CN101431035A - Component mounting device - Google Patents
Component mounting device Download PDFInfo
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- CN101431035A CN101431035A CNA200810173684XA CN200810173684A CN101431035A CN 101431035 A CN101431035 A CN 101431035A CN A200810173684X A CNA200810173684X A CN A200810173684XA CN 200810173684 A CN200810173684 A CN 200810173684A CN 101431035 A CN101431035 A CN 101431035A
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Abstract
The invention relates to a member installation apparatus which omits a shooting action to a member maker of a boarded first electronic member and shortens the productive tempo when a second electronic member is boarded on the first electronic member after a mounting substrate is boarded. The member mounting apparatus comprises am image processing unit for obtaining, keeping and processing at least the first electronic member images between the first electronic member and the second electronic member; a boarded head for keeping the first and second electronic members and boarding the same by using an adsorption mouth based on a processing result from the image processing unit; a storage unit for storing an adsorption guise correct value when the first electronic member is boarded on the mounting substrate; an image generating unit for generating a virtual image for boarding the first electronic member state by using the supply state image and corrective value of the first electronic member before adsorption; and a corrective unit for correcting the adsorption guise of the second electronic member.
Description
Technical field
The present invention relates to a kind of apparatus for mounting component, it utilizes adsorption mouth to keep carrying the 2nd electronic unit on the 1st electronic unit at the 1st electronic unit on the installation base plate and lift-launch, and carries.
Background technology
In Fig. 1, describe for an example of the structure of existing apparatus for mounting component.Apparatus for mounting component 100 has: main body base station 130; Boarded head 108, it has the adsorption mouth 106 of attract electrons parts; X-axis travel mechanism 110 and y-axis shift actuation mechanism 112, they carry out the location of boarded head 108; Parts supply unit 116, it is provided with assembly supply device; Substrate delivery section 118, it is carried installation base plate 104 and positions; Component identification camera 120, its identification utilize the state of the electronic unit of adsorption mouth absorption; And substrate identification camera 122, base plate mark on its identification installation base plate 104 or the parts mark on the electronic unit etc.
Current, when the stacked lift-launch of other electronic unit of lift-launch (being called the 2nd electronic unit) above the electronic units such as bare chip (being called the 1st electronic unit) that carry to installation base plate 104, for precision is carried goodly, the parts mark by being identified in the upper surface that is positioned at the 1st electronic unit 102a after the lift-launch by substrate identification camera 122 or the part of pattern, thereby carry out treatment for correcting, carry (patent documentation 1,2) on this basis loading position.
Patent documentation 1: the spy opens the 2006-93321 communique
Patent documentation 2: the spy opens the 2007-27300 communique
Summary of the invention
But, be stacked with under the situation of carrying the 2nd electronic unit on the 1st electronic unit upper strata of carrying to installation base plate 104, with respect to the 1st electronic unit that is carried before, need following two actions, promptly, the action of taking by the supply condition of 122 pairs of the 1st electronic units on parts supply unit 116 of substrate identification camera, with the action that the parts mark of the 1st electronic unit upper surface after carrying etc. is taken, there is (productive temp) the elongated problem of needed time of lift-launch of the 2nd electronic unit.
In addition, as shown in figure 10, the upper level of the 1st electronic unit 102a after lift-launch is a distance D, under the situation of the focus FD skew of the focal length d of this distance D and substrate identification camera 122, because the identification of the 1st electronic unit 102a after can't carrying is handled, so calibration function is invalid.Under the situation corresponding, need the correspondence of appending and appending the different new camera of focus etc. of adjustment, the autozoom function of the focal length of substrate identification camera 122, the problem that exists cost to increase with above-mentioned the 1st electronic unit 102a.
The present invention proposes in order to solve aforementioned existing problem, its purpose is, a kind of apparatus for mounting component is provided, it is when carrying the 2nd electronic unit on the 1st electronic unit that carries to installation base plate, can omit the action that the parts mark of the 1st electronic unit after carrying is taken, shorten productive temp.
