CN101393880B - Method for picture-in-picture observation and automatically wafer quality determination - Google Patents
Method for picture-in-picture observation and automatically wafer quality determination Download PDFInfo
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- CN101393880B CN101393880B CN2008101073108A CN200810107310A CN101393880B CN 101393880 B CN101393880 B CN 101393880B CN 2008101073108 A CN2008101073108 A CN 2008101073108A CN 200810107310 A CN200810107310 A CN 200810107310A CN 101393880 B CN101393880 B CN 101393880B
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Abstract
The invention relates to a method for achieving picture-in-picture observation and automatically determining the quality of a die bond, and the method can be achieved through a system consisting of combining pick-up cameras, a monocular microscope, an image acquisition card, an industrial computer and corresponding control software. The method comprises the following steps: the two pick-up camerasof the system are used for interpreting the image of die bond position on a clamping device side and that of a wafer on the wafer side, which are amplified by the microscope, into electrical signals,and then transferring the electrical signals to the image acquisition card respectively; and the control software is utilized for integrating the two separately-gathered images into one image in order of priority which later appears on a display screen in the form of a picture-in-picture. The method further includes a method for automatically determining the quality of the die bond.
Description
Technical field
The present invention relates to COB, LED encapsulation automatic field, for a kind of method of picture-in-picture observation and automatic decision die bond quality on the die bond machine.
Background technology
Die bond machine (also claiming the chip mount machine) is one of the key of LED device package and Core equipment, because chip is too little, cleanliness factor requires high, thus chip get brilliant and die bond, to be stained with glue and to put glue all be to finish at automaticity height, fireballing die bond machine.In order to guarantee solid crystalloid amount, different solid brilliant machines has different observations and judges solid brilliant method for quality, common more employing be observation as shown in Figure 2 and the system block diagram of judging solid crystalloid metering method.Known method is to use 2 monitors, wherein monitor 1 image by display chip sides such as capture cards when observing the die bond quality; Monitor 2 directly monitors the die bond position on the anchor clamps, do not need to control software control, but directly the analog quantity of CCD output is directly received on the monitor, show in real time the image of CCD, there are two shortcomings in this method: the one, and the user need monitor 2 monitors, and is cumbersome; The one, the time is very short when monitoring the die bond position, it is not by relevant devices such as capture cards, the anchor clamps under the real time monitoring camera lens, anchor clamps most of the time except die bond, some glue is all being moved (need move to next die bond position or some glue position) during automatic die bond, so the user can see the time of die bond quality very short (only having a few tens of milliseconds), the image time of demonstration is short and unintelligible.
For solving the deficiency of existing solid brilliant machine on observation and the solid crystalloid metering method of judgement, the present invention proposes a new technical scheme.
Summary of the invention
Hardware system of the present invention is made up of 2 video cameras, 2 monocular tube microscopes, image pick-up card, industrial computer and control corresponding softwares.The chip of the chip side that the CCD photo-sensitive cell in 2 video cameras amplifies microscope, the solid brilliant position of chuck side convert the signal of telecommunication to and pass to image pick-up card by 75 Europe coaxial cables.During work when having consolidated current die bond point, system moves to next die bond point immediately, but wait get brilliant assembly and remove after, move to again next die bond point after gathering the image of current die bond point and passing to image pick-up card, the image of another CCD acquisition chip side of while is also passed to capture card, control software is integrated into piece image with the image that two-way collects by primary and secondary, be presented on the display screen with picture-in-picture, user this moment can be seen clearly by the screen of a display die bond quality of image and chip image and current die bond point after the die bond, when defective work occurring, can quit work timely, improve the quality of consumer products.Wherein the primary and secondary user of picture-in-picture can be in the die bond process be switched at any time, and user friendly observation needs, and two paths of signals gathers simultaneously, has improved the response speed of system.
Judgement for the die bond quality, whether the present invention has increased an automatic decision die bond point in control software be the function of certified products, namely the die bond bit image is transferred to Computer Processing, use template matching method, with certified products as the coupling target, and with certified products relatively, determine whether this die bond point is certified products, if not certified products (belong to and leak crystalline substance, broken grain, inclination etc.), the prompting user that then reports an error is processed.This method is that whether automatic decision die bond point is certified products by software identification, and this method is compared with the method for traditional use manual detection, has not only improved the degree of accuracy, and has saved manpower.
Description of drawings
Fig. 1 is the system block diagram of the method for picture-in-picture observation of the present invention and automatic decision die bond quality.
Fig. 2 is known observation and the system block diagram of judging solid brilliant method for quality.
Fig. 3 is the design sketch of picture-in-picture observation of the present invention and automatic decision die bond quality.
Embodiment
The invention process system is by video camera, microscope, image collection card, and industrial computer and corresponding software are formed.
