CN101392090A - Piezoelectric conductive epoxy resin composite damping material and preparation method thereof - Google Patents
Piezoelectric conductive epoxy resin composite damping material and preparation method thereof Download PDFInfo
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- CN101392090A CN101392090A CNA2008102261848A CN200810226184A CN101392090A CN 101392090 A CN101392090 A CN 101392090A CN A2008102261848 A CNA2008102261848 A CN A2008102261848A CN 200810226184 A CN200810226184 A CN 200810226184A CN 101392090 A CN101392090 A CN 101392090A
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Abstract
The invention provides epoxy resin composite damping slurry for preparing a damping material, and a preparation method and the composite damping material thereof. The epoxy resin composite damping slurry contains components as follows: 100pbw (part by weight) of epoxy resin, 3pbw to 60pbw of rubber, 5pbw to 80pbw of piezoelectric filler and 3pbw to 30pbw of conductive filler; wherein, epoxy resin prepolymer is bisphenol A type epoxy resin; the rubber is the one which is in liquid state at normal temperature; the piezoelectric filler is piezoelectric ceramics with an average grain size of 2 Mum to 8 Mum; the conductive filler is a carbon series conductive material. The components are evenly and fully mixed according to the parts by weight and cured by adding a curing agent so as to obtain the epoxy resin composite damping material of the invention. The piezoelectric and conductive epoxy resin composite damping material of the invention has good damping effects such as eliminating noise and vibration, preventing electrostatic and the like.
Description
Technical field
The present invention relates to a kind of Resins, epoxy composite damping material, say further, relate to a kind of Resins, epoxy composite damping material that combines macromolecular material viscoelastic damping characteristic and piezoelectricity, electro-conductive material electrical effect and preparation method thereof.
Background technology
The vibration damping and noise reducing technology is that effectively control vibration and noise get one of approach, and the research of damping material and application are more and more important.Macromolecular material has elasticity and viscosity dual nature, in when, under repeated stress (as vibration) effect high elastic deformation taking place, the motion of molecule interchain has the characteristics that significant deformation lags behind STRESS VARIATION under suitable temperature and frequency condition, the distorted movement of this hysteresis will overcome very big resistance and do work, institute's work is converted into heat energy and dissipates in surrounding environment, and Here it is has the reason that viscoelastic macromolecular material can be used for doing damping material.
In macromolecular material, add the dynamic properties that mineral filler also can improve polymkeric substance, increase its dissipation factor, regulate its second-order transition temperature, expand its Applicable temperature scope.The main effect of mineral filler also is to increase material strain and consume energy ability, the motion of energy restriction molecule, produce friction when filler grain is in contact with one another between particle, also there are friction in particle and macromolecule interfacial simultaneously, thereby have increased the energy waste of material.
And when piezoelectricity, electro-conductive material were arranged in the filler, under external force, piezoelectric generation deformation at the electric charge of some corresponding surface generation opposite in sign, realized from the conversion of mechanical energy to electric energy; Electro-conductive material is converted into heat energy with electric energy again, thereby finally realizes the transformation of energy of mechanical energy thermotropism.
Emerging piezo-electric damping material is exactly the filler that adds piezoelectric and electro-conductive material in macromolecular material, its damping mechanism then is multiple energy transformation mechanism, its damping capacity is the comprehensive of several waste of energy approach: when material was subjected to vibrating, high molecular visco-elasticity behavior was converted into heat energy with part mechanical energy; Between filler and the matrix and the interface friction between the filler can loss part mechanical energy; Piezoelectric ceramics is converted into electric energy with part mechanical energy, and electric energy is converted into heat energy by conductive network again.
