CN101392335A - Method for preparing tungsten copper composite encapsulation material - Google Patents
Method for preparing tungsten copper composite encapsulation material Download PDFInfo
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- CN101392335A CN101392335A CNA2008101556692A CN200810155669A CN101392335A CN 101392335 A CN101392335 A CN 101392335A CN A2008101556692 A CNA2008101556692 A CN A2008101556692A CN 200810155669 A CN200810155669 A CN 200810155669A CN 101392335 A CN101392335 A CN 101392335A
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- copper
- tungsten
- infiltration
- size
- briquet
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- 238000000034 method Methods 0.000 title claims abstract description 49
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 title claims abstract description 23
- 239000000463 material Substances 0.000 title claims abstract description 23
- 239000002131 composite material Substances 0.000 title claims abstract description 19
- 238000005538 encapsulation Methods 0.000 title claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 64
- 229910052802 copper Inorganic materials 0.000 claims abstract description 64
- 239000010949 copper Substances 0.000 claims abstract description 64
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims abstract description 47
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 38
- 239000010937 tungsten Substances 0.000 claims abstract description 37
- 230000008595 infiltration Effects 0.000 claims abstract description 19
- 238000001764 infiltration Methods 0.000 claims abstract description 19
- 238000002360 preparation method Methods 0.000 claims abstract description 14
- 230000008569 process Effects 0.000 claims description 15
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 239000000126 substance Substances 0.000 abstract description 9
- 238000000465 moulding Methods 0.000 abstract description 6
- 230000008901 benefit Effects 0.000 abstract description 4
- 230000007797 corrosion Effects 0.000 abstract description 4
- 238000005260 corrosion Methods 0.000 abstract description 4
- 230000006872 improvement Effects 0.000 abstract description 4
- 239000002994 raw material Substances 0.000 abstract description 2
- 239000004484 Briquette Substances 0.000 abstract 3
- 238000004806 packaging method and process Methods 0.000 abstract 2
- 238000010923 batch production Methods 0.000 abstract 1
- 239000011091 composite packaging material Substances 0.000 abstract 1
- 238000005245 sintering Methods 0.000 description 28
- 239000007791 liquid phase Substances 0.000 description 10
- 239000000243 solution Substances 0.000 description 9
- 230000003628 erosive effect Effects 0.000 description 7
- 230000005496 eutectics Effects 0.000 description 6
- 230000004913 activation Effects 0.000 description 5
- 230000007812 deficiency Effects 0.000 description 5
- 239000012071 phase Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000004513 sizing Methods 0.000 description 4
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229960004643 cupric oxide Drugs 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000007907 direct compression Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical class Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000004663 powder metallurgy Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
Abstract
The invention is an improvement of a preparation method of packaging tungsten-copper composite materials, which is characterized in that raw materials are firstly suppressed into a tungsten briquette of final shape and size of products and sintered into a framework, and then the leaked copper on the surface is removed in a chemical way after the infiltration of copper. Compared with the prior art, due to the abolishment of the copper removing method by mechanical processing after the infiltration of copper, with the adoption of the chemical corrosion technique of copper, the molding size of the tungsten briquette can be the final required size of the product, thus not only bypassing the low-efficiency copper removing technique by mechanical fine processing and greatly improving production efficiency by 30 percent to 70 percent, but also greatly reducing the consumption of expensive wolfram during the processing of the tungsten briquette into the final size, and saving the wolfram by 10 percent to 80 percent. The improvement of the preparation method of packaging tungsten-copper composite materials is a brand-new method for preparing tungsten-copper composite packaging materials, has the advantages of high production capacity by unit time, high production efficiency, low proportion of processing cost and high utilization rate of materials and rate of final finished products, and is particularly suitable for batch production, thus not only saving wolfram material for molding and processing cost, but also producing products of high-performance and being able to achieve thermal conductivity and air-tightness performance of products by the infiltration method, with the thermal conductivity of 180W.M/K to 200W.M/K.
