CN101442061B - 相机组件 - Google Patents

相机组件 Download PDF

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Publication number
CN101442061B
CN101442061B CN2007102025963A CN200710202596A CN101442061B CN 101442061 B CN101442061 B CN 101442061B CN 2007102025963 A CN2007102025963 A CN 2007102025963A CN 200710202596 A CN200710202596 A CN 200710202596A CN 101442061 B CN101442061 B CN 101442061B
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groove
substrate
circuit board
camera module
image sensor
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CN101442061A (zh
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郑竣方
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to US12/061,913 priority patent/US7990730B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0311—Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Studio Devices (AREA)
  • Lens Barrels (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

本发明提供一种相机组件。所述相机组件包括所述电路板和一个相机模组，所述相机模组包括一个镜头模组、一个影像感测器和一个基板。所述镜头模组和所述影像感测器固定于所述基板的同一表面。所述影像感测器与所述基板电性连接，且收容在所述镜头模组内。所述电路板设置有一个凹槽，该凹槽用于***述相机模组，在所述凹槽的槽底上设置有至少一个金属接点。所述基板背对所述镜头模组的表面上设置有至少一个外接点，所述外接点与所述金属接点相接触。

Description

相机组件
技术领域
本发明涉及一种相机组件。
背景技术
请参阅图1，为现有技术提供的一种相机模组1与电路板2的连接结构的剖视图。所述相机模组1包括一个镜头模组3、一个感测器4和一个基板5。所述感测器4固定在所述基板5表面，且与所述基板5电性连接。所述镜头模组3固定在所述基板5设置有所述感测器4的表面上，并将所述感测器4收容在所述镜头模组3内部。
所述相机模组1通过SMT(表面贴装技术)组装到所述电路板2上之后，在维修或者当需要将所述相机模组1从所述电路板2上取下时，会非常的不方便，有时在拆卸时，会导致所述相机模组1和所述电路板2的损坏。
发明内容
有鉴于此，有必要提供一种便于拆装的相机组件。
一种相机组件，包括一个电路板和一个相机模组，所述相机模组包括一个镜头模组、一个影像感测器和一个基板。所述镜头模组和所述影像感测器固定于所述基板的同一表面。所述影像感测器与所述基板电性连接，且收容在所述镜头模组内。所述电路板设置有一个凹槽，该凹槽用于***述相机模组，在所述凹槽的槽底上设置有至少一个金属接点。所述基板背对所述镜头模组的表面上设置有至少一个外接点，所述外接点与所述金属接点相接触。
与现有技术相比较，所述电路板通过设置凹槽来***述相机模组，从而，在组装时，只需将所述相机模组向下按入所述电路板的凹槽内。由设置于所述电路板凹槽内的接点和所述相机模组的基板的外接点相接触，实现电性导通。该种结构非常便于拆装，而且在拆卸时不会对相机模组或电路板造成伤害。
附图说明
图1是现有技术提供的一种电路板与相机模组连接结构的剖视图。
图2是本发明第一实施方式提供的相机组件的剖视图。
图3是图2中相机组件的电路板的上视图。
图4是图2中相机组件的相机模组的下视图。
图5是本发明第二实施方式提供的相机组件的剖视图。
