CN101465211B - Lead frame and electronic component with the same and manufacturing method thereof - Google Patents
Lead frame and electronic component with the same and manufacturing method thereof Download PDFInfo
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- CN101465211B CN101465211B CN 200810185931 CN200810185931A CN101465211B CN 101465211 B CN101465211 B CN 101465211B CN 200810185931 CN200810185931 CN 200810185931 CN 200810185931 A CN200810185931 A CN 200810185931A CN 101465211 B CN101465211 B CN 101465211B
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- lead frame
- protector
- frame
- anode
- cathode leg
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- Condensed Matter Physics & Semiconductors (AREA)
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention solves the technical problems of protection of a stereo structure of a lead frame when the stereo assembly lead frame is winded, and improvement problems caused by the distortion of the lead frame. The solution is to mount a protector in the lead frame with an electronic element, and the vertical size of the protector is larger than the vertical electronic element. The protector and the lead frame are integral and the protector is removed when the lead frame is cut off.
Description
Technical field
The present invention relates to lead frame as the terminal use of electronic unit.
Background technology
In the prior art, the electronic equipment of making as on lead frame, loading electronic component for example has this solid electrolytic capacitor as shown in Figure 1.The solid electrolytic capacitor of Fig. 1 comprises capacitor element 1, anode lead frame 41 and the cathode leg frame 42 with anode leader 2 and negative electrode lead division 3.Capacitor element 1 covers through outer dress resin 5.
Here, anode lead frame 41 is carried out punch process with cathode leg frame 42 through the lead frame that band shape is extended and is obtained.
The solid electrolytic capacitor of Fig. 1 such punch process lead frame 4 shown in figure 10; And be lifted on the anode lead frame 41 the lifting portion 412 that is provided with; And form this lead frame shown in figure 11; Behind the surface of electroplating processes lead frame 4, be electrically connected the anode leader 2 and anode lead frame 41, negative electrode lead division 3 and cathode leg frame 42 of capacitor element 1.Afterwards, cover capacitor element 1, make its part of exposing anode lead frame 41 and cathode leg frame 42, thereby make through outer dress resin.
When as above making solid electrolytic capacitor like this; Under the state of three-dimensional bending lead frame 4 as Figure 11, carry out electroplating processes and twine lead frame; But at this moment, have friction to electroplate partly and be damaged, or the stereochemical structure of lead frame has been twisted such problem.In order to address this is that, as patent documentation 1, proposed between each frame, to clip this method of screening glass.
9-No. 86567 communiques of [patent documentation 1] japanese kokai publication hei
But, in above-mentioned this method, can not avoid between lead frame and screening glass, rubbing, can not prevent to electroplate the damage of part.Further, because screening glass is the plane,, can not prevent the bad generation that causes by the distortion of lead frame etc. so be not suitable for preventing the distortion etc. of the stereochemical structure of lead frame.
Summary of the invention
In view of the above problems, the present invention is characterized in that on said lead frame, having the protector of the face of the said electronic component of loading of protecting this lead frame in the lead frame that loads electronic component.Said lead frame can have lifting portion and/or stage portion, and at this moment the size at the said protector on the direction vertical with said lead frame is bigger than said lifting portion and/or the size of stage portion on the direction vertical with said lead frame.Said lead frame has anode lead frame and cathode leg frame, and said lifting portion and/or stage portion also can be arranged at least one of said anode lead frame and said cathode leg frame.
Manufacturing approach of the present invention is the manufacturing approach that comprises the electronic unit of lead frame with protector and the electronic component that on this lead frame, loads, and it is characterized in that, comprising: use said lead frame to form the step of protector; Said lead frame is implemented the step of electroplating processes; With said electronic component is loaded in the step on the said lead frame.
Manufacturing approach of the present invention further comprises: the step of on spool, twining said lead frame; With the step of drawing said lead frame and tripping protection device from said spool, before the step of loading said electronic component, cut off the step of this protector.
Through being as above this structure, because the plating of lead frame part contact with other lead frames, so can prevent to electroplate damage partly.Because the anode lead frame of lead frame and cathode leg frame part directly do not contact with other lead frames; So do not have from other lead frame applied pressures; Therefore, the stereochemical structure of lead frame can be protected, and the generation of the defective item that the distortion etc. by lead frame causes can be prevented.
Because manufacturing approach of the present invention uses lead frame to form, so can suppress by making the cost rising that protector causes.
Description of drawings
Fig. 1 is the stereogram of the solid electrolytic capacitor of an embodiment of the present invention;
Fig. 2 is the vertical view that is used for lead frame of the present invention;
Fig. 3 is the vertical view of the lead frame of an embodiment of the present invention;
Stereogram when Fig. 4 is the lead frame of having assembled an embodiment of the present invention;
Fig. 5 is the side view of lead frame shown in Figure 4;
Fig. 6 is the stereogram of the solid electrolytic capacitor of another embodiment of the present invention;
Fig. 7 is the vertical view of the lead frame of another embodiment of the present invention;
Fig. 8 is the stereogram of the lead frame of another embodiment of the present invention;
Fig. 9 is the stereogram of the lead frame of another embodiment of the present invention;
Figure 10 is the vertical view of the lead frame when existing lead frame is stamped into reservation shape;
Stereogram when Figure 11 is the existing lead frame of assembling.
