CN101490423B - Systems and methods for managing fluids using a liquid ring pump - Google Patents

Systems and methods for managing fluids using a liquid ring pump Download PDF

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Publication number
CN101490423B
CN101490423B CN2007800269340A CN200780026934A CN101490423B CN 101490423 B CN101490423 B CN 101490423B CN 2007800269340 A CN2007800269340 A CN 2007800269340A CN 200780026934 A CN200780026934 A CN 200780026934A CN 101490423 B CN101490423 B CN 101490423B
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fluid
chemical
concentration
mixing machine
liquid ring
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CN101490423A (en
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K·J·厄克特
G·瓜尔内利
J-L·马克
N·方雅
L·兰格里尔
C·科林
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LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude
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LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude
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Abstract

The invention relates to methods and systems for chemical management. In one embodiment, a blender is coupled to a processing system and configured to supply an appropriate solution or solutions to the system. Solutions provided by the blender are then reclaimed from the system and subsequently reintroduced for reuse. The blender may be operated to control the concentrations of various constituents in the solution prior to the solution being reintroduced to the system for reuse. Some chemicals introduced to the system may be temperature controlled. A back end vacuum pump subsystem separates gases from liquids as part of a waste management system.

Description

Use the system and method for liquid ring pump management fluid
Technical field
The present invention relates in processing environment, for example semiconductor fabrication environment, be used to manage the method and system of chemical product.
Background technique
In various industry, chemical delivery system is used to processing equipment supplying chemical product.Example industry comprises semi-conductor industry, pharmaceuticals industry, biomedical industries, food processing industry, household products industry, personal care product industry, petroleum industry etc.
Yes depends on performed detailed process, and chemical product is carried by given chemical delivery system.Therefore, the concrete chemical product to the semiconductor processing equipment supply depends on technology performed to wafer in equipment.The semiconductor technology of example comprises etching, cleaning, chemically mechanical polishing (CMP) and wet deposition (for example chemical vapor deposition, plating etc.).
Usually, two or more combination of fluids are formed the required solution of detailed process.This solution mixture can be prepared outward at the scene, is transported to the impact point/final position of given process then or uses point.This method is commonly referred to as batch processing or batches.As an alternative and ground preferably, the cleaning solution mixture was using point with suitable mixer or the preparation of mixing machine system before carrying to cleaning process.A kind of method in back is known as continuous blending sometimes.
No matter which kind of situation all is very important by the accurate mixing of the reagent of predetermined ratio, because the variation meeting of chemical concentration produces harmful effect to technology capability.For example, the chemical product of normality can not keep to(for) etch process can cause rate of etch uncertain, is the root of process reform therefore.
But in current processing environment, mixing only is one of them aspect that must be controlled with a lot of aspects that realize the treatment desired result.For example, except mixing, may wish or need the removal of chemical product in the control processing environment.Also may wish or need the temperature of the chemical solution of different phase in the control processing environment.At present, chemical management system can not be controlled a plurality of procedure parameters fully for certain application.
Therefore, need be used for managing the method and system of Chemical Regulation and supply at processing environment.
Summary of the invention
An embodiment provides a kind of vacuum pump system, comprising: with the vacuum pipeline of at least one fluid coupled in a plurality of fluid outputs of processing station; Liquid ring pump, it has the suction port that connects with vacuum pipeline, to receive the input multiphase flow that forms from one or more fluids of described a plurality of fluid outputs discharges; The jar that connects with the exhaust port of liquid ring pump, this jar comprise the one or more devices that are configured for removing through the multiphase flow of exhaust port output from liquid ring pump liquid; And be arranged on control pressurer system in the vacuum pipeline of liquid ring pump upstream, wherein, described control pressurer system is configured to keep goal pressure in the vacuum pipeline according to the required pressure in the processing station.
Another embodiment provides a kind of vacuum pump system, comprising: with the vacuum pipeline of at least one fluid coupled in a plurality of fluid outputs of processing station; Liquid ring pump, it has the suction port that connects with vacuum pipeline, to receive the input multiphase flow that forms from one or more fluids of described a plurality of fluid outputs discharges; The jar that connects with the exhaust port of liquid ring pump, this jar comprise the one or more devices that are configured for removing through the multiphase flow of exhaust port output from liquid ring pump liquid; And coolant source, this coolant source was used for injecting cooling fluid to this multiphase flow before the input multiphase flow enters liquid ring pump, and the temperature of described cooling fluid is enough to make liquid to coagulate from multiphase flow.
Another embodiment provides a kind of vacuum pump system, comprising: with the vacuum pipeline of at least one fluid coupled in a plurality of fluid outputs of processing station; Liquid ring pump, it has the suction port that connects with vacuum pipeline, to receive the input multiphase flow that forms from one or more fluids of described a plurality of fluid outputs discharges; The jar that connects with the exhaust port of liquid ring pump, this jar comprise the one or more devices that are configured for removing through the multiphase flow of exhaust port output from liquid ring pump liquid; And chemical concentrations control system.This chemical concentrations control system is configured to: in monitoring is contained in jar and to the fluid-encapsulated concentration of liquid ring pump supply with the operation that is used for liquid ring pump; And optionally regulate fluid-encapsulated concentration.
An embodiment provides a kind of vacuum pump system again, comprising: with the vacuum pipeline of at least one fluid coupled in a plurality of fluid outputs of processing station; Liquid ring pump, it has the suction port that connects with vacuum pipeline, to receive the input multiphase flow that forms from one or more fluids of described a plurality of fluid outputs discharges; The jar that connects with the exhaust port of liquid ring pump, this jar comprises the one or more devices that are configured for removing liquid from the multiphase flow of liquid ring pump output; Be arranged on the control pressurer system in the vacuum pipeline of liquid ring pump upstream, wherein, this control pressurer system is configured to keep goal pressure in the vacuum pipeline according to the required pressure in the processing station; And chemical concentrations control system.This chemical concentrations control system is configured to: in monitoring is contained in jar and to the fluid-encapsulated concentration of liquid ring pump supply with the operation that is used for liquid ring pump; And optionally regulate fluid-encapsulated concentration.This system also is included in the input multiphase flow and enters the coolant source that liquid ring pump is used for injecting to this multiphase flow freezing mixture before, and the temperature of described freezing mixture is enough to make liquid to coagulate from multiphase flow.
Another embodiment provides a kind of processing system, comprise: chemical mixing machine, its be configured to by operate flow control unit optionally with alternately be connected to the fluid input relevant with first and second processing station, make when chemical mixing machine is connected to the first fluid inlet relevant with first processing station, the chemistry mixing machine disconnects with second fluid input relevant with second processing station, and vice versa; A plurality of fluid outputs of processing station; And vacuum pump system, this vacuum pump system is via at least one fluid coupled at least one vacuum pipeline and the described a plurality of fluid output.This vacuum pump system comprises: liquid ring pump, and it has the suction port that connects with vacuum pipeline, to receive the input multiphase flow that forms from one or more fluids of described a plurality of fluid outputs discharges; And the jar that connects with the exhaust port of liquid ring pump, this jar comprises the one or more devices that are configured for removing through the multiphase flow of exhaust port output from liquid ring pump liquid.
Description of drawings
In order further to understand essence of the present invention and purpose, with reference to the detailed description of doing below in conjunction with accompanying drawing, wherein, the same or analogous reference character of like, in the accompanying drawings:
Fig. 1 is the schematic diagram that the processing system of on-board components is shown according to an embodiment of the invention.
Fig. 2 is the schematic diagram of the processing system that airborne and non-on-board components are shown according to another embodiment of the present invention.
Fig. 3 is the schematic diagram of semi-conductor manufacturing system according to an embodiment of the invention.
Fig. 4 is the schematic diagram of processing system according to an embodiment of the invention.
Fig. 5 is the schematic block diagram of an exemplary embodiment of semiconductor wafer purging system, described purging system comprises and the cleaner bath of using point process control mixing machine system to link to each other, in cleaning process, described mixing machine system prepares and carries cleaning solution to cleaner bath.
Fig. 6 is the schematic block diagram of exemplary embodiment of the process control mixing machine system of Fig. 5.
Fig. 7 is the schematic diagram with processing system of non-airborne mixing machine according to an embodiment of the invention.
Fig. 8 A is the schematic diagram with processing system of reclaiming system according to an embodiment of the invention.
Fig. 8 B is the schematic diagram with processing system of reclaiming system according to an embodiment of the invention.
Fig. 8 C is the schematic diagram with processing system of reclaiming system according to an embodiment of the invention.
Fig. 9 is the schematic diagram of vacuum pump system according to an embodiment of the invention.
Embodiment
Embodiments of the invention have provided the method and the chemical management system of the each side that is used to control FLUID TRANSPORTATION and/or recovery.
System survey
Fig. 1 shows an embodiment of processing system 100.Usually, this processing system 100 comprises process chamber 102 and chemical management system 103.According to an embodiment, chemical management system 103 comprises input subsystem 104 and output subsystem 106.It is contemplated that the parts of any amount of subtense angle 104,106 can be airborne or non-airborne with respect to process chamber 102.In this article, " airborne " refers to that subtense angle (or its parts) is integrated with process chamber 102 in Fab (clean room environment), and be perhaps more generally integrated as wherein a part of processing equipment (tool) with process chamber 102; And " non-airborne " refers to that subtense angle (or its parts) separates and the setting that stands away with process chamber 102 (or usually being equipment).In system shown in Figure 1 100, subtense angle 104,106 all is airborne, thereby system 100 forms a kind of integrated system that can be arranged on fully among the Fab.Correspondingly, process chamber 102 and subtense angle 104,106 can be assemblied on the shared framework.For the ease of cleaning, maintenance and the system reform, subtense angle can be arranged on dismountable for example subframe by castor (caster) supporting, thereby subtense angle can easily leave from process chamber 102 disengagements and rolling.
As example, input subsystem 104 comprises that fluid is connected to the mixing machine 108 and the vaporizer 110 of an inlet flow control system 112.Usually, mixing machine 108 is configured to two or more compounds (fluid) are mixed the required chemical solution of formation, then this chemical solution is supplied with inlet flow control system 112.Vaporizer 110 is configured to make the fluid after fluid vaporization also will be vaporized to supply with inlet flow control system 112.For example, vaporizer 110 isopropanol of can vaporizing, the fluid after will vaporizing then and gas carrier for example nitrogen mix.Inlet flow control system 112 is configured to the fluid of required flow rate after process chamber 102 distributes chemical solution and/or vaporization.For this reason, inlet flow control system 112 is connected to process chamber 102A by many intake pipelines 114.In one embodiment, process chamber 102A is constructed with single processing station 124, wherein can carry out one or more processes to the wafer that is positioned at this station 124.Correspondingly, described many intake pipelines 114 provide the required suitable chemical product (being supplied via inlet flow control system 112 by mixing machine 108) of 124 execution particular procedures at the station.In one embodiment, standing 124 can be to bathe (bath),, comprises the container of chemical solution that is, wafer is immersed in this container shifts out after a period of time.But more generally, standing 124 can be any environment, wherein one or more surfaces of wafer is exposed in one or more fluids by 114 supplies of many intake pipelines.In addition, although be appreciated that shown in Fig. 1 to be single processing station, process chamber 102A can comprise the processing station of any amount, and this will be below with reference to figure 2 explanation in further detail.
As example, output subsystem 106 comprises output stream control system 116, vacuum tank subtense angle 118 and vacuum pump subtense angle 120.Many export pipeline 122 arrives output stream control system 116 with process chamber 102A fluid coupled.Like this, fluid is discharged from process chamber 102A via described many export pipelines 122.The fluid of discharging subsequently can be via flowline 117 by earial drainage or be transported to vacuum tank subtense angle 118.In one embodiment, vacuum pump subtense angle 120 is discharged and be sent to some fluids from vacuum tank subtense angle 118, to be used for the adjusting (for example neutralization or dilution) as a waste management technology part.
