CN101483968A - Ejection type plasma gun and plasma processing device applying the same - Google Patents
Ejection type plasma gun and plasma processing device applying the same Download PDFInfo
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- CN101483968A CN101483968A CNA2008100022880A CN200810002288A CN101483968A CN 101483968 A CN101483968 A CN 101483968A CN A2008100022880 A CNA2008100022880 A CN A2008100022880A CN 200810002288 A CN200810002288 A CN 200810002288A CN 101483968 A CN101483968 A CN 101483968A
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Abstract
The invention provides an injection type plasma gun and a plasma device using the gun. The injection type plasma gun is used for injecting a plasma for processing surface treating to a basic material. The injection type plasma gun includes a plasma generator, a plasma nozzle and an obstruct piece. The plasma generator is used for generating plasma. The plasma nozzle is set between the basic material and the plasma generator, the plasma nozzle has a first hatch and a second hatch, the first hatch faces to the plasma generator, the second hatch faces to the basic material. The obstruct piece has a pylome that is set corresponding to the second hatch, the plasma passes through the plasma nozzle and reaches the basic material through the pylome.
Description
Technical field
The present invention relates to a kind of plasma torch and the plasma processing of using it, and particularly relevant for a kind of injecting type plasma torch and the plasma processing of using it with plasma nozzle.
Background technology
Under semiconductor industry was flourish, various preparation method and equipment were developed also polynaryly and use.Plasma can carry out cleaning surfaces, surface etching, dark etching (trenchetching), thin film deposition and surface composition and change or the like on the surface of base material.Plasma processing for example is plasma cleaning equipment (plasma cleaning), plasma-assisted chemical vapour deposition (plasma enhancechemical vapor deposition, PECVD), plasma assisted reaction formula ion(ic) etching (plasmaenhance reactive ion etching, PERIE), microwave plasma oxidation (micro waveplasma oxidation), microwave plasma nitrogenize (micro wave plasma nitridation), the ionic metal plasma deposition (ionized metal plasma, IMP) and sputter-deposited (sputter) or the like.Injecting type plasma torch (jet plasma gun) is applied in the above-mentioned plasma processing more and plasma needs the environment of ejection at a high speed.
Though plasma integral body is in electroneutral state, but in plasma atmosphere, the particle that has comprised many different potentials for example is atom (atom), free radical (radical), ion (ion), molecule (molecule), molecule free radical (molecular radical), polar molecule (polarmolecule), electronics (electron) and photon (photon) or the like.At plasma base material is carried out in the surface-treated process, plasma is easy to the face side of base material and assembles identical electrical particle.For example, when being mostly electronics in the plasma, can attract how electronegative particle toward the base material side shifting near substrate surface.Relatively, the particle of positively charged is then concentrated toward plasma torch in the other direction in the plasma, thereby forms bias voltage between plasma torch and substrate surface.Very little and plasma torch provides the high voltage plasma when the distance of substrate and plasma torch, for example be when the atmospheric plasma surface treatment, the average free footpath of particle in the plasma (mean free path) is less, produce unexpected collision between the particle, make and produce unexpected and uncontrollable paradoxical discharge reaction between plasma torch and the substrate surface, for example be the phenomenon of arcing and hairspring discharge, thereby destroy substrate surface and plasma processing.
In addition, plasma can be because the Yo-yo phenomenon of its atmosphere produces electric arc in the exit of injecting type plasma torch in the process that produces.Electric arc is to destroy the injecting type plasma torch, and its metallic is peeled off and contaminated substrate.Because the electric arc of injecting type plasma torch outlet destroys and the phenomenon of paradoxical discharge, limit the applicability of plasma to base material treatment.
Summary of the invention
The object of the invention provides a kind of injecting type plasma torch and the plasma processing of using it, in order to suppress the phenomenon of isoionic arcing and paradoxical discharge, improves the quality that base material carries out plasma treatment by insulating material.