The main both at home and abroad at present piezoelectric filler of using has crystal, semi-conductor, piezoceramic material, high polymer piezoelectric material etc.Wherein the piezoelectric property of piezoelectric ceramics is best, and has reasonable mechanical property.Pb-based lanthanumdoped zirconate titanates (PZT), barium titanate (BaTiO3), zirconium titanium lanthanum lead plumbate (PLZT) all have than higher piezoelectric constant, also are the normal piezoelectric ceramics that uses in piezo-electric damping material.Common conductive filler material can be divided into metal species filler and non-metal kind filler.The metal species filler is mainly by powder, paillon foil, silk and the fiber etc. of silver, copper, nickel and aluminium.Non-metallic fillers is commonly used carbon black, graphite, graphite fibre and carbon fiber and metal oxide etc.Poly(vinylidene fluoride) in the high polymer piezoelectric material (PVDF), fluorinated ethylene propylene (PVF), polyvinyl chloride (PVC) all are the polymer piezoelectrics with certain piezoelectricity.People such as Zhang Huiping (Zhang Huiping, Yan Xiong, Dong Yueqing, the dielectric energy consume mechanism [J] of PVDF/PZT/CB polymer composite. polymer material science and engineering, 2004,20 (2): 209-212) with PVDF being body material, is piezoelectric phase and conductive phase with PZT and CB, has prepared a kind of novel damping matrix material by mixing hot compacting method.(Hori M such as Hori, Aoki T, Ohira Y etc. piezoelectric ceramics, the NEW TYPE OF COMPOSITE mechanical damping material [J] of carbon black and Resins, epoxy. matrix material, 2001, be filler 32:287-290), make the PZT polymer compound film, and make its polarization produce piezoelectricity with Resins, epoxy is compound with PZT piezoelectric ceramics particulate.Result of study shows that the sound absorbing capabilities of this matrix material increases.If add a certain amount of conductive carbon black filler again, the acoustically effective of material is better.People (beam Rayleighs such as beam Rayleigh, Chang Le, high superfine. the application [J] of piezoelectric ceramics waste material in damping vibration attenuation material. renewable resource research, 2004 (2): 37-38) application in damping pitch is discovered to piezoelectric ceramics PZT waste material, be fixed in the carbon black doping under 3% the situation, along with the increase of piezoelectric ceramic powder doping, bituminous single order damping loss factor is dull to be increased.
Macromolecular material and ceramic powder are carried out the compound piezo-electricity composite material of making, overcome piezoceramic material density height, fragility is big, is difficult for making the shortcoming of big plane lamina or complicated shape.The piezo-electricity composite material of ceramic powder particle and polymkeric substance is a 0-3 type piezo-electricity composite material, and promptly ceramic powder is scattered in the matrix material that forms in the three-dimensional successive polymeric matrix.Have and be easy to make various forms, as thin slice, column, fibrous and moulded by casting etc.; Be easy to make, be suitable for mass production; Adapt to advantages such as the following use of case of bending thereby can be made into elastomerics, also make the damping capacity of macromolecular material improve simultaneously.Yet the effectiveness in vibration suppression as the polymer damping material of damping material base material has very big dependency to envrionment temperature and vibrational frequency, makes that the effectiveness in vibration suppression of damping material is still undesirable.And the adding of piezoelectric filler and conductive filler material, also can make the mechanical property of damping material itself such as toughness etc. be affected and descend.
Summary of the invention:
Resins, epoxy (EP) intensity height, high temperature resistant, water-alkali resistance is good, have good mechanical performance, wear resistance, electrical insulating property, chemical stability and adhesive property, and have low, easy machine-shaping of cure shrinkage and low cost and other advantages, extensive application all at aspects such as coating, tackiness agent, matrix material and embedding devices.But Resins, epoxy fragility is bigger, and second-order transition temperature is higher, has higher damping value under higher temperatures, can be used as the high temperature damping material and uses.But be subjected to certain restriction as the damping material application of using at normal temperatures.The present invention combines multiple damping vibration attenuation mechanism, by in Resins, epoxy, adding rubber, piezoelectric filler and conductive filler material, overcome shortcomings such as its normal temperature damping and amortization difference, make to have in the scope of the wide at normal temperatures temperature of epoxy resin composite material territory to have good damping vibration attenuation performance, working conditions no longer is subjected to the envrionment temperature considerable restraint.Improved toughness simultaneously, not only had comparatively ideal damping capacity, and had the good mechanical performance, can be used as structured material or use with structured material.
The purpose of this invention is to provide a kind of is the piezoelectricity conduction composite damping material of base material with Resins, epoxy; Another object of the present invention provides the preparation method of this Resins, epoxy composite damping material.
