CN101474923A - Non-contact type embedded body of electronic credential and method for producing the same - Google Patents
Non-contact type embedded body of electronic credential and method for producing the same Download PDFInfo
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- CN101474923A CN101474923A CN 200810204345 CN200810204345A CN101474923A CN 101474923 A CN101474923 A CN 101474923A CN 200810204345 CN200810204345 CN 200810204345 CN 200810204345 A CN200810204345 A CN 200810204345A CN 101474923 A CN101474923 A CN 101474923A
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Abstract
The invention provides a non-contact embedded body of an electronic certificate and a method for manufacturing the same. The embedded body comprises an upper protective layer, an upper connecting layer, a chip bearing bed, a lower connecting layer and a lower protective layer which are molten and compounded from top to bottom in sequence. The materials of the upper protective layer and the lower protective layer are a flexible material suitable for combining the certificate binding process and the prior paperhanging adhesive. The materials of the upper protective layer and the lower protective layer are fiber materials with a textile structure, or non-woven fabric, or paper or cotton fabric. The materials of the connecting layers are macromolecular and thermoplastic elastic films. The invention also provides the method for manufacturing the non-contact embedded body of the electronic certificate. The method comprise: melting and compounding the upper protective layer, the upper connecting layer, the chip bearing bed, the lower connecting layer and the lower protective layer from top to bottom to obtain the product. The embedded body has the advantages of strong fastness, warp resistance and flexure resistance. The material choosing range is widened through a reasonable layer structure, and the manufacturing method is simple and greatly reduces the manufacture cost.
Description
Technical field
The present invention relates to the non-contact type embedded body (INLAY) of electronic certificate, particularly relate to the interior contactless identification embedded body such as the electronic identity certificate front cover that is used for passport, pilot's card, seaman's book, press card and the manufacture method of such embedded body.
Background technology
Along with going deep into of anti-counterfeiting technology, requirement to identification class certificate is more and more higher, technical characterstics such as REID (RFID) is safe owing to having, nothing exposes the contact may be applied in the electronic identity certificate more, how to make the noncontact embedded body can adapt to the streamline binding process of certificate, the binding process and the pattern that keep original certificate to greatest extent, the integral body of certificate requires to meet International Civil Aviation Organization (ICAO) standard behind the control adding embedded body becomes the important topic that non-contact type embedded body manufacturing needs solve.
The comparatively general non-contact type embedded body that is used for card-type credentials because the material material of using is comparatively stiffening, is not suitable for being placed in the certificate front cover at present.
And use the composition material of certain material in most of national E-Passport certificate now as non-contact type embedded body in the certificate, as in patent US7059535, having used the skin-material of special expanded polyolefin macromolecular material as non-contact type embedded body, but the selection of material is comparatively single, does not have popularity.
Summary of the invention
The objective of the invention is to, the non-contact type embedded body and the manufacture method thereof of the electronic certificate of strong, the anti-bending of a kind of fastness, warp resistance is provided.
The present invention adopts following technical scheme:
A kind of non-contact type embedded body of electronic certificate comprises the compound last protective layer of fusion, last articulamentum, chip bearing layer, following articulamentum, lower protective layer from top to bottom successively.
Further, the described material of protective layer and lower protective layer of going up is for being fit to the flexible material that the certificate binding process combines with tradition paper adhesive.
Further, the described material of going up protective layer and lower protective layer is to have the fibrous material of textile structural or the cloth of nonwoven or paper or cotton material.Further, the described thickness of going up protective layer and lower protective layer is 0.1mm～0.2mm.
Further, the described material of going up articulamentum and following articulamentum has a macromolecular thermoplastic elastomer thin film material for softness.
Further, the described material of going up articulamentum and following articulamentum is a kind of in the following high molecular polymer or derivatives thereof:
Polyurethane, polyamide, polyethylene-vinylacetate, polyethylene, polypropylene, styrene, polyvinyl chloride, Organic fluoride, PETG, polymethyl methacrylate, polyether sulfone, polyester, organosilicon.
Further, the described thickness of going up articulamentum and following articulamentum is 0.012mm～0.1mm.
Further, the material of described chip bearing layer is soft insulating layer and thermoplastic high molecular film material.
Further, the structure of described chip bearing layer is two-layer.
Further, the thickness of described chip bearing layer is 0.06mm～0.35mm.
Further, the material of described chip bearing layer 3 is a kind of in the following high molecular polymer or derivatives thereof:
Polyethylene, polypropylene, PETG, Merlon, polyamide, polyvinyl chloride.