According to an aspect of the present invention, a kind of injecting type plasma torch (jet plasma gun) is proposed, in order to spray a plasma so that a base material is carried out surface treatment.The injecting type plasma torch comprises first-class ion generator, a plasma nozzle and a barriers.Plasma generator for generating plasma.Plasma nozzle is arranged between base material and the plasma generator, and plasma nozzle has one first opening and one second opening, and first opening is towards the plasma generator, and second opening is towards base material.Barriers be an insulating part and be arranged at plasma nozzle and base material between, barriers has a through hole, it is the corresponding second opening setting, plasma is to arrive base material by plasma nozzle and via through hole.
According to a further aspect in the invention, propose a kind of plasma processing, carry out surface treatment in order to produce first-class ion pair one base material.Plasma processing comprises a bearing, an injecting type plasma torch and a cavity.The injecting type plasma torch comprises a first-class ion generator and a plasma nozzle.Base material is positioned on the loading end of bearing.Plasma generator for generating plasma.Plasma nozzle is arranged between base material and the plasma generator, and plasma nozzle has one first opening and one second opening, and first opening is towards the plasma generator, and second opening is towards bearing.Cavity is in order to ccontaining bearing and plasma nozzle, and wherein the injecting type plasma torch is to be fixedly arranged on cavity, and the loading end of bearing is electrically to intercept with cavity.
For foregoing of the present invention can be become apparent, preferred embodiment cited below particularly, and cooperate appended graphicly, be described in detail below:
Description of drawings
Figure 1A figure illustrates the schematic diagram according to the plasma processing of first embodiment of the invention;
Figure 1B illustrates the part sectioned view of the plasma nozzle of Figure 1A figure;
Fig. 2 A illustrates according to the injecting type plasma torch of second embodiment of the invention and the schematic diagram of base material;
Fig. 2 B illustrates the schematic diagram of barriers of the injecting type plasma torch of Fig. 2 A;
Fig. 3 illustrates the generalized section of another kind of plasma nozzle of the present invention and barriers;
Fig. 4 illustrates the generalized section of another plasma nozzle of the present invention and barriers.
[primary clustering symbol description]
100: plasma processing
110: plasma
130: base material
131,176,279,379: the surface
150: bearing
151: insulating barrier
170,270: the injecting type plasma torch
171: the plasma generator
172: the first openings
173: plasma nozzle
174: the second openings
190: cavity
275,375,475: barriers
277,377: through hole
D10, d50, d70: bore
H10: distance
Embodiment
First embodiment
Please be simultaneously with reference to Figure 1A and Figure 1B, Figure 1A figure illustrates the schematic diagram according to the plasma processing of first embodiment of the invention, and Figure 1B illustrates the part sectioned view of the plasma nozzle of Figure 1A figure.Plasma processing 100 carries out surface treatment in order to produce 110 pairs one base materials of a plasma 130.Plasma processing 100 comprises a bearing 150, an injecting type plasma torch (jet plasma gun) 170 and one cavity 190.Injecting type plasma torch 170 comprises a first-class ion generator 171 and a plasma nozzle 173.Base material 130 is to be positioned on the loading end of bearing 150.Plasma generator 171 is in order to produce plasma 110.Plasma nozzle 173 is arranged between base material 130 and the plasma generator 171, and it is to be towards bearing 150 towards plasma generator 171, the second openings 174 that plasma nozzle 173 has one first opening 172 and one second opening, 174, the first openings 172.Cavity 190 is in order to ccontaining bearing 150 and plasma nozzle 173, and wherein injecting type plasma torch 170 is to be fixedly arranged on cavity 190, and the loading end of bearing 150 is electrically to intercept with cavity 190.
Shown in Figure 1A figure, bearing 150 comprises an insulating barrier 151, and the upper surface of this insulating barrier 151 can be used as the loading end of bearing 150.That is insulating barrier 151 electrically intercepts the loading end of bearing 150 and the cavity 190 of ground connection, so base material 130 is the state that presents floating potential (floating potential) under the atmosphere of plasma 110.In detail, because base material 130 passes through insulating barrier 151 and cavity 190 electrically intercepts.When the electronics in plasma 110 atmosphere touched one surperficial 131 and 130 reactions of electroneutral base material of base material 130, base material 130 was electronegative positions.Owing to electronegative base material 130 can attract mutually because of positive and negative charge, the particle that orders about positively charged in the plasma 130 reacts to produce with its surface 131 near base material 130, makes base material 130 get back to electroneutral state once again.
