CN101422877A - Grinding mat trimmer for chemical mechanical grinding - Google Patents
Grinding mat trimmer for chemical mechanical grinding Download PDFInfo
- Publication number
- CN101422877A CN101422877A CNA2007101848357A CN200710184835A CN101422877A CN 101422877 A CN101422877 A CN 101422877A CN A2007101848357 A CNA2007101848357 A CN A2007101848357A CN 200710184835 A CN200710184835 A CN 200710184835A CN 101422877 A CN101422877 A CN 101422877A
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- China
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- grinding
- trim elements
- cmp
- mat trimmer
- shell
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention discloses a grinding pad dresser for chemical and mechanical grinding, which comprises a dressing component used for dressing the grinding pad and a shell used for holding the dressing component; and the shell comprises at least one fluid mouth which is around the component to supply at least one fluid.
Description
Technical field
The present invention relates to the grinding mat trimmer that a kind of cmp is used, particularly relate to the grinding mat trimmer of a kind of cmp usefulness, meeting accommodating fluid.
Background technology
The cmp manufacture craft at present widely semiconductor fabrication process adopt.In the cmp manufacture craft, the grinding pad surface because lapping liquid can't be evenly distributed on the grinding pad, makes the abrasive characteristic variation after use after a while.For addressing the above problem, use grinding mat trimmer (polishing pad conditioner) that grinding pad is done in good time finishing at present, to recover the grinding function of grinding pad.
It is the trim elements that material is repaired that trimmer now generally comprises with the diamond.In the field of cmp, the usefulness of trim elements is the key that whole manufacture craft stability of influence and wafer remove rate (removal rate).Trim elements should be wanted to satisfy following requirement: stable wafer removes rate, trim elements must can suitably repair grinding pad, and then regeneration grinding pad function, and can prolong service-life of grinding pad.
When carrying out cmp, generally can use and grind slurry to promote the carrying out of cmp.When using trimmer finishing grinding pad, grind and starch and, can in dressing process, transfer on the trim elements from the particle that chemical mechanical planarization process produced.Over time, grinding slurry can become crystallization and stick on the trim elements with particle.This situation can shorten the service life of trim elements, causes diamond on the trim elements to drop and the scratch wafer causes faulty wafers.This is a problem that urgency is to be overcome.
Summary of the invention
The object of the present invention is to provide a kind of grinding mat trimmer that is used for cmp, these grinding mat trimmers can be supplied a fluid to continue the trim elements that cleaning is used for repairing grinding pad, avoid crystallization to produce to keep the finishing effect of trim elements.So can stablize the rate that removes uniformity (the remove rate ﹠amp of grinding pad; Uniformity RR_U%), and impels the quality rebuilding of grinding pad.
The objective of the invention is such realization, a kind of grinding mat trimmer promptly is provided, comprise the trim elements in order to the finishing grinding pad, and in order to holding the shell of trim elements, it comprises at least one fluid flow port around trim elements to supply at least one fluid.
The present invention provides a kind of method of grinding base material in addition.The present invention grinds the method for base material, and comprising at first provides a base material.Grind this base material with a milling tool then.Milling tool comprises at least one grinding pad and at least one grinding mat trimmer, this grinding mat trimmer comprises in order to repair the trim elements of this grinding pad, and in order to holding the shell of this trim elements, it comprises at least one fluid flow port around this trim elements to supply at least one fluid.
Because grinding mat trimmer of the present invention comprises at least one fluid flow port around trim elements, can supply first-class at least body with the trim elements on the cleaning grinding pad, avoid grinding slurry and form the accumulation of crystallization, so kept the long-acting finishing effect and the flaw that reduces wafer of trim elements with particle.
Description of drawings
Fig. 1-Fig. 4 is the preferred embodiment schematic diagram of grinding mat trimmer of the present invention;
Fig. 5 is the chemical machinery polishing system schematic diagram with plural grinding pad;
Fig. 6 is the chemical machinery polishing system schematic diagram with single large scale grinding pad;
Fig. 7 is the linear chemical mechanical planarization system schematic.