Purpose of the present invention realizes by following technical solution:
Piezoelectric conductive epoxy resin composite damping material of the present invention is a matrix with the Resins, epoxy of 100 parts by weight, and also include following component: rubber 3～60 parts by weight are preferably 5～50 parts by weight; Piezoelectric filler 5～80 parts by weight are preferably 8～70 parts by weight; Conductive filler material 3～30 parts by weight are preferably 5～20 parts by weight.
Wherein said Resins, epoxy is bisphenol A type epoxy resin.The epoxy equivalent (weight) of bisphenol A type epoxy resin (g/eq) is 184～194, and viscosity 11000～15000 (25 ℃, cps), low chlorine content.The kind of wherein preferred at least a following bisphenol A type epoxy resin: E-54, E-44, E-51.
Can form the cross-linked network of IPN structure behind the epoxy resin cure.Owing to running through mutually, tangling to produce to force and dissolve each other and synergistic effect between the cross-linked network, make the IPN material have not phase-splitting on the macroscopic view and the characteristics that are separated on the microcosmic, thereby created condition for preparation broad temperature, broadband damping material.The crosslinked of appropriateness can improve intermeshing ability between network, can increase compatibility between components, and the tool synergistic effect, makes IPN have good damping performance.But the degree of crosslinking increase again can restriction molecule motion, therefore, the too high damping capacity of material that can make again of degree of crosslinking descends among the IPN.In Resins, epoxy, add elastomeric component such as rubber and can make the degree of crosslinking of IPN more suitable, thereby realize the damping effect optimized.Therefore, also include rubber components in the Resins, epoxy composite damping material of the present invention, the adding of rubber components simultaneously can also improve the toughness of Resins, epoxy damping material.Described rubber is that second-order transition temperature is-50～0 ℃, and normal temperature is liquid rubber down.Described rubber is at least a in silicon rubber, urethanes and paracril preferably.
Piezoelectric filler described in the Resins, epoxy composite damping material of the present invention be particle size range at 2～8 μ m, be preferably the piezoelectric ceramics of 3～5 μ m.It is at least a in following material preferably: barium titanate, Pb-based lanthanumdoped zirconate titanates, zirconium titanium lanthanum lead plumbate.Its piezoelectric constant d33 is 240～500 * 10-12 C/N.
Conductive filler material described in the Resins, epoxy composite damping material of the present invention is the carbon series conductive material.The carbon series conductive filler generally all has good conductivity, and it is at least a in following material preferably: carbon fiber, carbon nanotube; Wherein said carbon fiber is more preferably from copper carbon fiber, and described carbon nanotube is preferably from the amination carbon nanotube.For the ease of disperse and the length range of processing carbon fiber generally at 0.2～6mm, preferably at 2～5mm.
The preparation method of a kind of Resins, epoxy composite damping material of the present invention, comprise that the component that will comprise described piezoelectric filler, conductive filler material, rubber mixes by the prepolymer of described amount and described Resins, epoxy, and add the auxiliary agent include solidifying agent, solidify afterwards and described Resins, epoxy composite damping material composition.Described solidifying agent comprises curing agent for epoxy resin and described rubber components solidifying agent commonly used.
Resins, epoxy damp composite material of the present invention can be realized with the form of coating, tackiness agent and structural part.Specifically, after the above each component mixing and adding epoxy curing agent, be poured into mixture in the mould or be coated in the surface that needs damping material as coating, perhaps being coated in as the tackiness agent of storeroom needs between the adherent surface, adopt common epoxy resin cure technology to be cured then, cool off afterwards from mould to take out and promptly obtain the damping material goods.