In addition, a bore d10 of first opening, 172 minimums is in fact greater than a bore d30 of second opening, 174 maximums.Plasma 110 is by first opening, 172 to second openings 174 of convergent, is ejected to by plasma nozzle 173 on the surface 131 of base material 130.
Moreover plasma processing 100 produces plasma 110 under a normal pressure (atmospheric) environment.Plasma 110 can be in order to a kind of specified particle on the surface 131 that removes base material 130, and for example plasma processing 100 can be a plasma cleaning equipment (plasma cleaningdevice).Plasma 110 also can be in order to remove a superficial layer of base material 130, for example plasma processing 100 can be a plasma assisted reaction formula ion(ic) etching device (plasma enhancereactive ion etching, PERIE).In addition, plasma 110 is more in order to form a sedimentary deposit on base material 130, for example plasma processing can be a plasma assistant chemical vapor deposition device (plasma enhance chemical vapor deposition, PECVD), ionic metal plasma deposition device (ionized metal plasma, IMP) or a sputtering unit (sputter).In addition, plasma processing 100 can be applicable to the treatment facility of processing continuously, and plasma processing 100 more comprises a conveyer belt (not illustrating), and bearing 150 is to be positioned on the conveyer belt, and used for conveyer belt is to transport base material 130.
The plasma processing of the first embodiment of the present invention, electrically intercept by loading end and the cavity of placing base material, make base material in plasma treatment process, present the state of floating potential, avoid isoionic particle to produce polarization phenomena, also suppress plasma and produce unexpected bias voltage.Therefore, will not have the phenomenon generation of arcing or hairspring discharge between the injecting type plasma torch of present embodiment and the base material.
Second embodiment
The injecting type plasma torch of second embodiment of the invention comprises a barriers, and all the other same numerals of sentencing as hereinbefore illustrate and repeat no more.
Please be simultaneously with reference to Fig. 2 A and Fig. 2 B, Fig. 2 A illustrates according to the injecting type plasma torch of second embodiment of the invention and the schematic diagram of base material, and Fig. 2 B illustrates the schematic diagram of barriers of the injecting type plasma torch of Fig. 2 A.Injecting type plasma torch 270 comprises plasma generator 171, plasma nozzle 173 and a barriers 275.Barriers 275 be an insulating part and be arranged at plasma nozzle 173 and base material 130 between, barriers 275 has a through hole 277, it is the setting of corresponding second opening 174 (being illustrated among Figure 1B), and plasma 110 is to arrive base material 130 by plasma nozzle 173 and via through hole 277.
Shown in Figure 1B and Fig. 2 B, barriers 275 is to couple with plasma nozzle 173.Second opening 174 of plasma nozzle 173 is surfaces 176 that are positioned at plasma nozzle 173.One surface 279 of barriers 275 is the surfaces 176 towards nozzle 173, and the area on the surface 279 of barriers 275 is the area that equals surface 176 in fact at least.One bore d50 of through hole 277 maximums is the bore d30 that equals second opening, 174 minimums in fact at the most.
Furthermore, when second of plasma 110 arrival plasma nozzles 173 export 174, the surface 279 of the barriers 275 of insulation is to suppress plasma 110 to produce electric arc in the exit of plasma nozzle 173, so barriers 275 can stop plasma 110 bombardment plasma spraying rifles 270 metallics with it to shoot down to base material 130 effectively.In addition, barriers 275 need have higher chemical stability and more can bear higher temperature, and to keep stable when 110 pairs of base materials of plasma 130 carry out surface treatment, barriers 275 is preferably a quartz glass or a ceramic material.
In addition, the barriers of injecting type plasma torch can comprise how different aspects, please refer to Fig. 3, and it illustrates the generalized section of another kind of plasma nozzle of the present invention and barriers.Barriers 375 has a through hole 377, and a bore d70 of through hole 377 is the bore d30 that equal second opening 174 in fact.One surface 379 of barriers 375 more coats plasma nozzle 173.Preferably, barriers 375 is sealed with plasma nozzle 173 in rotary manner.
