CN101380723A - Cleaning brush lifting device of chemically machinery wafer polishing device - Google Patents

Cleaning brush lifting device of chemically machinery wafer polishing device Download PDF

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Publication number
CN101380723A
CN101380723A CNA2007101476994A CN200710147699A CN101380723A CN 101380723 A CN101380723 A CN 101380723A CN A2007101476994 A CNA2007101476994 A CN A2007101476994A CN 200710147699 A CN200710147699 A CN 200710147699A CN 101380723 A CN101380723 A CN 101380723A
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CN
China
Prior art keywords
brush
cleaning brush
lifting
elevator
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2007101476994A
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Chinese (zh)
Inventor
徐昌源
尹晶焕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KC Tech Co Ltd
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MIYAKOYAMA MECATEC KK
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Publication date
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Priority to CNA2007101476994A priority Critical patent/CN101380723A/en
Publication of CN101380723A publication Critical patent/CN101380723A/en
Pending legal-status Critical Current

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Abstract

The present invention discloses a cleaning brush elevating device of a chemical mechanical wafer polishing device. The cleaning brush elevating device is used for vertically elevating a cleaning brush used for cleaning impurity on a wafer. The cleaning brush elevating device comprises a frame, a reference brush which is supported by the frame rotatablely, an elevating block which is arranged at the frame to ensure that the elevating block can raise and descend, an elevating brush which is rotatablely arranged at the elevating block, raises and descends together with the elevating block and is close to or far from the reference brush at the same time as well as a linear motor which is used for elevating the elevating block. The device can reduce the unit cost of the product, the production cost and the production time. In addition, the device also has the advantages of small size and light weight and can control the elevating drive to be exact.

