CN101470356A - Decribing apparatus and method - Google Patents
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- CN101470356A CN101470356A CNA2008101850544A CN200810185054A CN101470356A CN 101470356 A CN101470356 A CN 101470356A CN A2008101850544 A CNA2008101850544 A CN A2008101850544A CN 200810185054 A CN200810185054 A CN 200810185054A CN 101470356 A CN101470356 A CN 101470356A
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Abstract
The present invention provides a drawing device and a drawing method. The drawing processing speed is increased and a pattern with high precision is formed through a simple structure. Six partial modulating areas (D1-D6) are prescribed in DMD. The multiple exposure actions which use step-and-repeat are executed according to an exposure space (RS) corresponding with the width of one partial modulating area. In each exposure action, the exposure ON area (MON) and of control micro-mirror is prescribed and the whole body of micro-mirror of partial modulating area is set to an exposure OFF area (MOFF) in OFF state based on the raster data (portrayed data). The light is irradiated to a substrate (SW) through the micro-mirror which is positioned at the partial modulating area of the exposure ON area (MON). Furthermore, when the exposure action is executed, the combination composing partial modulating areas of the exposure ON area (MON) and the exposure OFF area (MOFF) is updated. The exposure ON area (MON) and the exposure OFF area (MOFF) are changed for shifting the exposure ON area (MON) circularly.
Description
Technical field
The present invention relates to a kind of quilt and describe to form on the body drawing apparatus and the plotting method of the pattern of circuit pattern etc. at electronic circuit board etc.Particularly relate to two-dimensional arrangements such as micro mirrors is the control of the rectangular exposing unit that forms.
Background technology
In the manufacturing engineering of substrate, the photosensitive material of painting photoresist etc. is perhaps described the processing of describing that body is used to form pattern to the quilt that sticks.As drawing apparatus, the known drawing apparatus (for example with reference to patent documentation 1,2,3) that uses for example LCD, DMD (Digital Micro-mirror Device, Digital Micromirror Device) etc. spatial optical modulation element (unit) two-dimensional arrangements to be become rectangular exposing unit (photomodulator).
Under the situation of describing to handle, describe body, the point of irradiation (exposure region) of two above exposing units is relatively moved toward the direction of scanning for the quilt that is placed on the drawing apparatus worktable.Then, according to the position of passing through of exposure region,, make to form and the corresponding pattern in this position with predetermined each spatial optical modulation element of timing controlled.When describing to handle,, make and form figuratum substrate through the predetermined operation that development treatment, etching, resist layer are peeled off etc.There is substep to repeat (step﹠amp as plotting method is known; Repeat) move mode, continuous move mode etc., the multiple-exposure mode of shining the same area repeatedly and repeatedly in addition in addition.
In drawing apparatus, will convert raster data from the pattern data of vector data of transmissions such as CAD system etc. to, and raster data will be controlled the spatial optical modulation element of micro mirror etc. as describing data as delineate.Carry out the input of these pattern datas repeatedly, to the conversion of raster data and the control of spatial optical modulation element, upgrade when whenever carrying out exposure actions and describe data.
In such drawing apparatus, when whenever carrying out exposure actions, upgrade the data of describing with huge data volume, thus when the conversion of pattern data and data transfer process, want spended time, and then can not shorten whole describe the processing time (handling capacity).As the Data Update time method that is used to shorten DMD, known for example have a following method: rectangular DMD is divided into zone more than two, with the micro mirror in the zone of finishing to transmit reset successively (with reference to patent documentation 4).In addition, be used for not using mechanical shutter and shorten the Data Update time method, also known have a following method: being provided for storing with the DMD set overall is the OFF memory of data of OFF state, according to the time shutter of process, the OFF data is sent to DMD (with reference to patent documentation 5).
Patent documentation 1: 2003-No. 57836 communiques of TOHKEMY
Patent documentation 2: 2003-No. 15309 communiques of TOHKEMY
Patent documentation 3: the international communique that discloses No. 02/12961
Patent documentation 4: 2005-No. 55881 communiques of TOHKEMY
Patent documentation 5: 2004-No. 128272 communiques of TOHKEMY
Under the situation of multiple-exposure mode, the once irradiating time (time shutter) must be shortened, to improve sweep velocity.But, because describing Data Update and will expending time in of DMD integral body so even irradiation time shortens, can not begin next exposure actions, can not improve sweep velocity.On the other hand, only micro mirror is resetted, can not directly adjust the required exposure of substrate, can not effectively improve drawing processing speed by each cut zone.
Summary of the invention
Drawing apparatus of the present invention is the drawing apparatus that can realize multiple-exposure, has: at least one exposing unit, and it is by two above spatial optical modulation elements are arranged in rectangular forming; Scanning element, it makes exposure region describe body for quilts such as substrates and relatively moves along the direction of scanning, and described exposure region is the view field of exposing unit.The exposing unit of DMD, LCD, SLM etc. will import from the illumination light of light source according to pattern and be described body, and be made of the outer spatial optical modulation element (unit) of substrate or substrate that illumination light is selectively imported to of micro mirror and liquid crystal cell etc.As light source, can use high-pressure sodium lamp, xenon lamp, LED and LASER Light Source etc.Scanning element relatively moves exposure region by substep repetitive mode that for example intermittently moves or the continuous move mode that moves continuously etc.
In addition, drawing apparatus has: describe data processing unit, its pattern data according to input generates describes data; And exposure control module, it controls two above spatial optical modulation elements by describing DCU data control unit based on the relative position of describing data and exposure region, according to making the overlapping mode of exposure region carry out exposure actions in interval (exposure spacing) within a predetermined distance.Pattern data is the vector data that generates when design such as CAD/CAM data for example.That describes that data representation is used to control optical modulation elements such as raster data describes to use data.
