CN101431130B - Luminous diode - Google Patents
Luminous diode Download PDFInfo
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- CN101431130B CN101431130B CN2007101242845A CN200710124284A CN101431130B CN 101431130 B CN101431130 B CN 101431130B CN 2007101242845 A CN2007101242845 A CN 2007101242845A CN 200710124284 A CN200710124284 A CN 200710124284A CN 101431130 B CN101431130 B CN 101431130B
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- light
- emitting diode
- filler particles
- fluorescent powder
- electrode
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Abstract
The invention relates to a light-emitting diode. The light-emitting diode comprises a light-emitting chip and a seal, the seal covers the light-emitting chip, wherein, a plurality of filling particles and a plurality of fluorescent powder particles are distributed in the seal, a plurality of filling particles are mutually collided, and a plurality of fluorescent powder particles are positioned among a plurality of filling particles.
Description
Technical field
The present invention relates to a kind of light-emitting diode.
Background technology
Characteristics such as light-emitting diode is fast because of its response, life-span length, color saturation height are widely used in the various products such as module backlight, mobile phone, stop-light, automotive headlight of liquid crystal indicator.
Seeing also Fig. 1, is a kind of prior art light-emitting diode structure schematic diagram.This light-emitting diode 10 comprises a substrate 11, a luminescence chip 12, two lead-in wire 13,1 first electrodes 14, one second electrode 15, one first pin 16, one second pin 17 and sealings 18.
This substrate 11 comprises a upper surface 111 and a lower surface 112.This first electrode 14, second electrode 15 and luminescence chip 12 all are arranged on this upper surface 111, and wherein, this first electrode 14 and second electrode 15 are symmetricly set on the both sides of this luminescence chip 12.
One lead-in wire 13 connects this luminescence chip 12 and this first electrode 14, and another lead-in wire 13 connects this luminescence chip 12 and second electrode 15.This first pin 16 runs through the upper and lower surperficial 111,112 of this substrate 11, and the one end connects this first electrode 14, and the other end protrudes in the lower surface 112 of this substrate 11.This second pin 17 also runs through the upper and lower surperficial 111,112 of this substrate 11, and the one end connects this second electrode 15, the lower surface 112 of outstanding this substrate 11 of the other end.
This sealing 18 covers this luminescence chip 12, these 13 and two electrodes 14,15 that go between.These sealing 18 inside are distributed with a plurality of fluorescent powder grains 181.This luminescence chip 12 is a blue light emitting chip, and this fluorescent powder grain 181 is yellow fluorescence powder particles (YAG).
The principle of luminosity of this light-emitting diode 10 is roughly as follows: be applied in a voltage between this first pin 16 and second pin 17, make this first electrode 14, this luminescence chip 13 and this second electrode, 15 conductings, this luminescence chip 13 sends blue light, and exciting this fluorescent powder grain 181 to produce gold-tinted, this gold-tinted of this blue light is converted into white light and penetrates.
Yet, in this sealing 18 not before the baking-curing, if this light-emitting diode 10 leaves standstill for a long time, the part fluorescent powder grain 181 in this sealing 18 can be subjected to gravity effect and be deposited on the upper surface 111 of this substrate 11 gradually, and promptly this fluorescent powder grain 181 can't keep even distribution.The blue light that sends when this luminescence chip 13 is during via the outgoing of different paths, fluorescent powder grain 181 how many differences in different paths, thereby the colourity of the white light that penetrates via different path is different, as: yellow partially via the white light that more fluorescent powder grain 181 penetrates, blue partially via the white light that less fluorescent powder grain 181 penetrates, cause the colourity of the white light of these light-emitting diode 10 emissions to be disperseed, optical purity is lower.
Summary of the invention
Be to solve the problem that prior art light-emitting diode colourity is disperseed, optical purity is lower, be necessary to provide that a kind of colourity is concentrated, the higher light-emitting diode of optical purity.
A kind of light-emitting diode, it comprises a luminescence chip and a sealing, this sealing covers this luminescence chip, wherein, be distributed with a plurality of filler particles and a plurality of fluorescent powder grain in this sealing, these a plurality of filler particles are conflicted mutually, and these a plurality of fluorescent powder grains are between these a plurality of filler particles.
A kind of light-emitting diode, it comprises a luminescence chip one sealing, and this sealing covers this luminescence chip, wherein, is distributed with a plurality of filler particles and a plurality of fluorescent powder grain in this sealing, and these a plurality of filler particles limit the deposition of these a plurality of fluorescent powder grains.
Compared with prior art, be distributed with this a plurality of filler particles in the sealing of light-emitting diode of the present invention, it limits these a plurality of fluorescent powder grain depositions to keep the distribution of these a plurality of fluorescent powder grains, improves the problem that white light colourity is disperseed, optical purity is lower that the prior art light-emitting diode causes light-emitting diode to send because of the fluorescent material deposition.
Description of drawings
Fig. 1 is a kind of prior art light-emitting diode structure schematic diagram.