In above-mentioned preparation process, the mixture temperature of epoxy prepolymer, curing (or crosslinked) condition are (comprising temperature, time, solidifying agent or the like) normal condition of epoxy resin cure in the prior art.Wherein solidification value is preferably 50～100 ℃, is preferably 2～14 hours set time.Employed equipment is used processing and curing (or crosslinked) equipment in the common processing of Resins, epoxy.It is also general for Resins, epoxy to use the usual auxiliaries and the consumption thereof that comprise solidifying agent at this.In the method for the invention, curing system that Resins, epoxy adopted and solidifying agent, with and consumption all be commonly used in the prior art.It can be preferably polynary amine curing agent, more preferably at least a in following material: quadrol, diaminodiphenylmethane, Dicyanodiamide, diamino diphenyl sulfone.Its consumption is 100 parts by weight in the prepolymer of described Resins, epoxy, is 10～30 parts.In addition, as required, also can add the conventional auxiliary agent of Resins, epoxy processing in right amount, as auxiliary curing agent, thinner, filler etc.
In above-mentioned preparation process, involved rubber components such as silicon rubber, urethanes and paracril etc., (comprising temperature, time, equipment) is all curable under its curing at above-described Resins, epoxy (or crosslinked) condition.In the method for the invention, curing system and solidifying agent that described rubber components adopts, with and consumption all be commonly used in the prior art.General silicon rubber can adopt tetraethoxysilane, and urethanes can adopt tolylene diisocyanate (TDI) etc.Its consumption also all is a conventional amount used.
In order to make described each component mixed effect better, the preparation method of Resins, epoxy composite damping material of the present invention preferably includes following steps:
1. earlier with surface treatment agent or with behind the surface treatment dilution agent with described piezoelectric filler and conductive filler material thorough mixing some hrs;
2. with described epoxy prepolymer and rubber mix, will once or several times add in the mixture of epoxy prepolymer and rubber, carry out thorough mixing through the conductive filler material after the above-mentioned processing, piezoelectric filler;
3. in said mixture, add described solidifying agent, and thorough mixing, solidify afterwards.
Above-described surface treatment agent is a surface treatment agent commonly used in the prior art, and consumption also is a conventional amount used.Surface treatment agent preferably sodium dodecyl sulfate among the preparation method of the present invention, its consumption is generally 3～5%wt of the filler gross weight of handling.Surface treatment agent can be earlier with the thinner dilution, and described thinner adopts common easy volatile solvent, and as acetone, ethanol, ether, trichloromethane, ketone, tetracol phenixin etc., weaker concn is common, does not need particular determination.
In addition in order to prevent humidity in order to avoid impact effect, in above-described preparation method, preferably respectively Resins, epoxy, piezoelectric filler, conductive filler material are dried before mixing.Bake out temperature is not higher than the heat resisting temperature of various materials, generally can be at 80～100 ℃; Drying time can be at 1～2h.
The mixing of above-mentioned each component can mix it by high-speed mixing equipment of the prior art.Wherein the stirrer rotating speed generally can be 300～2000r/min, and preferred 400～1000r/min, mixing temperature are generally at 50～100 ℃.
For the consistency of improving conductive filler material and epoxy resin-base with and dispersiveness in Resins, epoxy to obtain better modified effect, the preparation method of Resins, epoxy composite damping material of the present invention, preferably before described each component is mixed, with described conductive filler material pre-treatment.Described pre-treatment specifically comprises when described conductive filler material comprises carbon nanotube and/or carbon fiber, with described carbon nanotube amination treatment and/or with described carbon fiber copper plating treatment.
The present invention carries out the carbon nanotube amination treatment method of amination treatment with reference to prior art to carbon nanotube, the treatment process of putting down in writing as the document of following prior art: 1, Goh H W, Goh S H, Xu G Q, et al.Chemical Physics Letters 2003,373:277-83; 2, Herandi K, Ljubovic H, Seo J W, et al.Acta Materialia 2003,51:1447-52; 3, Liu Z F, Shen Z Y, Zhu T, et al.Lagnmuir 2000,16 (8): 3569-73.
Specifically can be: after carbon nanotube is handled with nitration mixture (H2SO4:HNO3=3:1), get acidifying carbon nanotube and hexanediamine again, with acetone cleaning, suction filtration, drying, obtain the carbon nanotube of hexanediamine ammonification after the cooling at 150 ℃ of following backflow 7h.
