CN101458288A - Apparatus and method for detecting open circuit defect by utilizing capacitive lead frame sensing - Google Patents
Apparatus and method for detecting open circuit defect by utilizing capacitive lead frame sensing Download PDFInfo
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- CN101458288A CN101458288A CNA2007101986357A CN200710198635A CN101458288A CN 101458288 A CN101458288 A CN 101458288A CN A2007101986357 A CNA2007101986357 A CN A2007101986357A CN 200710198635 A CN200710198635 A CN 200710198635A CN 101458288 A CN101458288 A CN 101458288A
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Abstract
The invention provides a device for sensing and detecting open circuit defects by using capacitive lead frame and a method thereof. According to one aspect, the invention provides a device for detecting the open circuit defects on the nodes between pins formed on electronic devices and circuit components arranged on the electronic devices. The device comprises an AC source and a sensor board. The AC source exerts AC signals upon current tested nodes among the nodes; according to the arrangement of the electronic devices, the sensor board is divided into blocks, so that one block corresponds to each node. A detector measures signals at the blocks corresponding to the tested nodes; the signals are generated due to the capacitive coupling between the tested nodes and the corresponding blocks, and judges whether the open circuit defects exist at the tested nodes based on the measurement results.
Description
Technical field
The present invention generally relates to and detects electrical connectivity (continuity), in particular to the apparatus and method that are used to utilize capacitive lead frame sensing (capacitive lead frame sensing) to come open defect (opendefect).
Background technology
A kind of common deficiency of finding through regular meeting during to the continuity testing of integrated circuit package (integrated circuit assembly) is " open circuit " defective.In open circuit defect, should work as therebetween in circuit, exist between two points of electrical connectivity and lacked electrical connection.Open circuit defect is normally caused by the problem in the manufacture process (for example leaking weldering).Therefore, during continuity testing, need diagnosis to disconnect such connection defective such as solder joint.Detection to open circuit defect normally utilizes known capacitive lead frame sensing technology to carry out.
Fig. 1 shows a kind of lead frame sensing measurement configuration of prior art.Proving installation 101 shown in Figure 1 comprises AC (interchange) source 102, sensing plate (sensor plate) 103, detecting device 104, impact damper 105 and earthing device 106.As shown in Figure 1, connector 107 is examples of electron device, it have N pin 110-1,110-2 ..., 110-N (N=9 in this example), and be installed on the circuit unit 108.For clarity, pin 110-1 and 110-9 in Fig. 1, have only clearly been marked.This is equally applicable to other key elements and accompanying drawing subsequently.Between the pin of connector and circuit unit, formed nine node 109-1,109-2. ..., 109-9.In this example, first node is played on a left side, and promptly node 109-1 will be the destination node of open circuit joint detection.As shown in Figure 1, AC source 102 is connected to tested node 109-1.The signal at node 109-1 place will capacitive be coupled to sensing plate 103, thereby detecting device 104 can be measured the electric signal of output place of impact damper 105, with the connectedness between the Far Left pin 110-1 of proof scheme assembly 108 and connector, just judge at node 109-1 place whether have open circuit defect.In this example, the capacitive coupling that should measure is actually the contact spring 111-1 of Far Left pin 110-1 and the coupling between the sensing plate.But, also exist via adjacent pin and via the extra coupling of the conductor wire on the circuit unit.In order to eliminate this capacitive at random coupling and to make minimum, other all nodes all are connected to signal ground by earthing device 106.In the case, earthing device 106 is the leads that are used for other nodes are connected to ground.This is called as " protection (guarding) " technology.
Fig. 2 shows the setting identical with Fig. 1, and only five of the left side nodes by short circuit together.This short circuit is contingent in practical design, it or take place by the conductor wire on the circuit unit, or take place, or low-impedance device on the circuit unit takes place by being installed in by the conductor wire in the device.If utilize traditional sensing plate shown in Figure 1, just can not test again, because the coupling of now total capacitive is to add by five connector springs to finish via the coupling extra at random of adjacent leads by short circuit node together." protection " technology can not be used for separating the coupling of the pin of five short circuits again, because the pin of these five short circuits or be connected directly together, perhaps impedance is too low.Above-mentioned this situation usually occurs on " power supply node ", and power supply node is connected with many device pins usually in current circuit design, and this may reduce the fault coverage (fault coverage) of traditional lead frame sensing technology greatly
As seen, the design of existing lead frame sensing technology makes that it can only be at device pin via circuit unit or device itself and short circuit could detect failure of connectivity together the time.Wish can for the pin of direct short-circuit or by the low impedance path on the circuit unit virtually short circuit pin together provide fault to cover and diagnosis.