Description
Technical field
The present invention is to the improvement of encapsulation with the tungsten-copper composite material preparation method, relates in particular to the high method for preparing tungsten copper composite encapsulation material of a kind of preparation efficiency and material use efficiency.
Background technology
Tungsten-copper composite material, because the low expansion character of existing tungsten, the high thermal conductivity that copper is arranged again, and its thermal expansivity and heat conduction, conductivity, can be designed by adjustment tungsten, copper component amount, with semiconductor silicon, arsenic, gallium arsenide, aluminum oxide, beryllium oxide etc. the matched well sealed knot is arranged, thereby be the packaged material of a kind of comparatively ideal microwave device, photoelectric device, unicircuit etc., be widely used.
Yet tungsten, two kinds of metal melting temperature of copper differ very big, and W, Cu are at high temperature not molten mutually substantially, promptly can not form eutectic, belong to solid phase and be not fused to liquid phase systems, therefore tungsten-copper composite material can only adopt the powder metallurgy process preparation, and prior art has infiltration method, high-temperature liquid-phase sintering, three kinds of methods of activation solution phase sintering to prepare tungsten-copper composite material substantially.
Infiltration method: tungsten powder is added a little binder be pressed into the pure tungsten briquet, sinter skeleton into, again that design flow is excessive copper spreads on the surface, through being higher than copper melting temperature (for example 1350 ℃) infiltration in the tungsten briquet, again by mechanical precision sizing to required type shape size.For example Chinese patent CN1995438 prepares the tungsten-copper alloy method, and first mixed powder sintering obtains the tungsten copper skeleton, and infiltration copper obtains tungsten-copper alloy again.Its advantage is: ooze copper in the tungsten briquet, hole can be filled by copper substantially between the tungsten particulate, can not form eutectic substantially again, thereby resistance to air loss and two important indicators of thermal conductivity are good, and thermal conductivity can reach 180-200W.M/K.Shortcoming is: it is uncertain big that infiltration copper overflows thickness, and every overflows thickness and there are differences, be favourable mechanical workout, it is relatively large that thickness direction is reserved process redundancy, the W skeleton size surplus is general 〉=0.8mm, and product is all with holes usually, step, shapes such as breach, cause mechanical precision sizing to required type shape size, process redundancy is big, not only production efficiency is lower, and cause consumption greatly for example to account for more than 80%, and it is bigger that price is higher than the tungsten waste of material of copper more than 3 times, relatively-high temperature liquid phase sintering, the activation solution phase sintering, waste material 10-45%, this manufactured cost is the highest in three kinds of methods, the tooling cost accounting is big, and the special-shaped more complexity of part, and manufacturing cost is high more.
High-temperature liquid-phase sintering: be that tungsten, copper powder are mixed by design proportion, be pressed into and littlely (be generally and obtain consistent prod and be fit to machine finshing greater than product type shape final size, die mould product size 〉=final size 0.2-0.3mm), through high temperature sintering more than 2000 ℃, mechanical precision sizing is removed copper and to final size.Advantage is that owing to adopt preformation to the approaching final type shape size of product, process redundancy is little than infiltration method relatively, expensive tungsten material use efficiency height.Its deficiency is: the one, and the sintering temperature height causes sintering cost height, and the sintering cost becomes the second largest cost factor except that the tungsten material in the preparation cost; The 2nd, high temperature sintering can produce the part eutectic, and eutectic exists can cause the reduction of tungsten-copper composite material resistance to air loss and thermal conductivity again; Thermal conductivity is 180-190W.M/K, and these two be as the necessary important indicator of packaged material, obviously can influence the reliability of encapsulated integrated circuit; The 3rd, piecewise, by face machinery precision sizing, production efficiency is still lower, and particularly multiaspect shaped body packaged material has increased machining complexity, difficulty and cost especially.