The main element symbol description
100,560,640,740 grinding mat trimmers
110 trim elements, 120 shells
121 fluid flow port 120A/120B assemblies
122A/122B fluid passage 123 grooves
500,600,700 work-table of chemicomechanical grinding mill
510,520,610,710 grinding pads
530,620,720 wafers
540,630,730 brilliant back of the body cushion pads
550 grind slurry
The specific embodiment
Fig. 1 illustrates grinding mat trimmer of the present invention, can be used as the usefulness of cmp.Grinding mat trimmer 100 of the present invention comprises the trim elements 110 in order to the finishing grinding pad, and the shell 120 in order to hold trim elements 110.Trim elements 110 is had now by this area with the material of shell 120, seldom gives unnecessary details at this.Trim elements 110 for example can be a diamond rod.The surface of trim elements 110 is preferably and can be embedded with the bulk material of hardness between 4-10.This bulk material for example can be by SiC, diamond, ZrO
2, Al
2O
3Constitute Deng material.
In order to clean trim elements 110 avoiding grinding the accumulation that slurry and particle form crystallization, shell 120 comprises at least one fluid flow port 121 around trim elements 110 to supply at least one fluid.So during the fluid ejection, just take away and grind slurry and particle, and then cleaning of the trim elements 110 that keeps clean.
The rectangle that is shaped as of Fig. 1 illustration grinding mat trimmer of the present invention 100 and trim elements 110, but be not limited to this.For example, grinding mat trimmer 100 of the present invention also can be for circular, oval with the shape of trim elements 110, i.e. dish shown in Fig. 2, or polygon, triangle for example shown in Figure 3, various geometry that waits or arbitrary shape etc.In addition, the shell 120 of grinding mat trimmer 100 of the present invention can also be made up of in removable mode plurality of element, and for example among Fig. 2, shell 120 promptly is made up of two semicircle assembly 120A/120B.
The size different according to wafer, the size of shell 120 is also different.For example, for eight cun employed boards of wafer, the length of shell 120 can be about the 31-32 centimetre, and width can be about the 6-7 centimetre.In addition, for ten two o'clock employed boards of wafer, the size of shell 120 can be about 70 centimeters.
Depending on the circumstances or the needs of the situation, the fluid that is supplied to grinding mat trimmer 100 can be ultra-pure water, grind gas or its combinations such as liquid, air, inert gas such as slurry.For example, slurry is ground in supply when grinding, and can not dry up in trim elements 110 surfaces of grinding mat trimmer 100 to carry out cmp smoothly and can guarantee to grind slurry, then supplies ultra-pure water when the finishing grinding pad, in order to cleaning trim elements 110, or provide air-flow with cleaning trim elements 110.In addition, can comprise at least one group of fluid passage in the shell 120 of grinding mat trimmer 100 of the present invention, for example the illustrative fluid passage 122A/122B of Fig. 1 gives required fluid in order to supply those each fluid flow ports 121 around shell 120.And this group fluid passage and fluid flow port also can be to be installed in removably on the shell 120 of grinding mat trimmer 100, for example are arranged on the shell 120 of grinding mat trimmer 100 in plug-in mode.
If will strengthen the effect of fluid cleaning trim elements 110, depending on the circumstances or the needs of the situation, the position of fluid flow port 121 can also be arranged in when fluid sprays, and fluid can touch trim elements 110 in fact, so that wash away the crystallization of grinding slurry, particle or its formation that may be attached to trim elements 110 surfaces.
In order to make trim elements 110 can be fixed in the grinding mat trimmer 100 firmly, except use common screw fixing, shell 120 can also comprise a groove 123 in addition, illustrate as Fig. 4, the shape of its corresponding trim elements 110, be used for being fastened on trim elements 110 in the groove 123 of grinding mat trimmer 100 in the mode that slips into, make the fixedly relative position of 120 on trim elements 110 and shell of trim elements 110, even can help again with a plurality of screws and fix, remove rate with usefulness and the wafer of further strengthening trim elements 110.
Grinding mat trimmer of the present invention is applicable in various chemical and mechanical grinding method.In a preferred embodiment, grinding mat trimmer of the present invention can be used in the chemical machinery polishing system with plural grinding pad.Fig. 5 illustration one this type of work-table of chemicomechanical grinding mill.Work-table of chemicomechanical grinding mill 500 with plural grinding pad comprises first grinding pad 510 and second grinding pad 520.Wafer 530 is fixing via crystalline substance back of the body cushion pad 540, drive and under the supply of grinding slurry 550 on first grinding pad 510, carry out cmp with rotation by crystalline substance back of the body cushion pad, on the other hand, 560 of grinding mat trimmers of the present invention are not placed wafer to carry out second grinding pad 520 of cmp in finishing.Otherwise, carry on the back cushion pad 540 when wafer 530 via crystalline substance and be fixed on second grinding pad 520, when under the supply of grinding slurry 550, carrying out cmp, 560 surfaces of not placing first grinding pad 510 of wafer in finishing of grinding mat trimmer of the present invention.So, grinding mat trimmer of the present invention just can be removed the crystallization of grinding slurry, particle or its formation on the trim elements surface that is attached to grinding mat trimmer immediately, and the trim elements after the utilization cleaning is synchronously adjusted the surface appearance of grinding pad.
