CN101460011B - 电路板制作方法 - Google Patents
电路板制作方法 Download PDFInfo
- Publication number
- CN101460011B CN101460011B CN2007102030213A CN200710203021A CN101460011B CN 101460011 B CN101460011 B CN 101460011B CN 2007102030213 A CN2007102030213 A CN 2007102030213A CN 200710203021 A CN200710203021 A CN 200710203021A CN 101460011 B CN101460011 B CN 101460011B
- Authority
- CN
- China
- Prior art keywords
- copper
- guide hole
- layer
- polish
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 35
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 320
- 239000010949 copper Substances 0.000 claims abstract description 316
- 229910052802 copper Inorganic materials 0.000 claims abstract description 314
- 239000000463 material Substances 0.000 claims abstract description 199
- 238000000034 method Methods 0.000 claims abstract description 53
- 239000000758 substrate Substances 0.000 claims description 50
- 239000011347 resin Substances 0.000 claims description 27
- 229920005989 resin Polymers 0.000 claims description 27
- 239000007788 liquid Substances 0.000 claims description 11
- 239000004744 fabric Substances 0.000 claims description 10
- 239000000919 ceramic Substances 0.000 claims description 6
- 239000004677 Nylon Substances 0.000 claims description 4
- 229920001778 nylon Polymers 0.000 claims description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims description 3
- DBMPSFYQYJMEND-UHFFFAOYSA-L [Cu](Cl)Cl.S(=O)(=O)(O)O Chemical compound [Cu](Cl)Cl.S(=O)(=O)(O)O DBMPSFYQYJMEND-UHFFFAOYSA-L 0.000 claims description 3
- VCFCCSHKRUCZGF-UHFFFAOYSA-L [Na+].[Na+].OS(O)(=O)=O.[O-]S(=O)(=O)OOS([O-])(=O)=O Chemical compound [Na+].[Na+].OS(O)(=O)=O.[O-]S(=O)(=O)OOS([O-])(=O)=O VCFCCSHKRUCZGF-UHFFFAOYSA-L 0.000 claims description 3
- GVDZRXUHIYPWEP-UHFFFAOYSA-L dipotassium;sulfonatooxy sulfate;sulfuric acid Chemical compound [K+].[K+].OS(O)(=O)=O.[O-]S(=O)(=O)OOS([O-])(=O)=O GVDZRXUHIYPWEP-UHFFFAOYSA-L 0.000 claims description 3
- XEMZLVDIUVCKGL-UHFFFAOYSA-N hydrogen peroxide;sulfuric acid Chemical compound OO.OS(O)(=O)=O XEMZLVDIUVCKGL-UHFFFAOYSA-N 0.000 claims description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 3
- 238000005530 etching Methods 0.000 abstract description 9
- 239000011248 coating agent Substances 0.000 abstract 7
- 238000000576 coating method Methods 0.000 abstract 7
- 230000001815 facial effect Effects 0.000 abstract 1
- 239000011148 porous material Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 254
- 229910000906 Bronze Inorganic materials 0.000 description 102
- 239000010974 bronze Substances 0.000 description 102
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 102
- 238000012856 packing Methods 0.000 description 12
- 238000005516 engineering process Methods 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 8
- 238000003825 pressing Methods 0.000 description 8
- 238000007639 printing Methods 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 4
- 230000003750 conditioning effect Effects 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 230000003628 erosive effect Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000010422 painting Methods 0.000 description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000004926 polymethyl methacrylate Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- 239000004952 Polyamide Substances 0.000 description 2
- XMTUTNATKAITLD-UHFFFAOYSA-N S(O)(O)(=O)=O.[O].[O] Chemical compound S(O)(O)(=O)=O.[O].[O] XMTUTNATKAITLD-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 235000019157 thiamine Nutrition 0.000 description 2
- 150000003544 thiamines Chemical class 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
Images
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007102030213A CN101460011B (zh) | 2007-12-12 | 2007-12-12 | 电路板制作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007102030213A CN101460011B (zh) | 2007-12-12 | 2007-12-12 | 电路板制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101460011A CN101460011A (zh) | 2009-06-17 |
CN101460011B true CN101460011B (zh) | 2012-03-21 |
Family
ID=40770560
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007102030213A Expired - Fee Related CN101460011B (zh) | 2007-12-12 | 2007-12-12 | 电路板制作方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN101460011B (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101716744B (zh) * | 2009-11-12 | 2012-01-18 | 博敏电子股份有限公司 | 无环盲孔高密度互连印制线路板板面整平的方法 |
CN103013523B (zh) * | 2012-12-13 | 2014-05-14 | 北京七星华创电子股份有限公司 | 一种蚀刻剂及其制备和应用 |
CN105792501B (zh) * | 2014-12-23 | 2018-10-30 | 鹏鼎控股(深圳)股份有限公司 | 电路板及其制作方法 |
CN106488642A (zh) * | 2015-08-27 | 2017-03-08 | 富葵精密组件(深圳)有限公司 | 柔性线路板及其制作方法 |
CN105611747B (zh) * | 2015-12-18 | 2018-07-20 | 景旺电子科技(龙川)有限公司 | 一种提高铜基板沉镍后镍表面亮度的制作方法 |
CN108289391A (zh) * | 2018-01-17 | 2018-07-17 | 维沃移动通信有限公司 | 一种电路板的制作方法、电路板及移动终端 |
CN109968166A (zh) * | 2019-03-19 | 2019-07-05 | 广州兴森快捷电路科技有限公司 | 电路板塞孔树脂的研磨方法及研磨装置 |
CN113453437A (zh) * | 2021-06-22 | 2021-09-28 | 江苏富乐德半导体科技有限公司 | 一种覆铜陶瓷基板表面缺陷处理的方法 |
-
2007
- 2007-12-12 CN CN2007102030213A patent/CN101460011B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN101460011A (zh) | 2009-06-17 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C53 | Correction of patent for invention or patent application | ||
CB02 | Change of applicant information |
Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant after: Fuku Precision Components (Shenzhen) Co., Ltd. Co-applicant after: Zhending Technology Co., Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Co-applicant before: Honsentech Co., Ltd. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170315 Address after: Guangdong, Shenzhen Province, Fuyong Town, Tong Tong Industrial Zone, factory 5, building 1, building Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee after: Peng Ding Polytron Technologies Inc Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee before: Zhending Technology Co., Ltd. |
|
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Co-patentee after: Peng Ding Polytron Technologies Inc Patentee after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee before: Peng Ding Polytron Technologies Inc Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120321 Termination date: 20201212 |