The activation solution phase sintering: develop for reducing the high-temperature liquid-phase sintering temperature, in the preparation of high-temperature liquid-phase sintering, be added with in the die mould trace for example nickel, cobalt, cupric oxide etc. help sintering aid, make it under relatively lower temp, to form eutectic, thereby reach the reduction sintering temperature.Chinese patent CN1590571 promptly adopts this method.Though this method has reduced sintering temperature, can be at 1600 ℃ of left and right sides sintering, but more above-mentioned high-temperature liquid-phase sintering process, only be to have reduced by 400 ℃ of left and right sides sintering temperatures, other deficiencies still exist, and owing to use sintering aid to produce the increase of eutectic amount, can cause local micropore to produce, thereby resistance to air loss and thermal conductivity index all be lower than the high-temperature liquid-phase sintering process, and thermal conductivity has only 50-170W.M/K.
The method for preparing tungsten-copper composite material, all exist not enough in various degree, and prior art is removed oozing out all unique employing machine finshing of copper, owing to oozing reasons such as copper amount, molding shrinkage, mechanical workout, pre-formed size at least 〉=0.2-0.8mm of final size, cause mechanical workout production efficiency low, the tooling cost accounting is big, particularly be with porous, groove, step and special-shaped product, production efficiency is lower, and the tooling cost accounting is bigger.Therefore still having is worth improved place.
Summary of the invention
The object of the invention is to overcome the deficiency of above-mentioned prior art, provides a kind of allowance for finish little, production efficiency height, the method for preparing tungsten copper composite encapsulation material that utilization rate of raw materials is high.
The object of the invention realizes that main the improvement is that first mold pressing obtains desired product type shape size tungsten base, fuses and oozes copper, removes the unnecessary copper that oozes in surface with chemical method after oozing copper, thereby overcomes the many deficiencies of prior art, realizes the object of the invention.Specifically, method for preparing tungsten copper composite encapsulation material of the present invention, comprise tungsten powder compacting tungsten briquet, sinter skeleton into, again with the copper of design flow through being higher than copper melting temperature infiltration in the tungsten briquet, it is characterized in that suppressing the tungsten briquet is the final type shape of product size, and infiltration copper oozes out copper after chemistry is removed the surface.
Chemistry of the present invention removes copper, mainly be only to adopt the chemical solutions that to corrode copper, not corrode tungsten, unnecessary copper is oozed out on erosion removal tungsten briquet surface, thereby get rid of the former unnecessary copper method that oozes of machine finshing method removal that needs to adopt, both improve preparation and produced efficient, reduced the loss that mechanical workout causes tungsten again.Therefore can corrode and go the chemical reagent solution of copper (not corroding tungsten) all can be used, such as but not limited to liquor ferri trichloridi, various acid, alkali and other salt chemical solutions.
The W skeleton preparation can be same as the prior art, adopts the pure tungsten powder to add the compressed with adhesive moulding, also can be the direct compression moulding of copper facing tungsten powder, sinters the W skeleton with structural strength into.
The infiltration copper method is also identical with the prior art infiltration method.Tungsten copper amount ratio is decided on product requirement.
Compacting tungsten briquet is the final type shape of a product size, and objectively compression moulding also is difficult to very accurately, therefore should not be construed as very accurate dimension, may be slightly larger than tens (hole etc. are slightly less than tens).For example for avoiding chemical copper removal, may cause the product surface microcosmic uneven because of the interface copper corrosion, may produce and electroplate back burning nickel process foaming, influence quality product, a kind of pure tungsten briquet size of more preferably suppressing of the present invention, the surface, particularly the thickness face leaves bright and clean plane process redundancy slightly, this process redundancy absolute value 0-≤0.1mm (physical dimension is plus tolerance, and hole, groove etc. is a minus tolerance).