Description

The cleaning brush lowering or hoisting gear of device of chemically machinery wafer polishing
Technical field
The present invention relates to device of chemically machinery wafer polishing, more specifically, relate to the cleaning brush lowering or hoisting gear of device of chemically machinery wafer polishing, this device can accurately be controlled and be used to clean the lifting of the cleaning brush of wafer polishing.
Background technology
The semiconductor crystal wafer manufacture process comprises the crystal column surface polishing process, is used to utilize chemically mechanical polishing (CMP) equipment etc., with when rotating wafer at a high speed, crystal column surface is polished.This crystal column surface polishing process must comprise the wafer cleaner process, is used for removing foreign substance that the process at wafer polishing produces or particle etc.A kind of embodiment that is used for the cleaning device of this wafer cleaner process is disclosed in the korean patent application publication number 2005-82323.
Schematically shown the critical piece of disclosed cleaning device in the open text of above-mentioned patent application among Fig. 1 and Fig. 2.
See figures.1.and.2, described cleaning device contacts with the rear surface with the front surface of the wafer that rotates by the deflector roll (not shown), and comprise a pair of cleaning brush 2 and 5, described cleaning brush is made by the sponge material with moisture retention and is carried out relative motion with respect to wafer.
In order to clean wafer or according to the type of wafer, the distance between the described cleaning brush 2 and 5 must be adjusted according to the kind that is injected at the chemical substance on the wafer.Therefore, need a kind of cleaning brush lowering or hoisting gear of one that is used for lifting cleaning brush 2 and 5.
Described cleaning brush lowering or hoisting gear comprises frame 1, benchmark brush 2, elevator 4, lifting brush 5, bootstrap block 7, electric rotating machine 8, crank 10, pitman arm 11 and elevating lever 12.
Described frame 1 is used to support above-mentioned member.Described benchmark brush 2 is rotatably supported by frame 1, and described elevator 4 is by frame 1 support, so that elevator 4 can oscilaltion.
Described benchmark brush 2 downsides by frame 1 rotatably support.More specifically, the rotating shaft 3 of described benchmark brush 2 is rotatably supported by frame 1.
Described elevator 4 is installed in the upside of frame 1, to carry out lifting.
The rotating shaft 6 of described lifting brush 5 rotatably is supported on the elevator 4.Therefore, described lifting brush 5 according to elevator 4 along the vertical direction motion and brush 2 oscilaltions with respect to benchmark.
Described bootstrap block 7 supports electric rotating machine 8, crank 10, pitman arm 11 and elevating lever 12, and the elevating movement of guiding elevating lever 12.
Described crank 10 is connected with the rotating shaft 9 of electric rotating machine 8, to rotate around rotating shaft 9.One end of described pitman arm 11 is connected with an end of crank 10, and the other end of pitman arm 11 is connected with elevating lever 12, rotatablely moving of crank 10 changed into the linear reciprocating motion of elevating lever 12.
Described elevating lever 12 is limited by bootstrap block 7, thereby only carries out linear reciprocating motion, and the upper end of elevating lever 12 is connected with elevator 4.Particularly, when elevating lever 12 passed through pitman arm 11 straight reciprocating motions, elevator 4 carried out elevating movement by elevating lever 12.Thereby described lifting brush 5 carries out elevating movement with respect to benchmark brush 2.
But the cleaning brush lowering or hoisting gear of above-mentioned traditional device of chemically machinery wafer polishing has following shortcoming.
At first, traditional cleaning brush lowering or hoisting gear needs many members, for example bent axle 10, pitman arm 11 and elevating lever 12 etc., thereby change rotatablely moving of motor into linear reciprocating motion, and traditional cleaning brush lowering or hoisting gear also needs complicated structure, for example bootstrap block 7, therefore wasted a large amount of product costs, production cost and production time.
Secondly, in traditional cleaning brush lowering or hoisting gear, change in the straight-line process will rotatablely moving, the pulse of motor is to utilize by divide the approximation that whole lifting distance obtains with predetermined interval to control.Therefore, the control procedure complexity, and the accuracy of elevating movement reduces.In addition, as mentioned above owing to be used for changing into the foozle of straight-line many members with rotatablely moving, thus depend on motor the anglec of rotation the control lifting position accuracy worse and worse.
Once more, in traditional cleaning brush lowering or hoisting gear, the volume and the weight thereof that are occupied by bootstrap block 7 grades are bigger.Therefore, be difficult to reduce size, weight reduction, and it is also comparatively complicated to control, change and repair its member.
Summary of the invention
Therefore, the present invention is intended to solve the above-mentioned problems in the prior art, and the invention provides a kind of cleaning brush lowering or hoisting gear of device of chemically machinery wafer polishing, described cleaning brush lowering or hoisting gear changes straight-line member into by adopting linear electric machine to save to be used for rotatablely moving, therefore reduced product cost, production cost, shortened the production time, and described cleaning brush lowering or hoisting gear minimizes the foozle between the member, thereby can carry out accurately Position Control, and described cleaning brush lowering or hoisting gear also to have size little, in light weight, be easy to control, and advantage such as can easily repair by changing its member.
According to an aspect of the present invention, provide a kind of cleaning brush lowering or hoisting gear of device of chemically machinery wafer polishing, described cleaning brush lowering or hoisting gear is used in the cleaning brush oscilaltion of the impurity on the cleaning wafer, and described cleaning brush lowering or hoisting gear comprises: frame; The benchmark brush, described benchmark brush is rotatably supported by described frame; Elevator, described elevator is installed on the described frame, so that described elevator can oscilaltion; Lifting brush, described lifting brush is rotatably installed on the described elevator, and described lifting brush and described elevator one lifting, simultaneously near or away from described benchmark brush; And linear electric machine, described linear electric machine is used to drive described elevator lifting.
According to a further aspect in the invention, a kind of cleaning brush lowering or hoisting gear of device of chemically machinery wafer polishing is provided, described cleaning brush lowering or hoisting gear also comprises: installing plate, described installing plate are fixedlyed connected with described elevator and are had the hole, and the part of motor shaft is inserted in the described hole; Fixture, described fixture are fixed in the part in the described hole of insertion of described motor shaft, so that described motor shaft is fixed on the described installing plate; The axle back-up block, described axle back-up block is fixedly mounted on the described frame, and the rotating shaft of described benchmark brush is rotatably supported by described axle back-up block; And the lifting shaft back-up block, described lifting shaft back-up block is fixedly mounted on the described elevator, and the rotating shaft of described lifting brush is rotatably supported by described lifting shaft back-up block.
