CN101374388B - Method for preparing fine line flexible circuit board with high peeling strength - Google Patents
Method for preparing fine line flexible circuit board with high peeling strength Download PDFInfo
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- CN101374388B CN101374388B CN2008100270927A CN200810027092A CN101374388B CN 101374388 B CN101374388 B CN 101374388B CN 2008100270927 A CN2008100270927 A CN 2008100270927A CN 200810027092 A CN200810027092 A CN 200810027092A CN 101374388 B CN101374388 B CN 101374388B
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Abstract
The invention relates to a method for producing a fine line flexible circuit board with high racking strength, including the following steps: selecting a metal foil as the carrier, vacuum sputtering alayer of sputtering metal level, which can improve the racking strength of the thin copper and the carrier, on one side of the metal foil, then coiling the planting thin copper layer on the sputtering metal level; selecting a film matrix which is coated with B stage modified epoxy or B stage acrylics or polyester film of TPI resin or polyimide film or liquid crystal polymer film on one side or ondouble sides; placing the thin copper layer with metal foil, release paper layer, silicon rubber layer, Teflon layer, stainless steel layer on surface of one side or double sides of the matrix in sequence from inside out; and then pressing the thin copper layer with metal foil carrier on surface of one side of the matrix or on surfaces of the double sides of the matrix separately. Comparing withthe prior art, the equality of the racking strength is effectively ensured at last, and the processing control is simple, the affinity between the matrix and the thin copper layer is good, the rackingstrength is high, the yield rate is high, and the cost for processing is low; the method is suitable for processing circuit boards with small-bore, and has high reliability; the electroplated layer is uniform and is suitable for producing a large amount of fine line products; the method can be used for producing flexible circuit boards with broad width, the utility ratio of the material is high and the efficiency is high.
Description
Technical field
The present invention relates to a kind of manufacture method of fine line flexible circuit board of high-peeling strength.
Background technology
Under the driving of the miniaturization of electronic product, liquid crystal display electron product high speed development, obtained on the application market of flexible electric circuit board enlarging fast.Flexibility coat copper plate is as its main raw material, and current technology and the market of being in is all in the situation that increases fast.In the LCD drive IC, it plays the effect of carrying IC chip, circuit communication, insulation support.Have high fine circuit, it is high that the lead-in wire positional precision is installed is its main feature.Produce the circuit board of high fine circuit, thin copper foil (thickness is less than 9 micron copper foils) flexibility coat copper plate is a critical material.
Name is called ultrathin copper foil and the tellite of being with carrier, the applying date is 2006.12.14, publication number is the patent of invention of CN1984526A, it is by foils, peel ply and ultrathin copper foil constitute, adopt electric plating method between foils and ultrathin copper foil, to form certain thickness peel ply, because foils has certain roughness, the electrodeposited coating that forms homogeneous on foils is very difficult, when electroplating, ultrathin copper foil can produce a large amount of pin holes, can significantly reduce pin hole though at first impact copper facing, but can not can't guarantee consistent peel strength from avoiding the appearance of this defective in essence.Peel ply is by the metal A that keeps fissility with the plating metal B easy to implement of ultrathin copper foil is constituted in addition, and the metal A that wherein constitutes peel ply better is selected from Mo, Ta, V, Mn, W, Cr, and metal B better is Fe, Co, Ni, Cr.Peel ply can electroplate liquid be formed or form different ratio of componentss by changing the plating condition by changing, and the purpose of this method is to need high-peeling strength on the one hand, and defectives such as peel strength is even, does not bubble, layering; The ultrathin copper foil of the band carrier of at high temperature peeling off easily on the other hand, so control is very complicated on its technology, its cost is also higher.
At present there has been the method for human magnetron sputtering to make printed substrate, be called a kind of magnetron sputtering process of making printed circuit board, the applying date utilized as name and be 2003.9.19, publication number patent of invention for CN1527656A, disclosing a kind of method is that the technology that forms line layer is electroplated in sputter then in the boring of insulation single layer of substrate material.Directly form conductive layer (plantation layer) at matrix surface, electroplate then and finish, this technology for matrix require high, especially for flexibility coat copper plate, the KAPTON EN that has only at present DuPont to produce in the world can really meet the demands, and peel strength is lower, and overall cost is high especially, and has limited the market application of this technology.