Exposure control module of the present invention is cut apart exposing unit and is stipulated to control spatial optical modulation element by each part modulation areas in plural zone (hereinafter referred to as the part modulation areas).At this, the exposure ON zone that regulation is formed by the part modulation areas of a part, and stipulate the exposure OFF zone that forms by in addition part modulation areas.Exposure OFF zone is the zone that does not import illumination light as a whole to substrate, and the exposure control module is carried out exposure actions by the spatial optical modulation element that is positioned at exposure ON zone.Then, exposure control module limit changes the combination that constitutes the exposure ON zone and the part modulation areas in exposure OFF zone, and exposure actions is carried out on the limit.
According to such structure, can carry out exposure actions by a part of zone of exposing unit, can switch exposure ON zone for satisfying necessary exposure.Its result improves sweep velocity when can satisfying necessary exposure, utilize suitable exposure to form pattern when can improving drawing processing speed.
About the regulation of part modulation areas, its quantity and dividing method can be arbitrarily, can be defined as exposure ON zone with at least 2 part modulation areas in the modulation areas of top with described two.In order easily to carry out the multiple-exposure action, preferably exposing unit is divided equally.For example, with making the exposure region distance corresponding, make exposure region moving exposure amount of separation when whenever carrying out exposure actions as the exposure spacing with part modulation areas width.
To the necessary exposure of plane of exposure according to the character of substrate etc. and different.In order to keep certain describing task time in the limit, the limit makes exposure be in appropriate state all the time, can switch exposure ON/OFF zone, shine the light of the exposure frequency of the exposure that satisfies the essence needs with target area from body to quilt that describe, and when exposure actions in addition, do not make illumination be mapped to this zone.Therefore, the exposure control module is in the entire portion modulation areas, and regulation exposure OFF regional percentage is identical with scan efficiency.Wherein, scan efficiency represents that necessary irradiation time (time shutter) describes data with respect to renewal and begin the ratio of the time before the next exposure actions.
Consider to change this situation of exposure ON/OFF zone regularly, the control module that preferably exposes makes exposure ON zone ring shift.At this, follow bad displacement and mean that the each several part modulation areas that makes formation exposure ON zone is to the adjacent part modulation areas displacement of phase place.Wherein, the part modulation areas about the two ends that are positioned at exposing unit also is made as adjacent continuously at this.
Under the situation that makes exposure ON zone ring shift, for the same area is carried out multiple-exposure as far as possible continuously, the part modulation areas that the exposure control module can be adjacent with phase place is defined as exposure ON zone.Wherein, the configuration relation when so-called " phase place is adjacent " expression is arranged the part modulation areas with the cycle same sequence is considered as adjacent in this part modulation areas that will be positioned at two ends.In this case, the displacement in exposure ON zone carry out with have before the suitable illumination control of on-off action of focal plane shutter of curtain and back curtain.For example, the exposure control module can make described exposure ON zone along the direction of scanning ring shift.
In order under at the relatively shorter condition of the necessary irradiation time of the same area, to improve sweep velocity, describe the data of describing that data processing unit can upgrade the each several part modulation areas corresponding to exposure actions.On the other hand, in order fully to guarantee the irradiation time at the same area, describing data processing unit can be corresponding to exposure actions, and the data of describing of the part modulation areas that switches to exposure ON zone are again upgraded.In this case, switch to exposure OFF zone from exposure ON zone till, the identical data of describing are assigned to the part modulation areas.
The memory span of the data volume of raster data and storage raster data increases according to the quantity of spatial optical modulation element.For generation and transmission processing and the raising sweep velocity of describing data expeditiously, the preferred data of describing that only generate a part modulation areas successively, corresponding to the relative position of exposure region, at from after continuous successively part modulation areas, use and to describe data.
Therefore, describing DCU data control unit can generate successively with two corresponding benchmark of part modulation areas with front in the modulation areas of top and describe data, corresponding to exposure actions the benchmark that is generated is described the part modulation areas that data allocations is given the front, and the benchmark that updates is described data distribute to remaining part modulation areas successively.For example, describe DCU data control unit can have with two with the corresponding plural storer of top modulation areas, benchmark is described data transmits to two above storeies displacements successively.On the other hand, under the situation that makes continuous part modulation areas ring shift, describe DCU data control unit the data of describing of a part modulation areas switching to the ON zone are again upgraded.
Manufacture of substrates of the present invention is carried out following processing: (1) is carried out at the substrate that is formed with photosensitive material at upper surface and is described to handle; (2) carry out development treatment at the substrate after describing to handle; (3) implement etching or gold-plated processing at the substrate after the development treatment; And (4) carry out the lift-off processing of photosensitive material at carrying out substrate after etching or the gold-plated processing, and this manufacture of substrates is characterised in that, in describing to handle, describes to handle by above-mentioned drawing apparatus.
Plotting method of the present invention is carried out following processing: exposure region is relatively moved along the direction of scanning for describing body, and described exposure region is served as reasons and two above spatial optical modulation elements is arranged in the view field of rectangular at least one exposing unit that forms; Data are described in pattern data generation according to input; And control two above spatial optical modulation elements based on the relative position of describing data and exposure region, carry out exposure actions according to making the overlapping mode of exposure region, this plotting method is characterised in that, to be defined as exposure ON zone by two parts of exposing unit regulation with the top modulation areas, part in addition is defined as exposure OFF zone, the limit changes the combination that constitutes the exposure ON zone and the part modulation areas in exposure OFF zone, and exposure actions is carried out by the spatial optical modulation element that is positioned at exposure ON zone in the limit.
According to the present invention, can improve drawing processing speed and form pattern with high precision by simple structure.
Description of drawings
Fig. 1 is the stereographic map that schematically illustrates the drawing apparatus of present embodiment.
Fig. 2 is the summary cut-open view of photohead.
Fig. 3 is the figure of expression scanning process.
Fig. 4 is arranged on the block diagram of describing control part on the drawing apparatus.
Fig. 5 is the figure in zone more than two of defined among expression exposure region and the DMD.