The invention that the application's technical scheme 1 is related is a kind of apparatus for mounting component, it is characterized in that having: boarded head, and it utilizes adsorption mouth to keep the 1st and the 2nd electronic unit, and carries; Graphics processing unit, it obtains the image of the 1st electronic unit at least by adsorption mouth absorption and carry the 1st electronic unit to the installation base plate and carry among the 2nd electronic unit on the 1st electronic unit before absorption, this image information is handled; Memory cell, the corrected value of the absorption attitude of the 1st electronic unit on installation base plate is carried in its storage; Image generation unit, it utilizes the image of obtained aforementioned the 1st electronic unit and the corrected value of the aforementioned absorption attitude of being stored, and generates the virtual image of the state that has carried the 1st electronic unit; And correcting unit, it proofreaies and correct the absorption attitude of aforementioned the 2nd electronic unit according to this virtual image.
According to the present invention, the corrected value (corrected value A) of the absorption attitude of carrying out when carrying the 1st electronic unit by the image of the supply condition before the absorption of using the 1st electronic unit with on installation base plate, generate virtual image, even the parts mark of the 1st electronic unit after carrying is not taken, also can obtain the offset information of the 1st identical when the parts mark of the 1st electronic unit after the lift-launch is taken electronic unit.
The effect of invention
According to the present invention,, can precision carry the 2nd electronic unit because control the absorption attitude of the 2nd electronic unit based on virtual image goodly.At this moment, because do not obtain the action of the image of the 1st electronic unit after the lift-launch, can shorten productive temp.Simultaneously, can not influence the component height of the 1st electronic unit after the lift-launch, precision is carried goodly.
Description of drawings
Fig. 1 is the oblique view of existing apparatus for mounting component.
Fig. 2 is the structured flowchart of the apparatus for mounting component of embodiments of the present invention.
Fig. 3 is the lift-launch flow chart of its 1st electronic unit.
Fig. 4 is the lift-launch flow chart of its 2nd electronic unit.
Fig. 5 is the figure of an example of image of the 1st electronic unit of the supply condition before its absorption of expression.
Fig. 6 is its figure at an example with the situation of carrying the 1st electronic unit on the installation base plate of inclination of expression.
Fig. 7 is the figure of an example of different images of the 1st electronic unit of the supply condition before its absorption of expression.
Fig. 8 is the virtual image of the situation of the 1st electronic unit that ground, no inclination angle carries Fig. 7 on the installation base plate of Fig. 6.
Fig. 9 has the virtual image of situation that 90 degree inclinations angle ground carry the 1st electronic unit of Fig. 7 on the installation base plate of Fig. 6.
Figure 10 is the skeleton diagram of problem of the focal length of the existing substrate of expression identification camera.
Embodiment
With reference to the accompanying drawings, embodiments of the present invention are at length described.
Apparatus for mounting component 100, identical with the structure of the existing apparatus for mounting component of being put down in writing among Fig. 1, have: boarded head 108; X-axis travel mechanism 110; Y-axis shift actuation mechanism 112; Parts supply unit 116, it is disposed at the front portion of apparatus for mounting component 100, supplies with the electronic unit 102 (being made of the 1st electronic unit 102a and the 2nd electronic unit 102b) that is installed on the installation base plate 104; Substrate delivery section 118, it extends upward setting from the central authorities of apparatus for mounting component 100 side after a while at right and left; And main body 130, it has at least a portion of graphics processing unit.In addition, graphics processing unit is obtained lift-launch at the 1st electronic unit 102a on the installation base plate 104 with carry the image of at least the 1 electronic unit 102a among the 2nd electronic unit 102b on the 1st electronic unit 102a, keeps this image information and handles.Therefore, in the present embodiment, graphics processing unit has component identification camera 120, substrate identification camera 122 and pattern recognition device described later 142 for example in order to take the 1st electronic unit 102a and the 2nd electronic unit 102b and to carry out this image processing.
Aforementioned boarded head 108 has: Z axle travel mechanism, and it liftably goes up adsorption mouth 106 and moves (not shown) in vertical direction (Z-direction); And θ axle travel mechanism, it makes adsorption mouth 106 is center rotation (not shown) with suction nozzle shaft (absorption axle).And, on boarded head 108, having carried substrate identification camera 122, it is taken the base plate mark 104a (Fig. 6) that forms on installation base plate 104.In addition, substrate identification camera 122 can be to being taken by the electronic unit 102 of the supply condition before adsorption mouth 106 absorption.
Aforementioned X-axis travel mechanism 110, the drive source that can utilize X-axis travel mechanism 110 is an X-axis motor 111, and boarded head 108 is moved to X-direction.