Summary of the invention
Purpose of the present invention is intended to overcome above-mentioned the deficiencies in the prior art, provide that affinity is good between a kind of matrix and the thin copper layer, peel strength is higher, high yield, processing cost are lower, be fit to the processing of circuit board small-bore, have the manufacture method of the fine line flexible circuit board of high reliability and the simple high-peeling strength of technology controlling and process.
Manufacture method according to the fine line flexible circuit board of a kind of high-peeling strength provided by the invention may further comprise the steps:
1), the formation of the thin copper of band carrier metal paper tinsel: choose metal forming as carrier, the thickness of metal forming is 8 μ m to 50 μ m, width is 100mm to 1000mm, can improve the splash-proofing sputtering metal layer of thin copper and described carrier peel strength at side surface vacuum sputtering one deck of metal forming, the thickness of this splash-proofing sputtering metal layer is 100 dust to 300 dusts, web-like is electroplated thin copper layer on this splash-proofing sputtering metal layer then, and the thickness of this thin copper layer is 2 μ m to 35 μ m.
2), the making of the copper-clad plate of band carrier metal paper tinsel: choose the polyester film of single face or the two-sided B of scribbling rank modified epoxy or B rank acrylic resin or TPI resin or the film matrix of polyimide film or liquid crystalline polymer film; Place thin copper layer, off-style paper layer, silastic-layer, Teflon layer, the stainless steel layer of band metal forming from the inside to the outside successively at matrix one side surface or both sides; Carry out pressing then, will the band metal forming thin copper layer be pressed together on a side surface of matrix or be pressed together on the matrix both side surface respectively, the temperature of pressing be 150 the degree to 330 the degree, the time is 0.3 hour to 3 hours, pressure is 1.5Mpa to 4Mpa; Off-style paper layer on the matrix, silastic-layer, Teflon layer, stainless steel layer are peeled off described matrix.
3), the copper-clad plate of band carrier metal paper tinsel is drilled through via according to the designing requirement of circuit board, boring is finished after etching and is fallen outer field metal forming.
4), hole metallization.
5), the designing requirement according to circuit board adds thick copper layer with the copper-clad plate electric plating of whole board.
6), the making of circuitous pattern:
7), lamination.
8), surface treatment.
The present invention also comprises following additional technical feature:
Described metal forming is made by aluminum or aluminum alloy or nickel or nickel alloy material.
Described metal forming is made by aluminum or aluminum alloy or nickel or nickel alloy material.
Described splash-proofing sputtering metal layer is copper or manganese or iron or tungsten or nickel or chromium or nichrome.
The thickness of described metal forming is 8 μ m or 12 μ m or 20 μ m or 35 μ m or 50 μ m; width is 100mm or 250mm or 500mm or 750mm or 1000mm; the thickness of described splash-proofing sputtering metal layer is 100 dusts or 150 dusts or 300 dusts, and the thickness of described thin copper layer is 2 μ m or 25 μ m or 35 μ m.
Step 2) temperature of pressing is 150 degree or 180 degree or 330 degree in, and the time is 0.3 hour or 2 hours or 3 hours, and pressure is 1.5Mpa or 2Mpa or 3Mpa or 4Mpa.
Electroplating current is 0.5ASD to 4ASD in the step 5), and electroplating time is 15 minutes to 120 minutes.
The present invention compares with present technology, has following advantage: the present invention adopts the mode of sputter to form sputtering layer, and sputtering layer thickness can not change because of the roughness of carrier metal paper tinsel, and finally guarantees the homogeneity of peel strength.Sputtering layer is made of a kind of metal in addition, the present invention does not need to consider simultaneously to peel off easily under high-peeling strength and the high temperature these two features, consider actual track plate manufacture craft demand, just consider high-peeling strength, the more effective quality of stability that improved just erodes the carrier metal paper tinsel after the boring of circuit board processing technology, play the effect of improving drilling quality, be very easy to control on its technology, cost is lower.Moreover affinity is good, peel strength is higher between film matrix of the present invention and the thin copper layer, high yield, and its processing cost is lower in addition; Be fit to the processing of circuit board small-bore on the technology, have high reliability; Even, the suitable fine rule in enormous quantities road product of producing of electrodeposited coating; Can produce big wide cut flexible electric circuit board, stock utilization height, efficient height.
Description of drawings
Below in conjunction with accompanying drawing, describe the present invention in detail:
Fig. 1 is the structural representation of the thin copper of band carrier metal paper tinsel among the present invention;
Fig. 2 is the structural representation when making the copper-clad plate of being with the carrier metal paper tinsel among the present invention;
Fig. 3 is the structural representation of the copper-clad plate of band carrier metal paper tinsel of the present invention.