Fig. 1 is the system block diagram of the method for picture-in-picture observation of the present invention and automatic decision die bond quality.
Place the interior CCD photo-sensitive cell of 2 video cameras of chip side and solid brilliant position fixture side to convert the chip of the chip side of microscopical amplification, the solid brilliant position of chuck side to the signal of telecommunication, pass to image pick-up card by 75 Europe coaxial cables.After handling, image collection card DSP sends host computer to.PC control software is removed noise of equipment, ambient noises etc. such as CCD at first to the image preliminary treatment, extracts enough characteristic points according to the character of image.
During the work of die bond machine, when admittedly complete current die bond point, system moves to next die bond point immediately, but wait get brilliant assembly and remove after, move to again next die bond point after gathering the image of current die bond point and passing to image pick-up card, the image of another CCD acquisition chip side of while is also passed to capture card, control software is integrated into piece image with the image that two-way collects by primary and secondary, be presented on the display screen with picture-in-picture, user this moment can be seen clearly by the screen of a display die bond quality of image and chip image and current die bond point after the die bond.When defective work occurring, can in time quit work, improve the quality of consumer products.Wherein the primary and secondary user of picture-in-picture can be in the die bond process be switched at any time, and user friendly observation needs, and two paths of signals gathers simultaneously, has improved the response speed of system.
Be provided with the function of an automatic decision die bond quality in the control software of described system, namely the image of die bond position is transferred to Computer Processing, use template matching method, with certified products as the coupling target, and with certified products relatively, determine that whether this die bond put certified products, if not certified products (belong to and leak crystalline substance, broken grain, inclination etc.), the prompting that then reports an error is processed by the user.
Owing to adopted this method, greatly alleviated the degree of fatigue that the user monitors screen, improved die bond quality and production efficiency.
Claims (4)
1. a picture-in-picture is observed and the solid brilliant method for quality of automatic judgement, it passes through by video camera, monocular tube microscope, image pick-up card, the system that industrial computer and control corresponding software are formed realizes, it is characterized in that, CCD photo-sensitive cell in 2 video cameras of described system is with the chip of the chip side of microscope amplification, the solid brilliant bit image of chuck side converts the signal of telecommunication to and passes to image pick-up card respectively, by Control Software the image that two-way collects is integrated into piece image by primary and secondary, be presented on the display screen with picture-in-picture, and use the template matches technology to judge solid crystalloid amount automatically.
2. observe according to the described a kind of picture-in-picture of claim 1 and the method for automatic decision die bond quality, it is characterized in that the primary and secondary user of picture-in-picture can be switched in the die bond process at any time, user friendly observation needs, and two paths of signals is gathered simultaneously, has improved the response speed of system.
3. observe according to the described a kind of picture-in-picture of claim 1 and the method for automatic decision die bond quality, it is characterized in that, when complete current die bond point admittedly, system moves to next die bond point immediately, move to next die bond point after brilliant assembly is removed the image of the current die bond point of rear collection and passed to image pick-up card but wait to get, the image of another CCD acquisition chip side of while is also passed to capture card again.
4. observe according to the described a kind of picture-in-picture of claim 1 and the method for automatic decision die bond quality, it is characterized in that, be provided with the function of an automatic decision die bond quality in the control software, namely the image of die bond position transferred to Computer Processing, use template matching method, with certified products as the coupling target, and with certified products relatively, determine that whether this die bond put certified products, if not certified products, the prompting that then reports an error is processed by the user.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101073108A CN101393880B (en) | 2008-10-29 | 2008-10-29 | Method for picture-in-picture observation and automatically wafer quality determination |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101073108A CN101393880B (en) | 2008-10-29 | 2008-10-29 | Method for picture-in-picture observation and automatically wafer quality determination |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101393880A CN101393880A (en) | 2009-03-25 |
| CN101393880B true CN101393880B (en) | 2010-06-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2008101073108A Expired - Fee Related CN101393880B (en) | 2008-10-29 | 2008-10-29 | Method for picture-in-picture observation and automatically wafer quality determination |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110276319A1 (en) * | 2010-05-06 | 2011-11-10 | Jonathan Michael Madsen | Determination of material optical properties for optical metrology of structures |
| CN102142391B (en) * | 2010-12-24 | 2012-05-30 | 深圳市大族光电设备有限公司 | Crystal taking manipulator of solid crystal processing machine |
| CN103177984B (en) * | 2013-03-22 | 2015-12-02 | 江苏艾科瑞思封装自动化设备有限公司 | Encapsulation overall process vision monitoring method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6756589B1 (en) * | 1998-07-10 | 2004-06-29 | Hitachi, Ltd. | Method for observing specimen and device therefor |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6756589B1 (en) * | 1998-07-10 | 2004-06-29 | Hitachi, Ltd. | Method for observing specimen and device therefor |
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Granted publication date: 20100602 Termination date: 20121029 |