 |
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