Fig. 2 is the structural representation of light-emitting diode first execution mode of the present invention.
Fig. 3 is the structural representation of light-emitting diode second execution mode of the present invention.
Fig. 4 is the structural representation of light-emitting diode the 3rd execution mode of the present invention.
Fig. 5 is the structural representation of light-emitting diode the 4th execution mode of the present invention.
Fig. 6 is the structural representation of light-emitting diode the 5th execution mode of the present invention.
Fig. 7 is the structural representation of light-emitting diode the 6th execution mode of the present invention.
Embodiment
Seeing also Fig. 2, is the structural representation of light-emitting diode first execution mode of the present invention.This light-emitting diode 20 comprises a substrate 21, a luminescence chip 22, two lead-in wire 23,1 first electrodes 24, one second electrode 25, one first pin 26, one second pin 27 and sealings 28.
This substrate 21 is a rectangular sheet, and it comprises a upper surface 211 and a lower surface 212.This first electrode 24, second electrode 25 and luminescence chip 22 all are arranged on this upper surface 211, and wherein, this first electrode 24 and second electrode 25 are symmetricly set on the both sides of this luminescence chip 22.
One lead-in wire 23 connects this luminescence chip 22 and this first electrode 24, and another lead-in wire 23 connects this luminescence chip 22 and second electrode 25.This first pin 26 runs through the upper and lower surperficial 211,212 of this substrate 21, and the one end connects this first electrode 24, and the other end protrudes in the lower surface 212 of this substrate 21.This second pin 27 also runs through the upper and lower surperficial 211,212 of this substrate 21, and the one end connects this second electrode 25, the lower surface 212 of outstanding this substrate 21 of the other end.
This sealing 28 covers this luminescence chip 22, these 23 and two electrodes 24,25 that go between, and its inside is uniformly distributed with a plurality of filler particles 280 and a plurality of fluorescent powder grain 281.These a plurality of filler particles 280 fill up this sealing 28, and these a plurality of filler particles 280 arrays are arranged and conflict mutually.These a plurality of fluorescent powder grains 281 are between these a plurality of filler particles 280.
This luminescence chip 22 is a blue light emitting chip.This fluorescent powder grain 281 is the yellow fluorescence powder particles.This filler particles 280 is hollow or solid transparent resin ball, shape can be spheroid or spherosome, its diameter is roughly 3 to 15 times of diameter of this fluorescent powder grain 281 for suitable, be 27 to 3375 times of its volume volume of being roughly this fluorescent powder grain 281, also can be according to the performance adjustment, its material is polymethyl methacrylate (PMMA).
Compared with prior art, be distributed with this a plurality of competing filler particles 280 in the sealing 28 of light-emitting diode 20 of the present invention, this fluorescent powder grain 281 is between these a plurality of filler particles 280.Even this light-emitting diode 20 is not being left standstill before the baking-curing for a long time, this fluorescent powder grain 281 is subjected to the restriction of this filler particles 280 and is difficult to break away between these a plurality of filler particles 280, thereby the even distribution of this fluorescent powder grain 281 can be kept for a long time, and then improves the problem that white light colourity is disperseed, optical purity is lower that the prior art light-emitting diode causes light-emitting diode to send because of the fluorescent material deposition.
In addition, the filler particles 281 in this sealing 28 also can be used as diffusion particle, and the light that this luminescence chip 22 is sent evenly spreads, and the white light that this light-emitting diode 20 is sent is more even.
Seeing also Fig. 3, is the structural representation of light-emitting diode second execution mode of the present invention.The light-emitting diode 30 of this execution mode and the light-emitting diode 20 of first execution mode are roughly the same, its difference is: substrate 31 is a box body structure, this substrate 31 is accommodated first electrode 34, luminescence chip 32, lead-in wire 33, second electrode 35 and sealing 38, this substrate 31 comprises a base plate 311 and a plurality of sidewall 312,311 one-tenth obtuse angles of the medial surface of this sidewall 312 and this base plate.This first electrode 34, this luminescence chip 32, this second electrode 35 all are arranged on this base plate 311, and two pins 36,37 run through this base plate 311 and are electrically connected with this first electrode 34 and second electrode 35 respectively.Wherein, 311 one-tenth obtuse angles of the medial surface of this sidewall 312 and base plate, the white light that this light-emitting diode 30 sends are then concentrated to middle body, increase the luminosity of this light-emitting diode 30.
Seeing also Fig. 4, is the structural representation of light-emitting diode the 3rd execution mode of the present invention.The light-emitting diode 40 of this execution mode and the light-emitting diode 30 of second execution mode are roughly the same, and its difference is: the medial surface of sidewall 412 and base plate 411 meet at right angles, and the white light that makes this light-emitting diode 30 send is further concentrated, and brightness is higher.