In one embodiment, input subsystem 104 and output subsystem 106 influence a plurality of process control targets individually or collaboratively.For example, can be in each stage monitoring and control solution concentration from mixing machine 108 to process chamber 102A.In another embodiment, output stream control system 116, vacuum tank subtense angle 118 and/or 120 cooperations of vacuum pump subtense angle, the required fluid that is arranged in the wafer surface top of process chamber 102A with control flows.In another embodiment, 120 cooperations of output stream control system 116 and vacuum pump subtense angle to regulate the fluid of discharging from process chamber 102A by output stream control system 116, make the fluid after the adjusting return mixing machine 108 then.These and other embodiment will be described in greater detail below.
In one embodiment, in process chamber 102A and/or near be provided with transfer device (for example automatic), be used for wafer move into, move through with shift out process chamber 102.Process chamber 102A can also be the part of a main equipment, and this will be described below.
In one embodiment, the various controlled members of system 100 are handled by controller 126.Controller 126 can be the device that can send any appropriate of control signal 128 to one or more controlled members of system 100.Controller 126 also can receive a plurality of input signals 130, and these input signals can comprise the solution concentration measured value, liquid level sensor output, temperature transducer output, flowmeter output at diverse location place in the system etc.As example, controller 126 can be the controller based on microprocessor that is used for programmable logic controller (PLC) (PLC) program, to realize different process control, comprises proportional-integral-differential (PID) feedback control among one of them embodiment.A kind of example controller that is suitable for being used in the process control mixing machine system is the PLCSimatic S7-300 system of Siemens company (Georgia).Although controller 126 is depicted as single parts, be appreciated that in fact controller 126 can be that a plurality of control units gather together and are formed for the control system of processing system 100.
As mentioned above, one or more parts of system 100 can be arranged to non-airborne with respect to process chamber 102A (or process chamber 102A is as its a part of entire equipment).Fig. 2 shows a kind of like this processing system 200 of structure, and this system has the non-airborne parts with respect to process chamber 102B.Identical reference character refers to the parts that the front is described about Fig. 1.As example, mixing machine 108, vacuum tank subtense angle 118 and vacuum pump subtense angle 120 are arranged to non-airborne.On the contrary, vaporizer 110, inlet flow control system 112 and output stream control system 116 illustrate into on-board components, and be same as shown in Figure 1.Non-on-board components can be arranged in Fab together or be arranged in sub level Fab with processing equipment (that is, process chamber 102B and any other integrated component that can form processing equipment).Should be appreciated that the structure of system 200 only is exemplary among Fig. 2, other the structure also may with it is contemplated that.For example, it is airborne that system 200 can be configured to make vacuum tank subtense angle 118, and vacuum pump subtense angle 120 right and wrong are airborne.In a word, mixing machine 108, vaporizer 110, inlet flow control subsystem 112, output stream control subsystem 116, vacuum tank subtense angle 118 and vacuum pump subtense angle 120 have constituted chemical according to an embodiment of the invention management system 103.But, should be noted that the chemical management system in conjunction with Fig. 1 and Fig. 2 description only is exemplary.Other embodiment within the scope of the present invention can comprise the difference layout of more less components and/or parts.For example, in an embodiment of chemical management system, do not comprise vaporizer 110.
The system 200 of Fig. 2 also shows the embodiment of multistation process chamber 102B.Correspondingly, Fig. 2 shows and has five stations 204 1-5The process chamber 102B of (individually or be referred to as station 204).More generally, process chamber 102B can have the station (that is one or more stations) of any amount.In one embodiment, can pass through seal arrangement (for example, be arranged between the processing station activatable door) between standing and standing isolates mutually.In one embodiment, isolation mounting is vacuum-tight, thereby processing station can remain in different stress levels.
Each is stood and 204 can be configured to carry out particular procedure on wafer.The process of carrying out is gone up at each station can be different, therefore need the different chemical product of mixing machine 108 via 112 supplies of inlet flow control system.Correspondingly, system 200 comprises a plurality of intake pipeline groups 206 1-5, every group corresponding to a different station.Five intake pipeline groups 206 have been shown in exemplary embodiment shown in Figure 2 1-5, be used for five processing station each.Each intake pipeline set constructor becomes the combination to the suitable chemical product of given station supply.For example, in one embodiment, process chamber 102B be used for before etch process for example and between the cleaning module of clean wafers.In this case, be used for first processing station 204 1Intake pipeline group 206 1Can supply the combination of a kind of SC-1 type solution (comprising the ammonium hydroxide in the deionized water and the mixture of hydrogen peroxide) and deionized water (DIW).Be used for second processing station 204 2Intake pipeline group 206 2But one or more in supplying deionized water (DIW) and the isopropanol (IPA).Be used for the 3rd processing station 204 3Intake pipeline group 206 3But one or more in supplying deionized water, diluted hydrogen fluoride and the isopropanol.Be used for the 4th processing station 204 4Intake pipeline group 206 4But supplying deionized water, known mixed chemical solution, have the special-purpose chemical solution of special properties and in the isopropanol one or more.Be used for the 5th processing station 204 5Intake pipeline group 206 5But one or more in supplying deionized water, SC-2 type solution (the water resulting mixture that comprises hydrogen peroxide and hydrochloric acid) and the isopropanol.With identical in conjunction with the situation of the described system 100 of Fig. 1, standing 204 can be that one or more surfaces with wafer are exposed to any environment by one or more fluids of many intake pipelines 114 supplies.
It is contemplated that the fluid of the intake pipeline (and pipeline among Fig. 1 114) in given group 206 of flowing through can be controlled individually.Correspondingly, flow through given group the time and the flow rate of independent pipeline of fluid can be independently controlled.In addition, when some intake pipelines during to the wafer surface accommodating fluid, other fluid can be supplied on the internal surface of processing station 204 to be used to clean described surface---for example before or after cycle of treatment.In addition, intake pipeline shown in Figure 2 only is exemplary, and other input thing can be from other source supply.
Each processing station 204 1-5Corresponding export pipeline or export pipeline group are all arranged, and fluid is discharged from processing station separately thus.As example, first processing station 204 1Be connected to earial drainage pipeline 208, and second to the 4th shown processing station 204 2-4Via export pipeline group 210 separately 2-4Be connected to output stream control system 116.Each (export pipeline) group is all represented one or more export pipeline.Like this, fluid is discharged from process chamber 102A via many export pipelines 122.From processing station via the export pipeline group 210 that is connected to output stream control system 116 1-4The fluid of discharging can be delivered to vacuum tank subtense angle 118 via many flowline 117.
In one embodiment, in process chamber 102B and/or annex be provided with transfer device (for example automatic), with wafer is moved into, moves through with shift out process chamber 102B.Process chamber 102B can be the part of main equipment also, and this will be described with reference to Fig. 3 below.
Referring now to Fig. 3, wherein show the planimetric map of processing system 300 according to an embodiment of the invention.Processing system 300 comprises the fore-end 302 that is used to receive wafer case.Fore-end 302 with hold the transhipment chamber 304 of transporting automatic 306 and engage.Cleaning module 308,310 is arranged on the both sides of transhipment chamber 304.Cleaning module 308,310 can comprise process chamber (single station or multistation) separately, and the described 102A-B of those cleaning process room sees figures.1.and.2 above for example.Cleaning module 308,310 comprises and/or connects the various parts of above-mentioned chemical management system 103.(described chemical management system 103 is shown in broken lines to be in order to be expressed as follows the fact: some parts of chemical management system can be arranged to airborne on processing system 300, and that other parts can be arranged to is non-airborne; Perhaps all parts can be arranged to airborne).Relative with fore-end 302, transhipment chamber 304 is connected to processing equipment 312.
In one embodiment, fore-end 302 can comprise load locking room (load lockchamber), can make this load locking room be in the low transhipment pressure of appropriateness, and it is opened wide to transhipment chamber 304.Transport subsequently in the wafer case that automatic 306 is provided with from load locking room and fetch each wafer, and wafer is transported to processing equipment 312 or one of them cleaning module 308,310.In the operation process of system 300, chemical management system 103 control fluids infeed and/or discharge cleaning module 308,310.
Should be appreciated that system 300 only is an embodiment with processing system of chemical management system of the present invention.Therefore, the embodiment of chemical management system is not limited to structure for example shown in Figure 3, perhaps even is not limited to semiconductor fabrication environment.
System and process control
Other embodiment of chemical management system is described referring now to the processing system shown in Fig. 4 400.For for simplicity, other embodiment will be described in conjunction with multistation process chamber system (system 200 for example shown in Figure 2 and that describe in the above).But, be appreciated that the following examples also are suitable for system shown in Figure 1 100.In addition, should be noted that the order of processing station 204 among Fig. 4 has not necessarily reflected the order of the process of carrying out on given wafer, but just arrange so for convenience.For simplicity, identical reference character is not described in detail at this corresponding to combine the same parts that Fig. 1 and/or Fig. 2 describe with the front.
The mixing machine 108 of system 400 is constructed with a plurality of inputs 402 1-N(being referred to as input 402) receives chemical product separately respectively.Import 402 fluid coupled to main supply line 404, wherein chemical product separately mixes formation solution.In one embodiment, monitored along the concentration of supply line 404 various chemical product in one or more stages.Correspondingly, Fig. 4 shows along supply line 404 and embeds a plurality of chemical monitoring devices 406 that are provided with 1-3(example shows three).In one embodiment, the chemical monitoring device is arranged on the each point place that two or more chemical product merge and mix on the supply line 404.For example, the first chemical monitoring device 406 1Be arranged on (the input 402 of first and second chemical product 1-2) mixing point place and the (input 402 of the 3rd chemical product 3) between the introducing point place (that is, from the upstream) in supply line 404.In one embodiment, the concentration monitor device 406 that uses in the system is electrodeless conductivity prober and/or refractive index (RI) detector, includes but not limited to exchange for example market of GLI international corporation (Colorado) 3700 series types on sale, the RI detector market of Swagelok company (Ohio) CR-288 type on sale and the acoustic signals sensor market model on sale of Mesa Laboratories company (Colorado) for example for example of (AC) circular coil sensor.
Mixing machine 108 via main supply line 404 optionally fluid coupled to a plurality of use impact points (being processing station 204).(certainly, it is contemplated that in another embodiment that mixing machine 108 is only served one and used impact point).In one embodiment, select to serve which processing station by 408 controls of FLOW CONTROL unit.408 expressions of FLOW CONTROL unit are suitable for controlling the device of any amount of the mobile aspect of fluid between mixing machine and the downstream targets.For example, FLOW CONTROL unit 408 can comprise and is used to control from the solution of mixing machine 108 multiple-way valve of the conveying of target downstream.As example, optionally (for example under the control of controller 126) will be sent to the first use point supply line 410 from the solution of mixing machine 108, the second use point supply line 412 or the 3rd uses a supply line 414 in FLOW CONTROL unit 408, wherein, each uses the some supply line relevant with different processing station.FLOW CONTROL unit 408 also can comprise flowmeter or flow governor.
In one embodiment, use the some supply line to embed with respect to each and be provided with a container.For example, Fig. 4 shows fluid coupled to being positioned at the FLOW CONTROL unit 408 and first processing station 204 1Between first container 416 that uses some supply line 410.Similarly, at the FLOW CONTROL unit 408 and second processing station 204 2Between, second container, 418 fluids are connected to second and use some supply line 412.These containers suitably are sized to provides enough volumes, with serve at mixing machine 108 different processing station (or mixing machine 108 for example because maintenance and unavailable) during in be used for separately processing station.In one embodiment, the capacity of container is 6 to 10 liters or the required specified volume of given process.The fluid level of each container can be determined by corresponding liquid level sensor 421,423 (for example high and low (liquid level) sensor) is provided.In one embodiment, container the 416, the 418th, pressurized container, and correspondingly comprise the inlet separately 420,422 that is used to receive superheated steam separately.In one embodiment, the concentration of the contents of container 416,418 is monitored.Therefore, container 416,418 shown in Figure 4 comprises active concentration monitor system 424,426.More detailed description is carried out in conjunction with Fig. 5-6 below in these and other aspect of system 400.