具体实施方式
请参阅图2，为本发明第一实施方式提供的相机组件100的剖视图。所述相机组件100包括一个电路板20与一个相机模组10。所述电路板20上设置一个凹槽21，该凹槽21用于收容一个相机模组10并与相机模组10电性连接。
所述电路板20为一个印刷电路板。所述凹槽21的每个侧壁上固定有至少一个铁片24，且所述铁片24均具有一个凸起，该凸起用于与所述相机模组10相配合，将所述相机模组10卡住，从而固定所述电路板20和所述相机模组10在水平位置上的位置关系。在本实施例中，所述铁片24呈长方形，其长边平行于所述凹槽21的槽底22。所述凸起的截面呈三角形，其横贯所述铁片24，并与所述槽底22平行。在所述电路板20的凹槽21的槽底22上设置有至少一个金属接点23。请一并参阅图2和图3，所述凹槽21呈方形，所述金属接点23分布在所述凹槽21槽底22的边缘，具体的，在所述槽底22相对的两条边上分别设置八个金属接点23，而另外两条边上分别设置四个金属接点23。所述电路板20通过所述金属接点23接收相机模组10传来的电信号。
所述相机模组10包括：一个镜头模组12、一个影像感测器13以及一个基板14。所述镜头模组12和所述影像感测器13固定于所述基板14的一个表面上，且所述影像感测器13收容于所述镜头模组12与所述基板14围成的空间内，在所述基板14表面围绕所述影像感测器13的区域设置有至少一个电子元件17，所述电子元件17可以为被动元件、驱动晶片等。
所述镜头模组12内部设置有至少一个成像透镜11，且该镜头模组12位于所述成像透镜11像侧的一端粘接在所述基板14表面。
所述影像感测器13可以为一个CCD(电荷耦合元件)，也可以为一个CMOS(互补性氧化金属半导体)，在本实施方式中，其为一个CCD。所述影像感测器13将感测到的光信号转换成电信号。
请一并参阅图2和图4，所述基板14为一个印刷电路板。在所述基板14的四个侧壁上分别具有一平行于侧壁长边的基板凹槽，该基板凹槽用于与所述铁片24的凸起相卡合，将所述凸起卡在该基板凹槽内。当然，所述基板14上每个侧壁上的可以设置不连续的多个开槽，其具体数量和开槽长度与相对应的铁片24的凸起的数量和长度一致。在所述基板14背对所述镜头模组12的表面15上设置有至少一个外接点16，所述外接点16用于将所述影像感测器13产生的电信号传送到外部电路。在本实施方式中，所述基板14呈方形，在所述表面15的四条边附近均设置有外接点16。所述外接点16的数量和位置与所述电路板20的金属接点23的数量和位置相对应。即，在所述表面15相对的两条边上分别设置有八个外接点，另外两条边上分别设置四个外接点。
在将所述相机模组10组装到所述电路板20上时，只需要将所述相机模组10向下按入所述电路板20的凹槽21内，此时，所述凹槽21侧壁上的铁片24的凸起恰好与所述相机模组10的基板凹槽相卡合，且所述相机模组10的基板14的外接点16与所述电路板20的凹槽21内的金属接点23相导通，实现了所述相机模组10与所述电路板20的电性连接。
可以理解，在所述电路板20和所述相机模组10之间还可以通过其它方式进行固定相对位置，只要其功能与本发明相同或相似，均应涵盖于本发明保护范围内。
请参阅图5，为本发明第二实施例提供的相机组件200的剖视图。所述相机组件200包括一个相机模组210和一个电路板220。所述相机模组210包括一个镜头模组212、一个影像感测器213和一个基板214。
所述相机组件200与本发明第一实施方式提供的相机组件100的结构基本相同，其不同之处在于：所述基板214的相对的两个表面上分别设置一个第一凹槽215和一个第二凹槽216。所述影像感测器213收容于所述第一凹槽215内，而所述第二凹槽216可以用于收容至少一个电子元件217。这样通过将所述影像感测器213放入到第一凹槽215内来减小所述相机模组210的高度。通过将原设置在所述影像感测器213周边的电子元件217放入所述第二凹槽216内，来减小所述基板214的尺寸，从而可以将相机模组210做的更小。
与现有技术相比较，所述电路板通过设置凹槽来***述相机模组，从而，在组装时，只需将所述相机模组相下按入所述电路板的凹槽内。由设置于所述电路板凹槽内的接点和所述相机模组的基板的外接点相接触，实现电性导通。该种结构非常便于拆装，而且在拆卸时不会对相机模组或电路板造成伤害。
另外，本领域技术人员还可在本发明精神内做其它变化，只要其不偏离本发明的技术效果，都应包含在本发明所要求保护的范围之内。

Claims (5)

