CN101489353A - Design method for board dimension - Google Patents
Design method for board dimension Download PDFInfo
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- CN101489353A CN101489353A CNA2008103001176A CN200810300117A CN101489353A CN 101489353 A CN101489353 A CN 101489353A CN A2008103001176 A CNA2008103001176 A CN A2008103001176A CN 200810300117 A CN200810300117 A CN 200810300117A CN 101489353 A CN101489353 A CN 101489353A
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Abstract
The present invention relates to a method for designing board dimension, wherein the method comprises the following steps: setting a first designing dimension of board; providing the board with a first design dimension, dividing the surface of board to be processed to a plurality of subareas, recording the board dimension of each subarea; placing the board in a hot processing manufacture process for expanding or contracting, calculating the expansion and contact rate of each subarea, executing compensation designing to the dimension of board of each subarea thereby obtaining a second designing dimension of board and manufacturing the board with the second designing dimension, so that the dimension of board with the second designing dimension is consistent with the first designing dimension. The designing method using the board dimension according to the invention can remarkably increase the consistency of dimension of board after expanding or contracting and the designing dimension, thereby increasing the manufacturing yield rate of subsequent product, saving raw material of production and reducing the production cost.
Description
Technical field
The present invention relates to the board design technical field, relate in particular to a kind of method for designing of board dimension.
Background technology
Along with the develop rapidly of electronic industry, make more and more meticulouslyr as the circuit of the circuit board of electronic product basic building block, the hole makes more and more forr a short time.Circuit board has the branch of single sided board, double sided board and multi-layer sheet, and it is made through a series of processing procedures such as boring, pressing, etching, exposure imagings by covering the copper base material.
Cover the Copper Foil in the copper base material, rolled copper foil especially is owing to have ductility preferably, it can produce expansion because of being heated in hot processing manufacture process such as circuit board process such as pressing, laser drill, after waiting to finish hot working, can be because heat volatilize, internal temperature is reduced to room temperature and is produced contraction.Referring to document: A.Luft, U.Franz, L.Emsermann, J.Kaspar; Astudy of thermal and mechanical effects on materials induced by pulsed laserdrilling; Applied physics A:Materials Science ﹠amp; Processing; Volume 63, No.2, and 1996, Pages 93 ~ 101.This breathing effect of Copper Foil has a strong impact on the delicate execution of circuit substrate, can cause than mistake, causes the product yield lower, and then waste is produced material and increased production cost.As, for enhancing productivity and reducing cost, in actual production, during circuit board manufacturing, usually need design and cut out large scale earlier and cover the copper base material, utilize this to cover the copper base material and make the large size electro base board, and then according to actual needs the large size electro base board is cut into many small size circuit substrates.Because the breathing rate of the each point of to be processed interior apart from each other of large scale Copper Foil differs bigger, cause the live width at two places of circuit substrate apart from each other inconsistent easily.And for example, drill through in the processing procedure of hole at laser, the breathing of Copper Foil causes that easily bore position is offset design attitude in advance, and shape of through holes is distorted.For another example, in 100 microns, or even 50 microns, 25 microns the time, the breathing of Copper Foil will cause anti-welding exposure off normal in the required precision of development anti-welding procedue, particularly anti-welding exposure.
Therefore, be necessary to provide a kind of method for designing of board dimension to reduce or eliminate the obstruction that Copper Foil breathing develops to the direction that becomes more meticulous circuit board.
Summary of the invention
Below a kind of method for designing of high-precision board dimension will be described with embodiment, and produce raw material and reduce production costs to save.
The method for designing of described board dimension may further comprise the steps: set first designing dimension of board; Sheet material with this first design size is provided, the face to be processed of sheet material is divided into a plurality of subregions, write down the size of the sheet material of each subregion; And sheet material is placed hot processing manufacture process, make it that breathing take place, calculate the breathing rate of the sheet material of each subregion, and the size of the sheet material of each subregion is compensated design according to this breathing rate, thereby obtain second design size of sheet material, making has the sheet material of second design size, so that it is consistent with described first design size to have the size of sheet material after hot processing manufacture process of second design size.
