CN101370365B - Electronic device - Google Patents

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Publication number
CN101370365B
CN101370365B CN2007101427358A CN200710142735A CN101370365B CN 101370365 B CN101370365 B CN 101370365B CN 2007101427358 A CN2007101427358 A CN 2007101427358A CN 200710142735 A CN200710142735 A CN 200710142735A CN 101370365 B CN101370365 B CN 101370365B
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mentioned
sub
housing
electronic installation
metal shell
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CN2007101427358A
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CN101370365A (en
Inventor
谢智和
许素菁
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Asustek Computer Inc
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Asustek Computer Inc
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Abstract

The invention relates to a electronic device comprising a body unit and at least a buffer assembly. The body unit possesses a first sub-shell, a second sub-shell and a main unit. The first sub-shell and the second sub-shell, both being metal shell with multiple holes, wraps the main unit; buffer assembly mounted on at least a part of metal shell, is provided with a binding part and a buffering part; binding part is between buffering part and metal shell, one part of binding part passes the holes and binds with metal shell. The binding part and buffering part are double base injection molded.

Description

Electronic installation
Technical field
The present invention relates to a kind of electronic installation, particularly relate to a kind of electronic installation with buffering material.
Background technology
Along with the continuous progress of science and technology, the also more and more polynary change of the kind of electronic product.Wherein, carry-along electronic installation, for example (Personal Digital Assistant, PDA), associated electrical consumer products such as mobile phone and notebook computer are because its convenience gos deep in the daily life it to personal digital assistant especially.
See also for example PDA of electronic installation shown in Figure 1, known 1, it can comprise a body unit 11, and body unit 11 has a main frame 111, a upper shell 112 and a lower house 113.Upper shell 112 and lower house 113 coat and protection main frame 111, and wherein the material of upper shell 112 and lower house 113 for example is a plastic material.
Yet known plastic material as upper shell 112 and lower house 113 is not shock-resistant usually, therefore, and the situation that regular meeting causes upper shell 112 or lower house 113 to break when known electronic installation 1 is dropped by eminence.So, not only the outward appearance of electronic installation 1 can be impaired, can cause the damage of electronic installation 1 internal structure or function etc. what is more, even can cause user's injury because of the fragment of upper shell 112 or lower house 113.
In addition, one highest wisdom is by adding a thermoplastic elastomer (TPE) (Thermoplastic Elastomer, TPE) material engages with the upper shell 112 or the lower house 113 of metal material as Buffer Unit, then must utilize the mode of gummed to engage, but cause the reliability that comes off and glue together of Buffer Unit to wait to confirm easily.
Summary of the invention
The objective of the invention is to, overcome the defective that existing electronic installation exists, and a kind of crashproof anti-electronic installation that falls of new structure is provided, be very suitable for practicality.
The object of the invention to solve the technical problems realizes by the following technical solutions.A kind of electronic installation according to the present invention's proposition, it is characterized in that, comprise: a body unit, have one first sub-housing, one second sub-housing and a main frame, the above-mentioned first sub-housing and the above-mentioned second sub-housing coat above-mentioned main frame, the above-mentioned first sub-housing or the above-mentioned second sub-housing are a metal shell, and above-mentioned metal shell has most holes; And at least one Buffer Unit, be arranged at least a portion of above-mentioned metal shell, above-mentioned Buffer Unit has a joint portion and a buffer part, above-mentioned binding site is between above-mentioned buffer part and above-mentioned metal shell, the part of above-mentioned joint portion is passed above-mentioned these holes and is engaged with above-mentioned metal shell, and wherein above-mentioned joint portion and above-mentioned buffer part are double-material jet formation.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid electronic installation, wherein said Buffer Unit is arranged at the part of above-mentioned metal shell.
Aforesaid electronic installation, wherein said joint portion and above-mentioned metal-back body heat fuse closes.
Aforesaid electronic installation, the material of wherein said metal shell are almag.
Aforesaid electronic installation, the material of wherein said joint portion is selected from the group that acrylonitrile-butadiene-styrene copolymer and Merlon constitute.
Aforesaid electronic installation, the material of wherein said buffer part are thermoplastics type's elastomer.
Aforesaid electronic installation, wherein said thermoplastics type's elastomer are thermoplastics type's rubber or thermoplastics type's polyurethane.