Or in another preferred embodiment, grinding mat trimmer of the present invention more can be used in the chemical machinery polishing system that only has single large scale grinding pad.Fig. 6 illustration one this type of work-table of chemicomechanical grinding mill.Work-table of chemicomechanical grinding mill 600 comprises the grinding pad 610 that can rotate.At least one wafer 620 is fixing via crystalline substance back of the body cushion pad 630, on grinding pad 610, to carry out cmp by the rotation drive of crystalline substance back of the body cushion pad, simultaneously, 640 of grinding mat trimmers of the present invention do not carry out the surface that the position of cmp is repaired grinding pad 610 immediately at another side.In addition, grinding mat trimmer of the present invention also can be used in linearity (linear) chemical machinery polishing system, illustrates as Fig. 7.Linear chemical mechanical planarization system 700 comprises grinding pad 710.Wafer 720 is fixing via crystalline substance back of the body cushion pad 730,, to carry out cmp by the rotation drive of crystalline substance back of the body cushion pad.On the other hand, 740 next surfaces of immediately repairing grinding pad 710 simultaneously, position of can not carry out cmp of grinding mat trimmer of the present invention at opposite side.So, grinding mat trimmer of the present invention just can be removed the crystallization of grinding slurry, particle or its formation on the trim elements surface that is attached to grinding mat trimmer immediately, and the trim elements after the utilization cleaning is synchronously adjusted the surface appearance of grinding pad.
Example
Below provide the operation of grinding mat trimmer of the present invention and existing grinding mat trimmer to compare.
Grinding mat trimmer of the present invention and existing grinding mat trimmer are used in the WCMP-5 board, under same recipe, relatively remove the rate flatness.The sampling time of existing grinding mat trimmer was 11 working days, and the grinding mat trimmer sampling time of the present invention was 8 working days.
Existing grinding mat trimmer
| Existing grinding mat trimmer | RR_U％ |
| 1 | 6.4839 |
| 2 | 6.785 |
| 3 | 6.0343 |
| 4 | 8.093 |
| 5 | 8.3594 |
| 6 | 8.8052 |
| 7 | 6.056 |
| 8 | 7.4234 |
| 9 | 14.0378 |
| 10 | 5.4041 |
| 11 | 6.4756 |
| Mean value | 7.6325 |
Grinding mat trimmer of the present invention
| Grinding mat trimmer of the present invention | RR_U％ |
| 1 | 5.7648 |
| 2 | 6.4487 |
| 3 | 6.9301 |
| 4 | 5.0689 |
| 5 | 4.4262 |
| 6 | 5.8628 |
| 7 | 5.2237 |
| 8 | 6.1312 |
| Mean value | 5.7320 |
By above more as can be known, grinding mat trimmer of the present invention can effectively reduce the flaw of wafer when cmp really.
The above only is preferred embodiment of the present invention, and all equalizations of doing according to claim of the present invention change and modify, and all should belong to covering scope of the present invention.
Claims (23)
1. grinding mat trimmer (polishing pad conditioner) that cmp is used comprises:
Trim elements (polishing tool) is in order to the finishing grinding pad; And
Shell (housing), in order to holding this trim elements, this shell comprises at least one fluid flow port around this trim elements to supply at least one fluid.
2. the grinding mat trimmer that cmp as claimed in claim 1 is used, wherein this trim elements is dish.
3. the grinding mat trimmer that cmp as claimed in claim 2 is used, wherein this shell comprises plurality of element.
4. the grinding mat trimmer that cmp as claimed in claim 1 is used, wherein the shape of this trim elements is selected from the polygon of being made up of triangle and rectangle.
5. the grinding mat trimmer that cmp as claimed in claim 1 is used, wherein this shell comprises groove, is used for engaging this trim elements to fix the relative position between this trim elements and this shell.