In running, container 416,418 distributes their contents by operation flow control apparatus 428,430 separately.Flow control apparatus 428,430 can for example be the pneumatic valve of controlled device 126 controls.The processing station 204 that the solution that container 416,418 distributes flows to separately via separately intake pipeline 206 subsequently.In addition, can make from the one or more processing station 204 of the vaporization flow direction of flow of vaporizer 110.For example, in this example, the vaporization fluid is transfused to second processing station 204 2
Every independently intake pipeline 206 all can have one or more fluid management devices 432 1-3(the every group of intake pipeline that illustrates for simplicity, only has a relevant fluid management device).Fluid management device 432 can comprise for example filter, flow governor, flowmeter, valve etc.In one embodiment, one or more drifting management devices 321 comprise and are used to heat the heater of fluid of respective lines of flowing through.
Discharge fluid by operating output stream control subsystem 116 from process chamber separately subsequently.As shown in Figure 4, each bar in many export pipelines 210 separately of output stream control subsystem 116 all comprises one or more drifting management devices 434 that himself is relevant 1-3(for convenience's sake, shown every group of export pipeline only have a relevant fluid management device).Fluid management device 434 can comprise for example filter, flow governor, flowmeter, valve etc.In one embodiment, the fluid management device can comprise active pressure control unit.For example, pressure control unit can be made up of the pressure transducer that is connected to flow governor.This active pressure control unit can be operated the process control of wishing with influence with respect to wafer and processing station separately---for example by the interface between control fluid and the wafer surface.For example, may be with respect to the pressure in pressure and the processing station control export pipeline, to guarantee required fluid/wafer interface.
In one embodiment, the fluid of discharging by output stream control subsystem 116 flows in one or more vacuum tanks of vacuum tank subtense angle 118.Correspondingly, as example, system 400 comprises two vacuum tanks.Be connected to second process chamber 204 for first jar 436 2Export pipeline 210 1Be connected to the 3rd process chamber 204 for second jar 438 3Export pipeline 210 3In one embodiment, can provide independent jar for every kind of different chemical product that the station is dealt with in input separately.This layout can help the utilization again (recovery will be discussed in more detail below) or the fluid treatment of fluid.
Fluid level in each jar 436,438 can be monitored by one or more liquid level sensors 437,439 (for example, high and low liquid level sensor).In one embodiment, jar 436,438 optionally pressurizes by input superheated steam 440,442, but also can be discharged so that jar reduces pressure.In addition, each jar 436,438 all the vacuum pipeline 444,446 by separately be connected to vacuum pump subtense angle 120.Like this, steam can discharge and handle vacuum pump subtense angle 120 from jar separately, and this will hereafter be described in more detail.Usually, Guan contents can be sent to earial drainage or are recovered and turn back to mixing machine for utilizing again.Correspondingly, shown second jar 438 to 452 emptyings of earial drainage pipeline.And shown in first jar 436 be connected to recovery line 448.Recovery line 448 fluid coupled are to mixing machine 108.Like this, fluid can turn back to mixing machine 108 and is reused from processing station.The recovery of fluid will be described in detail with reference to Fig. 8 below.
In one embodiment, come FLUID TRANSPORTATION in the assistance system 400 by the build-up pressure gradient.For example, for system shown in Figure 4 400, can be that starting point is that terminal point is set up the pressure gradient that reduces with processing station 204 with mixing machine 108.In one embodiment, mixing machine 108 and vaporizer 110 move being approximately under 2 atmospheric pressure, and inlet flow control subsystem 112 is moved under about 1 barometric pressure, and processing station is in about 400 holders (Torr) operation down.Setting up such pressure gradient has promoted fluid from mixing machine 108 flowing to processing station 204.
In running, container 416,418 will reduce by degree of filling, must periodically be recharged.According to embodiment, the management (for example fill, distribute, keep in repair and/or safeguard) of each container is carried out asynchronously.That is to say that when a given container serviced (for example being filled), other container can continue to distribute solution.Can be in response to the filling circulation that starts from the signal that hangs down fluid level sensor (one of sensor 421,423) for given container.For example, suppose that the sensor 421 of first container 416 is to the low fluid level signal of controller 126 indications.In response, controller 126 makes 416 decompressions (for example by opening the earial drainage pipeline) of first container, and makes FLOW CONTROL unit 408 that first container 416 is arranged to be communicated with mixing machine 108 fluids, makes mixing machine and other vessel isolation simultaneously.Subsequently, controller 126 is signaled mixing machine 108 mixing and is distributed suitable solution to first container 416.In case first container 416 is filled (for example by high liquid level fluid sensor indication) fully, controller 126 is signaled mixing machine 108 and is stopped to distribute solution so, and makes FLOW CONTROL unit 408 with mixing machine 108 and 416 isolation of first container.In addition, subsequently can be by superheated steam injecting gas inlet 420 is pressurizeed first container 416.At this moment, first container 416 is ready to beginning to first processing station distribution solution.Fill in the circulation at this, each other container can constantly distribute solution to their processing station separately.
In one embodiment, can consider to provide service to each container based on the priority algorithm that controller 126 is carried out.For example, priority algorithm can use based on volume.That is to say, distribute the container of maximum volume (for example preset time section in) to have limit priority, and distribute the container of minimum volume to have lowest priority.Like this, the priority of container can be from distributing maximum volume to distributing minimum volume to carry out classification.
Mixing machine
In different embodiments, the invention provides a kind of use point process control mixing machine system that comprises at least one mixing machine, to receive and at least two kinds of compounds of blending, so that be transported in the one or more containers or jar that include the chemical bath that helps processing (for example cleaning) semiconductor wafer or other parts.Chemical solution remains in the jar with selected volume and temperature, mixing machine can be configured to carry chemical solution continuously to one or more jars, perhaps selectively only carry chemical solutions (as indicated above and will be further described below) to one or more jars when needed, thus compound concentrations in the jar is kept within the required range.
Described jar can be the part of processing equipment, thereby mixing machine is directly to the processing equipment supply of chemical solutions that comprises the chemical bath of selecting volume.Described processing equipment can be any traditional or other suitable device of process semiconductor wafers or other parts (for example by etch process, cleaning process etc.), the equipment of describing with reference to Fig. 3 above for example 312.Selectively, mixing machine can be to one or more maintenances or holding vessel supply of chemical solutions, and then, holding vessel or jar are supplied with one or more processing equipmenies with chemical solution.
In one embodiment, provide a kind of use point process to control the mixing machine system, it is configured to increase the flow rate of the chemical solution of going to one or more jars when one or more compound concentrations in the solution fall into outside the selected target scope, thereby undesirable chemical solution in the displacement tank is supplied new chemical solution with required compound concentration simultaneously in jar fast.
With reference now to Fig. 5,, wherein shows the mixing machine system 500 that comprises mixing machine 108 according to an embodiment of the invention.According to an embodiment, shown mixing machine 108 is connected to jar 502, and has monitoring and recyclability concurrently.In one embodiment, jar 502 is pressurized containers 416 or 418 shown in Figure 4.Selectively, jar 502 is purge tanks (for example being arranged in one of them cleaning module 308,310 of processing system 300) that semiconductor wafer or other parts immerse and clean therein.
The input of purge tank 502 links to each other via flowline 512 with mixing machine 108.According to an embodiment, flowline 512 can be used some pipeline 410,412,414 corresponding to shown in Figure 4 one of them.In this exemplary embodiment, the cleaning solution that forms and supply with purge tank 502 in mixing machine unit 108 is the SC-1 cleaning solution, has the ammonium hydroxide (NH that supplies with the mixing machine unit through supply line 506 4OH), supply with the hydrogen peroxide (H of mixing machine unit through supply line 508 2O 2) and supply with the deionized water (DIW) of mixing machine unit through supply line 510.But, it should be noted that mixing machine system 500 can be configured to the equipment of any type mixture with the compound of the selected arbitrarily quantity of selected concentration supply (that is, two or more), described mixture can comprise for example hydrofluoric acid (HF), ammonium fluoride (NH 4F), hydrochloric acid (HCL), sulfuric acid (H 2SO 4), acetic acid (CH 3OOH), ammonium hydroxide (NH 4OH), caustic potoash (KOH), ethylenediamine (EDA), hydrogen peroxide (H 2O 2) and nitric acid (HNO 3) wait compound.For example, mixing machine 108 can be configured to distribute the solution of rare HF, SC-1 and/or SC-2.In one embodiment, may wish to import rare HF of heat.Correspondingly, mixing machine 108 can be constructed with the inlet that is used for hot DIW.In one embodiment, hot DIW can maintain about 25 ℃ to about 70 ℃ of scopes.
In addition, the surface active agent of any appropriate and/or other chemical additives (for example ammonium persulphate or APS) can combine with cleaning solution, to strengthen the cleaning performance for concrete application.Flowline 514 optionally with the input of mixing machine unit 108 and jars 502 between flowline 512 link to each other so that the cleaning solution that uses in cleaner bath adds this additive.
Jar 502 is sizing and the cleaning solution that is configured to keep selected volume in jar (for example, enough volumes are to be formed for the cleaner bath of cleaning operation) suitably.As mentioned above, cleaning solution can be fed to the jar 502 from mixing machine unit 108 continuously by one or more selected flow rates.Selectively, can be only in the selected time period (for example when jar is filled beginning and when jar in one or more components of cleaning solution fall into select or target concentration range outside the time) cleaning solution is fed to jar from the mixing machine unit.Jar 502 also is constructed with overflow segment or outlet, make cleaning solution supplies and/or be recycled to situation in the jar continuously in described mode hereinafter under, cleaning solution can leave jar via overflow line 516, and keeps having selected cleaning solution volume in the jar simultaneously.
Jar also have the relief port that links to each other with earial drainage pipeline 518, wherein earial drainage pipeline 518 comprises valve 520, optionally controls this valve, so as in the selected period as described below earial drainage and discharge cleaning solution from jar at faster speed.The electronic valve that eduction valve 520 is preferably controlled automatically by controller 126 (as described with reference to figure 1-4 in the preamble).Overflow and earial drainage pipeline 516 and 518 are connected to flowline 522, this flowline 522 comprises the pump 524 that is arranged on wherein, so that the cleaning solution that will discharge from jar 502 is transported to recirculation line 526 and/or collects the place or other processing place as described below.
In flowline 522, be provided with concentration monitor unit 528 in one position, pump 524 downstreams.This concentration monitor unit 528 comprises at least one sensor, and this sensor arrangement becomes when cleaning solution is flowed through pipeline 522 the (H for example of a kind of and/or multiple compound in the measurement cleaning solution 2O 2And/or NH 4OH) concentration.The sensor of concentration monitor unit 528 can be the type of any appropriate, measures so that one or more compounds of being paid close attention in the cleaning solution are carried out precise concentrations.In certain embodiments, used concentration sensor is electrodeless conductivity prober and/or refractive index (RI) detector in the system, includes but not limited to exchange for example market of GLI international corporation (Colorado) 3700 series types on sale, the RI detector market of Swagelok company (Ohio) CR-288 type on sale and the acoustic signals sensor market model on sale of Mesa Laboratories company (Colorado) for example for example of (AC) circular coil sensor.