Embodiment
Embodiment one
A kind of manufacture method of fine line flexible circuit board of high-peeling strength may further comprise the steps:
1); the formation of the thin copper (referring to Fig. 1) of band aluminium foil: choose aluminium foil (1) as carrier; the thickness of aluminium foil is 8 μ m to 50 μ m; preferred 8 μ m or 12 μ m or 20 μ m or 35 μ m or 50 μ m; width is 100mm to 1000mm; preferred 100mm or 250mm or 500mm or 750mm or 1000mm; can improve the sputter copper layer (2) of thin copper and described carrier peel strength at side surface vacuum sputtering one deck of aluminium foil; the thickness of this sputter copper layer is 100 dust to 300 dusts; preferred 100 dusts or 150 dusts or 300 dusts; web-like is electroplated thin copper layer (3) on this sputter copper layer then; the thickness of this thin copper layer is 2 μ m to 35 μ m, preferred 2 μ m or 5 μ m or 9 μ m or 12 μ m.
2), the making (referring to Fig. 2, Fig. 3) of the copper-clad plate of band aluminium foil: choose the polyester film of single face or the two-sided B of scribbling rank modified epoxy or B rank acrylic resin or TPI resin or the film matrix (4) of polyimide film or liquid crystalline polymer film; Place the thin copper layer of being with aluminium foil from the inside to the outside successively at matrix one side surface or both side surface (present embodiment is a both side surface), off-style paper layer (5), silastic-layer (6), Teflon layer (7), stainless steel layer (8), carry out pressing then, the thin copper layer of band carrier metal paper tinsel is pressed together on the both side surface of matrix respectively, the temperature of pressing is that 150 degree are to 330 degree, preferred 150 degree of the temperature of pressing or 180 degree or 330 degree, time is 0.3 hour to 3 hours, time is preferably 0.3 hour or 2 hours or 3 hours, pressure is 1.5Mpa to 4Mpa, preferred 1.5Mpa of pressure or 2Mpa or 3Mpa or 4Mpa; Off-style paper layer on the matrix, silastic-layer, Teflon layer, stainless steel layer are peeled off described matrix.
3), the copper-clad plate of band aluminium foil is drilled through via according to the designing requirement of circuit board, boring is finished after etching and is fallen outer field aluminium foil.
4), hole metallization, this step can adopt different forms according to prior art, no longer describes in detail here.
5), according to the designing requirement of circuit board the copper-clad plate electric plating of whole board is added thick copper layer, electroplating current is 0.5ASD to 4ASD, is preferably 0.5ASD or 2ASD or 4ASD; Electroplating time is 15 minutes to 120 minutes, is preferably 25 minutes.
6), the making of circuitous pattern: make the circuit egative film according to designing requirement, select the dry film of suitable thickness, adopt high-resolution egative film or adopt LDI (laser direct imaging) exposure sources to carry out image transfer.Select suitable etching solution for use, adjust its parameter such as electrode potential, temperature, concentration, pressure be to the scope of setting, and carries out etch process.
7), lamination: with ready-made double sided board flexible substrate and corresponding coverlay lamination, pressing under HTHP.Select perhaps that the photonasty coverlay is vacuum abutted, exposure, develop, the back curing process finishes the protection to circuit.
8), surface treatment, this step can adopt different forms according to prior art, no longer describes in detail here.
Embodiment two
Be step 1) with above-mentioned enforcement difference, choose alloy foil or nickel foil or nickel alloy foil as carrier, the back operation is with embodiment one.
Embodiment three
Be step 1) with embodiment one difference, described splash-proofing sputtering metal layer (2) is manganese or iron or tungsten or nickel or chromium or nichrome, and the back operation is with embodiment one.
The present invention adopts the mode of sputter to form sputtering layer, and sputtering layer thickness can not change because of the roughness of carrier metal paper tinsel, and finally guarantees the homogeneity of peel strength.Sputtering layer is made of a kind of metal in addition, the present invention does not need to consider simultaneously to peel off easily under high-peeling strength and the high temperature these two features, consider actual track plate manufacture craft demand, just consider high-peeling strength, the more effective quality of stability that improved just erodes the carrier metal paper tinsel after the boring of circuit board processing technology, play the effect of improving drilling quality, be very easy to control on its technology, cost is lower.Moreover affinity is good, peel strength is higher between matrix of the present invention and the thin copper layer, high yield, and its processing cost is lower in addition; Be fit to the processing of circuit board small-bore, have high reliability; Even, the suitable fine rule in enormous quantities road product of producing of electrodeposited coating; Can produce big wide cut flexible electric circuit board, stock utilization height, efficient height.