Fig. 6 is the process flow diagram that the multiple-exposure mode of utilization substep repetition is described to handle.
Fig. 7 is the figure that processing procedure is described in expression.
Fig. 8 is the figure that is illustrated in the pattern when DMD is relatively moved for substrate and the ON zone of exposing.
Fig. 9 is the block diagram of describing control part of the 2nd embodiment.
Figure 10 is the process flow diagram of describing to handle of the 2nd embodiment.
Figure 11 is the figure that describes processing procedure of expression the 2nd embodiment.
Figure 12 is the figure of the irradiated region during according to temporal representation fixing base SW.
Figure 13 is the figure that describes Data Update time and irradiation time according to temporal representation.
Symbol description
10 drawing apparatuses; 18 describe worktable; 20
1～20
8Photohead; 24DMD (exposing unit); 30 describe control part; 32 system, control circuits; The 34DMD driving circuit; 36 grating change-over circuits; The 38A-38F memory buffer; SW substrate (being described body); The EA exposure region; D1～D6 part modulation areas; DM micro mirror (spatial optical modulation element); EA1～EA6 part exposure region; M
ONExposure ON zone; M
OFFExposure OFF zone
Embodiment
Below, with reference to the description of drawings embodiments of the present invention.
Fig. 1 is the stereographic map that schematically illustrates the drawing apparatus of present embodiment.Fig. 2 is the summary cut-open view of photohead.In addition, Fig. 3 is the figure of expression scanning process.
Door columnar structure body 12 is provided with 8 photoheads 20 that are used for forming circuit pattern on substrate SW surface
1～20
8, each photohead has the 1st and the 2nd lamp optical system, exposing unit and imaging optical system.And, on the top of door columnar structure body 12, disposing two light source cell 16A and 16B relatively, light source cell 16A is to photohead 20
1～20
4Send illumination light, light source cell 16B is to photohead 20
5～20
8Send illumination light.
Rectangular-shaped substrate SW is the electronic circuit substrate of for example silicon wafer, dry film, glass substrate etc., is installed under the blank state of the processing that has been applied in pre-training processing and painting photoresist etc. and describes on the worktable 18.To describing the mutually orthogonal X-Y coordinate system of worktable 18 regulations, describe worktable 18 and can move along the Y direction.At this, the negative direction of regulation Y direction is the direction of scanning.
In addition, in Fig. 2, summarily illustrate exposing unit 20
1Inner structure, exposing unit 20
1Have the 1st lamp optical system (not shown), the 2nd lamp optical system 22, DMD24 and the imaging optical system 26 that are arranged in the 1st light source 16A.The 2nd lamp optical system 22 is arranged on from door columnar structure body 12 along describing on the back up pad 19 that worktable 18 extends in parallel, and imaging optical system 26 is configured in the top of substrate SW.And DMD24, catoptron 25 and optical system 27 are configured between the 2nd lamp optical system 22 and the imaging optical system 26.
DMD24 becomes rectangular exposing unit (light-modulating cell) for the micro rectangle shape micro mirror two-dimensional arrangements with a few μ m～tens μ m, constitutes at this micro mirror by 1024 * 768.Each micro mirror rotates change by means of electrostatic field, according to making, and switch posture according to control signal from the light beam of light source any posture location in the 2nd posture (OFF state) of the 1st posture (ON state) of the plane of exposure direction reflection of substrate SW and the reflection of the direction beyond plane of exposure.Each micro mirror is configured in whole on the memory cell of one (for example sram cell etc.) (not shown).
DMD24 optionally carries out ON/OFF control to each micro mirror respectively based on the control signal (describing data) that is stored in the memory cell, and the light after reflection on the micro mirror of ON state shines on the substrate SW by imaging optical system 26.Therefore, shine light on the substrate SW by in each micro mirror, being constituted, and become and will be formed at the corresponding illumination light of circuit pattern on the plane of exposure by the light beam of light after the reflection optionally.
At all micro mirrors is under the situation of ON state, as shown in Figure 3, has the subpoint EA (below, claim that this view field is an exposure region) of preliminary dimension in regulation on the substrate SW.At this, the multiplying power of imaging optical system 26 is 1 times, the size of exposure region and the consistent size of DMD24.
As Exposure mode, be suitable for the multiple-exposure mode of utilizing the substep repetitive mode herein, describe worktable 18 and move along the Y direction off and on.Exposure region EA whenever relatively carries out exposure actions during displacement RS, and with predetermined exposure spacing RS each micro mirror is carried out ON/OFF control.Exposure spacing RS is shorter than the size of exposure region EA, makes exposure region overlapped and carry out exposure actions repeatedly.Exposure region EA relatively moves on substrate SW off and on along the direction of scanning, and thereupon, circuit pattern is formed on the substrate SW along the direction of scanning.
At photohead 20
2～20
8In also carry out same exposure actions.The photohead 20 that forms a line along directions X perpendicular to the direction of scanning
1～20
8Move along the direction of scanning along with describing worktable 18, substrate SW is carried out overall exposing.Finish thus to describe to handle.After describing to handle, implement development treatment, etching or gold-plated, resist layer lift-off processing etc., make the substrate that is formed with circuit pattern.
Fig. 4 is arranged on the block diagram of describing control part on the drawing apparatus 10.And Fig. 5 is the figure in zone more than two of defined among expression exposure region and the DMD.
Describe control part 30 and be connected, have system, control circuit 32 with the workstation (not shown) of outside.System, control circuit 32 control is described to handle, to DMD driving circuit 34, read address control circuit 37 and describe each circuit output control signal such as worktable control circuit 38.The control program describing to handle is stored among the ROM (not shown) in the system, control circuit 32 in advance.