Flowline 530 links to each other the outlet of concentration monitor unit 528 with the inlet of three-way valve 532.Described three-way valve can be the electronic valve of being controlled automatically by following mode by the concentration measurement that controller 126 provides according to unit 528.Recirculation line 526 links to each other with the outlet of valve 532, and extends to the inlet of jar 502, so that get back to (as described below) the jar at normal system runtime chien shih solution from overflow line 516 recirculation.Be extended with earial drainage pipeline 534 from another outlet of valve 532, from jar 502, discharge solution (via pipeline 516 and/or pipeline 522) with one or more component concentrations in the convenient solution outside target zone the time.
Recirculation flow pipeline 526 can comprise temperature, pressure and/or flow rate sensor and one or more suitable heat exchanger of any suitable quantity and type so that when solution recirculation returns jars 502 to its heat, temperature and flow rate control.In system's running, recirculation line helps controlling a jar interior solution bath temperature.In addition, the filter and/or the pump (for example, except pump 524) of any suitable quantity can be set along flowline 526, filter with flow rate and control so that jars 502 solution is returned in recirculation.In one embodiment, the recirculation circuit that is limited by earial drainage pipeline 518, valve 520, pump 524, pipeline 522, concentration monitor unit 528, three-way valve 532 and recirculation line 526 defines top in conjunction with one in the described concentration monitor of Fig. 4 system 424,426.
Mixing machine system 500 comprises that the concentration measurement that obtains according to concentration monitor unit 528 controls the parts of mixing machine unit 108 and the controller 126 of eduction valve 520 automatically.As described below, controller leaves one or more compound concentrations controls in jars 502 the cleaning solution from the flow rate and earial drainage or the extraction of cleaning solution from jar 502 of the cleaning solution of mixing machine unit 108 according to what concentration monitor unit 528 recorded.
Controller 126 is arranged to communicate by letter in (shown in the dotted line among Fig. 5 536) with some parts of eduction valve 520, concentration monitor unit 528 and valve 532 and mixing machine unit 108 via suitable arbitrarily electric wire or radio communication connection, so that according to the survey data that receives from the concentration monitor unit mixing machine unit and eduction valve are controlled.Controller can comprise able to programme to realize any one or multiple suitable process control, the processor of for example proportional-integral-differential (PID) feedback control.A kind of exemplary controller that is applicable to process control mixing machine system is the market of Siemens company (Georgia) PLC Simatic S7-300 system on sale.
As mentioned above, mixing machine unit 108 receives the independently supplying stream of aqua ammonia, hydrogen peroxide and deionized water (DIW), and they mix mutually with suitable concentration and flow rate, and acquisition has the SC-1 cleaning solution of the desired concn of these compounds thus.Each flow in these compounds in the controller 126 control mixing machine unit 108 obtaining required ultimate density, and further controlled the flow rate of SC-1 cleaning solution, to form cleaner bath in jar 502.
Fig. 6 shows an exemplary embodiment of mixing machine unit.Particularly, be used for to mixing machine unit 108 supply NH 4OH, H 2O 2Comprise safety check 602,604,606 with each supply line 506,508 and 510 of DIW and be arranged on the electronic valve 608,610,612 of check valve downstream.The electronic valve that is used for each supply line is communicated by letter with controller 126 (for example via electric wire or wireless connections), so that control electronic valve automatically by controller in system's running.NH 4OH and H 2O 2Supply line 506 links to each other with an electronic three-way valve 614,616 respectively with 508, and described electronic three-way valve is communicated by letter with controller 126 (via electric wire or wireless connections), and is arranged on the downstream of first electronic valve 608,610.
DIW supply line 510 comprises the pressure regulator 618 that is arranged on electronic valve 612 downstreams, enter with control system 108 DIW pressure and flow, pipeline 510 further is branched off into three flowline in regulator 618 downstreams.First take-off line 620 that extends from main line 510 comprises the flow control valve 621 that is provided with along this take-off line, and by controller 126 controls, pipeline 620 also links to each other with first static mixer 630 this flow control valve alternatively.Second take-off line 622 extends to going back and NH of three-way valve 614 from main line 510 4The inlet that OH flowline 506 links to each other.In addition, the 3rd take-off line 624 extends to going back and H of three-way valve 616 from main line 510 2O 2The inlet that flowline 508 links to each other.Therefore, be used for NH 4OH and H 2O 2The three-way valve of each helps to add DIW in each of these fluids in the flowline, optionally to regulate the concentration of aqua ammonia and hydrogen peroxide in the distilled water before mixing mutually at system's run duration with in the static mixer of mixing machine unit.
Between first take-off line 620 of three-way valve 614 outlet that is used for the aqua ammonia supply line and deionized water supply line, be connected with NH in the position between valve 621 and static mixer 630 4OH flowline 626.Alternatively, flowline 626 can comprise energy controlled device 126 flow control valves 628 of control automatically, to strengthen the FLOW CONTROL to the aqua ammonia that infeeds first static mixer.The aqua ammonia and the deionized water that infeed in first static mixer 630 mix in mixer, roughly uniform solution after mixing with acquisition.Flowline 634 links to each other with the outlet of first static mixer, and extends into second static mixer 640 and link to each other.The moving pipeline 634 of longshore current is provided with any one or a plurality of suitable concentration sensor 632 (for example electrodeless sensor of one or more above-mentioned any types or RI detector) of determining aqua ammonia concentration in the solution.Concentration sensor 632 is communicated by letter with controller 126, so that the measurement concentration of the aqua ammonia in the solution that comes out from first static mixer to be provided.This then help before being transported to second static mixer 640, the aqua ammonia concentration in the solution to be controlled---optionally and automatically handle NH by controller 4OH and DIW supply line one of them or any valve among both.
H 2O 2Flowline 636 be connected to H 2O 2The outlet of the three-way valve 616 of supply line links to each other.Flowline 636 extends in the position between the concentration sensor 632 and second static mixer 640 from three-way valve 616 and links to each other with flowline 634.Alternatively, can comprise can be by controller 126 flow control valves 638 of control automatically, to strengthen the FLOW CONTROL to the hydrogen peroxide that infeeds second static mixer for flowline 636.NH after second static mixer 640 will dilute from the DIW that first static mixer 630 receives 4OH solution with from H 2O 2The H of supply line 2O 2Solution mixes, to form the SC-1 cleaning solution of the roughly uniform aqua ammonia, hydrogen peroxide and the deionized water that mix.Flowline 642 receives the mixed cleaning solution from second static mixer, and links to each other with the inlet of electronic three-way valve 648.
In one position, valve 648 upstreams, (for example be provided with at least one suitable concentration sensor 644 along flowline 642, the electrodeless sensor of one or more any the above-mentioned types or RI detector), with the concentration of one of them kind of hydrogen peroxide and ammonium hydroxide in definite cleaning solution.Concentration sensor 644 is also communicated by letter with controller 126, so that the concentration information that records to be provided to controller, this then help to control ammonium hydroxide in the cleaning solution and/or the concentration of hydrogen peroxide---optionally and automatically operate NH by controller 4OH, H 2O 2With any valve of DIW supply line in wherein one or more.Alternatively, can between sensor 644 and valve 648, pressure regulator 646 be set, so that the pressure of control cleaning solution and mobile along flowline 642.
One outlet of earial drainage pipeline 650 and three-way valve 648 links to each other, and flowline 652 is stretched out from another outlet end of three-way valve 648.Described three-way valve optionally and is automatically handled by controller 126, so that control is gone to the amount of jars 502 cleaning solution and transferred to the amount of earial drainage pipeline 650 from the mixing machine unit.In addition, the moving pipeline 652 of longshore current is provided with electronic valve 654, and this electronic valve control automatically by controller 126, goes to the mobile of jars 502 cleaning solution from the mixing machine unit with further control.Flowline 652 becomes flowline shown in Figure 5 512, to be used for that the SC-1 cleaning solution is sent to jar 502.
Being arranged on described a series of electronic valves in the mixing machine unit 108 and concentration sensor combines with controller 126 and helps in system's run duration accurate concentration of hydrogen peroxide and ammonium peroxide in the flow rate of the cleaning solution gone to jar of control and the cleaning solution during in the cleaning solution proposed for variable flow rate.In addition, when hydrogen peroxide with ammonium peroxide is wherein a kind of or both concentration when falling into outside the tolerance interval of cleaning solution, the concentration monitor unit 528 that is arranged on jars 502 the earial drainage pipeline 522 provides indication to controller.
Offer the concentration measurement of controller 126 according to concentration monitor unit 528, but the controller follow procedure changes the flow rate of going to the cleaning solution in the jar and opens eduction valve 520, to help the SC-1 cleaning solution in quick displacement (solution) bath, the new SC-1 cleaning solution of supply in jar simultaneously, cleaning solution is bathed be in suitable or target concentration range in.In case fully replaced the cleaning solution in the jar, making hydrogen peroxide and/or ammonium hydroxide concentration fall in the acceptable scope (is measured by concentration monitor unit 528), the controller follow procedure is closed eduction valve 520 and is controlled the mixing machine unit, so that reduce (or stopping) flow rate, keep the required compound concentration that is transported to the cleaning solution in the jar 502 simultaneously.
It is mentioned above and in the exemplary embodiment of the method for the system shown in Fig. 5 and Fig. 6 to the following describes operation.In this exemplary embodiment, can in jar, supply cleaning solution continuously, perhaps selectively, only with the selected cleaning solution (for example when cleaning solution will soon be replaced from jar) of in jar, supplying at interval.A kind of SC-1 cleaning solution of preparation in mixing machine unit 108, and it is infeeded jars 502, wherein the concentration range of ammonium hydroxide is about 0.01-29% by weight, be preferably about by weight 1.0%, the concentration range of hydrogen peroxide is about 0.01-31% by weight, is preferably about by weight 5.5%.Purge tank 502 is configured to cleaning solution in about 25 ℃ are kept to about 125 ℃ temperature range jar and bathes and be about 30 liters.
In running, when in jar 502, filling cleaning solution to maximum capacity, controller 126 control mixing machine unit 108, to supply cleaning solutions by first flow rate that is about 0-10 Liter Per Minute (LPM) to jar 502 via flowline 512, wherein, mixing machine can be supplied solution continuously or selectively at system's run duration in seclected time.When solution without interruption, the first exemplary flow rate is extremely about 0.25LPM of about 0.001LPM, is preferably about 0.2LPM.Ammonium hydroxide supply line 506 is about the NH of 29-30% by volume to the supply of mixing machine unit 4OH, and hydrogen peroxide supply line 508 is about 30% H by volume to the supply of mixing machine unit 2O 2Be about under the flow rate of 0.2LPM, the flow rate of the supply line of mixing machine unit can be set as follows, and have required ammonium hydroxide and concentration of hydrogen peroxide with the cleaning solution of guaranteeing to supply: DIW is about 0.163LPM, NH 4OH is about 0.006LPM, H 2O 2Be about 0.031LPM.
Can in cleaning solution, add additive (for example APS) via supply line 514 alternatively.In this operation phase, can first flow rate from mixing machine unit 108 to the Continuous Flow of the new SC-1 cleaning solution of jar 502 supplies, simultaneously, the cleaning solution from cleaner bath also flows out from jar 502 via overflow line 516 with roughly the same flow rate (for example about 0.2LPM).Like this, because inflow is identical or roughly similar with the flow rate of the cleaning solution that flows out jar, the volume maintenance that cleaning solution is bathed is constant relatively.The cleaning solution of overflow flows into earial drainage pipeline 522 and by concentration monitor unit 528, wherein continuously or to determine (the H for example of one or more compounds in the cleaning solution seclected time at interval 2O 2And/or NH 4OH) concentration measurement, and this concentration measurement offered controller 126.