For further improving chemistry erosion copper efficient, shorten the chemistry erosion copper time, the present invention is a kind of better to be when chemistry removes copper, and chemical copper etching liquor heating is higher than envrionment temperature, for example 40-50 ℃, the pressurization spray is to add fast response erosion copper speed.
Method for preparing tungsten copper composite encapsulation material of the present invention, with respect to prior art, remove copper method owing to got rid of mechanical workout behind the infiltration copper, adopt chemistry erosion process for copper to remove copper, substantially there is not contraction when adding pure tungsten briquet sintering, chemical corrosion goes the copper chemical reagent to be difficult to again make its corrosion, thereby tungsten briquet compact dimensions can be the final desired size of product; Even for further improving the quality, it is uneven to eliminate in the chemical copper removal issuable surface microscopic, it is smooth and reserve machining allowance to obtain surface microscopic, its process redundancy absolute value also only is〉0-≤0.1mm, not only omit the machine finshing of inefficiency and removed process for copper, improved production efficiency greatly, the liquid phase sintering of production efficiency higher temperatures, activation solution phase sintering improve about 30%, improve more than 70% at least than infiltration method; Be machined to the expensive tungsten consumption of final size but also can significantly reduce briquet, the liquid phase sintering of tungsten consumption higher temperatures, activation solution phase sintering save about 10%, save 〉=80% than infiltration method.The inventive method, three kinds of existing preparation method's deficiencies have been overcome, it is a kind of brand-new preparation tungsten copper composite electron packaged material novel method, with respect to prior art, unit time throughput is big, the production efficiency height, the tooling cost accounting is little, material use efficiency and final finished rate height, be particularly suitable for producing in batches, product is special-shaped, with holes, step, breach is many, and advantage of the present invention is more for obvious, can reach and save moulding tungsten material and tooling cost, the products obtained therefrom performance is good again, can reach infiltration method products obtained therefrom thermal conductivity and resistance to air loss performance, thermal conductivity: 180-200W.M/K.
Below in conjunction with two specific embodiments; the present invention is further understood in exemplary illustration and help; but the embodiment detail only is for the present invention is described; do not represent the present invention to conceive whole technical schemes down; therefore should not be construed as the technical scheme qualification total to the present invention, some do not depart from the unsubstantiality of the present invention's design and change In the view of the technician; for example simple the change or replacement of technical characterictic to have same or similar technique effect all belongs to protection domain of the present invention.
Embodiment
Embodiment 1: the finished product size 25*25*1mm, add the 0.3-0.8wt% stearic acid with the pure tungsten powder, and be pressed into the pure tungsten briquet of 25.1*25.1*1.1mm, degreasing in 900 ℃ of protective atmospheres obtains sintering (having intensity) skeleton.The design theory addition is added 5% excessive copper sheet, and single face is overlying on the W skeleton surface, oozes copper in 1350 ℃ of protective atmospheres.To be heated to be the pressure injection of 45 ℃ of iron trichlorides erosion copper solutions oozes behind the copper product and removes the surface and ooze copper.Precision is machined into desired size 25*25*1mm, obtains the packaged material matrix.
Embodiment 2: as previously mentioned, directly be pressed into the tungsten briquet with the copper facing tungsten powder, all the other methods are the same.
To those skilled in the art; under the present invention conceives enlightenment; some distortion that can directly derive or associate from this patent disclosure and general knowledge; or the substituting of known technology commonly used in the prior art; for example tungsten briquet forming adhesive can adopt other tackiness agents; product is with holes, step, breach; compression moulding simultaneously; reserving process redundancy is minus tolerance or the like; can both realize and basic identical function of the foregoing description and effect; launch for example no longer one by one to describe in detail, all belong to this patent protection domain.
For convenience of description, to remove copper and chemistry erosion copper be synonym to chemistry of the present invention.