Further, the compound last protective layer of described fusion, go up articulamentum, chip bearing layer, the gross thickness of articulamentum, lower protective layer is 0.4mm～0.6mm down.
The present invention also provides a kind of manufacture method of non-contact type embedded body of electronic certificate, and the last protective layer that comprises successively from top to bottom, last articulamentum, chip bearing layer, following articulamentum, lower protective layer are made by fusion is compound.Further, will go up protective layer and last articulamentum earlier, after down articulamentum and lower protective layer carry out in advance Combined Processing, fusion is compound again.
Further, described chip bearing layer is two-layer structure.
The non-contact type embedded body of electronic certificate of the present invention has the advantage of strong, the anti-bending of fastness, warp resistance, and by its rational layer structure, the range of choice of the material of widening, and its manufacture method is simple, greatly reduces manufacturing cost.
Description of drawings
Fig. 1 to Fig. 4 is the embodiment of the non-contact type embedded body of electronic certificate of the present invention.
The specific embodiment
As shown in Figure 1, a kind of non-contact type embedded body of electronic certificate comprises the compound last protective layer 1 of fusion, last articulamentum 2, chip bearing layer 3, following articulamentum 4, lower protective layer 5 from top to bottom successively.
Wherein, last protective layer 1 and lower protective layer 5 paper that can be used as page or leaf in the certificate or front cover papers bookbinding.Last articulamentum 2 and following articulamentum 4 are respectively applied for the effect that is connected of protective layer 1 and chip bearing layer 3, lower protective layer 4 and chip bearing layer 3.Chip bearing layer 3 is the carrier of noncontact coil and chip, and noncontact coil and chip 6 are located in the described chip bearing layer 3.
Wherein, last protective layer 1 and lower protective layer 5 can use and be fit to certificate binding process and the stronger flexible material of tradition paper adhesive adhesion, play the coil and the chip 6 of protection embedded body inside simultaneously and avoid outside impact action.The material of last protective layer 1 and lower protective layer 5 can select to have the fibrous material or the nonwoven of textile structural, also can be paper, preferably selects the cloth of cotton material for use.The described thickness of going up protective layer 1 and lower protective layer 5 is 0.1mm～0.2mm, and preferred thickness is 0.12mm～0.15mm.
Wherein, described articulamentum 2 and the following articulamentum 4 gone up can use the soft macromolecular thermoplastic elastomer thin film material that has, the described material of going up articulamentum 2 and 4 selections of following articulamentum under molten condition, should guarantee protective layer 1, on the material of articulamentum 2, chip bearing layer 3, following articulamentum 4 and lower protective layer 5 fuse together securely.Therefore, the described material of going up articulamentum 2 and following articulamentum 4 can be but be not limited to comprise high molecular polymer or derivatives thereofs such as polyurethane (PU), polyamide (PA), polyethylene-vinylacetate (EVA), polyethylene (PE), polypropylene (PP), styrene (PS), polyvinyl chloride (PVC), Organic fluoride (PF), PETG (PET), polymethyl methacrylate (PMMA), polyether sulfone (PES), polyester, organosilicon.In the present embodiment, the described thickness of going up articulamentum 2 and following articulamentum 4 is respectively 0.012mm～0.1mm.Can under the prerequisite of the performance that guarantees the compound fastness of fusion, the whole anti-bending of embedded body, warp resistance, together protect noncontact coil and chip 6 like this with last protective layer 1, lower protective layer 5 and chip bearing layer 3.
Wherein, because last articulamentum 2 and last protective layer 1, following articulamentum 4 and the comparatively soft frivolous difficult processing cross cutting of lower protective layer 5; can will go up articulamentum 2 and last protective layer 1, articulamentum 4 and lower protective layer 5 adopt complex methods such as elevated temperature heat composite algorithms, adhesive applying method or The tape casting compound in advance good down, two-layer material is convenient to cross cutting processing after compound in advance.If use adhesive applying method, employed adhesive can use the adhesive of environment-friendly type.
Wherein, the material of chip bearing layer 3 can use soft insulating layer and thermoplastic high molecular film material.Can noncontact coil and chip 6 be placed on the chip bearing layer 3 by the mode of imbedding or pasting.