Among the figure: the 1-capacitor element, the 2-anode leader, 3-negative electrode lead division, the 4-lead frame, the 41-anode lead frame, 42-cathode leg frame, 5-adorns resin outward.
Embodiment
Below, use accompanying drawing that the best mode that embodiment of the present invention is used is described.
(execution mode 1)
Fig. 1 is the solid electrolytic capacitor of an example of the electronic unit made as the lead frame that uses an execution mode of the present invention.The solid electrolytic capacitor of Fig. 1 comprises capacitor element 1, anode lead frame 41, the cathode leg frame 42 with anode leader 2 and negative electrode lead division 3 as electronic component, covers this capacitor element 1 with outer dress resin 5.On anode lead frame 41, form lifting portion.The anode leader 2 of capacitor element 1 is electrically connected with cathode leg frame 42 with anode lead frame 41, negative electrode lead division 3 respectively.
Fig. 3 is the vertical view of lead frame 4 of the present invention.Lead frame 4 is as shown in Figure 2, and the metallic plate banded through punch process obtains.Through punch process, lead frame 4 forms anode lead frame 41, cathode leg frame 42 and protector 43.Said protector 43 has first bend 431 that is connected with the framework of lead frame 4, second bend 432 that links to each other with first bend 431.The portion of terminal 411 that anode lead frame 41 has lifting portion 412, exposes from outer dress resin 5; Further; On both of anode lead frame 41 and cathode leg frame 42, form porose 41a, 42a, this hole also makes electrodeposited coating expose and form filler rod (fi1let) usefulness easily from outer dress resin 5 after lead frame 4 cuts off.Fig. 4 is that the lead frame 4 to Fig. 3 has carried out the stereogram when crooked, and Fig. 5 is its side sectional view.Like what find out from Fig. 4 and Fig. 5, protector is crooked above tilting on first bend 431, and further, the front end of bending machining second bend 432 makes it towards anode and cathode leg frame 41,42.Protector 43 relative lead frames 4 are bigger at the big or small h of vertical direction than the lifting portion 412 relative anode lead frame 41 of anode lead frame 41 at the big or small H of vertical direction.Be not particularly limited this big or small difference; But if compare at the big or small h of vertical direction with lifting portion 412 relative anode lead frame 41, protector 43 relative lead frames are excessive at the big or small H of vertical direction; Then because the diameter when spool twines becomes big, so bad.Through aforementioned structure, can prevent the contacting of lead frame 4 and other lead frames when spool twines lead frame 4, can prevent the distortion etc. of stereochemical structure of damage and the lead frame of plating.
The manufacturing approach of electronic unit of the present invention then, is described.
At first, be this shape shown in Figure 2 with the metallic plate punch process of band shape, carry out this punch process shown in Figure 3 afterwards.In addition, also can form structure shown in Figure 3 through a punch process.Then carry out bending machining.Also can be and after forming lifting portion 412 at the dotted portion of crooked anode lead frame 41, the dotted portion of bend protection device 43 and carry out bending machining, also can before carry out the formation of protector 43.Also can carry out the formation of lifting portion 412 of formation and the anode lead frame 41 of protector 43 simultaneously.
After as above-mentioned, forming Fig. 4 and lead frame 4 shown in Figure 5, lead frame 4 is implemented electroplating processes.After the lead frame 4 with band shape is immersed in the electrodeposited coating, on spool, twine lead frame 4.At this moment, because protector 43 can prevent and the contacting of other lead frames 4, so can prevent the distortion of stereochemical structure of damage and anode lead frame 41 of the plating part of lead frame 4.
Then, draw the lead frame 4 that is twined successively, block with predetermined length (the for example X line of Fig. 3).At this moment, the tripping protection device 43.
As stated; If be cut to predetermined length; Then on the anode lead frame 41 of the lead frame 4 that has cut off protector 43 and cathode leg frame 42, load capacitor element and be electrically connected; So that the anode leader 2 of container component 1 is guided on the anode lead frame 41, negative electrode lead division 3 is guided on the cathode leg frame 42.Afterwards, use predetermined mould, cover capacitor element 1 with outer dress resin; Make it keep the part of anode lead frame 41 and cathode leg frame 42; On preposition, cut off afterwards, thereby electronic unit shown in Figure 1 (solid electrolytic capacitor) is accomplished through framework from lead frame 4.
(execution mode 2)
Fig. 6 is to use the side sectional view of the electronic unit that the lead frame of another embodiment of the present invention makes.Except the lead frame 4 of the electronic unit (solid electrolytic capacitor) that is used for Fig. 6 is stamped into shape shown in Figure 7 with the metallic plate of band shape; And on the dotted line of Fig. 7, it is carried out bending machining; And make the anode lead frame 41 of the lifting portion with this structure as shown in Figure 8 and have outside the cathode leg frame 42 of stage portion, through making with the form 1 same method of implementing.