Is the vector data of being represented by coordinate data from workstation as the pattern data that the CAD/CAM data transmit.Grating change-over circuit 36 converts pattern data as the raster data of describing with view data to.Raster data is the two-dimensional points pattern data of the circuit pattern represented with 1 or 0 binary data, is ON state or OFF state with the determining positions of each micro mirror.Raster data is to generate at the DMD of each photohead, and is stored in the memory buffer 38A～38F that is connected in series.
As shown in Figure 5, in present embodiment, in the DMD24 that constitutes by 1024 * 768 micro mirror DM, stipulated respectively 6 modulation areas (hereinafter referred to as the part modulation areas) D1～D6 that constitutes by 1024 * 128 micro mirror DM.Corresponding therewith, in exposure region EA, also stipulated 6 part exposure region EA1～EA6.Part exposure region EA1～EA6 is that the front is arranged in order towards the direction of scanning, with exposure region EA1.In this projection multiplying power is 1 times, so the size of part exposure region and part modulation areas equates.
Among memory buffer 38A～38F, the raster data of the micro mirror of control section modulation areas D1～D6 is respectively stored as describing data.At DMD24, be with part exposure region EA6, be the corresponding data of part modulation areas D6 of DMD from the vector data of workstation, be stored among the memory buffer 38A.And during every execution exposure actions, new raster data is stored among the memory buffer 38A, and raster data is updated.Also also like this in other DMD.
On the other hand, the raster data that is stored in memory buffer 38B～38E corresponding to exposure actions respectively to adjacent memory buffer 38C～38F displacement.The raster data that is stored in memory buffer 38A～38F is sent to DMD driving circuit 34 corresponding to exposure actions.Control from buffering storer 38A～38F and read raster data and writing regularly by reading address control circuit 37 to DMD driving circuit 34.
Describe worktable control circuit 38 and control moving of X-Y transfer table mechanism to driving circuit 44 output control signals.The relative position of exposure region EA is detected in the position that position-detection sensor 48 is described worktable 18 by detection.System, control circuit 32 is based on by describing the relative position of the exposure region EA that worktable control circuit 42 detects, control DMD driving circuit 34 and read address control circuit 37 etc.
In addition, DMD driving circuit 34 has the following memory of data of storage: can micro mirror integral body be switched to the OFF state by each part modulation areas of each DMD, micro mirror is set at the OFF state.Then as described later, based on the control signal from system, control circuit 32, DMD driving circuit 34 transmits the OFF data to the part modulation areas with corresponding each DMD of switch.
Fig. 6 is the process flow diagram of describing to handle that utilizes the multiple-exposure mode of substep repetition.Fig. 7 is the figure that processing procedure is described in expression.Use Fig. 6, Fig. 7, utilize describing to handle and describing of multiple-exposure mode at present embodiment.
Below, for simple declaration, consider to form pattern by 1 DMD24, and the consideration structure on the size substrate Q corresponding with the size of DMD24, describing to handle.The character pattern that uses alphabetical A, B, C, D, E, F to obtain is repeatedly replaced circuit pattern, be defined as describing pattern.In addition, for convenience of explanation, this sentences the DMD24 that grown crosswise size Expressing.
According to describe worktable 18 begin to move when beginning to describe to handle, in step S101, detect the relative position of exposure region EA based on the position of describing worktable 18.As shown in Figure 7, substrate SW advances to the Y direction, and exposure region EA oppositely relatively moves as the direction of scanning with the Y direction.Then, when each substrate SW moves 1 exposure during amount of separation, described the position with continuous part exposure region EA2, the overlapping successively arrival part of the EA3... exposure region EA1 of part exposure region EA1 arrives.Illustrate 6 exposure position P on Fig. 7
n～P
N+5Pattern is described at the place.
Judge in step S102 whether exposure region EA arrives the predetermined exposure position.When being judged as in step S102 when not arriving exposure position, execution in step S101～S102 repeatedly is up to arriving exposure position.During this period, each micro mirror of DMD24 is specified to OFF state (reset mode) based on the OFF data from DMD driving circuit 34.When detecting the arrival exposure position at step S102, in step S103, stop to describe worktable 18.And, after the initial exposure position after describing to begin arrives, exposure spacing RS is detected the arrival situation of exposure position as benchmark.
In step S104, carry out exposure actions with the formation predetermined pattern, and each micro mirror of control DMD24.The raster data that is stored in memory buffer 38A～38F is written into DMD driving circuit 34, as describing part modulation areas D1～D6 that signal is outputed to DMD24 respectively.As shown in Figure 7, at exposure position P
nThe place carries out exposure actions based on the raster data that is made of the character pattern of sequential storage in memory buffer 38A～38F with F～A.
And, in step S104, in DMD24, set the employed zone of exposure actions (hereinafter referred to as exposure ON zone) M
ONObsolete zone during with exposure actions (hereinafter referred to as exposure OFF zone) M
OFFAt this, with 3 part modulation areas that account for half among 6 part modulation areas D1～D6 ON zone M that is defined as exposing
ON, and with remaining 3 part modulation areas OFF zone M that is defined as exposing
OFFAt exposure ON zone M
ON, each micro mirror is carried out ON/OFF control based on the signal (raster data) of describing that sends.On the other hand, at exposure OFF zone M
OFF,,, be the OFF state with the micro mirror set overall by the OFF data based on control signal from system, control circuit 32 with identical during substrate moves.For example, at exposure position P
nPlace, part modulation areas D1～D3 are set at exposure OFF zone M
OFF, part modulation areas D4～D6 is set at exposure ON zone M
ON, at next exposure position P
N+1Place, part modulation areas D3～D5 are set at exposure ON zone M
ON, part modulation areas D1, D2, D6 are set at exposure OFF zone M
OFF(with reference to Fig. 7).
And the combination that constitutes the part modulation areas in this exposure ON/OFF zone obtains change by each exposure actions.At this,, and make exposure ON zone ring shift only with the exposure ON regional integration that constitutes by 3 adjacent part modulation areas amount to an adjacent part modulation areas of direction of scanning displacement.Wherein, circulation described herein is meant, keeps the displacement in overall exposing ON zone when part modulation areas D1～D6 is assumed to periodically repeatedly arrangement.