The method for designing of the board dimension of the technical program is divided into a plurality of subregions by the face to be processed with sheet material, calculate the breathing rate of the sheet material of each subregion, and the size of the sheet material of each subregion is carried out design compensation according to the breathing rate of each subregion, and with the size making sheet material after this compensation, significantly improved the consistent degree of size and design size after the sheet material breathing, thus improve subsequent product the making yield, save and produce raw material and reduce production costs.
Description of drawings
Fig. 1 is the schematic diagram that the method for designing of the board dimension of the technical program designs Copper Foil.
Fig. 2 is the subregion M of Copper Foil shown in Figure 1
1Design size compensation schematic diagram.
Embodiment
The method for designing of the board dimension of the technical program be applicable to sheet material that design has an effect of expanding with heat and contract with cold as cover the copper base material, during circuit substrate in making, design size to sheet material compensates, so that the size of this sheet material behind thermo forming is consistent with design size.Because when covering the copper base material and be used for circuit board manufacturing, cover that the machined surface of copper base material is real to be copper foil surface, so the design size of covering the copper base material is to be processed size of Copper Foil.Below the Copper Foil that will cover the copper base material with design is an example, describes with the method for designing of accompanying drawing to the board dimension of the technical program in conjunction with the embodiments.
The method for designing of the board dimension that the technical program embodiment provides comprises the steps: when being used to design the Copper Foil that covers the copper base material
The first step, first design size of default Copper Foil;
Second step provided the Copper Foil with this first design size, and the face to be processed of Copper Foil is divided into a plurality of subregions, write down to be processed size of the Copper Foil of each subregion.
See also Fig. 1, Copper Foil 10 can be rolled copper foil or electrolytic copper foil, and it has to be processed 11.This first design size of to be processed 11 is long A, wide B.
Described subregion is meant in computer by related software and carries out virtual partition to be processed 11 in the design, so that follow-up first design size for the treatment of machined surface 11 according to the subregion compensation principle compensates.The number of subregion is decided according to the actual requirements.Certainly, for the needs of pinpoint accuracy, the number of subregion is The more the better.Preferably, each subregion is all rectangular, so that the breathing rate of the Copper Foil of follow-up each subregion of monitoring.
In the present embodiment, to be processed 11 has the first subregion M
1, the second subregion M
2, the 3rd subregion M
3With the 4th subregion M
4The first subregion M
1Adjacent both sides respectively with the second subregion M
2, the 3rd subregion M
3Drift angle and the 4th subregion M that limit, and these adjacent both sides altogether constitutes
4A drift angle form vertical angles.That is, if the first subregion M
1Long is L
1, wide is L
11, the second subregion M
2Long is L
2, wide is L
22, the 3rd subregion M
3Long is L
3, wide is L
33, the 4th subregion M
4Long is L
4, wide is L
44, L then
1=L
2, L
3=L
4, L
11=L
33, L
22=L
44, L
1+ L
3=A, L
11+ L
22=B.
The 3rd step, Copper Foil 10 is placed hot processing manufacture process, make it that breathing take place, calculate the breathing rate of the Copper Foil of each subregion, and the size of the Copper Foil of each subregion is compensated design according to this breathing rate, thereby obtain second design size of Copper Foil, making has the Copper Foil of second design size, so that it is consistent with described first design size to have the size of Copper Foil after hot processing manufacture process of second design size.
The harmomegathus value of the Copper Foil of described each subregion of calculating is included in and makes at least one reference region in to be processed of each subregion, in each reference region, choose at least one datum mark, so that the breathing rate of follow-up Copper Foil by measuring the datum in each subregion draws the breathing rate of each subregion Copper Foil.
