CN101458368B - 实现将光纤阵列***微孔阵列的装置及方法 - Google Patents
实现将光纤阵列***微孔阵列的装置及方法 Download PDFInfo
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- CN101458368B CN101458368B CN2007101793513A CN200710179351A CN101458368B CN 101458368 B CN101458368 B CN 101458368B CN 2007101793513 A CN2007101793513 A CN 2007101793513A CN 200710179351 A CN200710179351 A CN 200710179351A CN 101458368 B CN101458368 B CN 101458368B
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Application Number | Priority Date | Filing Date | Title |
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CN2007101793513A CN101458368B (zh) | 2007-12-12 | 2007-12-12 | 实现将光纤阵列***微孔阵列的装置及方法 |
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CN2007101793513A CN101458368B (zh) | 2007-12-12 | 2007-12-12 | 实现将光纤阵列***微孔阵列的装置及方法 |
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CN101458368A CN101458368A (zh) | 2009-06-17 |
CN101458368B true CN101458368B (zh) | 2010-04-21 |
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CN2007101793513A Active CN101458368B (zh) | 2007-12-12 | 2007-12-12 | 实现将光纤阵列***微孔阵列的装置及方法 |
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Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2548169Y (zh) * | 2002-03-01 | 2003-04-30 | 富士康(昆山)电脑接插件有限公司 | 光纤阵列 |
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Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN2548169Y (zh) * | 2002-03-01 | 2003-04-30 | 富士康(昆山)电脑接插件有限公司 | 光纤阵列 |
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Owner name: NATIONAL CENTER FOR ADVANCED PACKAGING Free format text: FORMER OWNER: INST OF MICROELECTRONICS, C. A. S Effective date: 20150217 |
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Free format text: CORRECT: ADDRESS; FROM: 100029 CHAOYANG, BEIJING TO: 214135 WUXI, JIANGSU PROVINCE |
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Effective date of registration: 20150217 Address after: 214135 Jiangsu province Wuxi City Linghu Road No. 200 Chinese Sensor Network International Innovation Park building D1 Patentee after: National Center for Advanced Packaging Co.,Ltd. Address before: 100029 Beijing city Chaoyang District Beitucheng West Road No. 3 Patentee before: Institute of Microelectronics of the Chinese Academy of Sciences |
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Effective date of registration: 20170818 Address after: 200331 room 155-2, ginkgo Road, Shanghai, Putuo District, China, 4 Patentee after: Shanghai State Intellectual Property Services Co.,Ltd. Address before: 214135 Jiangsu province Wuxi City Linghu Road No. 200 Chinese Sensor Network International Innovation Park building D1 Patentee before: National Center for Advanced Packaging Co.,Ltd. |
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Effective date of registration: 20191203 Address after: 214028 Jiangsu New District of Wuxi City Linghu Road No. 200 Chinese Sensor Network International Innovation Park building D1 Patentee after: National Center for Advanced Packaging Co.,Ltd. Address before: 200331 room 155-2, ginkgo Road, Shanghai, Putuo District, China, 4 Patentee before: Shanghai State Intellectual Property Services Co.,Ltd. |
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