Different according to the combination of the thickness of noncontact coil and chip 6 chips and coil, chip and chip bearing layer 3, the structure of described chip bearing layer 3 can be one or more layers.The gross thickness of described chip bearing layer 3 is generally 0.06mm～0.35mm.Constitute chip bearing layer 3 material can but be not limited to comprise polyethylene (PE), polypropylene (PP), PETG (PET), Merlon (PC), polyamide (PA), polyvinyl chloride macromolecular material or derivatives thereofs such as (PVC).
Because the material of last articulamentum 2, following articulamentum 4 and the material of chip bearing layer 3 all have thermoplastic property, under hot environment, its melt flow characteristics can be coated on noncontact coil and chip 6 in the thin-film material of articulamentum 2, following articulamentum 4 and chip bearing layer 3 formation, play the fixedly effect of noncontact coil and chip 6 better, improve the performance of the whole anti-bending of embedded body, warp resistance.
After described last protective layer 1, last articulamentum 2, chip bearing layer 3, following articulamentum 4, lower protective layer 5 stack, once laminated into type under the HTHP vacuum condition, become end product according to the size cross cutting then.The thickness of final products is 0.4mm～0.6mm.As long as after using traditional paper adhesive and interior page or leaf and front cover to paper, just can make the electronic certificate that contains non-contact type embedded body.Because above-mentioned five layers of material that is frivolous softness, so finished product is comparatively soft, the integral thickness of binding into front cover behind the electronic certificate is less than 0.9mm.
All raw material of the present invention is fit to carry out large-scale production and can cause adverse influence to environment all to select for use environmental friendliness, free of contamination environment-friendly materials to be advisable.
Following illustrative example explanation the foregoing description.
Example one
With reference to structure shown in Figure 1, the material of protective layer 1, last articulamentum 2, chip bearing layer 3, following articulamentum 4, lower protective layer 5 in the preparation.Last protective layer 1 and lower protective layer 5 use and are fit to certificate binding process and the stronger flexible material of tradition paper adhesive adhesion.Chip bearing layer 3 is carried out the cross cutting of chip hole, on chip bearing layer 3, carry out the embedding work of noncontact coil and chip 6 then.The thickness of this example chips bearing bed 3 is that 0.15～0.25mm is advisable, and last articulamentum 2 and following articulamentum 4 thickness are 0.04～0.06mm, and the thickness of last protective layer and lower protective layer is 0.12～0.15mm.After all material is ready, to stack according to Fig. 1 finish after, under high temperature, high pressure, vacuum state, carry out lamination, laminating temperature should be chosen near the softening point of thermoplastic, pressure is advisable not destroy chip.Product after lamination finished carry out behind the cross cutting non-contact type embedded body product to the end.The thickness of last non-contact type embedded body product should be about 0.5mm.
Example two
As shown in Figure 2, will go up protective layer 1 and last articulamentum 2 earlier, after down articulamentum 4 and lower protective layer 5 carry out in advance Combined Processing, obtaining thickness is last composite material 12 and the following composite material 45 of 0.1mm～0.2mm.Complex method can be used the elevated temperature heat composite algorithm, and The tape casting is directly compound, and the mode that also can use adhesive to fit again according to carrying out the HTHP operation described in the example one, is made non-contact type embedded body finished product as shown in Figure 2 after the applying at last.
Example three
As shown in Figure 3, when making non-contact type embedded body, according to the structure of the structural adjustment non-contact type embedded body of chip, as chip bearing layer 3 being adjusted into the double-layer structure of ground floor structure 31 and second layer structure 32, to adapt to the thickness of chip.For example the thickness of ground floor structure 31 is 0.1mm, and the thickness of second layer structure 32 is 0.15mm, and then according to the operation of example one, makes the finished product of non-contact type embedded body as shown in Figure 3 at last.
Example four
As shown in Figure 4, the upper surface of non-contact type embedded body 12345 finished products of making and front cover 10 papers, the mode of its lower surface and interior page or leaf 20 papers is made the electronic identity certificate.Also the part of non-contact type embedded body 12345 as interior page or leaf can be participated in binding, promptly the upper surface of non-contact type embedded body 12345 finished products, lower surface all paper, bind with interior page or leaf, make electronic certificate with the front cover paper then.
Above-described embodiment only is used to illustrate technological thought of the present invention and characteristics, its purpose makes those skilled in the art can understand content of the present invention and is implementing according to this, when can not only limiting claim of the present invention with present embodiment, be all equal variation or modifications of doing according to disclosed spirit, still drop in the claim of the present invention.