For example, at exposure position P
N+3Place, part modulation areas D1～D3 are set at exposure ON zone, and part modulation areas D4, D5, D6 are set at exposure OFF zone, at exposure position P
N+4Place, part modulation areas D1, D2, D6 are set at exposure ON zone, and part modulation areas D3, D4, D5 are set at exposure OFF zone.And, at exposure position P
N+5Place, part modulation areas D1, D5, D6 are set at exposure ON zone, and part modulation areas D2～D4 is set at exposure OFF zone.System, control circuit 32 control DMD driving circuits 34 are with ring shift exposure ON zone.Then, to relatively move as exposure position P
n～P
N+56 exposure actions of the width of shown exposure region EA integral body are as 1 circulation, the ring shift in the ON zone of exposing repeatedly.
In step S105,, drive X-Y transfer table mechanism 46 for substrate SW is moved to next exposure position.Then, in step S107, judge whether substrate SW has arrived the end exposure position.Under the situation that does not arrive the end exposure position, enter step S107, based on writing new raster data to memory buffer 38A at the pattern of next exposure position formation, the raster data that will be stored in memory buffer 38B～38F simultaneously is displaced to adjacent memory buffer.
In order when making substrate SW move the width RS of a part modulation areas, to utilize substep to repeat to realize multiple-exposure, when each substrate SW moved RS, the pattern that need make the each several part modulation areas of distributing to DMD 24 was to the direction displacement opposite with the direction of scanning.Therefore, substrate SW to next exposure position move during, the data of describing that are stored in memory buffer 38A～38E transmit to memory buffer 38B～38F respectively.On the other hand, in grating change-over circuit 36, the pattern data of input and position, front corresponding part modulation areas D1 generates raster data by the pattern data conversion process.Then, newly-generated raster data write buffering memory 38A.
For example as shown in Figure 7, at exposure position P
n,, store the corresponding raster data of pattern respectively with character F, E, D, C, B, A at memory buffer 38A, 38B, 38C, 38D, 38E, 38F.Then, at exposure position P
N+1, to memory buffer 38B, 38C, 38D, 38E, 38F, the raster data of be shifted mobile character E, F, D, C, B stores the raster data of newly-generated character A into memory buffer 38A.Behind the execution in step S107, turn back to step S101, repeatedly execution in step S101～S106.On the other hand, in step S106, be judged as and arrived when describing end position, finish to describe to handle.
Fig. 8 is the figure that is illustrated in the pattern when DMD24 is relatively moved for substrate SW and the ON zone of exposing.
In Fig. 8, make and the exposure ON zone corresponding characters pattern when having fixed the position of substrate SW brightens.The number of times that is equivalent to actual exposure on this position (irradiation) along the same character pattern number of arranging perpendicular to the direction of substrate SW.Irradiation pattern forms the light of required exposure in each district of substrate SW, on the other hand, because exposure OFF zone, does not shine light more than the aequum at the same area of substrate SW, substrate SW is carried out the exposure of impartial exposure.On the fate of substrate SW, roughly shine light 3 times,, determine to constitute exposure ON zone M based on the ratio of actual exposure (irradiation) number of times with respect to all exposure frequencies (6 times) that same district is carried out
ONPart modulation areas number.That is, be a whole roughly half in the ratio of actual exposure, the exposure ON zone M of single exposure action
ONBe set at half district of DMD integral body.
In addition, in Fig. 8, at the exposure frequency of all character patterns not quite identical (exposure frequency is that character C of 2 times etc., exposure frequency are character A of 3 times etc.).But, in the present embodiment, only explained the step in the limited range, so exposure frequency changes, but because in fact substrate is carried out repeated multiple times scanning, so can be considered as each district's essence is shone the required exposure amount equably, and by any setting DMD cut apart the modulation areas number, can be in district arbitrarily control exposure (irradiation) number of times equably all.In addition, the situation of the exposure deficiency after considering just to have begun to describe constitutes and carries out actual formation the in short-term scanning back after beginning to describe and describe pattern, thus can be whole by same exposure formation pattern at substrate.
According to above-mentioned present embodiment, 6 part modulation areas D1～D6 of regulation in DMD24, according to the spacing RS that exposes accordingly of the width with 1 part modulation areas, the multiple-exposure action that utilizes substep to repeat.In each exposure actions, regulation is controlled the exposure ON zone M of micro mirror DM based on raster data (describing data)
ONWith exposure OFF zone M with the micro mirror set overall OFF state of part modulation areas
OFF, by being positioned at exposure ON zone M
ONOn the micro mirror of part modulation areas to substrate SW irradiates light.And when whenever carrying out exposure actions, renewal is used for constituting exposure ON zone M
ONWith exposure OFF zone M
OFFThe combination of part modulation areas, change exposure ON zone M
ONWith exposure OFF zone M
OFFWith ring shift exposure ON zone M
ON
Thus, the same district of substrate is carried out the illumination of necessary exposure, substrate integral body is formed pattern by the correct exposure amount.Control adjustment by DMD is to the exposure of substrate, so can mechanical shutter is not set and carry out high-precision light quantity adjustment in light source side, can not reduce sweep velocity and carries out multiple-exposure.
And, in the present embodiment, only be to import corresponding pattern data successively with part modulation areas D1, by the grating conversion process will with the corresponding raster data of part modulation areas D1 corresponding to exposure actions write buffering memory 38.Then, the data (benchmark is described data) of describing of write buffering memory 38A are displaced to memory buffer 38B～38F successively corresponding to exposure actions.
Minimizing is as the data volume in the time-consuming data conversion treatment of data processing (raster data generates and handles), and carry out the not displacement of time-consuming raster data transmission processing in the data processing, so can carry out the whole data processing of describing effectively, can improve sweep velocity.