Aforementioned y-axis shift actuation mechanism 112, the drive source that can utilize y-axis shift actuation mechanism 112 is a Y-axis motor 113, and the X-axis travel mechanism 110 with boarded head 108 is moved to Y direction.
Aforesaid base plate delivery section 118 is used for when constituting mounting production lines etc. with a plurality of apparatus for mounting component, receives and sends substrate 104 from the apparatus for mounting component of both sides, installation base plate 104 can be fixed on the assigned position of apparatus for mounting component 100.
Above-mentioned parts identification camera 120 be arranged on parts supply unit 116 near, be configured to take the electronic unit 102 that is adsorbed on the adsorption mouth 106 from the below.
Aforementioned controller 132 for example is the microcomputers such as CPU of control device integral body, has RAM and ROM etc., is connected with each inscape, can control assembly erecting device 100 integral body.In addition, carry out the control of each travel mechanism, can carry out the correction indication and the lift-launch of the absorption attitude of electronic unit 102 according to the aftermentioned virtual image.That is, in the present embodiment, for example can constitute correcting unit by controller 132 and each travel mechanism.
Aforementioned display (display) 136, for example the image of the electronic unit 102 that can take with parts data, operational data, by component identification camera 120 and substrate identification camera 122 etc. is presented on its display screen.
Aforementioned pattern recognition device 142 is made of A/D converter 144, CPU 146 and memory 148, is connected with component identification camera 120.Take the parts 102 that are adsorbed on the aforementioned adsorption mouth 106 if utilize component identification camera 120, then will be from the analog image information of the electronic unit 102 of component identification camera 120 output, utilize A/D converter 144 to be transformed to digital signal and be stored in the memory 148, and according to aforementioned image information the electronic unit 102 that is adsorbed is discerned by CPU 146.And, computing is carried out in the center of parts 102 and the offset between the absorption position and absorption angle, thus absorption attitude (component identification processing) that can identification component 102.
And pattern recognition device 142 also has following function: handle the image information of the base plate mark 104a (Fig. 6) that is taken by substrate identification camera 122, computing is carried out in the position of base plate mark 104a, the offset of identification installation base plate 104 etc.In addition, pattern recognition device 142 can be preserved the image information of the electronic unit 102 of the supply condition before the absorption of being taken by substrate identification camera 122, utilizes corrected value A to generate the virtual image of the state that carries the 1st electronic unit.That is, in the present embodiment, for example can be with pattern recognition device 142 as image generation unit.Also have and handle above-mentioned these image informations, the function that corrected value etc. is transmitted to controller 132.
Below, utilize Fig. 3～Fig. 9, the action of the related apparatus for mounting component of present embodiment is at length described.
Begin most, utilize Fig. 3 to describe for the action of on installation base plate 104, carrying the 1st electronic unit 102a.
At first, in order to proofread and correct the offset of installation base plate 104, take the base plate mark 104a (Fig. 6) (step S1) of installation base plates 104, carry out the identification (step S2) of the offset etc. of installation base plate 104 by substrate identification camera 122.Therefore in addition, because this action gets final product when beginning most to be fixed on an installation base plate 104 on the substrate delivery section 118, need when each stacked lift-launch, not carry out.
Then, make substrate identification camera 122 move (step S3), the supply condition before the absorption of the 1st electronic unit 102a in the recess 103 (Fig. 5) is taken (step S4) to the absorption position of the 1st electronic unit 102a of parts supply unit 116.The image information that is taken is stored in (step S5) in the memory 148.Here, so-called recess 103 is for example being supplied with under the situation of electronic unit 102 by the belt feeder, is meant the recess space of the belt feeder of accommodating electronic unit 102.
Then,,, ask for the specific absorption position of the 1st electronic unit 102a by following step according to the position of the parts mark 102c (Fig. 5) of the 1st electronic unit 102a by the above-mentioned image information that is taken, in this position by adsorption mouth 106 absorption.(step S6).
, use Fig. 5 here, describe particularly for specific absorption position SP.In addition, suppose the center CC skew of center P C and the recess 103 of the 1st electronic unit 102a, but do not have angular deflection with recess 103.