Each reference region can be located at any place of each subregion, and preferably, each reference region equidistantly distributes in to be processed 11.With subregion M
1Be example, described reference region can be positioned at subregion M
1Each edge, limit.Particularly, described reference region can be and is located at subregion M
1Interior groove 12.Described groove 12 can form by chemical etching Copper Foil 10, and it is offered to Copper Foil 10 inside to be processed 11.Described datum mark can be any point on the Copper Foil of groove 12 correspondences.Preferably, described datum mark is the central point of groove 12 bottom surfaces.When sheet material be comprise Copper Foil and insulating substrate cover the copper base material time, also can etch away the part Copper Foil by the method for chemical etching, make copper foil layer and insulated base material layer surround the formation groove.Certainly, when sheet material be have multilayer copper foil cover the copper base material time, need the described outermost part Copper Foil of copper base material that covers of etching.When sheet material during for the circuit substrate in making, can obtain a reference region by etching somewhere circuit, as long as be convenient in to be processed 11, to be provided with the breathing rate that the breathing rate of discernible reference region and follow-up Copper Foil by the datum mark place draws the Copper Foil of this datum mark place subregion.In the present embodiment, Copper Foil 10 has a plurality of from its to be processed 11 groove of offering to its inside 12, and each groove 12 is located at four top corner regions of each subregion.The cross section of groove 12 is rounded, and its diameter is 1 millimeter, and described datum mark is the central point of each groove 12 bottom surface.With the first subregion M
1Be example, be provided with E, F, four datum marks of G, H in it.Described four datum marks lay respectively at subregion M
1Four drift angle districts.
What deserves to be mentioned is, because to be processed 11 of Copper Foil 10 and each subregion can be regarded as by infinite a plurality of points and form, though the Copper Foil breathing rate difference of each some corresponding position, but it is less that the breathing rate of two adjacent points changes relatively, and promptly the breathing rate of the Copper Foil of these 2 correspondences approaches a constant.Therefore,, can in each subregion, make more reference region, thereby choose more datum mark, and make described datum mark be uniformly distributed in to be processed of each subregion as far as possible for further improving precision.
For being used for the Copper Foil of circuit board manufacturing, described hot processing manufacture process comprises hot pressing, boring, processing procedure such as anti-welding.
The breathing rate of the Copper Foil of described each subregion of calculating can be by calculating each datum Copper Foil position coordinates difference of to be processed relatively 11 before and after breathing obtain.
Below with the first subregion M
1Be located at the first subregion M
1Datum mark E be example, the coordinate position difference and the subregion M of each datum Copper Foil after to be processed 11 breathing of described calculating is described
1The breathing rate.
Referring to Fig. 1, at first set up rectangular axes XOY, the first coordinate position E (X of record datum mark E
1, Y
1).Described reference axis can build in to be processed 11, that is to say, discerns the position coordinates of each datum mark in each subregion by this reference axis, and this reference axis also can build on respectively in each subregion, as long as but can mark the position coordinates of datum mark.In the present embodiment, described reference axis XOY is located in to be processed 11, and the position coordinates of all datum marks in to be processed 11 is by this reference axis XOY sign.The X-axis of described reference axis XOY is parallel to subregion M
1Length direction, Y-axis is parallel to subregion M
1Width.Secondly, Copper Foil 10 is placed environment identical with the following process parameter such as hot pressing processing procedure, make its experience processing procedure identical with the change in size of simulation Copper Foil 10 in the following process processing procedure with following process, after treating that the hot pressing processing procedure finishes, obtain second coordinate position the E ' (X of datum mark E in reference axis XOY immediately
2, Y
2) the breathing state of Copper Foil in the hot pressing processing procedure to draw datum mark E place.At last, according to the first coordinate position E (X of datum mark E
1, Y
1) and second coordinate position the E ' (X
2, Y
2), the front and back coordinate position that calculates datum mark E is poor.Subregion M then
1Breathing rate E in datum mark E place along X-axis
1Be (X
2-X
1)/X
1, along the breathing rate E of Y-axis
2Be (Y
2-Y
1)/Y
2
In like manner, it is poor to calculate the front and back coordinate position of 3 of F, G, H by preceding method.If subregion M
1Be respectively F in datum mark F, G, H three places along the breathing rate of X-axis
1, G
1, H
1, be respectively F along the breathing rate of Y-axis
2, G
2, H
2, subregion M then
1Breathing rate N along X-axis
1Be (E
1+ F
1+ G
1+ H
1)/4 are along the breathing rate N of Y-axis
2Be (E
2+ F
2+ G
2+ H
2)/4.The second subregion M
2, the 3rd subregion M
3With the 4th subregion M
4Breathing rate along X-axis and Y direction can be calculated by preceding method.
