CN101499747A - Cooling apparatus for semi-conductor thermo-electric generation module - Google Patents
Cooling apparatus for semi-conductor thermo-electric generation module Download PDFInfo
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- CN101499747A CN101499747A CNA2008101720269A CN200810172026A CN101499747A CN 101499747 A CN101499747 A CN 101499747A CN A2008101720269 A CNA2008101720269 A CN A2008101720269A CN 200810172026 A CN200810172026 A CN 200810172026A CN 101499747 A CN101499747 A CN 101499747A
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- radiator
- generation module
- condenser
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- electric generation
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Abstract
The invention discloses a cooling device which is used for a semiconductor temperature difference power generation module and has high efficiency, comprising a radiator and a condenser which are communicated with each other and made of metal; the radiator is arranged on the cold end surface of the semiconductor temperature difference power generation module; the installation position of the condenser is higher than that of the radiator; the chamber of the radiator is internally filled with cooling liquid; by utilizing the characteristic that the phase change latent heat of the liquid is large, more heat can be absorbed from the cold end surface of the semiconductor temperature difference power generation module and the temperature difference of the cold end surface and the hot end surface of the semiconductor temperature difference power generation module can be improved further, thus gaining better power generation effect by utilizing the residual heat; simultaneously, the cooling liquid flows circularly, requires no power, has no medium loss and medium leakage, saves the energy and protects the environment.
Description
Technical field
The present invention relates to a kind of cooling device, particularly a kind of cooling device that is used for semi-conductor thermo-electric generation module.
Background technology
Along with the development of Domestic Automotive Industry, the fuel amount that vehicle consumes is huge, but about 60% energy is not effectively used in the fuel oil, and the overwhelming majority is discharged in the atmosphere with the form of used heat, has caused the waste and the environmental pollution of fuel oil.The existing at present semiconductor thermo-electric generation apparatus that is directed to the using waste heat from tail gas of internal combustion engine recovery invents, the thermoelectric effect of utilizing the solid semiconductor material is carried out the principle of thermo-electric generation and the engine exhaust heat designed reclaims temperature difference electricity generation device, the quality of its effect is decided by the temperature difference of semi-conductor thermo-electric generation module both sides, the temperature difference is big more, and its utilization rate of waste heat is high more, effect is good more.
Summary of the invention
The purpose of this invention is to provide a kind of cooling device that is used for semi-conductor thermo-electric generation module, being intended to provides a kind of cooling system more efficiently to the exhaust gases of internal combustion engines semiconductor thermoelectric generating system for recycling waste heat.
The objective of the invention is to be achieved through the following technical solutions:
A kind of cooling device that is used for semi-conductor thermo-electric generation module, comprise the metal radiator and the condenser that are interconnected, radiator is installed in the cold junction face of semi-conductor thermo-electric generation module, and the condenser installation site is higher than radiator, is filled with cooling fluid in the cavity of radiator.
Further described cooling fluid boiling point is lower than 100 ℃.
The top of further described radiator and condenser overhead, radiator bottom and condenser bottom are communicated with.
The further described radiator and the condenser outside all are covered with thin fin.
Further described radiator and condenser radiator and condenser internal cavities are cuboid.
The invention has the beneficial effects as follows that the cooling liquid boiling point in the radiator is lower, utilizes the bigger characteristics of liquid phase-change latent heat, radiator can absorb more heat from the cold junction face of semi-conductor thermo-electric generation module; Steam after the evaporation does not just dispel the heat in radiator, more is to enter into to be condensed into liquid behind the condenser and to dispel the heat, and has overcome the problem of radiator because of area, volume restrictions heat-sinking capability deficiency; Liquid circulation flows, and need not power, no dielectric loss, leakage, energy-conserving and environment-protective.
Description of drawings
With embodiment the present invention is described in further detail with reference to the accompanying drawings below.
Fig. 1 is a structural representation of the present invention;
Among the figure:
1, radiator; 2, condenser; 3, catheter; 4, wireway; 5,6, thin fin; 7, semi-conductor thermo-electric generation module.