Return Fig. 3, utilize component identification camera 122, the 1st electronic unit 102a by adsorption mouth 106 absorption is taken (step S7).And, obtain the center of the 1st electronic unit 102a and the side-play amount between the absorption position, angle (step S8) by the component identification processing.And, consider the offset of installation base plate 104, at this moment the absorption attitude of proofreading and correct the 1st electronic unit 102a, remains on (step S9) in the storage device 134 with the corrected value (as corrected value A) after the reality correction.
At last, under the state that utilizes above-mentioned corrected value A to carry out proofreading and correct, the 1st electronic unit 102a is carried on installation base plate 104 (step S10).
Below, mainly utilize Fig. 4, describe for the action of on the 1st electronic unit 102a that is equipped on the installation base plate 104, carrying the 2nd electronic unit 102b.
At first, adsorption mouth 106 is moved, the 2nd electronic unit 102b (step S20) of adsorption element supply unit 116.Take the 2nd electronic unit 102b (step S21) that is adsorbed by component identification camera 120.And, obtain the center of the 2nd electronic unit 102b and the side-play amount between the absorption position, angle (step S22) by the component identification processing.
Then, proofread and correct the absorption attitude (step S23) of the 2nd electronic unit 102b with respect to the installation site.That is, consider the skew of installation base plate 104, the absorption attitude of proofreading and correct the 2nd electronic unit 102b.
Then, utilize the supply condition before the absorption remain in the memory 148 the 1st electronic unit 102a image and remain on corrected value A in the storage device 134, generation virtual image as described below (step S24)., utilize Fig. 6～Fig. 9 here, describe for virtual image.
For example, as shown in Figure 6, suppose that installation base plate 104 has the situation of the angular deflection of 5 degree.And, with respect to installation base plate 104, consider to obtain respectively virtual image: (a) state of the state of the 1st electronic unit 102a that carries with the angle of 0 degree and the 1st electronic unit 102a that (b) carries with the angles of 90 degree at following state.
As shown in Figure 7, suppose the 1st electronic unit 102a angle tilt with-10 degree in recess 103.In addition, the inclination of angle judges with parts mark 102c to be benchmark.Its reason is, in existing stacked lift-launch, also is that the parts mark 102c with the 1st electronic unit 102a carries out the correction of the 2nd electronic unit 102b as benchmark.In addition, for convenience of explanation, suppose not location skew between the center C C of the center P C of the 1st electronic unit 102a and recess 103.
The image information of Fig. 7 can be obtained by step S4.Corrected value A is the image information that obtains in the component identification of component identification camera 120 is handled, and is the value after actual being corrected.Therefore, apply corrected value A, can calculate the position of the parts mark 102c that carries the 1st electronic unit 102a on installation base plate 104 accurately, generate as virtual image by image information to the 1st electronic unit 102a of Fig. 7.That is,, to the rotation corrections that the 1st electronic unit 102a carries out 15 degree, carry on installation base plate 104 as the corrected value A of the 1st electronic unit 102a in order to have the inclination of 0 degree with respect to installation base plate 104.In this case, if the image information of Fig. 7 is carried out the rotation of 15 degree of this corrected value A,, can obtain the image of Fig. 8 then as virtual image.That is, this virtual image is identical with the state of Fig. 6 (a).
Similarly, in order to have the inclinations of 90 degree with respect to installation base plate 104, to the rotation corrections that the 1st electronic unit 102a carries out 105 degree, carry on installation base plate 104 as the corrected value A of the 1st electronic unit 102a.In this case, if the image information of Fig. 7 is carried out the rotation of 105 degree of this corrected value A, then can obtain the image of Fig. 9 as virtual image.That is, this virtual image is identical with the state of Fig. 6 (b).
Therefore, the action that can not need the parts mark 102c to the 1st electronic unit 102a after carrying to take.Promptly, even the parts mark 102c that virtual image can be described as not the 1st electronic unit 102a after carrying takes, the also offset information of the 1st identical electronic unit 102a when parts mark 102c to the 1st electronic unit 102a after carrying takes.
Return Fig. 4 below,, proofread and correct (step S25) with respect to loading position based on the 1st electronic unit 102a of above-mentioned virtual image with the absorption attitude of the 2nd electronic unit 102b.Between benchmark that the base plate mark 104a by installation base plate 104 obtains and the benchmark that obtains by the parts mark 102c of the 1st electronic unit 102a that obtains based on virtual image, do not exist under the situation of skew, by the correction of step S23, can not proofread and correct in this step and realization lift-launch accurately.But, between benchmark that the base plate mark 104a by installation base plate 104 obtains and the benchmark that obtains by the parts mark 102c of the 1st electronic unit 102a that obtains based on virtual image, exist under the situation of skew, proofread and correct this position offset.