The object of the invention to solve the technical problems also realizes by the following technical solutions.A kind of electronic installation according to the present invention proposes is characterized in that, comprises: a body unit, have one first sub-housing, one second sub-housing and a main frame, and the above-mentioned first sub-housing and the above-mentioned second sub-housing coat above-mentioned main frame; One display unit, have one the 3rd sub-housing, one the 4th sub-housing and a display floater, the above-mentioned the 3rd sub-housing and the above-mentioned the 4th sub-housing coat above-mentioned display floater, one of them is a metal shell at least for the above-mentioned first sub-housing, the above-mentioned second sub-housing, the above-mentioned the 3rd sub-housing or the above-mentioned the 4th sub-housing, and above-mentioned metal shell has most holes; And at least one Buffer Unit, be arranged at least a portion of above-mentioned metal shell, above-mentioned Buffer Unit has a joint portion and a buffer part, above-mentioned binding site is between above-mentioned buffer part and above-mentioned metal shell, the part of above-mentioned joint portion is passed above-mentioned these holes and is engaged with above-mentioned metal shell, and wherein above-mentioned joint portion and above-mentioned buffer part are double-material jet formation.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid electronic installation, wherein said Buffer Unit is arranged at the part of above-mentioned metal shell.
Aforesaid electronic installation, wherein said joint portion and above-mentioned metal-back body heat fuse closes.
Aforesaid electronic installation, the material of wherein said metal shell are almag.
Aforesaid electronic installation, the material of wherein said joint portion is selected from the group that acrylonitrile-butadiene-styrene copolymer and Merlon constitute.
Aforesaid electronic installation, the material of wherein said buffer part are thermoplastics type's elastomer.
Aforesaid electronic installation, wherein said thermoplastics type's elastomer are thermoplastics type's rubber or thermoplastics type's polyurethane.
Aforesaid electronic installation, the wherein said second sub-housing and the above-mentioned the 3rd sub-housing are superimposed with each other.
The present invention compared with prior art has tangible advantage and beneficial effect.By above technical scheme as can be known, major technique of the present invention thes contents are as follows:
Edge is for reaching above-mentioned purpose, to comprise a body unit and at least one Buffer Unit according to a kind of electronic installation of the present invention.Body unit has one first sub-housing, one second sub-housing and a main frame, and the first sub-housing and the second sub-housing coat main frame, and the first sub-housing or the second sub-housing are a metal shell, and metal shell has most holes.Buffer Unit is arranged at least a portion of metal shell, Buffer Unit has a joint portion and a buffer part, binding site is between buffer part and metal shell, and the part of joint portion is passed those holes and engaged with metal shell, and wherein joint portion and buffer part are double-material jet formation.
In addition, for reaching above-mentioned purpose, comprise a body unit, a display unit and at least one Buffer Unit according to a kind of electronic installation of the present invention.Body unit has one first sub-housing, one second sub-housing and a main frame, and the first sub-housing and the second sub-housing coat main frame.Display unit has one the 3rd sub-housing, one the 4th sub-housing and a display floater, the 3rd sub-housing and the 4th sub-housing coat display floater, the first sub-housing, the second sub-housing, the 3rd sub-housing or the 4th sub-housing at least wherein one be a metal shell, metal shell has most holes.Buffer Unit is arranged at least a portion of metal shell, Buffer Unit has a joint portion and a buffer part, binding site is between buffer part and metal shell, and the part of joint portion is passed those holes and engaged with metal shell, and wherein joint portion and buffer part are double-material jet formation.
By technique scheme, electronic installation of the present invention has following advantage and beneficial effect at least:
A kind of electronic installation of the present invention is subject to the external force collision place by the Buffer Unit that setting has shock-absorbing and absorption impact in metal shell side and/or corner etc., when electronic installation is clashed into or when eminence drops, can absorb impact by Buffer Unit, avoid electronic installation to produce and damage.In addition; the present invention more utilizes high impact plastic material to protect electronic installation; see through the method for double-material jet formation; making metal shell and plastic material carry out heat by the hot melt post fuses and closes; avoid whereby between Buffer Unit and metal shell because of the unlike material situation that comes off easily that is difficult for mutually combining takes place, to guarantee the quality of electronic installation.
In sum, the present invention has above-mentioned plurality of advantages and practical value, no matter it all has bigger improvement on product structure or function, obvious improvement is arranged technically, and produced handy and practical effect, and more existing electronic installation has the outstanding effect of enhancement, thus be suitable for practicality more, and have the extensive value of industry, really be a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is known electronic installation schematic diagram;
Fig. 2 is the electronic installation schematic diagram of first embodiment of the invention;
Fig. 3 is that Buffer Unit of the present invention combines profile with metal shell;
Fig. 4 A is the main computer unit part schematic diagram of the electronic installation of second embodiment of the invention;
Fig. 4 B is the display unit part schematic diagram of the electronic installation of second embodiment of the invention; And
Fig. 4 C is the electronic installation schematic diagram of second embodiment of the invention.