Describedly according to this breathing rate the Copper Foil of each subregion is carried out the dimension compensation design and be meant in computer and compensate by to be processed 11 first design size of related software with Copper Foil 10.
With the first subregion M
1Be example, if its breathing rate N along X-axis
1I.e. (E
1+ F
1+ G
1+ H
1)/4 are greater than zero, then the first subregion M that obtains after the compensation
1The length L of second design size
1/ (1+N
1), if N
1Less than zero, the first subregion M that obtains after then compensating
1The length of second design size be L
1/ (1-N
1), if its breathing rate N along Y-axis
2I.e. (E
2+ F
2+ G
2+ H
2)/4 are greater than zero, then the first subregion M that obtains after the compensation
1The width of second design size should be L
11/ (1+N
2), if N
2Less than zero, subregion M then
1The width of second design size should be L
11/ (1-N
2).See also Fig. 2, in the present embodiment, because N
1Greater than zero, N
2Less than zero, the first subregion M
1Swell value along X-axis is L
6, be L along the value of dwindling of Y-axis
5, therefore, subregion M
1Second design size that obtains after the compensation should be long L
1-L
6, wide L
11+ L
5The second subregion M
2, the 3rd subregion M
3With the 4th subregion M
4The length and the width of first design size can carry out design compensation by preceding method.
The method for designing of the board dimension of present embodiment is by being virtually divided into Copper Foil a plurality of subregions, calculate the Copper Foil breathing rate of each subregion, and the Copper Foil of each subregion is carried out dimension compensation according to the breathing rate of each subregion, obtain second design size of sheet material, make before the circuit board manufacturing, only need by the size of each subregion after compensation promptly second design size cut out the Copper Foil of corresponding size, and will comprise that the copper base material that covers of the Copper Foil of this second size is used for circuit board manufacturing and gets final product.Owing to before circuit board manufacturing, Copper Foil 10 has been carried out predictable design compensation, the size of Copper Foil after hot processing manufacture process with second size after the compensation can be consistent with the first design size height, therefore can reduce breathing greatly needs the influence of hot processing manufacture process goods precision to follow-up boring, anti-welding development etc., thus improve subsequent product the making yield, save and produce raw material and reduce production costs.
More than the method for designing of the board dimension of the technical program is described in detail, but can not be interpreted as it is restriction to the technical program design.Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion, and all these change the protection range that all should belong to the application's claim with distortion according to the technical conceive of the technical program.
Claims (9)
- The method for designing of [claim 1] a kind of board dimension may further comprise the steps:Set first designing dimension of board;Sheet material with this first design size is provided, the face to be processed of sheet material is divided into a plurality of subregions, write down the size of the sheet material of each subregion; AndSheet material is placed hot processing manufacture process, make it that breathing take place, calculate the breathing rate of the sheet material of each subregion, and the size of the sheet material of each subregion is compensated design according to this breathing rate, thereby obtain second design size of sheet material, making has the sheet material of second design size, so that it is consistent with described first design size to have the size of sheet material after hot processing manufacture process of second design size.
- The method for designing of [claim 2] board dimension as claimed in claim 1, it is characterized in that, the breathing rate of the sheet material of described each subregion of calculating is included in to be processed of sheet material of each subregion and makes at least one reference region, in this reference region, choose at least one datum mark, calculate the mean value of the breathing rate of the sheet material of whole datum in each subregion.
- The method for designing of [claim 3] board dimension as claimed in claim 2, it is characterized in that, in each subregion of described calculating all the mean value of the breathing rate of the sheet material of datum be included in to be processed of sheet material with described first design size and set up reference axis, write down second coordinate position of each datum mark of first coordinate position of each datum mark and this sheet material after breathing, the difference of calculating first coordinate position of each datum mark and second coordinate position draws the breathing rate of the sheet material of each datum, and calculates the step of mean value of breathing rate of the sheet material of the whole datum of each subregion according to the breathing rate of the sheet material of each datum.