1.一种相机组件，所述相机组件包括一个电路板和一个相机模组，所述相机模组包括一个镜头模组、一个影像感测器和一个基板，所述镜头模组和所述影像感测器固定于所述基板的同一表面，所述影像感测器与所述基板电性连接，且收容在所述镜头模组内，其特征在于：所述电路板设置有一个凹槽，该凹槽用于***述相机模组，在所述凹槽的槽底上设置有至少一个金属接点，所述基板背对所述镜头模组的表面上设置有至少一个外接点，所述外接点与所述金属接点相接触。
2.如权利要求1所述相机组件，其特征在于：所述凹槽呈方形，在所述凹槽的槽底的四条边附近分别设置有至少一个金属接点。
3.如权利要求1所述相机组件，其特征在于：所述基板的面对所述镜头模组的表面设置有一个凹槽，所述影像感测器设置在所述基板的凹槽内。
4.如权利要求1所述相机组件，其特征在于：所述基板背对所述镜头模组的表面设置有一个凹槽，所述凹槽内收容有至少一个电子元件。
5.如权利要求1所述相机组件，其特征在于：所述电路板的凹槽的每个侧壁上均固定有一个铁片，所述铁片具有一个截面为三角形的凸起，该凸起横贯所述铁片且平行于所述凹槽的槽底，在所述相机模组的基板的侧壁上对应每个所述凸起的位置设置有基板凹槽，所述凸起与所述凹槽相卡合。
CN2007102025963A 2007-11-20 2007-11-20 相机组件 Expired - Fee Related CN101442061B (zh)

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102903722A (zh) * 2011-07-26 2013-01-30 旭丽电子(广州)有限公司 薄型化有源检测模块及其制作方法
CN103579260B (zh) * 2012-07-18 2016-11-16 光宝电子(广州)有限公司 基板连接式模块结构
US9602730B2 (en) * 2014-12-31 2017-03-21 Torrey Pines Logic, Inc. Mountable, thermal situational-awareness accessory for use with optical devices
US9431442B2 (en) * 2015-02-02 2016-08-30 Apple Inc. Overmolded reconstructed camera module
US9973669B2 (en) 2015-08-28 2018-05-15 Apple Inc. Dual overmolded reconstructed camera module

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1199982A (zh) * 1997-05-16 1998-11-25 索尼株式会社 图象拾取装置和摄象机
CN1664639A (zh) * 2004-03-05 2005-09-07 鸿富锦精密工业（深圳）有限公司 数码相机模块
CN101144887A (zh) * 2006-09-12 2008-03-19 群光电子股份有限公司 嵌入式相机镜头模组及其制造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6483101B1 (en) * 1999-12-08 2002-11-19 Amkor Technology, Inc. Molded image sensor package having lens holder
US6654187B2 (en) * 2001-07-16 2003-11-25 Alex Ning Camera lens carrier for circuit board mounting
US7095621B2 (en) * 2003-02-24 2006-08-22 Avago Technologies Sensor Ip (Singapore) Pte. Ltd. Leadless leadframe electronic package and sensor module incorporating same
US6741405B1 (en) * 2003-03-27 2004-05-25 Exquisite Optical Technology Co., Ltd Hood for a digital image collecting lens
EP1498756A1 (fr) * 2003-07-17 2005-01-19 STMicroelectronics S.A. Méthode de fixage d'une lentille par rapport à un capteur optique dans un dispositif de prise d'images
JP2005176185A (ja) * 2003-12-15 2005-06-30 Nec Access Technica Ltd カメラモジュール実装構造
KR100673950B1 (ko) * 2004-02-20 2007-01-24 삼성테크윈 주식회사 이미지 센서 모듈과 이를 구비하는 카메라 모듈 패키지
TWI282873B (en) * 2004-03-12 2007-06-21 Premier Image Technology Corp Lens module and assembling method thereof
TWI268627B (en) * 2005-07-27 2006-12-11 Impac Technology Co Ltd Image sensing module and method for packing the same
TWI309335B (en) * 2006-02-24 2009-05-01 Advanced Semiconductor Eng An image sensor package
JP4950542B2 (ja) * 2006-04-07 2012-06-13 岩手東芝エレクトロニクス株式会社 固体撮像装置およびその製造方法
KR101231305B1 (ko) * 2006-05-25 2013-02-07 엘지이노텍 주식회사 카메라 모듈 조립체
JP2008187554A (ja) * 2007-01-31 2008-08-14 Citizen Miyota Co Ltd 固体撮像装置
CN101436603B (zh) * 2007-11-14 2010-11-10 鸿富锦精密工业（深圳）有限公司 成像模组

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1199982A (zh) * 1997-05-16 1998-11-25 索尼株式会社 图象拾取装置和摄象机
CN1664639A (zh) * 2004-03-05 2005-09-07 鸿富锦精密工业（深圳）有限公司 数码相机模块
CN101144887A (zh) * 2006-09-12 2008-03-19 群光电子股份有限公司 嵌入式相机镜头模组及其制造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2004-266844A 2004.09.24

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