According to a further aspect in the invention, a kind of cleaning brush lowering or hoisting gear of device of chemically machinery wafer polishing is provided, described cleaning brush lowering or hoisting gear comprises: first brush, described first brush is rotatably installed on the frame, thereby, carry out relative motion with respect to wafer with when one of wafer surface contacts; Second the brush, described second the brush be installed on the described frame so that described second the brush can rotate and move up and down, thereby with wafer another the surface contact in, carry out relative motion with respect to wafer; And linear electric machine, described linear electric machine is used to drive the described second brush lifting, thereby controls the distance between described first brush and second brush.
Description of drawings
In conjunction with the accompanying drawings, by following detailed, above-mentioned and other purposes of the present invention, feature and advantage will be more obvious.In the accompanying drawings:
Fig. 1 is a kind of perspective schematic view of cleaning brush lowering or hoisting gear of traditional device of chemically machinery wafer polishing;
Fig. 2 is the cross-sectional view of Fig. 1;
Fig. 3 is the perspective schematic view according to the cleaning brush lowering or hoisting gear of the device of chemically machinery wafer polishing of one embodiment of the present invention; And
Fig. 4 is the cross-sectional view of Fig. 3.
The specific embodiment
Below, with the cleaning brush lowering or hoisting gear of describing in detail in conjunction with the accompanying drawings according to the device of chemically machinery wafer polishing of one embodiment of the present invention.
With reference to Fig. 3 and Fig. 4, be used for lifting cleaning brush 21 and 25 one according to the cleaning brush lowering or hoisting gear of the device of chemically machinery wafer polishing of one embodiment of the present invention, and comprise frame 20, first brush (being the benchmark brush) 21, elevator 24, second brush (being the lifting brush) 25 and linear electric machine 28, wherein, described cleaning brush is used for the impurity on the device of chemically machinery wafer polishing cleaning wafer of wafer polishing.
Described frame 20 is used to support above-mentioned member.Described benchmark brush 21 is rotatably supported by frame 20, and described elevator 24 is by frame 20 supports, and carrying out oscilaltion, and described linear electric machine 28 is fixedly mounted on the frame 20.
Described benchmark brush 21 has rotating shaft 22, and described rotating shaft 22 is rotatably installed in the downside of frame 20, thereby described benchmark brush 21 rotates around rotating shaft 22 on frame 20.
Described elevator 24 is installed in the upside of frame 20, so that described elevator 24 can oscilaltion.More specifically, on described elevator 24, be formed with the guiding groove (not shown) along the vertical direction, and on described frame 20, be formed with the riser guide 23 that is used to insert in the described guiding groove.Described guide rail 23 inserts in the described guiding groove, thereby guides the elevating movement of described elevator 24.Certainly, said structure just is used to guide a kind of structure of embodiment of the elevating movement of elevator 24, is understood that easily, can adopt various guides, as long as can guide elevator 24 along the vertical direction.
Described lifting brush 25 has rotating shaft 26, and described rotating shaft 26 is rotatably supported by described elevator 24, to carry out elevating movement with elevator 24.When described lifting brush 25 carried out elevating movement, it is 21 close to each other or away from each other that described lifting brush 25 and benchmark are brushed.Therefore, can adjust distance between described benchmark brush 21 and the lifting brush 25.
Described linear electric machine 28 is fixedly mounted on the frame 20, and the motor shaft 27 of described linear electric machine 28 is connected with described elevator 24, with the described elevator 24 of lifting up and down.Described linear electric machine 28 is accurately controlled by impulse wave or driving signal etc., thereby can control described motor shaft 27 linear reciprocating motions.
Owing to adopted this linear electric machine 28, therefore can save and be used for changing into straight-line complex component, crank 10 for example illustrated in figures 1 and 2, pitman arm 11, elevating lever 12 and bootstrap block 7 etc. rotatablely moving.
Described motor shaft 27 must be fixedlyed connected with described elevator 24.For realizing this structure, on described elevator 24, be installed with installing plate 29, described installing plate 29 has the hole 29a that passes these installing plate 29 extensions, the part of described motor shaft 27 is inserted among the 29a of this hole, and for example the fixture 30 of screw, bolt etc. is fastened in the part in the described hole 29a of insertion of motor shaft 27.Therefore, described motor shaft 27 is fixedly mounted on the described elevator 24, thereby described elevator 24 can oscilaltion.
Simultaneously, reference axis back-up block 32 is fixedly mounted on the frame 20, and described reference axis back-up block 32 is used to support the rotating shaft 22 of benchmark brush 21, and regularly pulley 33 is installed on the rotating shaft 22 of described benchmark brush 21.
And lifting shaft back-up block 34 is fixedly mounted on the described elevator 24, and the rotating shaft 26 of described lifting brush 25 supports by this lifting shaft back-up block 34, and regularly pulley 35 is installed on the rotating shaft 26 of described lifting brush 25.
Described timing pulley 33 is connected by the timing belt (not shown) with 35.According to said structure, described benchmark brush 21 and lifting brush 25 can accurately rotate together.
Below, will the operating process of aforesaid cleaning brush lowering or hoisting gear be described.When driving linear electric machine 28, so that during motor shaft 27 oscilaltions, the elevator 24 that is connected with motor shaft 27 carries out elevating movement along riser guide 23.
Like this, because can be easily and accurately control linear electric machine 28, therefore can save and be used for changing into straight-line member, thereby reduce product cost, production cost, shorten the production time rotatablely moving.In addition, can reduce the size of equipment, alleviate the weight of equipment, and be easy to control or repair linear electric machine 28 and the replacing parts.And, can accurately adjust the initial position of elevator 24.Therefore, can make the infringement of wafer or drive error minimize.
Though described illustrative embodiments of the present invention for illustrative purposes, but those skilled in the art should be understood that, under the prerequisite that does not break away from disclosed scope and spirit of the present invention in the appended claims, various modifications, interpolation and replacement all are fine.