The form of above-mentioned enforcement only is used to explain the present invention, should not be construed as the invention that the scope that limits claim is put down in writing.The present invention can reach within the scope of the claims in the equivalent scope and freely change.For example, the shape of lead frame is not limited to shown in Fig. 3 Fig. 8 etc., also can be so as shown in Figure 9, also can be the shape that does not have expression among the figure.Be provided with the hole that forms filler rod (fillet) usefulness on the lead frame of embodiments of the invention, but this hole is not necessary, does not limit its shape yet.Further, the present invention is not limited to be used for the lead frame of the making of solid electrolytic capacitor.
In addition, should not limit the number of protector of the present invention especially.
Claims (3)
1. lead frame, it is the lead frame that is used to make the band shape of solid electrolytic capacitor, wherein:
Form on the said lead frame: the many antianodes lead frame and the cathode leg frame that load capacitor element; And the protector of face of protecting the said capacitor element of loading of said lead frame,
Said protector is formed between the said cathode leg frame perhaps adjacent between the adjacent said anode lead frame.
2. lead frame according to claim 1 is characterized in that:
Said anode lead frame or said cathode leg frame possess lifting portion or the stage portion that forms through with its part bending,
On the thickness direction of said lead frame, the height of the aspect ratio of said protector said lifting portion or said stage portion is big.
3. the manufacturing approach of a solid electrolytic capacitor, it is to utilize claim 1 or 2 described lead frames to make the method for solid electrolytic capacitor, this manufacturing approach comprises:
Cut off the step of said protector;
On said lead frame, load the step of capacitor element; With
Cover the step of said capacitor element with outer dress resin.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007324223A JP5111089B2 (en) | 2007-12-17 | 2007-12-17 | Manufacturing method of solid electrolytic capacitor |
| JP2007-324223 | 2007-12-17 | ||
| JP2007324223 | 2007-12-17 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201210078329 Division CN102592830A (en) | 2007-12-17 | 2008-12-16 | Lead frame and electronic element having lead frame and manufacturing method of it |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101465211A CN101465211A (en) | 2009-06-24 |
| CN101465211B true CN101465211B (en) | 2012-07-11 |
Family
ID=40805729
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201210078329 Pending CN102592830A (en) | 2007-12-17 | 2008-12-16 | Lead frame and electronic element having lead frame and manufacturing method of it |
| CN 200810185931 Active CN101465211B (en) | 2007-12-17 | 2008-12-16 | Lead frame and electronic component with the same and manufacturing method thereof |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201210078329 Pending CN102592830A (en) | 2007-12-17 | 2008-12-16 | Lead frame and electronic element having lead frame and manufacturing method of it |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5111089B2 (en) |
| KR (1) | KR101143186B1 (en) |
| CN (2) | CN102592830A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107895649A (en) * | 2017-12-15 | 2018-04-10 | 株洲中电电容器有限公司 | It is a kind of to mount solid tantalum capacitor without leadframe surfaces |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5921052A (en) * | 1982-07-26 | 1984-02-02 | Nec Corp | Lead frame for semiconductor substrate |
| US5920113A (en) | 1996-08-13 | 1999-07-06 | Motorola, Inc. | Leadframe structure having moveable sub-frame |
| KR19990034731A (en) * | 1997-10-30 | 1999-05-15 | 윤종용 | Lead-on chip lead frames and packages using them |
| JPH11340396A (en) * | 1998-05-22 | 1999-12-10 | Rohm Co Ltd | Structure of hoop-like lead frame for manufacturing electronic component |
| JP2002222745A (en) * | 2001-01-29 | 2002-08-09 | Matsushita Electric Ind Co Ltd | Method of manufacturing electronic parts |
| US20060157829A1 (en) * | 2003-06-18 | 2006-07-20 | Koninklijke Phillips Electronics N.C. | Lead frame, semiconductor device comprising the lead frame and method of manufacturing a semiconductor device with the leadframe |
| KR100725175B1 (en) * | 2004-08-05 | 2007-06-07 | 옵티멈 케어 인터내셔널 테크 인코포레이티드 | Chip leadframe module |
-
2007
- 2007-12-17 JP JP2007324223A patent/JP5111089B2/en active Active
-
2008
- 2008-11-07 KR KR1020080110386A patent/KR101143186B1/en not_active IP Right Cessation
- 2008-12-16 CN CN 201210078329 patent/CN102592830A/en active Pending
- 2008-12-16 CN CN 200810185931 patent/CN101465211B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20090065431A (en) | 2009-06-22 |
| JP5111089B2 (en) | 2012-12-26 |
| CN101465211A (en) | 2009-06-24 |
| KR101143186B1 (en) | 2012-05-08 |
| CN102592830A (en) | 2012-07-18 |
| JP2009147186A (en) | 2009-07-02 |
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