The copper facing of carbon fiber is to carbon fiber treatment process commonly used in the prior art, the technology of putting down in writing as the document of following prior art is prepared: 1. Hou Wei etc., the optimization of carbon fiber surface chemical-copper-plating process, " electroplate and cover with paint, lacquer, colour wash, etc. ", 2007 the 9th phase P18～20; 2. Yang Lian prestige etc., the copper-plated research of carbon fiber, " Materials science and technology ", 2005 the 6th phase P620～622; 3. Gao Song etc., the copper-plated bath stability of carbon fiber surface, " material and metallurgical journal ", 2005 the 4th phase P317～320.
The present invention carries out the carbon fiber electroless copper method of copper plating treatment with reference to prior art to carbon fiber, specifically can be: carbon fiber is handled 3h with surface treatment agents such as sodium lauryl sulphate, clean drying.Dry after soaking 3h with acetone more afterwards, place 420 ℃ of following 1h oven dry of retort furnace.Be submerged into distilled water again, in 30 ℃ of constant temperature waters,, add zinc powder, sodium lauryl sulphate, Sodium dodecylbenzene sulfonate and copper-bath while stirring, regulate PH=4 with dilute sulphuric acid with 600 rev/mins of stirrings.Continue to stir suction filtration behind the 2h, filter residue is poured into and is stirred suction filtration behind the 1h in the benzotriazole solution, cleans after drying with distilled water, promptly gets copper carbon fiber.
The present invention utilizes viscoelastic damping characteristic and the piezoelectric effect of piezoelectric ceramics and the conductivity of electro-conductive material of macromolecular material, and having prepared with Resins, epoxy (EP) is composite piezoelectric, the conduction damping material of base material.Resins, epoxy damp composite material preparation of the present invention is simple, is widely used.Its main application form is coating, tackiness agent, also can be used as structured material or and structured material use together.Because it contains rubber, piezoelectricity, conducing composite material, the damp composite material that is solidified the back preparation by Resins, epoxy damping composite mortar of the present invention has effects such as noise, vibration and the anti-electrostatic of elimination.
Embodiment:
Below in conjunction with embodiment, further specify the present invention.
Performance test:
According to " GB/T 18258-2000 damping material damping capacity testing method " test damping capacity; By " GB/T 15662-1995 conduction, antistatic plastic volume specific resistance testing method " standard testing volume specific resistance." GB/T 2570-1995 Test method for flexural properties of resin casting body " test flexural strength." GB/T1043-1993 rigid plastics charpy impact test method " test shock strength.
Material property index, the trade mark:
Resins, epoxy:
Type: dihydroxyphenyl propane Racemic glycidol ether type epoxy
The trade mark: E-51
Source: Wuxi Di Aisheng epoxy company limited
Molecular formula:
Outward appearance: yellowish to yellow transparent thick liquid, low chlorine content.
Oxirane value: 0.48～0.54
Epoxy equivalent (weight) (g/eq): 184～194
Viscosity (25 ℃, cps): 11000～15000
Epoxy curing agent 1:
Title: (4,4 ')-diaminodiphenyl-methane (DDM)
Source: Beijing chemical reagents corporation
Molecular formula:
Outward appearance: white or light brown pressed powder
Reactive hydrogen equivalent: 49.6
Density (g/cm
3): 1.15
Fusing point (℃): 90～92
Boiling point (1.2kPa, ℃): 232
Solvability: be dissolved in acetone, methyl alcohol, be insoluble in benzene, ether.
Epoxy curing agent 2:
Title: 1 (EDA), be called for short quadrol.
The trade mark: LR-500G
Source: Guangzhou Chemical Reagent Factory
Outward appearance: colourless or little yellow thick liquid
Purity (%): 99
Density (g/cm
3) (20/20 ℃): 0.902
Fusing point (℃): 8.5
Boiling point (℃): 117.2
Conductive filler material 1:
Title: multi-walled carbon nano-tubes (MWNTs)
The trade mark: MWNTs 1020
Source: Nanometer Port Co., Ltd., Shenzhen
Outward appearance: black powder
Purity:〉95%
External diameter (nm): 10～20
Internal diameter (nm): 3～5
Length (μ m): 1～15
Decolorizing carbon:＜3%
Specific surface area (m
2/ g): 40～300
Bulk density (g/m
3): 0.07
Actual density (g/cm
3): 2.1
The amination made of carbon nanotubes:
With multi-walled carbon nano-tubes (MWNTs 1020) nitration mixture (H
2SO
4: HNO
3=3:1) handle, after washing drying, get the acidifying carbon nanotube, get acidifying carbon nanotube and hexanediamine (commercially available) again at 150 ℃ of following backflow 7h, the cooling back obtains the aminating carbon nanotube of hexanediamine with acetone cleaning, suction filtration, drying.