Particularly, only need the raster data that generation is cut apart modulation areas D1 (amounts of 128 row) at the 1st of DMD to get final product, so compare with the situation of the raster data that will generate and upgrade DMD integral body (amounts of 768 row) all the time, data processing time (raster data rise time) becomes 1/6, has improved data processing speed.Its result shortens integral body and describes the processing time.And, can reduce the capacity of a memory buffer, can realize the raising of data processing speed by the simple low cost circuit structure.
Can also under the situation that exposure region is tilted in the direction of scanning, scan it.In this case, according to the angle of inclination, proofread and correct and describe data.As Exposure mode, can use continuous move mode with certain speed scanning, also can carry out generation, renewal and the stores processor of raster data according to the timing of the relative position of exposure region and exposure actions.In the present embodiment, whenever move respectively cut apart exposure region along the width of direction of scanning the time carry out exposure actions, but can also be according to formed pattern (for example circuit pattern of linearity), with in addition distance as the spacing of exposing.And, also alternatively cut apart respectively that exposure region is carried out this mode of exposure actions on same exposure position and the overlapped multiple-exposure mode of a part of using the small point of irradiation that makes each micro mirror.In addition, the imaging multiplying power can also be set at beyond 1 times.
In the present embodiment, DMD is divided into 6, has stipulated 6 part modulation areas, but then can determine arbitrarily, be defined as and arrange (direction along transversal direction of scanning is cut apart) towards the direction of scanning and get final product about the quantity cut apart and the method cut apart.For example, be 2 in the number of permutations along the direction of scanning of the micro mirror of DMD
NThe time, be divided into N part and get final product.In this case, prepare N storer.And, can also be at exposure ON zone, replacement is stipulated the zone that connects continuously and is constituted exposure ON zone by the discrete partial modulation areas, carries out whole ring shift.In addition, the quantity that constitutes the part modulation areas in exposure ON zone can also wait according to the sensitometric characteristic of the photoresist of substrate and sweep velocity and set.
The quantity of photohead can be arbitrarily, can also replace DMD and uses the spatial light modulator as two-dimensional arrangements such as LCD, SLM.And the structure of storer can be arbitrarily, can be the structure that 6 memory buffer are connected in parallel and form, and perhaps, can also cut apart single storer of regulation and constitute two above storeies.
Then, use Fig. 9～Figure 11 to come the drawing apparatus of the 2nd embodiment is described.In the 2nd embodiment, upgrade the data of describing successively, the ON/OFF of displacement exposure simultaneously zone to a part modulation areas.About structure in addition, identical with the 1st embodiment in fact.
Fig. 9 is the block diagram of describing control part of the 2nd embodiment.
Describe control part 30 ' and have the memory buffer 38 ' that is used for storing with 1 corresponding raster data of part modulation areas amount.Therefore, this will with respect to DMD integral body describe data be 1/6 describe data storage in memory buffer 38 '.Corresponding to raster data is regularly sent to DMD driving circuit 34 according to predetermined, new raster data is stored in the memory buffer 38 ' successively.
Figure 10 is the process flow diagram of describing to handle of the 2nd embodiment.Figure 11 is the figure that describes processing procedure of expression the 2nd embodiment.And Figure 12 is the figure of the irradiated region during according to temporal representation fixing base SW.
Step S201～step S203 is identical with step S101～S103 of Fig. 6 of the 1st embodiment.That is, up to describe worktable 18 move to predetermined describe the position till.Then, as described below, among step S204～S208, describing that exposure ON/OFF zone is switched through 6 times.
Illustrate displacement process among Figure 11 through the exposure ON/OFF zone of 6 exposure actions stp1-stp6 and stp7-stp12.In the 1st exposure actions after describing worktable 18 and stopping, the right half of part modulation areas D1～D3 of the DMD24 ON zone M that is defined as exposing
ON, remaining part modulation areas D4～D6 OFF zone M that is defined as exposing
OFF
Among the step S204 of Figure 10, determine to upgrade again to describe the section data modulation areas, among the step S205, the raster data that will be stored in the memory buffer 38 ' sends to determined part modulation areas by DMD driving circuit 26.For example, in the stp1 of Figure 11, send the new data of describing to part modulation areas D3.
On the other hand, in step S206, determine to become again the part modulation areas in exposure OFF zone, in step S207, the OFF data are sent to determined part modulation areas from DMD driving circuit 26.In the stp1 of Figure 11, redefine part modulation areas D6 as exposure OFF zone.
In step S208, judge whether describing to have carried out exposure actions 6 times under the state that worktable 18 stops.When being judged as when not carrying out 6 exposure actions, return step S204, in step S204～S207, determine new exposure ON zone and exposure OFF zone.
When returning step S204, as shown in figure 11, renewal is described section data modulation areas (that is, switching to the part modulation areas in exposure ON zone from exposure OFF zone) and is shifted singly to adjacent part modulation areas towards the direction of scanning.In addition, the part modulation areas that switches to exposure OFF zone from exposure ON zone also is shifted singly towards the direction of scanning.But at the part modulation areas D1 and the D6 that are positioned at DMD 24 two ends, it is adjacent to be considered as phase place.
In stp2 shown in Figure 11, redefine part modulation areas D4 as exposure ON zone, upgrade and describe data.Its on the other hand, the part modulation areas D1 OFF zone that is defined as exposing.And, part modulation areas D2 and D3 describe data storage in each sram cell of DMD 24, so in the exposure actions of stp1 and stp2, the micro mirror that remains the part modulation areas D2 in exposure ON zone and D3 is described data and controlled based on identical.The micro mirror that remains the part modulation areas D5 in exposure OFF zone and D6 is too based on the OFF data and controlled.
And, herein, by counting determine (S204) that carries out the part modulation areas that switches to exposure ON zone counting variable is added 1 mode.Equally, determine (S206) about the part modulation areas that switches to exposure OFF zone also undertaken by counting.