At last, the 2nd electronic unit 102b is carried on the 1st electronic unit 102a (step S26).
Like this, because the corrected value A of the absorption attitude of carrying out when using the image of the preceding supply condition of the absorption of the 1st electronic unit 102a and on installation base plate 104, carrying the 1st electronic unit 102a, generate virtual image, even, also can obtain the offset information of taking the 1st identical electronic unit 102a with parts mark 102c to the 1st electronic unit 102a after the lift-launch so the parts mark 102c of the 1st electronic unit 102a after carrying is not taken.
Therefore, according to present embodiment,, can precision carry the 2nd electronic unit 102b because control the absorption attitude of the 2nd electronic unit 102b based on virtual image goodly.At this moment, because do not obtain the action of the image of the 1st electronic unit 102a after the lift-launch, can shorten productive temp.Simultaneously, the influence of the component height of the 1st electronic unit 102a after not carried can precision be carried goodly.
In the present embodiment, the 1st electronic unit 102a of the supply condition before the absorption is contained in the recess 103, but is not limited thereto.For example, the situation of carrying directly adsorbing bare chip from silicon wafer, or under the situation of supply in bulk, also can use the present invention.
In addition, in the present embodiment, corrected value A remains in the storage device 134, and the image information of supply condition remains in the memory 148, but the present invention is not limited thereto.In the image information of corrected value A, supply condition any one all can remain in storage device 134 or the memory 148.Because no matter remain in which, the present invention all brings into play its effect.And, obviously can be that in CPU 146 or the controller 132 any one carried out this processing.
And, in the present embodiment, must use component identification camera 120 to carry out (step S8, S22) such as component identification processing, carry out the component identification of being undertaken and handle but also can discern camera 122, adsorb the correction (step S9, S23) of attitude according to its result by component identification camera 120 by substrate.And, also can not use component identification camera 120, replacement carry out component identification by laser.
And, in the present invention as can be known, the 1st electronic unit 102a and the 2nd electronic unit 102b, its packaged type and IC and chip part can be the same or different.For example, can on the IC packaging part, carry chip-resistance or chip capacitor, also can adopt the stacked lift-launch between the IC.Under the situation between the IC, can be with combinations in some way such as BGA, the SOP of the DIP of insert type or SIP etc., surface installing type, SON, QFP, CSP, bare chips.No matter any, the present invention all brings into play its effect.
And,, also can take by the 2nd electronic unit 102b that substrate is discerned 122 pairs of supply conditions of camera even on the 2nd electronic unit 102b, do not carry under the situation of electronic unit.This is because in the lift-launch of bare chip grade in an imperial examination 2 electronic unit 102b self, reasons such as damage when adsorbing because of reducing, requirement is avoided adsorbing disabled position and under the situation of adsorbing with respect to certain location SP precision, is preferably proofreaied and correct adjustment by the supply condition of substrate identification camera 122 identifications the 2nd electronic unit 102b and to absorption position goodly.
And, when generating virtual image, only show rotation as corrected value A, if but have the offset of the center P C of the 1st electronic unit 102a, corrected value A is changed.And, in the above-described embodiment, also to consider the topology data of the 1st electronic unit 102a and installation base plate 104 certainly, carry out the lift-launch of the 2nd electronic unit 102b.
