CN101452897B - Heat radiating device for LED - Google Patents
Heat radiating device for LED Download PDFInfo
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- CN101452897B CN101452897B CN2007101248199A CN200710124819A CN101452897B CN 101452897 B CN101452897 B CN 101452897B CN 2007101248199 A CN2007101248199 A CN 2007101248199A CN 200710124819 A CN200710124819 A CN 200710124819A CN 101452897 B CN101452897 B CN 101452897B
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- heat
- dissipating
- radiating device
- radiator
- led
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Abstract
The invention provides an LED heat-dissipating device, which is used for dissipating the heat of an LED module pasted on the heat-dissipating device. The device comprises a plurality of radiators, heat-dissipating units and heat pipes, wherein each radiator comprises a bottom plate and a plurality of heat-dissipating fins extending upwards from the top surface of the bottom plate; each heat-dissipating unit consists of a plurality of heat-dissipating sheet bodies; an airflow channel is formed between every two adjacent heat-dissipating sheet bodies; the heat pipes connect the bottom plates together with the heat-dissipating units in series; the heat-dissipating units are arranged between the two adjacent radiators, the width of the heat-dissipating sheet bodies is less than the height of the radiators so that the heat-dissipating units do not protrude out of the top and bottom surfaces of the radiators when the heat-dissipating units are arranged between the two adjacent radiators, and the airflow channels communicate with an upper region and a lower region of the LED heat-dissipating device. When the air in the airflow channels is heated to enter the upper region of the LED module, the airflow channels are immediately replenished with the airflow of the lower region of the LED module, so as to form the upper-lower airflow circulation which is capable of effectively improving the heat-dissipating efficiency of the LED module.
Description
Technical field
The present invention relates to a kind of heat abstractor, particularly a kind of LED radiating device.
Background technology
Along with the develop rapidly of electronic industry, the electronic component speed of service constantly promotes, and produces a large amount of heats during operation, and itself and system temperature are raise, and influences the stability of its work then.For guaranteeing that electronic component can normally move, a radiator is installed usually, thereon to discharge the heat that it is produced.
The traditional solution of electronic element radiating problem is normally installed a radiator on each heat-generating electronic elements, this radiator comprises the base plate that closely contacts with electronic component, is located at the some radiating fins on the base plate.But, for some special heat-generating electronic elements such as the huge light-emitting diode of quantity, if like this by traditional heat radiation solution, utilize a solid base plate to contact, be transmitted to be dispersed in the surrounding air on the radiating fin by heat and dispel the heat light-emitting diode with all light-emitting diode.
Yet this type of base plate volume and area are all bigger, and the cost that not only strengthens radiator also causes entire product excessive, overweight simultaneously.The more important thing is, because the radiating fin ambient air convection intensity of the roomy and high hot-zone, position, solid intermediate portion of base plate is poor than the radiating fin of base plate periphery obviously, the integral heat sink ability of this radiator can be greatly influenced like this, the serious consequence of dispelling the heat non-uniform phenomenon and easily causing portion's heater element to damage can be produced simultaneously.
Summary of the invention
In view of this, be necessary to provide a kind of cross-ventilation LED radiating device preferably.
A kind of LED radiating device, be used for the light emitting diode module that adheres on the heat abstractor is dispelled the heat, it comprises some radiators, some heat-sink units and some heat pipes, described radiator comprises that a base plate reaches from the upwardly extending some radiating fins of plate top surface, described heat-sink unit is made of some heat radiation lamellar bodies, be formed with gas channel between the per two adjacent fin bodies, described heat pipe is serially connected described base plate and heat-sink unit, described heat-sink unit is interposed between the two adjacent radiators, the width of described heat radiation lamellar body is less than the height of described radiator, do not protrude out the top and bottom of radiator when making heat-sink unit be interposed between the second radiator, described gas channel is communicated with the zone up and down of described LED radiating device.