Seeing also Fig. 5, is the structural representation of light-emitting diode the 4th execution mode of the present invention.The light-emitting diode 50 of this execution mode and the light-emitting diode 20 of first execution mode are roughly the same, its difference is: luminescence chip 52 is arranged on first electrode 54 by elargol (figure do not show) and is electrically connected with this first electrode 54, two pins 56,57 are separately positioned on the two ends of substrate 51, and first, second electrode 54,55 extends and is electrically connected with these two pins 56,57 to the two ends of substrate 51 respectively.
Seeing also Fig. 6, is the structural representation of light-emitting diode the 5th execution mode of the present invention.The light-emitting diode 60 of this execution mode and the light-emitting diode 20 of first execution mode are roughly the same, its difference is: first electrode 64 has a bowl structure (not indicating), luminescence chip 62 is arranged on the inner bottom surface of this bowl structure and is electrically connected with this first electrode 64, and sealing 68 covers this bowl structure; This light-emitting diode 60 further comprises a shell 69, is used to accommodate this first electrode 64, second electrode 65, luminescence chip 62, lead-in wire 63 and this sealing 68.
Seeing also Fig. 7, is the structural representation of light-emitting diode the 6th execution mode of the present invention.The light-emitting diode 70 of this execution mode and the light-emitting diode 20 of first execution mode are roughly the same, its difference is: filler particles 780 is leg-of-mutton tetrahedron for the four sides, these a plurality of filler particles 780 are conflicted mutually with a plurality of fluorescent powder grains 781, make the position of this fluorescent powder grain 781 be defined, its even distribution can be kept for a long time.
It is described that light-emitting diode of the present invention is not limited to above-mentioned execution mode, as: in first execution mode, this luminescence chip 22 also can be the UV-light luminous chip, to should fluorescent powder grain 281 being red, green and blue look fluorescent powder grain; The material of this filler particles 280 also can be glass; In second execution mode, the medial surface of the sidewall 312 of this box body 31 also can be coated with a reflector, to improve the light utilization efficiency of this light-emitting diode 30; In the 6th execution mode, this filler particles 780 also can be irregularly shaped for square, cuboid, octahedron or other, only needs to conflict mutually with this fluorescent powder grain 781 get final product with the even distribution that keeps this fluorescent powder grain 781.
Claims (10)
1. light-emitting diode, it comprises a luminescence chip and a sealing, this sealing covers this luminescence chip, be distributed with a plurality of fluorescent powder grains in this sealing, it is characterized in that: also be distributed with a plurality of filler particles in this sealing, these a plurality of filler particles are conflicted mutually, and these a plurality of fluorescent powder grains are between these a plurality of filler particles.
2. light-emitting diode as claimed in claim 1 is characterized in that: the volume of this filler particles is 27 to 3375 times of the volume of this fluorescent powder grain.
3. light-emitting diode as claimed in claim 1 is characterized in that: these a plurality of filler particles are further conflicted mutually with these a plurality of fluorescent powder grains.
4. light-emitting diode as claimed in claim 1 is characterized in that: this filler particles is spheroid, spherosome, tetrahedron, square, cuboid or octahedron.
5. light-emitting diode as claimed in claim 1 is characterized in that: the material of this filler particles is a transparent resin.
6. light-emitting diode as claimed in claim 1 is characterized in that: the material of this filler particles is a polymethyl methacrylate.
7. light-emitting diode as claimed in claim 1 is characterized in that: this light-emitting diode further comprises one first electrode and one second electrode, and this first electrode and second electrode are electrically connected with this luminescence chip respectively.
8. light-emitting diode as claimed in claim 1 is characterized in that: fill up this filler particles in this sealing.
9. light-emitting diode, it comprises a luminescence chip and a sealing, and this sealing covers this luminescence chip, is distributed with a plurality of fluorescent powder grains in this sealing, it is characterized in that: also be distributed with a plurality of filler particles in this sealing, these a plurality of filler particles limit the deposition of these a plurality of fluorescent powder grains.
10. light-emitting diode as claimed in claim 9 is characterized in that: these a plurality of fluorescent powder grains are limited between a plurality of filler particles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101242845A CN101431130B (en) | 2007-11-07 | 2007-11-07 | Luminous diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101242845A CN101431130B (en) | 2007-11-07 | 2007-11-07 | Luminous diode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101431130A CN101431130A (en) | 2009-05-13 |
| CN101431130B true CN101431130B (en) | 2010-11-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101242845A Active CN101431130B (en) | 2007-11-07 | 2007-11-07 | Luminous diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101431130B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2459759Y (en) * | 2000-09-22 | 2001-11-14 | 东贝光电科技股份有限公司 | Led |
| CN101026206A (en) * | 2006-02-23 | 2007-08-29 | 亿光电子工业股份有限公司 | White light-emitting diode package structure |
-
2007
- 2007-11-07 CN CN2007101242845A patent/CN101431130B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2459759Y (en) * | 2000-09-22 | 2001-11-14 | 东贝光电科技股份有限公司 | Led |
| CN101026206A (en) * | 2006-02-23 | 2007-08-29 | 亿光电子工业股份有限公司 | White light-emitting diode package structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101431130A (en) | 2009-05-13 |
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