Claims (1)
1. apparatus for mounting component is characterized in that having:
Boarded head, it utilizes adsorption mouth to keep the 1st and the 2nd electronic unit, and carries;
Graphics processing unit, it obtains the image of the 1st electronic unit at least by adsorption mouth absorption and carry the 1st electronic unit to the installation base plate and carry among the 2nd electronic unit on the 1st electronic unit before absorption, this image information is handled;
Memory cell, the corrected value of the absorption attitude of the 1st electronic unit on installation base plate is carried in its storage;
Image generation unit, it utilizes the image of obtained aforementioned the 1st electronic unit and the corrected value of the aforementioned absorption attitude of being stored, and generates the virtual image of the state that has carried the 1st electronic unit; And
Correcting unit, it proofreaies and correct the absorption attitude of aforementioned the 2nd electronic unit according to this virtual image.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007289214A JP4943300B2 (en) | 2007-11-07 | 2007-11-07 | Component mounting equipment |
| JP2007289214 | 2007-11-07 | ||
| JP2007-289214 | 2007-11-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101431035A true CN101431035A (en) | 2009-05-13 |
| CN101431035B CN101431035B (en) | 2012-11-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810173684XA Active CN101431035B (en) | 2007-11-07 | 2008-11-07 | Component mounting device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4943300B2 (en) |
| CN (1) | CN101431035B (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102595800A (en) * | 2011-01-04 | 2012-07-18 | 鸿骐新技股份有限公司 | Visual positioning device for carrying out high-accuracy synchronous attaching on multiple substrates and method thereof |
| CN103889200A (en) * | 2012-12-19 | 2014-06-25 | 雅马哈发动机株式会社 | Surface mounting apparatus, and correction coefficient calculating method of surface mounting apparatus |
| CN110519508A (en) * | 2015-02-02 | 2019-11-29 | 宁波舜宇光电信息有限公司 | A method of identification feature object during camera module automatic aligning |
| CN110545656A (en) * | 2018-05-28 | 2019-12-06 | 贝思瑞士股份公司 | Method for calibrating a component mounting device |
| CN111034387A (en) * | 2017-08-31 | 2020-04-17 | 株式会社富士 | Component mounting machine and component mounting method |
| CN113228846A (en) * | 2019-01-18 | 2021-08-06 | 株式会社富士 | Component mounting apparatus |
| CN114902825A (en) * | 2020-02-07 | 2022-08-12 | 株式会社富士 | Adsorption position adjusting device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP6731577B2 (en) * | 2016-06-23 | 2020-07-29 | パナソニックＩｐマネジメント株式会社 | Component mounting method and component mounting apparatus |
| WO2023190012A1 (en) * | 2022-03-30 | 2023-10-05 | 京セラ株式会社 | Robot hand, processing device, drive mechanism control unit, program, and control system |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4548310B2 (en) * | 2005-11-07 | 2010-09-22 | パナソニック株式会社 | Electronic component mounting method |
| JP4458034B2 (en) * | 2005-12-08 | 2010-04-28 | パナソニック株式会社 | Electronic component mounting apparatus and electronic component mounting method |
-
2007
- 2007-11-07 JP JP2007289214A patent/JP4943300B2/en active Active
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2008
- 2008-11-07 CN CN200810173684XA patent/CN101431035B/en active Active
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102595800A (en) * | 2011-01-04 | 2012-07-18 | 鸿骐新技股份有限公司 | Visual positioning device for carrying out high-accuracy synchronous attaching on multiple substrates and method thereof |
| CN103889200A (en) * | 2012-12-19 | 2014-06-25 | 雅马哈发动机株式会社 | Surface mounting apparatus, and correction coefficient calculating method of surface mounting apparatus |
| CN103889200B (en) * | 2012-12-19 | 2017-03-01 | 雅马哈发动机株式会社 | Surface mounting apparatus and the correction coefficient calculating method of surface mounting apparatus |
| CN110519508A (en) * | 2015-02-02 | 2019-11-29 | 宁波舜宇光电信息有限公司 | A method of identification feature object during camera module automatic aligning |
| CN111034387A (en) * | 2017-08-31 | 2020-04-17 | 株式会社富士 | Component mounting machine and component mounting method |
| CN110545656A (en) * | 2018-05-28 | 2019-12-06 | 贝思瑞士股份公司 | Method for calibrating a component mounting device |
| CN113228846A (en) * | 2019-01-18 | 2021-08-06 | 株式会社富士 | Component mounting apparatus |
| CN113228846B (en) * | 2019-01-18 | 2022-10-14 | 株式会社富士 | Component mounting apparatus |
| CN114902825A (en) * | 2020-02-07 | 2022-08-12 | 株式会社富士 | Adsorption position adjusting device |
| CN114902825B (en) * | 2020-02-07 | 2024-04-02 | 株式会社富士 | Adsorption position adjusting device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2009117624A (en) | 2009-05-28 |
| JP4943300B2 (en) | 2012-05-30 |
| CN101431035B (en) | 2012-11-21 |
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