Gas channel between above-mentioned heat radiation lamellar body is communicated with this light emitting diode module zone up and down, obtain replenishing into when entering the light emitting diode module upper zone when the air in the gas channel is heated at once, form the radiating efficiency that the circulation of going up downstream can effectively improve this light emitting diode module like this from the air draught of light emitting diode module lower area.
With reference to the accompanying drawings, the invention will be further described in conjunction with specific embodiments.
Description of drawings
Fig. 1 is the stereogram of LED radiating device of the present invention.
Fig. 2 is the three-dimensional exploded view of LED radiating device among Fig. 1.
Fig. 3 is the inversion figure of LED radiating device among Fig. 1.
Fig. 4 is the vertical view of LED radiating device among Fig. 1.
Embodiment
Shown in Fig. 1-4, LED radiating device of the present invention is used for the light emitting diode module 40 that is attached at its bottom is dispelled the heat, and it comprises that the identical radiator of three structures 10, two groups are folded in heat-sink unit 20 and the some heat pipes 30 that radiator 10 and heat-sink unit 20 thermal conductances are linked together between adjacent two radiators 10.
Shown in Fig. 1-2, above-mentioned radiator 10 can be one-body molded by heat conductivility good metal material such as aluminium, copper etc., and it comprises a rectangular base plate 12 and some radiating fins 14 that extends vertically upward from base plate 12 end faces.These radiating fin 14 mutual equi-spaced apart and parallel with relative two long limits of base plate 12 are formed with the gas channel (not label) that air feed stream passes through between per two radiating fins 14.This radiator 10 offers the some interconnections 16 that radiating fin 14 are cut into some equal portions, and these interconnections 16 extend perpendicular to radiating fin 14, and offers the semi-circular recesses 120 of ccontaining heat pipe 30 on the base plate 12 of corresponding interconnection 16 bottoms.
Above-mentioned each group heat-sink unit 20 is included in three fins group of lining up row between adjacent two radiators 10, some heat radiation lamellar bodies 22 that each fins group is made by rectangular metal sheet constitute, the width of this heat radiation lamellar body 22 is slightly less than the height of this radiator 10, so that heat-sink unit 20 does not protrude out the top and bottom of radiator 10 when being interposed between the second radiator 10, promptly each heat radiation lamellar body 22 end face and bottom surface are all between the end face and bottom surface of radiator 10.Each heat radiation lamellar body 22 bores a hole 220 at interval being provided with corresponding with groove 120 on radiator 10 base plates 12 three near its lower limb, the periphery vertical extent of this perforation 220 has circular fold 222, when all heat radiation lamellar body 22 mutual superposition form heat-sink unit 22 together, the perforation 220 of these correspondences and flanging 222 form together that a heating tube 30 places and with the radiator 10 grooves 120 corresponding tubulose holding channels that are communicated with.The last lower limb of this heat radiation lamellar body 22 vertically is extended with some spaced tabs 224 to the homonymy of flanging 222 respectively, and the development length of this lug 224 equates that with flanging 222 lamellar body 22 mutual equi-spaced apart come dispelling the heat.Be formed with between the per two adjacent heat radiation lamellar bodies 22 and be communicated with this LED radiating device gas channel in zone up and down.
The quantity of above-mentioned heat pipe 30 is nine, is divided into three groups, and three every group, wherein each group heat pipe 30 is set in the fins group.Each heat pipe 30 straight extension, its cross section are circular.
See also Fig. 3, be installed on the bottom surface of each radiator 10 base plate 12 to above-mentioned light emitting diode module 40 equi-spaced apart, it comprises a rectangular circuit board 42 and some light-emitting diodes 44 that is installed on the circuit board 42 with being arranged, and this light-emitting diode 44 is radiator 10 dorsad.