Embodiment
As shown in Figure 1, the cooling device that is used for semi-conductor thermo-electric generation module of the present invention, comprise the radiator 1 and the condenser 2 that are interconnected, radiator 1 is the cuboid that adopts metal material to make, for obtaining better heat-transfer effect, preferably copper and aluminium material, there is rectangular cavity in portion within it, and charges into cooling fluid; Radiator 1 one sides are smooth plane, and this simultaneously is attached on the cold junction face of semi-conductor thermo-electric generation module 7, and opposite side is covered with thin fin 6, in order to the heat exchange area of increase with air; The top of radiator 1 cavity is communicated to the top of condenser 2 by a wireway 4, and the bottom of radiator 1 cavity is communicated to the bottom of condenser 2 by a catheter 3; The structure of condenser 2 is identical with the structure of radiator, and the surface is covered with thin fin 5 and comes enhance heat, and the installation site of condenser 2 can be determined on a case-by-case basis, as long as guarantee to be positioned at the top of radiator 1; Cooling fluid in radiator 1 cavity, be characterized in that boiling point is lower, can evaporate behind the heat that absorption semiconductor module 7 cold junction faces transmit, because evaporation back radiator 1 cavity internal pressure rises, steam relies on the pressure effect to enter the cavity of condenser 2 by wireway 4, because it is liquid with vapor condensation that condenser 2 carries out heat exchange with air, liquid flow back in the radiator 1 along the catheter of opening in condenser 2 cavity bottom 3 owing to the action of gravity meeting, liquid is reuptaked heat again and is evaporated, and through such circulation heat all is dispersed in the air.
This device utilizes the bigger characteristics of liquid phase-change latent heat, can be from the cold junction face of semi-conductor thermo-electric generation module Absorb more heat, the steam after the evaporation does not just dispel the heat in radiator, more is to enter into condensation Be condensed into liquid behind the device and dispel the heat, it is hypodynamic because of area, volume restrictions heat radiation energy to have overcome radiator Problem; Can further improve the temperature difference of the cold and hot end face of semi-conductor thermo-electric generation module, thereby obtain better Utilize the generating effect of waste heat, liquid circulation flows simultaneously, need not power, no dielectric loss, leakage, Energy-conserving and environment-protective.
Claims (5)
1, a kind of cooling device that is used for semi-conductor thermo-electric generation module, it is characterized in that comprising the metal radiator and the condenser that are interconnected, radiator is installed in the cold junction face of semi-conductor thermo-electric generation module, and the condenser installation site is higher than radiator, is filled with cooling fluid in the cavity of radiator.
2, the cooling device that is used for semi-conductor thermo-electric generation module according to claim 1 is characterized in that described cooling fluid boiling point is lower than 100 ℃.
3, the cooling device that is used for semi-conductor thermo-electric generation module according to claim 1 is characterized in that the top of described radiator and condenser overhead, radiator bottom and condenser bottom are communicated with.
4, the cooling device that is used for semi-conductor thermo-electric generation module according to claim 1 is characterized in that described radiator and the condenser outside all is covered with thin fin.
5, be used for the cooling device of semi-conductor thermo-electric generation module according to described any of claim 1 to 4, it is characterized in that described radiator and condenser internal cavities are cuboid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008101720269A CN101499747A (en) | 2008-10-28 | 2008-10-28 | Cooling apparatus for semi-conductor thermo-electric generation module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008101720269A CN101499747A (en) | 2008-10-28 | 2008-10-28 | Cooling apparatus for semi-conductor thermo-electric generation module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101499747A true CN101499747A (en) | 2009-08-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008101720269A Pending CN101499747A (en) | 2008-10-28 | 2008-10-28 | Cooling apparatus for semi-conductor thermo-electric generation module |
Country Status (1)
| Country | Link |
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| CN (1) | CN101499747A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102200344A (en) * | 2011-04-09 | 2011-09-28 | 王海波 | System and method for realizing cogeneration of heat conduction oil furnace by using semiconductor power generation device |
| CN103677188A (en) * | 2013-12-29 | 2014-03-26 | 苏州市峰之火数码科技有限公司 | Self-power-generation cooling type host case |
| CN111534674A (en) * | 2020-03-25 | 2020-08-14 | 佛山津西金兰冷轧板有限公司 | Annealing hydrogen processing system |
| CN114337375A (en) * | 2021-12-22 | 2022-04-12 | 北京化工大学 | Passive radiator, thermoelectric power generation device and thermoelectric power generation system |
-
2008
- 2008-10-28 CN CNA2008101720269A patent/CN101499747A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102200344A (en) * | 2011-04-09 | 2011-09-28 | 王海波 | System and method for realizing cogeneration of heat conduction oil furnace by using semiconductor power generation device |
| CN103677188A (en) * | 2013-12-29 | 2014-03-26 | 苏州市峰之火数码科技有限公司 | Self-power-generation cooling type host case |
| CN111534674A (en) * | 2020-03-25 | 2020-08-14 | 佛山津西金兰冷轧板有限公司 | Annealing hydrogen processing system |
| CN114337375A (en) * | 2021-12-22 | 2022-04-12 | 北京化工大学 | Passive radiator, thermoelectric power generation device and thermoelectric power generation system |
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Application publication date: 20090805 |