Can make cleaning solution circulation by modulating valve 532 alternatively, make the cleaning solution that flows out in jars 502 with flow through recirculation line 526 and returning in the jar of selected flow rate (for example about 20LPM).This in service, mixing machine unit 108 can be controlled such that, unless one or more compound concentrations are in outside the selected target scope in the cleaning solution, otherwise does not have cleaning solution to transfer to the jar from the mixing machine unit.Selectively, cleaning solution can be supplied with selected flow rate (for example about 0.20LPM) by the mixing machine unit, combines with recirculation cleaning solution by pipeline 526.In this selectable operation embodiment, can regulate (for example regulating automatically) three-way valve 532 by controller 126 so as with cleaning solution to be discharged in the pipeline 534 to the approximately identical flow rate of jar supply cleaning solution with the mixing machine unit, the cleaning solution recirculation line 526 of still flowing through simultaneously.In another alternative plan, but cut-off valve 532, with avoid when mixing machine unit 108 during continuously to jar 502 supply cleaning solutions (for example with about 0.20LPM) fluid pass through pipeline 526 recirculation.In this application, solution leaves jar via pipeline 516, and its flow rate and fluid enter from the mixing machine unit that flow rate in the jar approximately equates or be similar.
Be conducted to situation in the jar continuously for cleaning solution, as long as the concentration measurement that concentration monitor unit 528 provides is in the tolerance interval, so, the flow rate that controller 126 just will be gone to the cleaning solution of jar 502 from mixing machine unit 108 is held in first flow rate, and the concentration of hydrogen peroxide and aqua ammonia is in the selected concentration range.For cleaning solution is not the situation that is conducted to from the mixing machine unit continuously the jar, controller 126 is kept this running state (that is, not going to cleaning solution the jar from the mixing machine unit) and is in outside the selected concentration range up to the concentration of hydrogen peroxide and/or aqua ammonia.
(for example, the NH when deviation of concentration of one of them kind is outside tolerance interval in hydrogen peroxide that records when concentration monitor unit 528 and the ammonium hydroxide 4The measurement concentration of OH has departed from about 1% scope with respect to aimed concn, and/or H 2O 2Measurement concentration departed from about 1% scope with respect to aimed concn), any one or a plurality of valve in the mixing machine unit 108 handled and controlled to controller as mentioned above, opens or increase to second flow rate with the flow rate that will go to the cleaning solution jars 502 from the mixing machine unit and (keep NH in the cleaning solution simultaneously 4OH and H 2O 2Concentration in selected scope).
Second flow rate can be at about 0.001LPM in the scope of about 20LPM.For continuous cleaning solution operation, the second exemplary flow rate is about 2.5LPM.Controller is also opened the eduction valve 520 in the jar 502, so that cleaning solution flows out from jar with about identical flow rate.Be about under the flow rate of 2.5LPM, the flow rate of the supply line of mixing machine unit can be set as follows, and have required ammonium hydroxide and concentration of hydrogen peroxide with the cleaning solution of guaranteeing to supply: DIW is about 2.04LPM, NH 4OH is about 0.070LPM, H 2O 2Be about 0.387LPM.
Selectively, to from system, discharge with the cleaning solution that selected flow rate (for example about 20LPM) is recycled in the jar by regulating three-way valve 532, make washing fluid turn to pipeline 534 and no longer in the inflow line 526, the mixing machine unit transfers to selected level (for example 20LPM) with second flow rate, so that the fluid that compensation is discharged with same or similar flow rate.Like this, in the process of the cleaning solution flow rate that increases inflow and outflow jar, the volume of cleaning solution bath can be kept constant relatively in the jar 502.In addition, in displacement tank, in the process of the solution of selected volume, can keep jar interior process temperature and circulate parameter.
Controller is kept cleaning solution and is carried in jar 502 with second flow rate, provides the concentration measurement that is in the tolerance interval until concentration monitor unit 528 to controller.When the concentration measurement that provides when concentration monitor unit 528 was in the tolerance interval, cleaning solution was bathed and is met required cleaning compound concentration once more.Subsequently, cleaning solution (perhaps not being conducted to the cleaning solution the jar from the mixing machine unit) is supplied with first flow rate in controller control mixing machine unit 108 in jar 502, controller is further handled eduction valve 520 to operating position, and is only mobile via overflow line 516 to promote from the cleaning solution in the jar.In the application of having used recirculation line, controller is handled three-way valve 532, makes cleaning solution from pipeline 522 inflow line 526 and return in jars 502.
Therefore, although contingent decomposition and/or other reaction may change the chemical solution concentration in the jar, but use or manufacturing process in, above-mentioned use point process control mixing machine system still can be effectively, accurately control is transported at least two kinds of compound concentrations in the cleaning solution of chemical solution flow container (for example equipment or NaOH solution tank NaOH).When chemical solution has undesirable or unacceptable one or more compound concentrations in determining jar, this system can be with first flow rate new chemical solution without interruption in jar, and with than first flow rate faster second flow rate apace the chemical solution in the jar is replaced into new chemical solution.
It is top described and in the exemplary embodiment shown in Fig. 5 and Fig. 6 to use point process control mixing machine system to be not limited to.On the contrary, this system can be used for providing to any semiconductor processes jar or other selected equipment and have two or more compounds arbitrarily the chemical solution of the mixture of (for example the above-mentioned type), keeps in cleaning application process simultaneously that compound concentrations is in the tolerance interval in the chemical solution.
In addition, described process control mixing machine system can with the NaOH solution tank NaOH of arbitrarily selected quantity or jar and/or semiconductor processing equipment be used in combination.For example, above-mentioned controller and mixing machine unit can directly be supplied the chemical solution mixture of two or more compounds with accurate concentration to two or more processing equipmenies.Selectively, this chemical solution can be supplied to one or more maintenances or holding vessel in controller and mixing machine unit, and this holding vessel is to one or more processing equipmenies (system 400 for example shown in Figure 4) supply of chemical solutions.Process control mixing machine system provides accurate control to compound concentration in the chemical solution by the concentration of solution in the monitoring jar, and outside solution concentration falls into target zone the time to these jars displacement or make-up solution.
The design of described process control mixing machine system and being configured with helps fully will be to wherein the one or more chemical solution flow containers and/or the processing equipment of supply of chemical solutions are arranged near system with this system.Particularly, process control mixing machine system can be arranged in manufactory (Fab) or cleanroom or near, perhaps selectively, be arranged in the sub-Fab chamber but near NaOH solution tank NaOH and/or equipment in the cleanroom residing position.For example, the process control mixing machine system that comprises mixing machine unit and controller can be positioned at NaOH solution tank NaOH or processing equipment about 30 meters, preferably in about 15 meters, more preferably about 3 meters or more among a small circle in.In addition, process control mixing machine system can with one or more equipment integrations comprise the single unit of handling mixing machine system and equipment so that form.
Non-airborne mixing machine
As mentioned above, according to one embodiment of present invention, mixing machine 108 can be arranged to non-airborne.That is to say that mixing machine 108 can separate with the processing station that this mixing machine 108 is served, like this, mixing machine 108 can for example be arranged among the sub-Fab by long-range.
In the specific embodiment of non-airborne mixing machine, a kind of centralized mixing machine is configured to serve a plurality of equipment.Fig. 7 shows a kind of so centralized mixing machine system 700.Usually, mixing machine system 700 comprises mixing machine 108 and one or more filled station 702 1-2Show two in this exemplary embodiment and fill station 702 1-2(be referred to as and fill station 702).Mixing machine 108 can be configured to aforementioned any embodiment in identical (for example above described) in conjunction with Fig. 6.Mixing machine 108 is by main supply line 404 and a pair of flowline 704 1-2Fluid coupled is to filling station 702, flowline 704 1-2End separately be connected to one of them and fill station 702 1-2In main supply line and flowline 704 1-2Junction point be provided with FLOW CONTROL unit 706.FLOW CONTROL unit 706 expression is suitable for controlling the device of any amount of mixing machine 108 aspect mobile with filling fluid between the station 702.For example, FLOW CONTROL unit 706 can comprise and is used to control from the solution of mixing machine 108 multiple-way valve of the conveying of target downstream.Correspondingly, optionally (for example under the control of controller 126) will be from the solution of mixing machine 108 via first flowline 704 in FLOW CONTROL unit 706 1Deliver to first and fill station 702 1With via second flowline 704 2Deliver to second and fill station 702 2FLOW CONTROL unit 706 also can comprise flowmeter or flow governor.
Each fills station 702 and is connected to one or more processing equipmenies 708.In this exemplary embodiment, filled station is connected to four equipment (equipment 1-4) separately, but more generally, filled station can be connected to the use point of any amount.For from the conveying (and/or metering, flow rate etc.) of the solution that fills station 702 can by be arranged on separately filled station and the FLOW CONTROL unit 710 between a plurality of equipment 708 1-2Control.In one embodiment, between separately filled station and a plurality of equipment 708, filter 712 is set 1-2Filter 712 1-2Be chosen to before solution is transported to separately equipment will be wherein Impurity removal.
In one embodiment, each fills station 702 and supplies different chemical product to equipment 708 separately.For example, in one embodiment, first fills station 702 1The hydrofluoric acid of supply dilution, and the second filled station 702 2Supply SC-1 type solution.The flow control apparatus at equipment place separately can be operable to the suitable processing station/chamber of equipment that input solution is sent to.
In one embodiment, can asynchronously operate with mixing machine 108 at each filled station.That is to say, fill each in the time of can at the same time solution being distributed to one or more equipment 708 and fill station 702 1-2For this reason, each fills the station and is constructed with the filled loop that wherein is provided with at least two containers.In this exemplary embodiment, first fill the station and have and contain two containers 716 1-2First fill loop 714 A-DDescribed filled loop is by many flowline paragraph qualifications.The first mobile line sections 714 AWith the flowline 704 and first container 716 1Fluid coupled.The second flow duct line segment 714 BWith first container 716 1Fluid coupled is to processing equipment 708.The 3rd flow duct line segment 714 CWith the flowline 704 and second container 716 2Fluid coupled.The 4th flow duct line segment 714 DWith second container 716 2Fluid coupled is to processing equipment 708.In filling the loop, be provided with a plurality of valves 720 1-4, with between control mixing machine 108 and the container 716 and container 716 be communicated with fluid between a plurality of equipment 708.
Each container 716 has the liquid level sensor 717 of suitable quantity 1-2(for example high liquid level sensor and low liquid level sensor) is to experience the fluid level in the container separately.Each container also has the pressurized gas inlet 719 that can use the pressurization of separately container 1-2With the floss hole 721 that can use the decompression of separately container 1-2Although do not illustrate, first processing station 702 1Filled loop 714 A-DCan be equipped with the drifting management device of any amount, for example pressure regulator, flow governor, flowmeter etc.
Second fills station 702 constructs identical.Therefore, shown in Figure 7 second fill station 702 and have to be arranged on and fill loop 724 A-DIn two containers 722 1-2, described filled loop 724 A-DHave and be used to control a plurality of valves 726 that fluid is communicated with 1-4
In running, controller 126 can be operated the control unit 706 that flows, to fill station 720 at mixing machine 108 and first 1Between set up to be communicated with.Controller 126 also can be operated first and fill return valve 720 1, with in first flowline 704 1With filled loop 714 A-DFirst line sections 714 that flows ABetween set up fluid and be communicated with, thus at the mixing machine 108 and first container 716 1Between set up fluid and be communicated with.In this structure, mixing machine 108 can make flow of solution to first container 716 1, up to a suitable sensor 717 1(that is, high liquid level sensor) indication container is full, and at this moment, first fills return valve 720 1Close, can pass through to pressurized gas inlet 719 1Use gas and to container 716 1Pressurization.Before filling first container and during, can open floss hole 721 separately 1So that container decompression.