Moreover, please refer to Fig. 4, it illustrates the generalized section of another plasma nozzle of the present invention and barriers.Barriers 475 has a distance h 10 with plasma nozzle 173.Aspect according to different plasma processings, when barriers 475 and plasma nozzle 173 have distance h 10, barriers 475 collimater (collimator) of can arranging in pairs or groups is provided with, plasma nozzle 173 can move with respect to barriers 475, also or plasma nozzle 173 and barriers 475 can move with respect to base material 130.Increase plasma processing applicability widely.
The injecting type plasma torch of the second embodiment of the present invention comprises that a barriers is arranged between plasma nozzle and the base material, makes plasma when arriving second opening of plasma nozzle, not reason cyclone phenomenon bombardment injecting type plasma torch.And plasma is through behind the through hole of barriers, and isoionic air-flow and electrical property state thereof more tend towards stability, and therefore can promote the quality of substrate surface treatment.
Disclosed injecting type plasma torch of the above embodiment of the present invention and the plasma processing of using it, base material is to be positioned on the loading end of the microscope carrier that is electrically insulated with cavity, is that a barriers is set between plasma nozzle and base material.Leave the outlet of plasma nozzle at plasma after, because the microscope carrier that is electrically insulated, plasma can not produce unusual electric discharge phenomena between injecting type plasma torch and base material, therefore can make plasma stably base material be carried out surface treatment.Be arranged between plasma nozzle and the base material by barriers, can suppress plasma and outside plasma nozzle, form electric arc, or shoot down the particle pollution base material of plasma spray nozzle surface.So injecting type plasma torch of the present invention and the plasma processing of using it, when carrying out the surface treatment of base material, the may command plasma is in more stable status, and then improves the quality of substrate surface treatment and the range of application of plasma processing.
In sum, though the present invention discloses as above with preferred embodiment, so it is not in order to limit the present invention.The persond having ordinary knowledge in the technical field of the present invention, without departing from the spirit and scope of the present invention, when being used for a variety of modifications and variations.Therefore, protection scope of the present invention is when looking accompanying being as the criterion that claim defines.
Claims (10)
1. injecting type plasma torch in order to spray a plasma so that a base material is carried out surface treatment, is characterized in that this injecting type plasma torch comprises:
First-class ion generator is in order to produce this plasma;
One plasma nozzle is arranged between this base material and these ion generators, and this plasma nozzle has one first opening and one second opening, and this first opening is towards these ion generators, and this second opening is towards this base material; And
One barriers, its be an insulating part and be arranged at this plasma nozzle and this base material between, this barriers has a through hole, it is to should the second opening setting, this plasma is to arrive this base material by this plasma nozzle and via this through hole.
2. injecting type plasma torch as claimed in claim 1, it is characterized in that, this second opening is positioned at a first surface of this plasma nozzle, and a second surface of this barriers is towards this first surface, and the area of this second surface is the area that equals this first surface at least.
3. injecting type plasma torch as claimed in claim 1 is characterized in that the maximum caliber of this through hole equals the lowest calibre of this second opening.
4. injecting type plasma torch as claimed in claim 1 is characterized in that, this barriers is to comprise coupling, coating this plasma nozzle with this plasma nozzle or keep a spacing with this plasma nozzle.
5. injecting type plasma torch as claimed in claim 1 is characterized in that, this plasma be comprise a kind of specified particle in order to the surface that removes this base material, in order to the superficial layer that removes this base material or in order on this base material, to form a sedimentary deposit.
6. injecting type plasma torch as claimed in claim 1 is characterized in that, this barriers be a ceramic material or a quartz glass both wherein one.
7. a plasma processing carries out surface treatment in order to produce first-class ion pair one base material, it is characterized in that this plasma treatment equipment comprises:
One bearing, this base material are to be positioned on the loading end of this bearing;
One injecting type plasma torch comprises:
First-class ion generator is in order to produce this plasma; And
One plasma nozzle is arranged between this base material and these ion generators, and this plasma nozzle has one first opening and one second opening, and this first opening is towards these ion generators, and this second opening is towards this bearing; And
One cavity, in order to ccontaining this bearing and this plasma nozzle, wherein this injecting type plasma torch is to be fixedly arranged on this cavity, this loading end of this bearing is electrically to intercept with this cavity.