See also Fig. 4, above-mentioned LED radiating device is when combination, above-mentioned heat pipe 30 is set in the holding channel of heat-sink unit 20 of two groups of spaces, is exposed in the middle of two groups of heat-sink units 20 and heat pipe 30 parts of relative both sides are embedded in the groove 120 on the base plate 12 by the interconnection on the radiator 10 16 and can fix by modes such as welding, stickups.Above-mentioned light emitting diode module 40 can post bottom surface at this radiator 10 base plates 12 by modes such as lock screw or stickups.At this moment, heat-sink unit 20 closely is interposed in respectively between 12 liang of relative long sides of two radiators, 10 base plates, and its heat radiation lamellar body 22 and gas channel are all parallel with the radiating fin 14 of radiator 10.
Above-mentioned LED radiating device in use, the heat that light emitting diode module 40 produces is absorbed by base plate 12, a part of then heat is transmitted on the radiating fin 14 of radiator 10, and another part is transmitted on the heat-sink unit 20 by heat pipe 30 and finally is dispersed into the effect that reaches cooling light emitting diode module 40 in the surrounding air by radiating fin 14 and heat radiation lamellar body 22.
The heat radiation lamellar body 22 of above-mentioned heat-sink unit 20 is the light relatively bigger sheet metal of area of quality, and be connected with radiator 10 by heat pipe 30 and need not to be provided with base, so under the situation that slightly increases the weight of the LED radiating device oeverall quality, significantly increase the overall area of dissipation of this LED radiating device, the while also reduces the use of submount material and reduces the material cost that this LED radiating device is made.And the gas channel of 22 of above-mentioned heat radiation lamellar bodies is communicated with this light emitting diode module, and about in the of 40 the zone, obtain replenishing into when entering light emitting diode module 40 upper zones when the air in the gas channel is heated at once, form the radiating efficiency that the circulation of going up downstream can effectively improve this light emitting diode module 40 like this from the air draught of light emitting diode module 40 lower areas.
Be understandable that, in other embodiments, LED radiating device can comprise the radiator 10 more than two or three, and the heat-sink unit 20 of respective amount is interposed between the two whenever adjacent radiators 10 and enough passes the heat pipe 30 of these radiators 10 and heat-sink unit 20.
Claims (9)
1. LED radiating device, it comprises some radiators, some heat-sink units and some heat pipes, described radiator comprises that a base plate reaches from the upwardly extending some radiating fins of plate top surface, it is characterized in that: described heat-sink unit is made of some heat radiation lamellar bodies, be formed with gas channel between the per two adjacent fin bodies, described heat pipe is serially connected described base plate of radiator and heat-sink unit, described heat-sink unit is interposed between the two adjacent radiators, the width of described heat radiation lamellar body is less than the height of described radiator, do not protrude out the top and bottom of radiator when making heat-sink unit be interposed between the second radiator, described gas channel is communicated with the zone up and down of described LED radiating device.
2. LED radiating device as claimed in claim 1 is characterized in that: be formed with some grooves on the described base plate, described heat pipe is embedded in the corresponding groove.
3. LED radiating device as claimed in claim 2 is characterized in that: described radiating fin is perpendicular to forming interconnection on described groove and the respective slot.
4. LED radiating device as claimed in claim 3 is characterized in that: described interconnection is some equal portions with the radiating fin cutting.
5. LED radiating device as claimed in claim 2 is characterized in that: described base plate is rectangular, and described radiating fin and heat radiation lamellar body are parallel with base plate two relative long sides.
6. LED radiating device as claimed in claim 5 is characterized in that: described heat-sink unit is interposed between the long limit of the close base plate of two adjacent radiators.
7. LED radiating device as claimed in claim 1 is characterized in that: described heat radiation lamellar body is rectangular.
8. LED radiating device as claimed in claim 2, it is characterized in that: described heat radiation lamellar body offers the perforation corresponding with the groove of described base plate of radiator near its lower edge, the periphery vertical extent of described perforation has circular fold, the holding channel that the corresponding formation with flanging of most perforation one heating tube places.