When first container 716 1When being filled, fill station 702 1Can be configured such that second container 716 2Distribute solution to one or more equipment 708.Correspondingly, second valve 720 2Close the 3rd valve 720 3Open the 4th valve 720 4Be set to and allow second container 716 2With processing equipment 708 via the 4th flow duct line segment 714 DThe position that fluid is communicated with.In the solution assigning process, can be by to separately gas access 721 2Application of pressure gas and make the second container pressurized.
In case determine second container 716 2In fluid level reached predetermined low liquid level (as suitable low liquid level sensor 717 2Shown), then fill station 702 and can be configured to suspend from second container 716 by first valve that fills the loop is set to correct position 2Distribution and begin from first container 716 1Distribution.Then, can be by opening floss hole 721 separately 2To second container 716 2After this decompression, can be used to fill second container 716 from the solution of mixing machine 108 2
Second fills station 702 2Operation and first fill station 702 1Operation identical, therefore be not described in detail.
Filling one of them filled station 702 1-2In container after, solution can be in a period of time be distributed to one or more equipment 708 in described filled station.During this period, FLOW CONTROL unit 706 can be operable to mixing machine 108 is arranged to be communicated with other filled station fluid.The amount of capacity that it is contemplated that the container that will fill the station is specified to, and for flowing into and flowing out the given flow rate that fills the station, before another complementary tank that fills the station exhausted, mixing machine 108 can recharge one of them one of them container that fills the station.Like this, can keep from the solution distribution that fills the station and not interrupt, perhaps not interrupt basically.
Reclaiming system
As mentioned above, in one embodiment of the invention, be recycled and reused from the fluid that processing station (perhaps more generally referring to use a little) is discharged.Referring now to Fig. 8 A, wherein show the embodiment of reclaiming system 800A.Reclaiming system 800A comprises the parts of front with reference to the some of Fig. 4 description, and these parts are marked and are not described in detail by same reference character.In addition, for clarity sake, more foregoing projects are removed.Usually, reclaiming system 800A comprises mixing machine 108 and a plurality of jar 802 1-N(being referred to as jar 802).Jar 802 is corresponding with jar 436 shown in Figure 4, and therefore, each jar fluid coupled arrives processing station (not shown) separately, and can also fluid coupled arrive vacuum pump subtense angle 120 (not shown).
In one embodiment, the liquid in jar 802 liquid-gas stream that are configured to import is separated from the gas.For this reason, jar 802 can comprise the striking plate 828 of the ingress that is positioned at jar separately respectively 1-NWhen running into striking plate 828, liquid coagulates from the input fluid by blunt power (blunt force) effect.Jar 802 also can comprise demister 830 1-NDemister 830 generally includes with respect to the fluid of the demister 830 of the flowing through planar array of (for example about 90 degree) location angularly.Cause liquid further from gas, to coagulate with the impact on demister surface.The liquid storage region 832 that the liquid that condenses from the input fluid is being positioned at jar bottom 1-NIn gather, simultaneously, any residual steam is discharged to vacuum pump subtense angle 120 (see figure 1)s.In one embodiment, the demister below is positioned with degassing baffle 834 1-N, for example just in time be positioned at striking plate 828 belows.Degassing baffle extends and at one end forms opening 836 above liquid storage region 832 1-NIn this structure, degassing baffle allows liquid to enter liquid storage region 832 via opening 836, but prevents that moisture from liquid is along with the liquid-gas stream of input is introduced again.
Each jar 802 is all via separately recovery line 804 1-N(being referred to as recovery line 804) fluid coupled is to mixing machine 108.By pump 806 separately is provided 1-N(being referred to as pump 806) impels fluid mobile by recovery line 804 separately from jar.Jars 802 with their pumps 806 separately between fluid be communicated with by the pneumatic valve 808 that is arranged in the recovery line 804 1-NThe operation of (being referred to as valve 808) is controlled.In one embodiment, pump 806 is centrifugal pump or suitable substitute, for example air operated diaph pump or diaphragm pump.
In one embodiment, in each recovery line, be provided with filter 810 1-N(being referred to as filter 810).Filter 810 is chosen to before the recovery fluid is introduced into mixing machine 108 impurity wherein be removed.Although not shown, filter can be connected to a rinse-system respectively, and described rinse-system is configured to make washing solution (for example DIW) filter of flowing through, and is filtered the impurity that device is caught to remove and to take away.Can manage the fluid that (for example control and/or monitor) flows to filter and mixing machine 108 by one or more drifting management devices are provided.As example, drifting management device 812 1-N, 814 1-NBe arranged on and be positioned at the filter upstream and downstream in the recovery line separately.For example, in this exemplary embodiment, upstream device 812 1-NBe pneumatic valve (being referred to as valve 812), it is arranged on the upstream of each filter 810.Correspondingly, can control the flow rate that reclaims fluid by handling pneumatic valve 812.In addition, downstream unit 814 1-NComprise pressure regulator and flow control valve, be introduced into mixing machine 108 with the fluid of guaranteeing required pressure and flow rate.Each drifting management device can be subjected to the control of controller 126 (see figure 4)s.
Every recovery line 804 all stops at main supply line 404 places of mixing machine 108.Correspondingly, each fluid that flows out from jar separately all can flow into the solution that flows by main supply line 404 and mix with this solution.In one embodiment, introduce the upstream of reclaiming the mixing station (mixer 642 for example above with reference to Fig. 6 described) of fluid from be arranged on main supply line 404.In addition, can in mixer 642 downstreams one or more concentration monitor devices 818 be set along main supply line 404.Although only show a concentration monitor device for simplicity, but, can consider provides the concentration monitor device for the every kind of different chemical product that reclaims, and in this case, can will reclaim the main supply line 404 of stream introducing at the suitable some place of separately concentration monitor device upstream for specific stream.Like this, can monitor the concentration of chemical product separately at concentration monitor device place separately.If concentration is not in target zone, then mixing machine 108 can be operable to the suitable chemical product that injects amount of calculation from each inlet 402.Then, solution mixes in mixer 642 as a result, and carries out concentration monitor at concentration monitor device 818 places once more.This process can be continuous, and solution is turned to carry out earial drainage, up to obtaining desired concn.Can make flow of solution to suitable use point then.
In some constructions, the chemical product of reason station use can be always identical throughout.Correspondingly, in one embodiment, each recovery line 804 can enter suitable use point supply line 410,412,414, shown in the reclaiming system 800B shown in Fig. 8 B.Although do not illustrate, can the concentration monitor device be set along each recovery line, so that monitoring enters the respective concentration of the recovery stream that uses the some supply line.Although do not illustrate, can be along using a some supply line 410,412,414 that the mixed zone is set, flow with fluid with the recovery that will import and to mix from mixing machine 108.Simultaneously, can be 180 degree each other from the fluid of mixing machine 108 and separately recovery stream and carry and realize that the suitable of fluid mixes by making.Inlet flow can mix at a T type connected member place, and the mixture of Xing Chenging is 90 degree flow directions use point separately with respect to the inlet flow stream thus.
Selectively, can consider to make and respectively reclaim some place that fluid flow to concentration monitor device upstream suitable in the mixing machine 108, shown in the reclaiming system 800C shown in Fig. 8 C.For example, from first recovery line 804 1The hydrofluoric acid of dilution reclaim solution and can import hydrofluoric acid inlet 402 1The downstream and be configured to monitor the hydrofluoric acid concentration first concentration monitor device 406 1The upstream.From second recovery line 804 2The recovery solution of SC-1 type chemical product can import ammonium hydroxide inlet 402 2With hydrogen peroxide inlet 402 3The downstream and the second and the 3rd concentration monitor device 406 that is configured to monitor SC-1 type solution component concentration 2, 406 NThe upstream.The rest may be inferred.In one embodiment, by drawing an equation, can distinguish each component in a kind of multicomponent (for example ammonium hydroxide and hydrogen peroxide) mixture by the process model that uses metering signal and titrate the analysis result.Must know the input chemical concentration that enters technology, more specifically, in that chemical process is decomposed, NH owing to taking place 3Molecule effusion or formation must be known concentration of fluid before generating salt or by product arbitrarily.Like this, the metering of variation can be observed, and the composition variation that is used in particular for this process can be predicted.
In each previous embodiment, suitable for making concentration, reclaim fluid and can be filtered with monitored.But, after a period of time and/or certain quantity of processing circulation, reclaim fluid and will no longer be suitable for their desired use.Therefore, in one embodiment, be recirculation and reuse the limited time and/or the cycle of treatment of limited number of time from the solution of jar 804.In one embodiment, cycle of treatment is measured with handled number of wafers.Therefore, in one embodiment, be recovered and be re-used in N wafer for the given chemical solutions of given processing station, wherein, N is some predetermined integer.After handling N wafer, described solution is diverted to carry out earial drainage.
Should be appreciated that the reclaiming system 800A-C shown in Fig. 8 A-C only is an embodiment's a exemplary illustration.The those skilled in the art will recognize that other embodiment in the scope of the invention.For example, in another embodiment of reclaiming system 800A-C, selectively, fluid can be sent into from jar 802 and be arranged in for example non-airborne recovery plant of sub-Fab.For this reason, suitable flow control apparatus (for example pneumatic valve) can be set in recovery line 804 separately.
The vacuum pump subtense angle
Referring now to Fig. 9, wherein show an embodiment of vacuum pump subtense angle 120.Usually, vacuum pump subtense angle 120 can be operable to collect waste liquid and with gas and fluid breakdown so that waste management.Correspondingly, vacuum pump subtense angle 120 is connected to each vacuum tank 436,438 (see figure 4)s and vacuum tank 802 (see figure 8)s by vacuum pipeline 902.Like this, vacuum pipeline 902 can be connected to each vacuum pipeline 444 and 446 shown in Figure 4.Although not shown in Figure 9, can in the vacuum pipeline separately ( pipeline 444 and 446 for example shown in Figure 4) of vacuum pipeline 902 and/or vacuum tank, one or more valves be set, optionally on jar separately, a vacuum is set thus.In addition, vacuum gauge 904 can be set in vacuum pipeline 902, to measure the pressure in the vacuum pipeline 902.
In one embodiment, in vacuum pipeline 902, be provided with active control pressurer system 908.Usually, active control pressurer system 908 is operable to the required pressure of keeping in the vacuum pipeline 902.Pilot pressure can help guaranteeing carrying out process control at the technology of carrying out in processing station 204 (for example seeing Fig. 4) separately by this way.For example, suppose that the arts demand of execution in given processing station 204 is kept 400 pressure that hold in the palm in vacuum pipeline 902, so, active control pressurer system 908 is operable under PID control (cooperating with controller 126) and keeps required pressure.
In one embodiment, active control pressurer system 908 comprises pressure transmitter 910 and pressure regulator 912, and they are telecommunication each other.Pressure transducer 910 is measured the pressure in the vacuum pipelines 902, sends signal to pressure regulator 912 then, makes pressure regulator 912 open or close separately variable orifice (orifice) according to the difference between measuring pressure and setting (required) pressure.
In one embodiment, placing the vacuum on the vacuum pipeline 902 is to be produced by the pump that is positioned at active control pressurer system 908 downstreams.In one embodiment, pump 914 is liquid ring pumps.Liquid ring pump is particularly advantageous, because its vibration and steady flow of treatment fluid, steam and fog safely.Although the operation of liquid ring pump is known, but still provide concise and to the point description here.But, be appreciated that embodiments of the invention are not limited to the specific operation or the configuration aspects of liquid ring pump.