Conductive filler material 2:
Title: carbon fiber (CF)
The trade mark: CF-P
3200
Source: the special conductive powder material centre of development of protecting, Beijing
Outward appearance: black powder
Density (g/m
3): 1.5～1.7
Length (mm): 3.2 (mean values)
Diameter (μ m): 11～15
Tensile strength (MPa): 600～800
Carbon content: 〉=95%
Resistivity (Ω .cm): 3 * 10
-3～7 * 10
-3
The copper carbon fiber preparation:
With carbon fiber (CF-P
3200) handle 3h with surface treatment agents such as sodium lauryl sulphate, clean drying.Dry after soaking 3h with acetone more afterwards, place 420 ℃ of following 1h oven dry of retort furnace.Be submerged into distilled water and do not have, in 30 ℃ of constant temperature waters,, add zinc powder, sodium lauryl sulphate, Sodium dodecylbenzene sulfonate and copper-bath while stirring, regulate PH=4 with dilute sulphuric acid with 600 rev/mins of stirrings.Continue to stir suction filtration behind the 2h, filter residue is poured into and is stirred suction filtration behind the 1h in the benzotriazole solution, cleans after drying with distilled water, promptly gets copper carbon fiber.
Piezoelectric filler:
Title: Pb-based lanthanumdoped zirconate titanates (PZT)---particle size range: 3～5 μ m
Model: P-5
Source: acoustics institute of the Chinese Academy of Sciences
Outward appearance: white or pale yellow powder
Relative permittivity ε: 1000
Dielectric loss tg δ: 0.2
The piezoelectric strain coefficient d
33(10
-12C/N): 450
Density p (10
3Kg/m
3): 7.5
Rubber:
1. silicon rubber GF_T11E
Source: the logical boat Science and Technology Ltd. of Beijing boat
Outward appearance: normal temperature liquid state
Form: two component A and B, A is a silicone rubber component; B is a curing agent component, and major ingredient is a tetraethoxysilane; The weight ratio of A: B is 10: 1
Viscosity (25 ℃, cps): A component 28000～3000, B component: 100
Density (g/
3): the A component is 1.6～1.7, and the B component is 0.98
2. urethane: (101 glue)
Source: the anchor board 101-H of Shanghai Xinguang Chemical Co., Ltd. tackiness agent system
Outward appearance: normal temperature liquid state
Form: two component first and second, first: the weight ratio of second is 5: 1, and first is the urethanes component, and second is curing agent component, and main component is tolylene diisocyanate (TDI).
The preparation process of embodiment and Comparative Examples:
Carry out the carbon fiber copper plating treatment at first according to the method described above, the carbon nanotube amination treatment, standby.Afterwards with surface treatment agent or with behind the surface treatment dilution agent with piezoelectric filler and conductive filler material thorough mixing some hrs.
Take by weighing then through 50 ℃ of thinning Resins, epoxy E-51 of heating, put into there-necked flask, stir with electric blender under 50 ℃ of thermostat(t)ed waters, stirring speed is 400 rev/mins.A kind of, the piezoelectric ceramics, the urethane first component (or silicon rubber) that weigh according to quantity in described carbon fiber, copper carbon fiber or the amination carbon nanotube add in the there-necked flask, stir 10 min with E-51 at 50 ℃ of following heating in water bath.Take by weighing a certain amount of epoxy curing agent then and add in the flask, again with deaerating agent tributyl phosphate (commercially available) 2 mL, regulating stirring velocity is 500 rev/mins, vacuum outgas simultaneously, vacuum stirring 20 min.Taking by weighing urethane second component (or take by weighing silicon rubber B component by A, B components by weight 10:1) at 5: 1 by first and second components by weight again adds and continues to stir 10 min in the flask.Stop to stir, while hot mixture is poured in the grinding tool of smearing the vacuum silicone grease, 80 ℃ of following normal pressures solidify 2 h, stop heating, naturally cooling in baking oven, depanning.