In step S204～S207, the displacement in exposure ON zone and exposure OFF zone is carried out 6 times repeatedly.Its result, successively more new portion modulation areas D1～D6 describe data, on the other hand, part modulation areas D1～D6 switches to exposure OFF zone from exposure ON zone successively.In Figure 11, part modulation areas D3, D4, D5, D6, D1, D2 switch to exposure ON zone successively, and on the other hand, part modulation areas D6, D1, D2, D3, D4, D5 switch to exposure OFF zone successively.
In step S208, when being judged as the change action that is through with through 6 times exposure ON/OFF zone, enter step S209, judge whether substrate SW has arrived to describe to handle end position.Not being to describe to handle under the situation of end position, enter step S210, move and describe worktable 18.At this, will with half (RS/2) of the corresponding projection in zone width of part modulation areas as exposure spacing RS ', describing to stop after worktable 18 has moved exposure spacing RS ' (S201～S203).
Figure 11 shows the exposure actions that has moved behind the exposure spacing RS '.Stp7～stp12 is identical with stp1～stp6, and the exposure ON zone and the exposure OFF zone that are made of 3 continuous part modulation areas are shifted.Like this, when having passed through a series of exposure actions of 6 times repeatedly, describe to handle.In step S209, substrate SW arrives when describing to handle end position, finishes to describe to handle.
In Figure 12, come according to temporal representation fixing base SW and irradiated region and shading region when DMD 24 is relatively moved through stp1～stp12.Wherein, irradiated region represents and relative district, exposure ON zone that shading region is represented and relative district, exposure OFF zone.
As shown in figure 12, same district is periodically carried out continuous exposure.To the exposure frequency in any district about equally, to the light of the identical in fact exposure of substrate WBR.The leading section PKT that describes pattern PK shown in Figure 11 is equivalent to half of part modulation areas width RS, the district when representing that with oblique line illumination light arrives leading section PK in Figure 12.
Figure 13 is the figure that describes Data Update time and irradiation time according to temporal representation.
In Figure 13 (a), represent the irradiation time T2 of drawing apparatus in the past and describe Data Update time T 1.That describes Data Update time T 1 expression DMD 24 integral body describes that data are sent to DMD, each micro mirror switches to the time before the new ON/OFF position.That is, expression begins to begin the time before to next exposure actions from exposure actions.On the other hand, irradiation time T2 represents the necessary irradiation time (exposure) of predetermined sweep velocity, and at this, irradiation time T2 is defined as describing half of Data Update time.
When raising is used to increase the sweep velocity of handling capacity, describe Data Update time T 1 and become longer according to penetrating time T 2, during this period, each micro mirror is based on the describing data of front and controlled.Therefore, through behind the irradiation time T1, wait by mechanical shutter and to interdict illumination light, make the unnecessary illumination rayed less than on the substrate SW.
On the other hand, in Figure 13 (b), represented present embodiment irradiation time and describe the Data Update time.In the present embodiment, illumination light projects on the DMD24 continuously.It by the displacement in exposure OFF zone, adjusts the irradiation time to the same area of substrate SW on the other hand.At this, when the schedule of proportion of describing Data Update time T 2 and irradiation time T1 shown in Figure 13 (a) is shown scan efficiency, set exposure OFF zone corresponding to scan efficiency.Because T1/T2 is 0.5, so 3 part modulation areas become exposure OFF zone.
In addition, in the 2nd embodiment, carried out the multiple-exposure that utilizes substep to repeat, substrate SW moves, exposure actions is carried out on the limit but also can the limit make continuously.
In the 1st, the 2nd embodiment, constitute the drawing apparatus that is used for the substrate of electronic circuit board etc. is formed circuit pattern, but be not limited to circuit pattern, also can constitute quilt that the pattern that is used for character, mark etc. is formed on film etc. and describe drawing apparatus on the body.
Claims (11)
1. drawing apparatus, this drawing apparatus has:
At least one exposing unit, it is by two above spatial optical modulation elements are arranged in rectangular forming;
Scanning element, it makes exposure region be relatively moved along the direction of scanning for describing body, and described exposure region is the view field of described exposing unit;
Describe data processing unit, its pattern data according to input generates describes data; And
The exposure control module, it controls described two above spatial optical modulation elements by describing DCU data control unit based on the relative position of describing data and exposure region, according to making the overlapping mode of exposure region carry out exposure actions,
This drawing apparatus is characterised in that,
Two parts with the top modulation areas that described exposure control module will be specified in described exposing unit are defined as exposure ON zone, part in addition is defined as exposure OFF zone, the limit changes the combination of the part modulation areas that constitutes described exposure ON zone and described exposure OFF zone, and exposure actions is carried out by the spatial optical modulation element that is positioned at the ON zone of exposing in the limit.
2. drawing apparatus according to claim 1 is characterized in that,
Described exposure control module makes described exposure ON zone ring shift.
3. drawing apparatus according to claim 2 is characterized in that,
The part modulation areas that described exposure control module is adjacent with phase place is defined as exposure ON zone.
4. drawing apparatus according to claim 2 is characterized in that,
Described exposure control module makes described exposure ON zone along the direction of scanning ring shift.
5. drawing apparatus according to claim 1 is characterized in that,
The described data of describing of describing DCU data control unit according to exposure actions renewal each several part modulation areas.
6. drawing apparatus according to claim 5 is characterized in that,
The described DCU data control unit of describing generates successively with described two corresponding benchmark of part modulation areas with front in the modulation areas of top and describes data, corresponding to exposure actions the benchmark that is generated is described the part modulation areas that data allocations is given described front, and corresponding to exposure actions the benchmark that updates is described data and distribute to remaining part modulation areas successively.
7. drawing apparatus according to claim 1 is characterized in that,
The described data processing unit of describing upgrades the data of describing of the part modulation areas that switches to exposure ON zone again corresponding to exposure actions.