Claims (4)
1, method for preparing tungsten copper composite encapsulation material, comprise tungsten powder compacting tungsten briquet, sinter skeleton into, again with the copper of design flow through being higher than copper melting temperature infiltration in the tungsten briquet, it is characterized in that suppressing the tungsten briquet is the final type shape of product size, and infiltration copper oozes out copper after chemistry is removed the surface.
2, according to the described tungsten copper composite electron of claim 1 packaged material preparation method, it is characterized in that suppressing tungsten briquet size, the surface, particularly the thickness face leaves the process redundancy absolute value slightly 0-≤the bright and clean planar process redundancy of 0.1mm.
3,, it is characterized in that it is that the copper etching liquor heating is higher than envrionment temperature that chemistry removes copper, the pressurization spray according to claim 1 or 2 described tungsten copper composite electron packaged material preparation methods.
4, according to the described tungsten copper composite electron of claim 3 packaged material preparation method, it is characterized in that the copper etching liquor Heating temperature is 40-50 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101556692A CN101392335B (en) | 2008-10-10 | 2008-10-10 | Method for preparing tungsten copper composite encapsulation material |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101556692A CN101392335B (en) | 2008-10-10 | 2008-10-10 | Method for preparing tungsten copper composite encapsulation material |
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| Publication Number | Publication Date |
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| CN101392335A true CN101392335A (en) | 2009-03-25 |
| CN101392335B CN101392335B (en) | 2010-12-08 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101928867A (en) * | 2010-04-09 | 2010-12-29 | 西安理工大学 | Method for preparing tungsten-copper alloy based on loose-loading infiltration method |
| CN102051498A (en) * | 2009-11-04 | 2011-05-11 | 江苏鼎启科技有限公司 | Tungsten and molybdenum copper alloy heat sink material and preparation method |
| CN104561625A (en) * | 2014-12-11 | 2015-04-29 | 陕西斯瑞工业有限责任公司 | Method for preparing copper-tungsten composite with high electric erosive resistance by virtue of microwave sintering |
| CN105798544A (en) * | 2014-12-31 | 2016-07-27 | 北京有色金属研究总院 | Tungsten-copper composite material and preparation method thereof |
-
2008
- 2008-10-10 CN CN2008101556692A patent/CN101392335B/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102051498A (en) * | 2009-11-04 | 2011-05-11 | 江苏鼎启科技有限公司 | Tungsten and molybdenum copper alloy heat sink material and preparation method |
| CN101928867A (en) * | 2010-04-09 | 2010-12-29 | 西安理工大学 | Method for preparing tungsten-copper alloy based on loose-loading infiltration method |
| CN101928867B (en) * | 2010-04-09 | 2012-04-04 | 西安理工大学 | Method for preparing tungsten-copper alloy based on loose-loading infiltration method |
| CN104561625A (en) * | 2014-12-11 | 2015-04-29 | 陕西斯瑞工业有限责任公司 | Method for preparing copper-tungsten composite with high electric erosive resistance by virtue of microwave sintering |
| CN105798544A (en) * | 2014-12-31 | 2016-07-27 | 北京有色金属研究总院 | Tungsten-copper composite material and preparation method thereof |
| CN105798544B (en) * | 2014-12-31 | 2018-10-02 | 北京有色金属研究总院 | A kind of tungsten-carbon/carbon-copper composite material and preparation method thereof |
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| Publication number | Publication date |
|---|---|
| CN101392335B (en) | 2010-12-08 |
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Effective date of registration: 20240319 Address after: No. 8 Huguang West Road, Ceramic Industry Park, Dingshu Town, Yixing City, Wuxi City, Jiangsu Province, China, 214252 Patentee after: Wuxi Meitexin Microelectronic Materials Co.,Ltd. Country or region after: China Address before: Huankeyuan Garden Road 214205 Jiangsu city of Yixing Province, No. 48 Patentee before: JIANGSU DINGQI SCIENCE AND TECHNOLOGY Co.,Ltd. Country or region before: China |