With gained standard batten, carry out every performance test.Each component prescription of embodiment and Comparative Examples sees Table 1, and its each routine test result sees Table 2.
Table 1
Table 2
According to the data of last table as seen, the Resins, epoxy damping material that the embodiment of the invention obtains has good damping, occur two peaks between 0～60 ℃ and 60～80 ℃, dissipation factor tg δ peak value is all higher, even two peak values have just appearred in embodiment 8 in 0～60 ℃ scope.Illustrate that thus piezoelectricity electrical conduction mechanism and viscoelastic damping mechanism brought into play effect simultaneously.Damping material with respect to Comparative Examples is seen, Resins, epoxy damping material of the present invention has damping preferably in bigger warm territory scope.
Claims (10)
1. piezoelectric conductive epoxy resin composite damping material, it includes following component:
Resins, epoxy 100 parts by weight
Rubber 3～60 parts by weight
Piezoelectric filler 5～80 parts by weight
Conductive filler material 3～30 parts by weight
Wherein said Resins, epoxy is bisphenol A type epoxy resin; Normal temperature is liquid rubber down; Described piezoelectric filler is the piezoelectric ceramics of particle size range at 2～8 μ m; Described conductive filler material is the carbon series conductive material.
2. Resins, epoxy composite damping material according to claim 1, it includes following component:
Resins, epoxy 100 parts by weight
Rubber 5～50 parts by weight
Piezoelectric filler 8～70 parts by weight
Conductive filler material 5～20 parts by weight.
3. Resins, epoxy composite damping material according to claim 1, wherein said rubber are selected from least a in silicon rubber, urethanes and the paracril.
4. Resins, epoxy composite damping material according to claim 1, wherein said piezoelectric ceramics are selected from least a in the following material: barium titanate, Pb-based lanthanumdoped zirconate titanates, zirconium titanium lanthanum lead plumbate; Described carbon series conductive material is selected from least a in the following material: carbon fiber, carbon nanotube.
5. Resins, epoxy composite damping material according to claim 4, wherein said carbon fiber is selected from copper carbon fiber, and described carbon nanotube is selected from the amination carbon nanotube.
6. according to a kind of preparation method of the described piezoelectric conductive epoxy resin composite damping material of one of claim 1～5, comprise that the component that will comprise described piezoelectric filler, conductive filler material, rubber mixes by the prepolymer of described amount and described Resins, epoxy, and add the auxiliary agent include solidifying agent, solidify afterwards and described Resins, epoxy composite damping material composition.
7. the preparation method of Resins, epoxy composite damping material according to claim 6, epoxy curing agent is that 100 parts by weight are counted 10～30 parts with the prepolymer of described Resins, epoxy in the wherein said solidifying agent; Described epoxy curing agent is polynary amine curing agent.
8. the preparation method of Resins, epoxy composite damping material according to claim 7, wherein said epoxy curing agent is selected from least a in the following material: quadrol, diaminodiphenylmethane, Dicyanodiamide, diamino diphenyl sulfone.
9. the preparation method of Resins, epoxy composite damping material according to claim 6, comprising following steps:
1. earlier with surface treatment agent or with behind the surface treatment dilution agent with described piezoelectric filler and conductive filler material thorough mixing some hrs;
2. with described epoxy prepolymer and rubber mix, will once or several times add in the mixture of epoxy prepolymer and rubber, carry out thorough mixing through the conductive filler material after the above-mentioned processing, piezoelectric filler;
3. in said mixture, add described solidifying agent, and thorough mixing, solidify afterwards.
10. according to the preparation method of each described Resins, epoxy composite damping material of claim 6～9, comprising before described each component is mixed, with described conductive filler material pre-treatment, comprise when described conductive filler material comprises carbon nanotube and/or carbon fiber, with described carbon nanotube amination treatment and/or with described carbon fiber copper plating treatment.
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2008
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