Summary of the invention
According to an aspect of the present invention, a kind of device that is used to detect the pin that is formed at electron device and the open circuit defect at the node place between the circuit unit of this electron device is installed is provided, this device comprises: the AC source, its current tested node in described node applies the AC signal: and sensing plate, its layout according to described device is divided into block, and making has a block corresponding with it for each described node.The signal that detectors measure and the corresponding block of described tested node place produce owing to the coupling of the capacitive between described tested node and the described corresponding block, and judge at described tested node place whether have open circuit defect based on the result of described measurement.
According to a further aspect in the invention, a kind of method that is used to detect the pin that is formed at electron device and the open circuit defect at the node place between the circuit unit of this electron device is installed is provided, this method comprises that placement is divided into the sensing plate of block according to the layout of described device, and making has a block corresponding with it for each described node.Current tested node applies the AC signal in described node.Measure the signal that produces owing to the coupling of the capacitive between described tested node and the described corresponding block with the corresponding block of described tested node place.Result based on described measurement judges at described tested node place whether have open circuit defect.
Description of drawings
Explanation below reading in conjunction with the accompanying drawings can be understood aforementioned and other features of the present invention more fully, in the accompanying drawing:
Fig. 1 shows the lead frame sensing measurement setting of prior art.
Fig. 2 shows the setting identical with Fig. 1, and only five of the left side pins by short circuit together.
Fig. 3 shows the lead frame sensing measurement setting according to first embodiment of the invention.
Fig. 4 shows the vertical view of sensing plate shown in Figure 3.
Fig. 5 shows the lead frame sensing measurement setting according to second embodiment of the invention.
Fig. 6 shows the lead frame sensing measurement setting according to third embodiment of the invention.
Fig. 7 shows and is used to utilize capacitive lead frame sensing for example shown in Figure 3 to be provided with the process flow diagram of the method for open defect.
Embodiment
Referring now to accompanying drawing embodiments of the invention are described.
Fig. 3 shows the lead frame sensing measurement setting according to first embodiment of the invention.Be similar to Fig. 1, proving installation 101 shown in Figure 3 comprises AC source 102, sensing plate 103, detecting device 104, impact damper 105 and earthing device 106.Connector 107 (for example Memory connector) have N pin 110-1,110-2 ..., 110-N (N=9 in this example), and be installed on the circuit unit 108.Therefore, between the pin of connector and circuit unit, formed 9 node 109-1,109-2 ..., 109-9.With shown in Figure 2 similar, five nodes on the left side by short circuit together, this situation usually occurs on " power supply node ", as mentioned above.
Those skilled in the art will appreciate that the connector here just can be installed in an example of the electron device on the circuit unit.The present invention also can be used for the electrical connectivity between test case such as CPU slot and the pcb board.It is also contemplated that the electron device and the circuit unit of other types.And, the number of pins here (and corresponding interstitial content) and all be example by the interstitial content of short circuit.Device can have the pin of arbitrary number, can form the node of arbitrary number between pin and the circuit unit, and the node that arbitrary number wherein can be arranged is not perhaps had node by short circuit by short circuit.
According to the present invention, in the proving installation 101 of first embodiment, sensing plate 103 is divided into block (segment), and the impact damper of each block and its oneself is connected.Block to sensing plate is divided the layout that will depend on device.Specific in this example, block is divided the layout of contact node is carried out, and more specifically says so to finish corresponding to the physical form of contact spring and position.The shape of contact spring is a rectangle in this example.Therefore the outward appearance that is used for sensing plate behind the subregion of this exemplary means will be as shown in Figure 4.Those skilled in the art will appreciate that the block of sensing plate is divided and can be finished by other means.For example, take place if capacitive coupling is a lead frame by device, the shape of the block that then is divided into should be corresponding to the shape of lead frame.