- The method for designing of [claim 4] board dimension as claimed in claim 3 is characterized in that, be set forth in and set up reference axis in to be processed of sheet material with this first design size and be included in and respectively set up a reference axis in each subregion.
- The method for designing of [claim 5] board dimension as claimed in claim 1 is characterized in that, each reference region is equidistantly arranged in to be processed.
- The method for designing of [claim 6] board dimension as claimed in claim 1 is characterized in that, described each reference region lays respectively to be processed edge of described sheet material.
- The method for designing of [claim 7] board dimension as claimed in claim 5 is characterized in that, described each reference region lays respectively at the edge of described each subregion.
- [claim 8] is characterized in that as the method for designing of each described board dimension of claim 5 ~ 7, and described reference region is a groove, and described groove is offered towards sheet material inside from the to be processed of sheet material.
- The method for designing of [claim 9] board dimension as claimed in claim 8 is characterized in that, described groove cross section is circular, and described datum mark is the central point of groove floor.
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|---|---|---|---|
| CN2008103001176A CN101489353B (en) | 2008-01-16 | 2008-01-16 | Design method for board dimension |
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|---|---|---|---|
| CN2008103001176A CN101489353B (en) | 2008-01-16 | 2008-01-16 | Design method for board dimension |
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| CN101489353A true CN101489353A (en) | 2009-07-22 |
| CN101489353B CN101489353B (en) | 2011-11-16 |
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| CN108990291A (en) * | 2018-08-23 | 2018-12-11 | 佛山市顺德区骏达电子有限公司 | A kind of secondary application method of wiring board plate optimization large scale sawing sheet |
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| CN113115518A (en) * | 2021-04-13 | 2021-07-13 | 生益电子股份有限公司 | Collapsible translation method |
| US11341628B2 (en) | 2019-12-20 | 2022-05-24 | Industrial Technology Research Institute | Method for compensating design image of workpiece and system for processing design image of workpiece |
| CN115421331A (en) * | 2022-08-19 | 2022-12-02 | 柏承科技(昆山)股份有限公司 | Small piece large typesetting and positioning processing method |
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Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US5406497A (en) * | 1990-09-05 | 1995-04-11 | Vlsi Technology, Inc. | Methods of operating cell libraries and of realizing large scale integrated circuits using a programmed compiler including a cell library |
| US7117456B2 (en) * | 2003-12-03 | 2006-10-03 | International Business Machines Corporation | Circuit area minimization using scaling |
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| CN103747617A (en) * | 2013-12-24 | 2014-04-23 | 广州兴森快捷电路科技有限公司 | PCB expansion compensation method |
| CN103747617B (en) * | 2013-12-24 | 2017-02-15 | 广州兴森快捷电路科技有限公司 | PCB expansion compensation method |
| CN108990291A (en) * | 2018-08-23 | 2018-12-11 | 佛山市顺德区骏达电子有限公司 | A kind of secondary application method of wiring board plate optimization large scale sawing sheet |
| CN108990291B (en) * | 2018-08-23 | 2021-01-12 | 佛山市顺德区骏达电子有限公司 | Secondary application method for optimizing large-size cutting of circuit board plate |
| US11341628B2 (en) | 2019-12-20 | 2022-05-24 | Industrial Technology Research Institute | Method for compensating design image of workpiece and system for processing design image of workpiece |
| CN111031685A (en) * | 2019-12-25 | 2020-04-17 | 深圳市景旺电子股份有限公司 | Manufacturing method of high-frequency antenna PCB |
| CN111031685B (en) * | 2019-12-25 | 2022-06-21 | 深圳市景旺电子股份有限公司 | Manufacturing method of high-frequency antenna PCB |
| CN113115518A (en) * | 2021-04-13 | 2021-07-13 | 生益电子股份有限公司 | Collapsible translation method |
| CN115421331A (en) * | 2022-08-19 | 2022-12-02 | 柏承科技(昆山)股份有限公司 | Small piece large typesetting and positioning processing method |
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|---|---|
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Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee after: Zhending Technology Co., Ltd. Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee before: Honsentech Co., Ltd. Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |
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Granted publication date: 20111116 Termination date: 20130116 |