Claims (5)

1, a kind of cleaning brush lowering or hoisting gear of device of chemically machinery wafer polishing, described cleaning brush lowering or hoisting gear are used in the cleaning brush oscilaltion of the impurity on the cleaning wafer, and described cleaning brush lowering or hoisting gear comprises:
Frame;
The benchmark brush, described benchmark brush is rotatably supported by described frame;
Elevator, described elevator is installed on the described frame, so that described elevator can oscilaltion;
Lifting is brushed, and described lifting is brushed and is rotatably installed on the described elevator, and described lifting brush and described elevator one lifting are so that described lifting is brushed close or brushed away from described benchmark; And
Linear electric machine, described linear electric machine are used to make described elevator oscilaltion.
2. the cleaning brush lowering or hoisting gear of device of chemically machinery wafer polishing according to claim 1, wherein, the motor shaft of described linear electric machine is fixedly mounted on the described elevator.
3. the cleaning brush lowering or hoisting gear of device of chemically machinery wafer polishing according to claim 2 also comprises:
Installing plate, described installing plate are fixedlyed connected with described elevator and are had the hole, and the part of described motor shaft is inserted in the described hole; And
Fixture, described fixture are fixed in the part in the described hole of insertion of described motor shaft, so that described motor shaft is fixed on the described installing plate.
4. the cleaning brush lowering or hoisting gear of device of chemically machinery wafer polishing according to claim 3 also comprises:
The reference axis back-up block, described reference axis back-up block is fixedly mounted on the described frame, and rotatably supports the rotating shaft of described benchmark brush; And
The lifting shaft back-up block, described lifting shaft back-up block is fixedly mounted on the described elevator, and rotatably supports the rotating shaft of described lifting brush.
5. the cleaning brush lowering or hoisting gear of a device of chemically machinery wafer polishing comprises:
First brush, described first brush is rotatably installed on the frame, thereby with when one of wafer surface contacts, carries out relative motion with respect to wafer;
Second brush, described second brush is installed on the described frame, so that described second brush can rotate and oscilaltion, thereby with when another surface of wafer contacts, carries out relative motion with respect to wafer; And
Linear electric machine, described linear electric machine are used for described second brush of lifting, thereby control the distance between described first brush and second brush.
CNA2007101476994A 2007-09-07 2007-09-07 Cleaning brush lifting device of chemically machinery wafer polishing device Pending CN101380723A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNA2007101476994A CN101380723A (en) 2007-09-07 2007-09-07 Cleaning brush lifting device of chemically machinery wafer polishing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNA2007101476994A CN101380723A (en) 2007-09-07 2007-09-07 Cleaning brush lifting device of chemically machinery wafer polishing device

Publications (1)

Publication Number Publication Date
CN101380723A true CN101380723A (en) 2009-03-11

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Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2007101476994A Pending CN101380723A (en) 2007-09-07 2007-09-07 Cleaning brush lifting device of chemically machinery wafer polishing device

Country Status (1)

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CN (1) CN101380723A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103769376A (en) * 2012-10-25 2014-05-07 株式会社荏原制作所 Substrate cleaning apparatus and substrate cleaning method
CN109524327A (en) * 2017-09-19 2019-03-26 株式会社荏原制作所 Running-in machine, adjustment system and storage medium

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103769376A (en) * 2012-10-25 2014-05-07 株式会社荏原制作所 Substrate cleaning apparatus and substrate cleaning method
CN109524327A (en) * 2017-09-19 2019-03-26 株式会社荏原制作所 Running-in machine, adjustment system and storage medium

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
ASS Succession or assignment of patent right

Owner name: K.C. TECH CO., LTD.

Free format text: FORMER OWNER: DOOSAN MECATEC CO., LTD.

Effective date: 20090904

C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20090904

Address after: Gyeongnam, South Korea

Applicant after: K. C. Tech Co., Ltd.

Address before: Gyeongnam, South Korea

Applicant before: Miyakoyama MECATEC Kabushiki Kaisha

C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Open date: 20090311