Particularly, in this example, sensing plate 103 be divided into block 103-1,103-2 ..., 103-6.After sensing plate is divided like this, by the node of short circuit, a unique with it correspondence of independent block is arranged for each.For example, block 103-1 is corresponding to node 109-1, and block 103-2 is corresponding to node 109-2 ..., block 103-5 is corresponding to node 109-5.Not by the node of short circuit, promptly node 109-6,109-7,109-8 and 109-9 have a public block 103-6 corresponding with it, as shown in Figure 3 for all.Correspondingly, exist 6 impact damper 105-1,105-2 ..., 105-6 respectively with block 103-1,103-2 ..., 103-6 is connected.
Like this, when current tested node 109-1 was applied with the AC signal by AC signal source 102, this AC signal will capacitive be coupled to corresponding with it block 103-1.Subsequently, detecting device 104 can be measured the output signal of impact damper 105-1 to judge whether there is open circuit defect at node 109-1 place.That carries out in the detecting device 104 judges that according to measurement result the operation whether open circuit defect exists is as known in the art, will no longer describe in detail here.Test to the connectedness at other node places can be finished by similar mode.
Fig. 5 shows the lead frame sensing measurement setting according to second embodiment of the invention.Be provided with similarly with shown in Figure 3, the sensing plate that is divided into block has been used in shown in Figure 5 being provided with.But,, utilized a multiplexer 112 to share common impact dampers 105 and this impact damper be connected to block in the use in order to save expensive impact damper electron device.The input of this multiplexer 112 is connected with one of block of sensing plate 103 respectively, and its output is connected with public impact damper 105, as shown in Figure 5.For example, if current tested node is node 109-1, then multiplexer will output to impact damper 105 to the signal at block 103-1 place.
Fig. 6 shows the lead frame sensing measurement setting according to third embodiment of the invention.Difference between first embodiment and the 3rd embodiment is that sensing plate 103 is divided into block in mode shown in Figure 6, make for nine node 109-1,109-2 ..., among the 109-9 each, will have an independent block corresponding uniquely with it.For example, block 103-1 is corresponding to node 109-1, and block 103-2 is corresponding to node 109-2 ..., block 103-9 is corresponding to node 109-9.Correspondingly, exist 9 impact damper 105-1,105-2 ..., 105-9 be connected respectively to block 103-1,103-2 ..., 103-9.Obviously, also can promptly replace 9 impact dampers in the case in conjunction with configuration shown in Figure 5 with a multiplexer and a public impact damper.
Fig. 7 shows and is used to utilize capacitive lead frame sensing for example shown in Figure 3 to be provided with the process flow diagram of the method for open defect.In step S701, sensing plate 103 is placed on the appropriate position of connector 107 tops, and this connector 107 has been installed on the circuit unit 108, as shown in Figure 3.In step S702, AC source 102 is connected to tested node, for example node 109-1.In step S703, with current not tested and also not by short circuit node 109-6,109-7,109-8 and 109-9 ground connection together.At step S704, measure from the signal of impact damper 105-1 output with detecting device 104.At step S705, detecting device 104 judges at node 109-1 place whether have open circuit defect according to the result of the measurement of carrying out among the step S704.Judge that according to measurement result the method whether open circuit defect exists is as known in the art, will no longer describe in detail here.At step S706, all nodes have been judged whether after tested.If then this process finishes.Otherwise this process turns back to step S702.For next node repeating step S702-S706.
Therefore the present invention has improved traditional lead frame sensing technology.For the pin of direct short-circuit or by the low impedance path on the circuit unit situation of short circuit pin together virtually, the present invention has improved the fault coverage of capacitive lead frame sensing testing technology.
Under the situation that does not break away from spirit of the present invention and essential characteristics, can realize the present invention with other concrete forms.Therefore, given embodiment should only be considered to exemplary, rather than restrictive, scope of the present invention is limited by claims rather than above stated specification, so all drop on the implication of equivalent of claim and the variation in the scope all will be included in this.
Claims (14)
1. device that is used to detect the pin that is formed at electron device and the open circuit defect at the node place between the circuit unit of this electron device is installed, this device comprises:
Alternating current source, its current tested node in described node applies AC signal;
Sensing plate, its layout according to described device is divided into block, and making has a block corresponding with it for each described node; And
Detecting device, it measures the signal that produces owing to the coupling of the capacitive between described tested node and the described corresponding block with the corresponding block of described tested node place, and judges at described tested node place whether have open circuit defect based on the result of described measurement.