8. plasma processing as claimed in claim 7 is characterized in that this bearing comprises an insulating barrier, and a surface of this insulating barrier is as this loading end.
9. plasma processing as claimed in claim 7 is characterized in that, this injecting type plasma torch also comprises:
One barriers, its be an insulating part and be arranged at this plasma nozzle and this base material between, this barriers has a through hole, it is to should the second opening setting, this plasma is to arrive this base material by this plasma nozzle and via this through hole.
10. plasma processing as claimed in claim 7 is characterized in that, this equipment is to produce this plasma under an atmospheric pressure environment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100022880A CN101483968B (en) | 2008-01-08 | 2008-01-08 | Ejection type plasma gun and plasma processing device applying the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100022880A CN101483968B (en) | 2008-01-08 | 2008-01-08 | Ejection type plasma gun and plasma processing device applying the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101483968A true CN101483968A (en) | 2009-07-15 |
| CN101483968B CN101483968B (en) | 2012-01-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008100022880A Active CN101483968B (en) | 2008-01-08 | 2008-01-08 | Ejection type plasma gun and plasma processing device applying the same |
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| CN (1) | CN101483968B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101998746A (en) * | 2009-08-24 | 2011-03-30 | 通用电气公司 | Gas distribution ring assembly for plasma spray system |
| CN102291923A (en) * | 2011-08-10 | 2011-12-21 | 苏州工业职业技术学院 | Plasma gun |
| CN108370639A (en) * | 2015-12-07 | 2018-08-03 | 等离子体处理有限公司 | The method of device and processing workpiece surface for generating atmospheric plasma beam |
| CN112531180A (en) * | 2019-09-17 | 2021-03-19 | 全球能源互联网研究院有限公司 | Method for removing anode carbon deposit of flat-plate battery |
| CN112531180B (en) * | 2019-09-17 | 2024-05-31 | 全球能源互联网研究院有限公司 | Method for removing carbon deposit on anode of flat plate type battery |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1029135C (en) * | 1987-04-03 | 1995-06-28 | 富士通株式会社 | Method and apparatus for vapor deposition of diamond |
| US5393952A (en) * | 1991-02-28 | 1995-02-28 | Kabushiki Kaisha Komatsu Seisakusho | Plasma torch for cutting use with nozzle protection cap having annular secondary GPS passage and insulator disposed in the secondary gas passage |
| JP4287936B2 (en) * | 1999-02-01 | 2009-07-01 | 中外炉工業株式会社 | Vacuum deposition system |
| CN200997720Y (en) * | 2007-01-25 | 2007-12-26 | 普利喜科技股份有限公司 | Plasma torch device for producing activated gas |
-
2008
- 2008-01-08 CN CN2008100022880A patent/CN101483968B/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101998746A (en) * | 2009-08-24 | 2011-03-30 | 通用电气公司 | Gas distribution ring assembly for plasma spray system |
| CN102291923A (en) * | 2011-08-10 | 2011-12-21 | 苏州工业职业技术学院 | Plasma gun |
| CN108370639A (en) * | 2015-12-07 | 2018-08-03 | 等离子体处理有限公司 | The method of device and processing workpiece surface for generating atmospheric plasma beam |
| US10555411B2 (en) | 2015-12-07 | 2020-02-04 | Plasmatreat Gmbh | Device for generating an atmospheric plasma beam, and method for treating the surface of a workpiece |
| CN112531180A (en) * | 2019-09-17 | 2021-03-19 | 全球能源互联网研究院有限公司 | Method for removing anode carbon deposit of flat-plate battery |
| CN112531180B (en) * | 2019-09-17 | 2024-05-31 | 全球能源互联网研究院有限公司 | Method for removing carbon deposit on anode of flat plate type battery |
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| Publication number | Publication date |
|---|---|
| CN101483968B (en) | 2012-01-11 |
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