Usually, liquid ring pump is operable to by being provided at the impeller that rotates freely in the eccentric housing and removes gas and fog.By in pump, infeeding liquid---normally water (being called fluid-encapsulated) is realized the vacuum pump effect.In this exemplary embodiment, fluid-encapsulated by jar 906 supplies, this jar 906 arrives pump 914 via supply line 913 fluid coupled.As example, in supply line 913, be provided with valve 958, so that optionally jar 906 and pump 914 are isolated.When entering pump in running, the fluid-encapsulated impeller blade that is rotated is pushed against on the internal surface of pump 914 housings when fluid-encapsulated, and the liquid piston to expand in the eccentric blade profile that is formed on pump case causes vacuum thus.When (in the inlet flow) gas or steam when the suction port 907 of the pump 914 that is connected with vacuum pipeline 902 enters pump 914, gas is stopped by impeller blade and liquid piston.When impeller rotated, liquid/gas/steam was inwardly promoted by the narrow space between rotor and the housing, compressed the gas of being obstructed thus.Then, when impeller is finished its rotation, discharge compressed fluid by exhaust port 909.
The exhaust port 909 of pump 914 is connected to flowline 915, and described flowline 915 stops at jar 906 places.In-individual embodiment, jars 906 liquid that are configured in will the liquid-gas stream of input further separate with gas.For this reason, jar 906 can comprise striking plate 916 in its ingress.When running into striking plate 916, liquid coagulates under blunt power effect from the input fluid.Jar 906 also can comprise demister 920.Described demister 920 generally includes the planar array that angle (for example about 90 degree) location is arranged with respect to the fluid of the demister 920 of flowing through.Cause liquid further from gas, to coagulate with the impact on demister surface.Coagulate the liquid that from inlet flow and gather the liquid storage region 918 of jar 906 bottoms, remaining any steam is discharged by exhaust line 924 simultaneously.In one embodiment, below the demister, for example just in time below striking plate 916, be positioned with degassing baffle 922.Degassing baffle 922 extends above liquid storage region 918, and at one end forms opening 921.In this structure, degassing baffle 922 allows liquid to enter liquid storage region 918 via opening 921, but prevents to be introduced again with the liquid-gas stream of input from the moisture of liquid.
In one embodiment, be contained in fluid-encapsulated in jars 906 and become to keep required fluid-encapsulated temperature by heat exchange.For example, in one embodiment, may wish the temperature that maintains below 10 ℃ fluid-encapsulated.For this reason, vacuum pump subtense angle 120 comprises cooling circuit 950.Pump 937 (for example centrifugal pump) provides machine power, and cooling circuit 950 so that fluid is flowed through.Described cooling circuit 950 comprises outlet line 936 and a pair of reflux pipeline 962,964.First reflux pipeline 962 is with the inlet of outlet line 936 fluid coupled to heat exchanger 954.Second reflux pipeline 964 is connected to the outlet of heat exchanger 954, and stops at jar 906 places, wherein, and in cooling fluid-encapsulated is assigned to jars 906 liquid storage region 918.As example, in second reflux pipeline 964, be provided with valve 960, can make a cooling circuit 950 and jar 906 isolation thus.Like this, controlled temperature fluid-encapsulated caused some steam/fog to coagulate from inlet flow and enters in the liquid of canned pump 914.
In one embodiment, heat exchanger 954 is communicated with airborne cooling system 952 fluids.In specific embodiment, described airborne cooling system 952 is a kind of cooling systems based on fluorine Lyons, and it makes fluorine Lyons heat exchanger 954 of flowing through.In context, " airborne " refers to that cooling system 952 and heat exchanger 954 physics are integrated.In another embodiment, cooling system 952 can be " non-airborne " parts, for example free-standing cooler.
In running, can make fluid-encapsulatedly to cycle through cooling circuit 950 from jar 906 in continuous or periodic mode.Flow through during heat exchanger 954 when fluid-encapsulated, this fluid is cooled and returns jars 906 subsequently.Can control the heat exchange action (that is, making fluid-encapsulated which kind of temperature that is in) of heat exchanger 954 by operation cooling system 952.For this reason, temperature transducer 953 can with fluid-encapsulated connection of comprising in the liquid storage region 918 of jar 906.The measured value that temperature transducer 953 obtains can be offered controller 126.Controller 126 can send appropriate control signals to cooling system 952 subsequently, causes the temperature that cooling system 952 is regulated fluorine Lyons (other perhaps used cooling liquid) thus.It is contemplated that equally fluid-encapsulated in the liquid storage region 918 can be by with the heat exchange of the surrounding environment of jar 906 and partly cooled off.Like this, fluid-encapsulated can keep temperature required.
In one embodiment, can be with vacuum pipeline 902 from fluid-encapsulated injection liquid ring pump 914 upstreams through cooling off of cooling off loop 950.Therefore, the supply line 957 shown in vacuum pump subtense angle 120 comprises from second reflux pipeline, 964 branches.Valve 956 is arranged in the supply line 957, can set up or disconnect cooling circuit 950 thus and be communicated with fluid between the vacuum pipeline 902.When valve 956 stayed open, a part entered vacuum pipeline 902 through fluid-encapsulated the outflow from cooling circuit 950 of cooling via supply line 957.Like this, the fluid-encapsulated gas/liquid flow that flows to liquid ring pump 914 by vacuum pipeline 902 that enters through cooling off.Like this, the relatively low fluid-encapsulated gas/liquid flow that makes input through cooling of temperature coagulates some steam or fog before entering pump 914.In one embodiment, for the inlet flow of temperature between about 80 ℃ and about 10 ℃ (from vacuum tank via vacuum pipeline 902), can be between about 5 ℃ and about 10 ℃ through the fluid-encapsulated temperature of cooling.
In one embodiment, vacuum pump subtense angle 120 is configured to monitor one or more concentration of component in fluid-encapsulated.The monitoring chemical concentration may be favourable, for example for any (for example metal) parts of protecting liquid ring pump 914 and/or other parts of vacuum pump subtense angle 120.For this reason, system 120 shown in Figure 9 comprises the active chemical concentrations control system 940 that is arranged in the cooling circuit 950.In this exemplary embodiment, concentration control system 940 comprises the chemical monitoring device 942 that is electrically connected with pneumatic valve 944, shown in bidirectional line 945.But, should be appreciated that, not directly intercommunication mutually of pneumatic valve 944, but by controller 126 communications.In running, chemical monitoring device 942 is checked one or more fluid-encapsulated component concentrations of the export pipeline 936 of flowing through.If exceeded the setting value of chemical monitoring device 942, then chemical monitoring device 942 (or in response to the controller 126 from the signal of chemical monitoring device 942) sends signal to pneumatic valve 944, pneumatic valve 944 is opened and being communicated with of earial drainage pipeline 938 thus, can discharge so that at least a portion is fluid-encapsulated.In this exemplary embodiment, safety check 939 is arranged in the earial drainage pipeline 938, in case the fluid stopping body refluxes.In addition, back pressure regulator 946 is arranged in the earial drainage pipeline 938 or some place of this earial drainage pipeline upstream.This back pressure regulator 946 has been guaranteed to keep enough pressure in cooling circuit 950, makes fluid-encapsulated continuous-flow by cooling circuit 950 thus.
In one embodiment, jars 906 optionally fluid coupled to one of them of a plurality of different earial drainage devices (drain).Then, select in described a plurality of earial drainage device specific one according to fluid-encapsulated composition (that is, component or concentration).For example, in comprising the fluid-encapsulated situation of solvent, can be with the fluid-encapsulated importing first earial drainage device, and in the situation of non-solvent/solvent-free thing, can be with the fluid-encapsulated importing second earial drainage device.Aspect at least one, this embodiment can be used for avoiding forming deposition on the given earial drainage pipeline---otherwise may when for example solvent is handled by identical earial drainage device with non-solvent/solvent-free thing, deposit.Therefore, it is contemplated that, can monitor for example independent formation of HF, NH3, HCL or IPA of fluid-encapsulated chemical solution.Earial drainage pipeline that can each importing in these chemical solutions is independent (perhaps, some combination of solution can be imported independent pipeline).In one embodiment, this can realize by the variable density of using sonic sensor to measure solution in the jar 906.
When jar 906 during by earial drainage (more generally), can have the fluid-encapsulated of enough liquid levels by providing active tank level control system 928 to keep in jars 906 in any time of system's 120 run durations.In one embodiment, active tank level control system 928 comprises pneumatic valve 944 and a plurality of fluid level sensor 934 that is arranged on the intake pipeline 926 1-2Fluid level sensor 934 can comprise for example high liquid level sensor 934 1With low liquid level sensor 934 2 Pneumatic valve 944 and a plurality of fluid level sensor 934 1-2Be electrically connected mutually via controller 126, for example shown in the dashed communications circuit 932.When operation, the fluid level in the jar 906 can enough reduce to trigger low fluid level sensor 934 2In response to this, controller 126 sends control signal opens pneumatic valve 930, to allow setting up connection via intake pipeline 926 between first sealant flow body source 970 (for example, deionized water (DIW) source) and jar 906.In case the fluid in the jar 906 returns to and is positioned at high and low liquid level sensor 934 2Between liquid level, then pneumatic valve 930 cuts out.
Have the Sealing fluid of enough liquid levels except keeping when the jar earial drainage in jars 906, active tank level control system also can be in response to from high fluid level sensor 934 2Signal and start earial drainage circulation.In other words, be enough to trigger high fluid level sensor if the fluid level in the jar 906 is elevated to, sensor will send signal to controller 126 so.In response to this, controller 126 sends signal opens pneumatic valve 944, and makes the sealant flow physical efficiency flow to earial drainage pipeline 938.
In addition, it is contemplated that jar 906 can be connected to the fluid-encapsulated or additive of any amount.For example, in one embodiment, jar 906 is connected to neutralizer source 972.Can select neutralizer to neutralize from the various components of vacuum tank via the inlet flow of vacuum pipeline 902.In one embodiment, neutralizer is acid or alkaline, and respectively can neutralization bases or acid.Can be by source 972 being connected to intake pipeline 926 at valve 974 places optionally in the future the neutralizer in self-neutralization agent source 972 introduce in jars 906.Valve 974 can be configured such that one of them or the both in source 970,972 are communicated with jar 906 fluids.
The various embodiments of chemical management system have been described here.But the disclosed embodiments only are exemplary, and the those skilled in the art will be appreciated that other embodiment in the scope of the invention.For example, the some embodiments in front provide a kind of can be airborne or the mixing machine 108 of non-airborne setting with respect to processing equipment, still, in another embodiment, can save mixing machine 108 fully.That is to say that the concrete required concrete solution of technology can be provided ready-madely and use the concentration that need not blending.Like this, the carrying shield that comes of concrete solution can be connected to inlet flow control subsystem 112, as shown in Figure 1.
Therefore, obviously, the invention provides a lot of additional embodiment that the those skilled in the art will recognize that, these embodiments within the scope of the invention.

Claims (38)

1. vacuum pump system comprises:
Vacuum pipeline with at least one fluid coupled in a plurality of fluid outputs of processing station;
Liquid ring pump, this liquid ring pump has the suction port that connects with vacuum pipeline, to receive the input multiphase flow that forms from one or more fluids of described a plurality of fluid outputs discharges;
The jar that connects with the exhaust port of liquid ring pump, this jar comprise the one or more devices that are configured for removing through the multiphase flow of exhaust port output from liquid ring pump liquid; And
Be arranged on the control pressurer system in the vacuum pipeline of liquid ring pump upstream, wherein, this control pressurer system is configured to keep goal pressure in the vacuum pipeline according to the required pressure in the processing station; With
The chemical concentrations control system, this chemical concentrations control system is configured to:
In monitoring is contained in jar and to the fluid-encapsulated concentration of liquid ring pump supply with the operation that is used for liquid ring pump; And
With a plurality of earial drainage devices of fluid-encapsulated guiding one of them, wherein, select the earial drainage device based on fluid-encapsulated composition.
2. the system as claimed in claim 1 is characterized in that, at least one in described one or more devices comprise following at least one of them:
Degassing baffle; And
Be positioned at the striking plate that jar ingress is used to receive the output of liquid ring pump.
3. the system as claimed in claim 1 is characterized in that, at least one in described one or more devices comprises demister.