Claims (15)
1, a kind of non-contact type embedded body of electronic certificate is characterized in that: comprise the compound last protective layer of fusion, last articulamentum, chip bearing layer, following articulamentum, lower protective layer from top to bottom successively.
2, the non-contact type embedded body of electronic certificate according to claim 1 is characterized in that: the described material of protective layer and lower protective layer of going up is for being fit to the flexible material that the certificate binding process combines with tradition paper adhesive.
3, the non-contact type embedded body of electronic certificate according to claim 2 is characterized in that: the described material of going up protective layer and lower protective layer is to have the fibrous material of textile structural or the cloth of nonwoven or paper or cotton material.
4, the non-contact type embedded body of electronic certificate according to claim 3 is characterized in that: the described thickness of going up protective layer and lower protective layer is 0.1mm～0.2mm.
5, according to the non-contact type embedded body of the described electronic certificate of arbitrary claim in the claim 1 to 4, it is characterized in that: the described material of going up articulamentum and following articulamentum has a macromolecular thermoplastic elastomer thin film material for softness.
6, the non-contact type embedded body of electronic certificate according to claim 5 is characterized in that: the described material of going up articulamentum and following articulamentum is a kind of in the following high molecular polymer or derivatives thereof:
Polyurethane, polyamide, plastic of poly vinyl acetate, polyethylene, polypropylene, styrene, polyvinyl chloride, Organic fluoride, PETG, polymethyl methacrylate, polyether sulfone, polyester, organosilicon.
7, the non-contact type embedded body of electronic certificate according to claim 6 is characterized in that: the described thickness of going up articulamentum and following articulamentum is 0.012mm～0.1mm.
8, the non-contact type embedded body of electronic certificate according to claim 7 is characterized in that: the material of described chip bearing layer is soft insulating layer and thermoplastic high molecular film material.
9, the non-contact type embedded body of electronic certificate according to claim 8 is characterized in that: the structure of described chip bearing layer is two-layer.
10, the non-contact type embedded body of electronic certificate according to claim 9 is characterized in that: the thickness of described chip bearing layer is 0.06mm～0.35mm.
11, according to the non-contact type embedded body of the described electronic certificate of arbitrary claim in the claim 6 to 10, it is characterized in that: the material of described chip bearing layer 3 is a kind of in the following high molecular polymer or derivatives thereof:
Polyethylene, polypropylene, PETG, Merlon, polyamide, polyvinyl chloride.
12, the non-contact type embedded body of electronic certificate according to claim 11 is characterized in that: the compound last protective layer of described fusion, go up articulamentum, chip bearing layer, the gross thickness of articulamentum, lower protective layer is 0.4mm～0.6mm down.
13, a kind of manufacture method of non-contact type embedded body of electronic certificate is characterized in that: incite somebody to action the last protective layer that comprise successively from top to bottom, last articulamentum, chip bearing layer, descend articulamentum, lower protective layer to make by fusion is compound.
14, the manufacture method of the non-contact type embedded body of electronic certificate according to claim 13 is characterized in that: will go up protective layer and last articulamentum earlier, after down articulamentum and lower protective layer carry out in advance Combined Processing, fusion is compound again.
15, the manufacture method of the non-contact type embedded body of electronic certificate according to claim 14 is characterized in that: described chip bearing layer is two-layer structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810204345 CN101474923A (en) | 2008-12-10 | 2008-12-10 | Non-contact type embedded body of electronic credential and method for producing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810204345 CN101474923A (en) | 2008-12-10 | 2008-12-10 | Non-contact type embedded body of electronic credential and method for producing the same |
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| Publication Number | Publication Date |
|---|---|
| CN101474923A true CN101474923A (en) | 2009-07-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200810204345 Pending CN101474923A (en) | 2008-12-10 | 2008-12-10 | Non-contact type embedded body of electronic credential and method for producing the same |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103839101A (en) * | 2014-03-18 | 2014-06-04 | 陈昊 | High temperature resistant PC card for automobile electronic mark |
| CN109003698A (en) * | 2017-06-07 | 2018-12-14 | E.I.内穆尔杜邦公司 | Flexible electric conductor in thermoformed articles |
-
2008
- 2008-12-10 CN CN 200810204345 patent/CN101474923A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103839101A (en) * | 2014-03-18 | 2014-06-04 | 陈昊 | High temperature resistant PC card for automobile electronic mark |
| CN109003698A (en) * | 2017-06-07 | 2018-12-14 | E.I.内穆尔杜邦公司 | Flexible electric conductor in thermoformed articles |
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Open date: 20090708 |