The foregoing description is only for the usefulness that the present invention is described; and be not be to the invention restriction; the those of ordinary skill in relevant technologies field; under the situation that does not break away from the spirit and scope of the present invention; can also make various variations and modification; therefore all technical schemes that are equal to also should belong to category of the present invention, and scope of patent protection of the present invention should be limited by each claim.
Claims (6)
1. the manufacture method of the fine line flexible circuit board of a high-peeling strength is characterized in that may further comprise the steps:
1), the formation of the thin copper of band carrier metal paper tinsel: choose metal forming (1) as carrier, the thickness of metal forming is 8 μ m to 50 μ m, width is 100mm to 1000mm, can improve the splash-proofing sputtering metal layer (2) of thin copper and described carrier peel strength at side surface vacuum sputtering one deck of metal forming, the thickness of this splash-proofing sputtering metal layer is 100 dust to 300 dusts, web-like is electroplated thin copper layer (3) on this splash-proofing sputtering metal layer then, and the thickness of this thin copper layer is 2 μ m to 35 μ m;
2), the making of the copper-clad plate of band carrier metal paper tinsel: choose the polyester film of single face or the two-sided B of scribbling rank modified epoxy or B rank acrylic resin or TPI resin or the film matrix (4) of polyimide film or liquid crystalline polymer film; Place thin copper layer, off-style paper layer (5), silastic-layer (6), Teflon layer (7), the stainless steel layer (8) of being with the carrier metal paper tinsel from the inside to the outside successively at matrix one side surface or both sides; Carry out pressing then, thin copper layer that will band carrier metal paper tinsel is pressed together on a side surface of matrix or is pressed together on the matrix both side surface respectively, the temperature of pressing be 150 degree to 330 degree, the time is 0.3 hour to 3 hours, pressure is 1.5Mpa to 4Mpa; Off-style paper layer on the matrix, silastic-layer, Teflon layer, stainless steel layer are peeled off described matrix;
3), the copper-clad plate of band carrier metal paper tinsel is drilled through via according to the designing requirement of circuit board, boring is finished after etching and is fallen outer field carrier metal paper tinsel;
4), hole metallization;
5), the designing requirement according to circuit board adds thick copper layer with the copper-clad plate electric plating of whole board;
6), the making of circuitous pattern;
7), lamination;
8), surface treatment.
2. the manufacture method of the fine line flexible circuit board of high-peeling strength according to claim 1 is characterized in that described carrier metal paper tinsel (1) made by aluminum or aluminum alloy or nickel or nickel alloy material.
3. the manufacture method of the fine line flexible circuit board of high-peeling strength according to claim 1 is characterized in that described splash-proofing sputtering metal layer (2) is copper or manganese or iron or tungsten or nickel or chromium or nichrome.
4. the manufacture method of the fine line flexible circuit board of high-peeling strength according to claim 1; the thickness that it is characterized in that described carrier metal paper tinsel is 8 μ m or 12 μ m or 20 μ m or 35 μ m or 50 μ m; width is 100mm or 250mm or 500mm or 750mm or 1000mm; the thickness of described splash-proofing sputtering metal layer is 100 dusts or 150 dusts or 300 dusts, and the thickness of described thin copper layer is 2 μ m or 5 μ m or 9 μ m or 12 μ m or 35 μ m.
5. the manufacture method of the fine line flexible circuit board of high-peeling strength according to claim 1, it is characterized in that step 2) in the temperature of pressing be 150 degree or 180 degree or 330 degree, time is 0.3 hour or 2 hours or 3 hours, and pressure is 1.5Mpa or 2Mpa or 3Mpa or 4Mpa.
6. the manufacture method of the fine line flexible circuit board of high-peeling strength according to claim 1 is characterized in that electroplating current is 0.5ASD to 4ASD in the step 5), and electroplating time is 15 minutes to 120 minutes.
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| CN2008100270927A CN101374388B (en) | 2008-03-28 | 2008-03-28 | Method for preparing fine line flexible circuit board with high peeling strength |
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| CN2008100270927A CN101374388B (en) | 2008-03-28 | 2008-03-28 | Method for preparing fine line flexible circuit board with high peeling strength |
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| CN101374388B true CN101374388B (en) | 2010-06-02 |
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