2. device as claimed in claim 1, wherein said sensing plate is divided into block according to the position and the shape of described node.
3. device as claimed in claim 1 or 2, wherein said sensing plate are divided so that for each described node, have an independent block corresponding uniquely with it.
4. device as claimed in claim 1 or 2, some nodes in the wherein said node by short circuit together, and described sensing plate is divided so that for the node of each short circuit, there is an independent block corresponding uniquely with it, and for all not by the node of short circuit, have a public block corresponding with it, and this public block is different from the corresponding block of any and described short circuit node.
5. device as claimed in claim 1 also comprises earthing device, is used for all current not tested and be not connected to ground by short circuit node together.
6. device as claimed in claim 1 also comprises impact damper, and each impact damper is connected between the input of one of block of described sensing plate and described detecting device.
7. device as claimed in claim 1 also comprises:
Impact damper, it is connected between the output of the input of described detecting device and multiplexer; And
Described multiplexer, it comprises the input of one of block of being connected respectively to described sensing plate.
8. method that is used to detect the pin that is formed at electron device and the open circuit defect at the node place between the circuit unit of this electron device is installed, this method comprises:
Placement is divided into the sensing plate of block according to the layout of described device, and making has a block corresponding with it for each described node;
Current tested node applies AC signal in described node;
Measure the signal that produces owing to the coupling of the capacitive between described tested node and the described corresponding block with the corresponding block of described tested node place; And
Result based on described measurement judges at described tested node place whether have open circuit defect.
9. method as claimed in claim 8, wherein said sensing plate is divided into block according to the position and the shape of described node.
10. method as claimed in claim 8 or 9, wherein said sensing plate is divided so that for each described node, has an independent block corresponding uniquely with it.
11. method as claimed in claim 8 or 9, some nodes in the wherein said node by short circuit together, and described sensing plate is divided so that for the node of each short circuit, there is an independent block corresponding uniquely with it, and for all not by the node of short circuit, have a public block corresponding with it, and this public block is different from the corresponding block of any and described short circuit node.
12. method as claimed in claim 8 also comprises all current not tested and be not connected to ground by short circuit node together.
13. method as claimed in claim 8 also comprises the layout impact damper, each impact damper is connected between the input of one of block of described sensing plate and described detecting device.
14. method as claimed in claim 8, also comprise and arrange impact damper and multiplexer, wherein said impact damper is connected between the output of the input of described detecting device and described multiplexer, and each input of described multiplexer is connected to one of block of described sensing plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101986357A CN101458288A (en) | 2007-12-11 | 2007-12-11 | Apparatus and method for detecting open circuit defect by utilizing capacitive lead frame sensing |
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| Application Number | Priority Date | Filing Date | Title |
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| CNA2007101986357A CN101458288A (en) | 2007-12-11 | 2007-12-11 | Apparatus and method for detecting open circuit defect by utilizing capacitive lead frame sensing |
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| CN101458288A true CN101458288A (en) | 2009-06-17 |
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| CNA2007101986357A Pending CN101458288A (en) | 2007-12-11 | 2007-12-11 | Apparatus and method for detecting open circuit defect by utilizing capacitive lead frame sensing |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102708219A (en) * | 2011-12-13 | 2012-10-03 | 西安交通大学 | Method for predicting voltage value of full-open defect of interconnecting wire of deep sub-micron integrated circuit |
| CN103983887A (en) * | 2014-05-23 | 2014-08-13 | 工业和信息化部电子第五研究所 | Automatic locating method and device for open circuit of circuit |
-
2007
- 2007-12-11 CN CNA2007101986357A patent/CN101458288A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102708219A (en) * | 2011-12-13 | 2012-10-03 | 西安交通大学 | Method for predicting voltage value of full-open defect of interconnecting wire of deep sub-micron integrated circuit |
| CN102708219B (en) * | 2011-12-13 | 2014-03-12 | 西安交通大学 | Method for predicting voltage value of full-open defect of interconnecting wire of deep sub-micron integrated circuit |
| CN103983887A (en) * | 2014-05-23 | 2014-08-13 | 工业和信息化部电子第五研究所 | Automatic locating method and device for open circuit of circuit |
| CN103983887B (en) * | 2014-05-23 | 2017-05-10 | 工业和信息化部电子第五研究所 | Automatic locating method and device for open circuit of circuit |
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Open date: 20090617 |