9. LED radiating device as claimed in claim 8 is characterized in that: the last lower limb of described this heat radiation lamellar body vertically is extended with some spaced tabs to the homonymy of flanging respectively, and the development length of this lug equates with flanging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101248199A CN101452897B (en) | 2007-12-05 | 2007-12-05 | Heat radiating device for LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101248199A CN101452897B (en) | 2007-12-05 | 2007-12-05 | Heat radiating device for LED |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101452897A CN101452897A (en) | 2009-06-10 |
| CN101452897B true CN101452897B (en) | 2011-03-30 |
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ID=40735041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101248199A Expired - Fee Related CN101452897B (en) | 2007-12-05 | 2007-12-05 | Heat radiating device for LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101452897B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108811441B (en) * | 2018-06-20 | 2024-02-09 | 江苏英杰电子器件有限公司 | Split welding type radiator |
| CN113280272B (en) * | 2021-06-03 | 2022-01-11 | 深圳市昭祺科技有限公司 | Surface-mounted LED (light-emitting diode) pipe fitting |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2653575Y (en) * | 2003-09-10 | 2004-11-03 | 珍通科技股份有限公司 | Double layer heat radiator |
| CN2655326Y (en) * | 2003-09-10 | 2004-11-10 | 幸孺企业有限公司 | Radiator |
| CN2699477Y (en) * | 2004-05-17 | 2005-05-11 | 华音电器股份有限公司 | Heat-pipe radiator construction |
| CN1705112A (en) * | 2004-05-26 | 2005-12-07 | 鸿富锦精密工业（深圳）有限公司 | Heat pipe radiating unit and manufacturing method thereof |
| CN2800492Y (en) * | 2005-04-23 | 2006-07-26 | 富准精密工业(深圳)有限公司 | Heat pipe radiator |
| CN1851910A (en) * | 2005-04-22 | 2006-10-25 | 富准精密工业(深圳)有限公司 | Heat-pipe radiating apparatus |
| CN2845166Y (en) * | 2005-06-08 | 2006-12-06 | 陈国星 | Heat-pipe radiator and fin thereof |
| CN1917190A (en) * | 2005-08-19 | 2007-02-21 | 富准精密工业(深圳)有限公司 | Heat sink for heat pipe |
| CN2877035Y (en) * | 2005-11-15 | 2007-03-07 | 曜越科技股份有限公司 | Overhead suspension type heat radiation member |
-
2007
- 2007-12-05 CN CN2007101248199A patent/CN101452897B/en not_active Expired - Fee Related
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2653575Y (en) * | 2003-09-10 | 2004-11-03 | 珍通科技股份有限公司 | Double layer heat radiator |
| CN2655326Y (en) * | 2003-09-10 | 2004-11-10 | 幸孺企业有限公司 | Radiator |
| CN2699477Y (en) * | 2004-05-17 | 2005-05-11 | 华音电器股份有限公司 | Heat-pipe radiator construction |
| CN1705112A (en) * | 2004-05-26 | 2005-12-07 | 鸿富锦精密工业（深圳）有限公司 | Heat pipe radiating unit and manufacturing method thereof |
| CN1851910A (en) * | 2005-04-22 | 2006-10-25 | 富准精密工业(深圳)有限公司 | Heat-pipe radiating apparatus |
| CN2800492Y (en) * | 2005-04-23 | 2006-07-26 | 富准精密工业(深圳)有限公司 | Heat pipe radiator |
| CN2845166Y (en) * | 2005-06-08 | 2006-12-06 | 陈国星 | Heat-pipe radiator and fin thereof |
| CN1917190A (en) * | 2005-08-19 | 2007-02-21 | 富准精密工业(深圳)有限公司 | Heat sink for heat pipe |
| CN2877035Y (en) * | 2005-11-15 | 2007-03-07 | 曜越科技股份有限公司 | Overhead suspension type heat radiation member |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101452897A (en) | 2009-06-10 |
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Granted publication date: 20110330 Termination date: 20111205 |