8. drawing apparatus according to claim 1 is characterized in that,
Described exposure control module is in the entire portion modulation areas, and regulation exposure OFF regional percentage is identical with scan efficiency.
9. drawing apparatus according to claim 1 is characterized in that,
Described exposure control module is by all assigning to stipulate two with the top modulation areas to described exposing unit.
10. manufacture of substrates, this manufacture of substrates is carried out following processing:
(1) describes to handle at the substrate execution that is formed with photosensitive material at upper surface;
(2) carry out development treatment at the substrate after describing to handle;
(3) implement etching or gold-plated processing at the substrate after the development treatment; And
(4) carry out the lift-off processing of photosensitive material at carrying out substrate after etching or the gold-plated processing, this manufacture of substrates is characterised in that,
In describing processing, describe to handle by the described drawing apparatus of claim 1.
11. a plotting method, this plotting method is carried out following processing:
Exposure region is relatively moved along the direction of scanning for describing body, and described exposure region is served as reasons and two above spatial optical modulation elements is arranged in the view field of rectangular at least one exposing unit that forms;
Data are described in pattern data generation according to input; And
Control described two above spatial optical modulation elements based on the relative position of describing data and exposure region, according to making the overlapping mode of exposure region carry out exposure actions,
This plotting method is characterised in that,
To be defined as exposure ON zone by two parts of described exposing unit regulation with the top modulation areas, part in addition is defined as exposure OFF zone, the limit changes the combination of the part modulation areas that constitutes described exposure ON zone and described exposure OFF zone, and exposure actions is carried out by the spatial optical modulation element that is positioned at the ON zone of exposing in the limit.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007336275A JP5241226B2 (en) | 2007-12-27 | 2007-12-27 | Drawing apparatus and drawing method |
| JP2007336275 | 2007-12-27 |
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| Publication Number | Publication Date |
|---|---|
| CN101470356A true CN101470356A (en) | 2009-07-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008101850544A Pending CN101470356A (en) | 2007-12-27 | 2008-12-26 | Decribing apparatus and method |
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|---|---|
| JP (1) | JP5241226B2 (en) |
| CN (1) | CN101470356A (en) |
| TW (1) | TW200928604A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101799635A (en) * | 2010-03-16 | 2010-08-11 | 芯硕半导体（中国）有限公司 | Exposure method of maskless photoetching technology |
| CN110737179A (en) * | 2018-07-20 | 2020-01-31 | 株式会社斯库林集团 | Drawing device and drawing method |
| CN112415858A (en) * | 2019-08-21 | 2021-02-26 | 株式会社斯库林集团 | Drawing method and drawing device |
| TWI803339B (en) * | 2022-06-07 | 2023-05-21 | 國立成功大學 | System for scanning light spot array and the method thereof |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5503992B2 (en) * | 2010-02-08 | 2014-05-28 | 株式会社オーク製作所 | Exposure equipment |
| JP5881314B2 (en) * | 2011-05-30 | 2016-03-09 | 株式会社オーク製作所 | Exposure equipment |
| TWI564671B (en) * | 2011-05-30 | 2017-01-01 | Orc Manufacturing Co Ltd | Exposure device |
| JP5881313B2 (en) * | 2011-05-30 | 2016-03-09 | 株式会社オーク製作所 | Exposure equipment |
| JP6537309B2 (en) * | 2015-03-18 | 2019-07-03 | 株式会社オーク製作所 | Exposure apparatus and exposure method |
| KR102162270B1 (en) * | 2015-09-04 | 2020-10-06 | 어플라이드 머티어리얼스, 인코포레이티드 | Line edge roughness reduction via step size alteration |
| JP7422263B1 (en) | 2023-08-24 | 2024-01-25 | 株式会社オーク製作所 | Exposure equipment and exposure method |
| JP7455265B1 (en) | 2023-08-24 | 2024-03-25 | 株式会社オーク製作所 | Exposure equipment and exposure method |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005055881A (en) * | 2003-07-22 | 2005-03-03 | Fuji Photo Film Co Ltd | Drawing method and drawing apparatus |
| US20050128559A1 (en) * | 2003-12-15 | 2005-06-16 | Nishimura Ken A. | Spatial light modulator and method for performing dynamic photolithography |
| JP2005210112A (en) * | 2003-12-26 | 2005-08-04 | Fuji Photo Film Co Ltd | Exposing method and device thereof |
| JP2006113412A (en) * | 2004-10-15 | 2006-04-27 | Fuji Photo Film Co Ltd | Drawing method and apparatus |
| JP2006350022A (en) * | 2005-06-16 | 2006-12-28 | Fujifilm Holdings Corp | Drawing apparatus and drawing method |
| JP2007304517A (en) * | 2006-05-15 | 2007-11-22 | Shinko Electric Ind Co Ltd | Exposure method and device for direct drawing system |
-
2007
- 2007-12-27 JP JP2007336275A patent/JP5241226B2/en active Active
-
2008
- 2008-09-25 TW TW97136864A patent/TW200928604A/en unknown
- 2008-12-26 CN CNA2008101850544A patent/CN101470356A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101799635A (en) * | 2010-03-16 | 2010-08-11 | 芯硕半导体（中国）有限公司 | Exposure method of maskless photoetching technology |
| CN110737179A (en) * | 2018-07-20 | 2020-01-31 | 株式会社斯库林集团 | Drawing device and drawing method |
| CN110737179B (en) * | 2018-07-20 | 2022-08-02 | 株式会社斯库林集团 | Drawing device and drawing method |
| CN112415858A (en) * | 2019-08-21 | 2021-02-26 | 株式会社斯库林集团 | Drawing method and drawing device |
| TWI803339B (en) * | 2022-06-07 | 2023-05-21 | 國立成功大學 | System for scanning light spot array and the method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5241226B2 (en) | 2013-07-17 |
| TW200928604A (en) | 2009-07-01 |
| JP2009157168A (en) | 2009-07-16 |
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