4. the system as claimed in claim 1 is characterized in that, also is included in the input multiphase flow and enters the coolant source that liquid ring pump is used for injecting to this multiphase flow cooling fluid before, and the temperature of described cooling fluid is enough to make liquid to coagulate from multiphase flow.
5. the system as claimed in claim 1 is characterized in that, this chemical concentrations control system is optionally regulated fluid-encapsulated concentration.
6. the system as claimed in claim 1 is characterized in that, also comprises:
The chemical mixing machine that connects with processing station, this chemistry mixing machine is configured to mixed chemical solution for being transported to processing station.
7. system as claimed in claim 6 is characterized in that, also comprises the concentration monitor device, and this concentration monitor device can be operable to determines at least a concentration in the number of chemical product in the mixed solution of chemical mixing machine.
8. system as claimed in claim 6 is characterized in that, also comprises the concentration monitor system, and this concentration monitor system construction becomes:
Determine at least a concentration in the number of chemical product in the mixed solution of chemical mixing machine; And
In case determined that at least a chemical product does not have predetermined concentration described in the solution, then in chemical mixing machine, add a certain amount of one or more fluids, have predetermined concentration up to described at least a chemical product.
9. system as claimed in claim 8 is characterized in that, chemistry monitor system is configured to prevent that solution from flowing into processing station, has predetermined concentration up to described at least a chemical product.
10. vacuum pump system comprises:
Vacuum pipeline with at least one fluid coupled in a plurality of fluid outputs of processing station;
Liquid ring pump, this liquid ring pump has the suction port that connects with vacuum pipeline, to receive the input multiphase flow that forms from one or more fluids of described a plurality of fluid outputs discharges;
The jar that connects with the exhaust port of liquid ring pump, this jar comprise the one or more devices that are configured for removing through the multiphase flow of exhaust port output from liquid ring pump liquid; And
Coolant source, this coolant source was used for injecting cooling fluid to this multiphase flow before the input multiphase flow enters liquid ring pump, and the temperature of described cooling fluid is enough to make liquid to coagulate from multiphase flow; With
The chemical concentrations control system, this chemical concentrations control system is configured to:
In monitoring is contained in jar and to the fluid-encapsulated concentration of liquid ring pump supply with the operation that is used for liquid ring pump; And
With a plurality of earial drainage devices of fluid-encapsulated guiding one of them, wherein, select the earial drainage device based on fluid-encapsulated composition.
11. system as claimed in claim 10 is characterized in that, described coolant source is a cooling circuit, and this cooling circuit is configured to make a fluid to be recycled to a heat exchanger from jar, and then returns in the jar; Wherein, described cooling fluid is the circuit fluid, and discharges from cooling circuit at some place in heat exchanger downstream.
12. system as claimed in claim 11 is characterized in that, also comprises an airborne cooling system, this airborne cooling system is configured to the heat exchanger supply coolant.
13. system as claimed in claim 10 is characterized in that, at least one in described one or more devices comprises demister.
14. system as claimed in claim 10 is characterized in that, at least one in described one or more devices comprise following at least one of them:
Degassing baffle; And
Be positioned at the striking plate that jar ingress is used to receive the output of liquid ring pump.
15. system as claimed in claim 10 is characterized in that, also comprises chemical mixing machine, this chemistry mixing machine connects with processing station, and is configured to mixed chemical solution for being transported to processing station.
16. system as claimed in claim 15 is characterized in that, also comprises the concentration monitor device, this concentration monitor device can be operable to determines at least a concentration in the number of chemical product in the mixed solution of chemical mixing machine.
17. system as claimed in claim 15 is characterized in that, described chemical mixing machine comprises a concentration monitor system, and this concentration monitor system construction becomes:
Determine at least a concentration in the number of chemical product in the mixed solution of chemical mixing machine; And
In case determined that at least a chemical product does not have predetermined concentration described in the solution, then in chemical mixing machine, add a certain amount of one or more fluids, have predetermined concentration up to described at least a chemical product.
18. system as claimed in claim 17 is characterized in that, chemistry monitor system is configured to prevent that solution from flowing into processing station, has predetermined concentration up to described at least a chemical product.
19. a vacuum pump system comprises:
Vacuum pipeline with at least one fluid coupled in a plurality of fluid outputs of processing station;
Liquid ring pump, this liquid ring pump has the suction port that connects with vacuum pipeline, to receive the input multiphase flow that forms from one or more fluids of described a plurality of fluid outputs discharges;
The jar that connects with the exhaust port of liquid ring pump, this jar comprise the one or more devices that are configured for removing through the multiphase flow of exhaust port output from liquid ring pump liquid; And
The chemical concentrations control system.This chemical concentrations control system is configured to:
In monitoring is contained in jar and to the fluid-encapsulated concentration of liquid ring pump supply with the operation that is used for liquid ring pump;
Optionally regulate fluid-encapsulated dense giving up; And
With a plurality of earial drainage devices of fluid-encapsulated guiding one of them, wherein, select the earial drainage device based on fluid-encapsulated composition.
20. system as claimed in claim 19 is characterized in that, at least one in described one or more devices comprises demister.
21. as claim 19 fast system, it is characterized in that, at least one in described one or more devices comprise following at least one of them:
Degassing baffle; And
Be positioned at the striking plate that jar ingress is used to receive the output of liquid ring pump.
22. system as claimed in claim 19 is characterized in that, also comprises:
The chemistry mixing machine, this chemistry mixing machine connects with processing station, and is configured to mixed chemical solution for being transported to processing station.
23. the system as claimed in claim 22 is characterized in that, also comprises the concentration monitor device, this concentration monitor device can be operable to determines at least a concentration in the number of chemical product in the mixed solution of chemical mixing machine.
24. the system as claimed in claim 22 is characterized in that, also comprises the concentration monitor system, this concentration monitor system construction becomes:
Determine at least a concentration in the number of chemical product in the mixed solution of chemical mixing machine; And
In case determined that at least a chemical product does not have predetermined concentration described in the solution, then in chemical mixing machine, add a certain amount of one or more fluids, have predetermined concentration up to described at least a chemical product.
25. system as claimed in claim 24 is characterized in that, chemistry monitor system is configured to prevent flow of solution to processing station, has predetermined concentration up to described at least a chemical product.
26. a vacuum pump system comprises:
Vacuum pipeline with at least one fluid coupled in a plurality of fluid outputs of processing station;
Liquid ring pump, this liquid ring pump has the suction port that connects with vacuum pipeline, to receive the input multiphase flow that forms from one or more fluids of described a plurality of fluid outputs discharges;
The jar that connects with the exhaust port of liquid ring pump, this jar comprises the one or more devices that are configured for removing liquid from the multiphase flow of liquid ring pump output;
Be arranged on the control pressurer system in the vacuum pipeline of liquid ring pump upstream, wherein, this control pressurer system is configured to keep goal pressure in the vacuum pipeline according to the required pressure in the processing station;
The chemical concentrations control system, this chemical concentrations control system is configured to:
In monitoring is contained in jar and to the fluid-encapsulated concentration of liquid ring pump supply with the operation that is used for liquid ring pump;
Optionally regulate fluid-encapsulated concentration; And
With a plurality of earial drainage devices of fluid-encapsulated guiding one of them, wherein, select the earial drainage device based on fluid-encapsulated composition; And
Coolant source, this coolant source was used for injecting freezing mixture to this multiphase flow before the input multiphase flow enters liquid ring pump, and the temperature of described freezing mixture is enough to make liquid to coagulate from multiphase flow.
27. system as claimed in claim 26 is characterized in that, also comprises:
The chemistry mixing machine, this chemistry mixing machine connects with processing station, and is configured to mixed chemical solution for being transported to processing station.
28. system as claimed in claim 27 is characterized in that, also comprises the concentration monitor device, this concentration monitor device can be operable to determines at least a concentration in the number of chemical product in the mixed solution of chemical mixing machine.
29. system as claimed in claim 27 is characterized in that, also comprises the concentration monitor system, this concentration monitor system construction becomes:
Determine at least a concentration in the number of chemical product in the mixed solution of chemical mixing machine; And
In case determined that at least a chemical product does not have predetermined concentration described in the solution, then in chemical mixing machine, add a certain amount of one or more fluids, have predetermined concentration up to described at least a chemical product.
30. system as claimed in claim 29 is characterized in that, chemistry monitor system is configured to prevent flow of solution to processing station, has predetermined concentration up to described at least a chemical product.
31. a processing system comprises:
The chemistry mixing machine, this chemistry mixing machine is configured to come optionally and alternately be connected to the fluid input relevant with first and second processing station by the operation flow controlling unit, make when chemical mixing machine is connected to the first fluid inlet relevant with first processing station, the chemistry mixing machine disconnects with second fluid input relevant with second processing station, and vice versa;
A plurality of fluid outputs of processing station; And
Vacuum pump system, this vacuum pump system be via at least one fluid coupled at least one vacuum pipeline and the described a plurality of fluid output, and comprise:
Liquid ring pump, this liquid ring pump has the suction port that connects with vacuum pipeline, to receive the input multiphase flow that forms from one or more fluids of described a plurality of fluid outputs discharges;
The jar that connects with the exhaust port of liquid ring pump, this jar comprise the one or more devices that are configured for removing through the multiphase flow of exhaust port output from liquid ring pump liquid; And the chemical concentrations control system, this chemical concentrations control system is configured to:
In monitoring is contained in jar and to the fluid-encapsulated concentration of liquid ring pump supply with the operation that is used for liquid ring pump; And
Optionally regulate fluid-encapsulated concentration.
32. system as claimed in claim 31 is characterized in that, described vacuum pump system also comprises:
Be arranged on the control pressurer system in the vacuum pipeline of liquid ring pump upstream, wherein, described control pressurer system is configured to keep goal pressure in the vacuum pipeline according to the required pressure in the processing station.
33. system as claimed in claim 31 is characterized in that, described vacuum pump system also comprises:
Coolant source, this coolant source was used for injecting freezing mixture to this input multiphase flow before the input multiphase flow enters liquid ring pump, and the temperature of described freezing mixture is enough to make liquid to coagulate from the incoming flow multiphase flow.
34. system as claimed in claim 31 is characterized in that, also comprises:
First supply container, this first supply container comprise described first fluid inlet and first outlet that connects with first processing station; And
Second supply container, this second supply container comprise described second fluid input and second outlet that connects with second processing station; Described first and second fluid outputs connect with chemical mixing machine.
35. system as claimed in claim 31 is characterized in that, chemical mixing machine is configured to mix first chemical solution for being transported to first processing station, and mixes second chemical solution for being transported to second processing station.
36. system as claimed in claim 31 is characterized in that, chemical mixing machine comprises the concentration monitor device, and this concentration monitor device can be operable to determines at least a concentration in the number of chemical product in the mixed solution of chemical mixing machine.
37. system as claimed in claim 31 is characterized in that, chemical mixing machine comprises the concentration monitor system, and this concentration monitor system construction becomes:
Determine at least a concentration in the number of chemical product in the mixed solution of chemical mixing machine; And
In case determined that at least a chemical product does not have predetermined concentration described in the solution, then in chemical mixing machine, add a certain amount of one or more fluids, have predetermined concentration up to described at least a chemical product.
38. system as claimed in claim 37 is characterized in that, chemistry monitor system is configured to prevent flow of solution any in processing station, has predetermined concentration up to described at least a chemical product.
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US11/549,094 US7871249B2 (en) 1998-04-16 2006-10-12 Systems and methods for managing fluids using a liquid ring pump
US11/549,094 2006-10-12
PCT/IB2007/001250 WO2007135504A1 (en) 2006-05-19 2007-05-15 Systems and methods for managing fluids using a liquid ring pump

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CN101490422B (en) 2012-06-20
CN101490423A (en) 2009-07-22

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