6. the grinding mat trimmer that cmp as claimed in claim 1 is used, wherein this fluid system selects Free water and grinds the group that slurry is formed.
7. the grinding mat trimmer that cmp as claimed in claim 1 is used, wherein this fluid contacts this trim elements in fact when this fluid flow port ejection.
8. the grinding mat trimmer that cmp as claimed in claim 1 is used more comprises at least one screw to fix the relative position between this trim elements and this shell.
9. grinding mat trimmer that cmp is used comprises:
Trim elements is in order to the finishing grinding pad; And
Shell, in order to holding this trim elements, this shell comprises at least one fluid flow port around this trim elements to supply at least one fluid, is used for engaging this trim elements to fix the relative position between this trim elements and this shell with a groove.
10. the grinding mat trimmer that cmp as claimed in claim 9 is used, wherein this trim elements is dish.
11. as the grinding mat trimmer that the cmp of claim 10 is used, wherein this shell comprises plurality of element.
12. the grinding mat trimmer that cmp as claimed in claim 9 is used, wherein the shape of this trim elements is selected from the polygon of being made up of triangle and rectangle.
13. the grinding mat trimmer that cmp as claimed in claim 9 is used, wherein this fluid selects Free water and grinds the group that slurry is formed.
14. the grinding mat trimmer that cmp as claimed in claim 9 is used, wherein this fluid contacts this trim elements in fact when this fluid flow port ejection.
15. the grinding mat trimmer that cmp as claimed in claim 9 is used more comprises at least one screw to fix the relative position between this trim elements and this shell.
16. a method of grinding base material comprises:
Base material is provided; And
Grind this base material with milling tool, wherein this milling tool comprises at least one grinding pad and at least one grinding mat trimmer, and this grinding mat trimmer comprises:
Trim elements is in order to repair this grinding pad; And
Shell, in order to holding this trim elements, this shell comprises at least one fluid flow port around this trim elements to supply at least one fluid.
17. as the method for claim 16, wherein this trim elements is dish.
18. as the method for claim 17, wherein this shell comprises a plurality of assemblies.
19. as the method for claim 16, wherein the shape of this trim elements is selected from the polygon of being made up of triangle and rectangle.
20. as the method for claim 16, wherein this shell comprises groove, is used for engaging this trim elements to fix the relative position between this trim elements and this shell.
21. as the method for claim 16, wherein this fluid system selects Free water and grinds the group that slurry is formed.
22. as the method for claim 16, wherein this fluid contacts this trim elements in fact when this fluid flow port ejection.
23., more comprise at least one screw to fix the relative position between this trim elements and this shell as the method for claim 16.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101848357A CN101422877A (en) | 2007-10-30 | 2007-10-30 | Grinding mat trimmer for chemical mechanical grinding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101848357A CN101422877A (en) | 2007-10-30 | 2007-10-30 | Grinding mat trimmer for chemical mechanical grinding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101422877A true CN101422877A (en) | 2009-05-06 |
Family
ID=40613863
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007101848357A Pending CN101422877A (en) | 2007-10-30 | 2007-10-30 | Grinding mat trimmer for chemical mechanical grinding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101422877A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102343553A (en) * | 2011-09-28 | 2012-02-08 | 上海宏力半导体制造有限公司 | Dresser device and detection method thereof |
| CN105500208A (en) * | 2016-01-21 | 2016-04-20 | 苏州新美光纳米科技有限公司 | Finishing device for CMP technological polishing pad |
| CN112077742A (en) * | 2020-09-21 | 2020-12-15 | 北京烁科精微电子装备有限公司 | Polishing pad dresser and chemical mechanical planarization equipment |
-
2007
- 2007-10-30 CN CNA2007101848357A patent/CN101422877A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102343553A (en) * | 2011-09-28 | 2012-02-08 | 上海宏力半导体制造有限公司 | Dresser device and detection method thereof |
| CN102343553B (en) * | 2011-09-28 | 2015-06-17 | 上海华虹宏力半导体制造有限公司 | Dresser device and detection method thereof |
| CN105500208A (en) * | 2016-01-21 | 2016-04-20 | 苏州新美光纳米科技有限公司 | Finishing device for CMP technological polishing pad |
| CN112077742A (en) * | 2020-09-21 | 2020-12-15 | 北京烁科精微电子装备有限公司 | Polishing pad dresser and chemical mechanical planarization equipment |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20090506 |