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to its embodiment of electronic installation, structure, feature and the effect thereof that foundation the present invention proposes, describe in detail as after.
Hereinafter with reference to correlative type, the electronic installation according to preferred embodiment of the present invention is described.
First embodiment
See also shown in Figure 2ly, electronic installation 2 of the present invention is a PDA(Personal Digital Assistant) for example, comprises a body unit 21 and at least one Buffer Unit 22.
Body unit 21 has a main frame 211, one first sub-housing 212 and one second sub-housing 213, the first sub-housings 212 and the second sub-housing 213 and coats main frame 211.Wherein, the first sub-housing 212 or the second sub-housing 213 can be a metal shell, in the present embodiment, are that metal shell is that example explains with the first sub-housing 212.The material of the first sub-housing 212 is an almag for example, has most holes 214.Certainly, except main frame 211, the first sub-housing 212 and the second sub-housing 213 more can coat a display floater 215.
Buffer Unit 22 is arranged at least a portion of the first sub-housing 212, and in the present embodiment, Buffer Unit 22 is that example explains to be arranged at first sub-housing 212 two relative side S1.Wherein, Buffer Unit 22 has a joint portion 221 and a buffer part 222, and both are double-material jet formation, and joint portion 221 then is used for engaging with the first sub-housing 212, so joint portion 221 is positioned at the side of Buffer Unit 22 near the first sub-housings 212.
In this example, preferable acrylonitrile-butadiene-styrene copolymer (the acrylonitrile butadiene styrene copolymer that is selected from of the material of joint portion 221, ABS) and Merlon (polycarbonate, PC) group that is constituted, the material of buffer part 222 then is a thermoplastic elastomer (TPE), for example be thermoplastics type's rubber (Thermoplastic Rubber, TPR) or the thermoplastic poly amido formate (Thermoplastic Polyurethane, TPU).
In addition, note that present embodiment can describe in detail for asking, in Fig. 2, joint portion 221 and buffer part 222 separately presented that right Buffer Unit 22 should be the parts of one.
Then, please consult Fig. 2 and shown in Figure 3 simultaneously, the generalized section that Fig. 3 combines with the first sub-housing 212 for expression Buffer Unit 22.Joint portion 221 has most projections 223, projection 223 passes the hole 214 on the first sub-housing 212, and utilize the heat mode of melting to make projection 223 pass the partial melting of the first sub-housing 212, so that greater than hole 214, can making Buffer Unit 22 engage with the first sub-housing 212, its surface fixes.
Therefore, be arranged at the side S1 of electronic installation 2,, avoid electronic installation 2 to produce and damage when electronic installation 2 is clashed into or when eminence drops, can absorb impacts by Buffer Unit 22 by Buffer Unit 22.
Second embodiment
Please consult simultaneously shown in Fig. 4 A, Fig. 4 B and Fig. 4 C, the electronic installation 3 of second embodiment of the invention and the difference of first embodiment are: the electronic installation 3 of present embodiment for example be a portable computer (Notebook, NB).
Electronic installation 3 comprises a body unit 31, a display unit 32 and a Buffer Unit 33.One main frame 311 of body unit 31 (as Fig. 4 A) is folded between the first sub-housing 312 and the second sub-housing 313, one display floater 321 of display unit 32 (as Fig. 4 B) then be folded in the 3rd sub-housing 322 and the 4th sub-housing 323 between, and display unit 32 is to be connected to each other by pivot T with body unit 31.
When electronic installation 3 closures, the second sub-housing 313 and the 3rd sub-housing 322 can be superimposed with each other.Wherein, one of them is a metal shell at least for first sub-housing 312, second sub-housing the 313, the 3rd sub-housing 322 and the 4th sub-housing 323, in the present embodiment, is that metal shell is that example explains with the first sub-housing 312 and the 4th sub-housing 323.And 33,34 and 35 of Buffer Units are arranged at least one side S2 and/or a bent angle K of the first sub-housing 312 and the 4th sub-housing 323 respectively.
In the present embodiment, Buffer Unit 33,34 and 35 material can be utilized and the identical material of Buffer Unit 22 among first embodiment, and the combination of Buffer Unit 33,34 and the 35 and first sub-housing 312 and the 4th sub-housing 323, also for first embodiment in Buffer Unit 22 heat identical with the first sub-housing 212 melt combination, do not repeat them here.Wherein, Buffer Unit 33 has joint portion 331 and buffer part 332, and Buffer Unit 34 has joint portion 341 and buffer part 342, and Buffer Unit 35 has joint portion 351 and buffer part 352.
Please consult Fig. 4 A earlier, with the situation that combines of the first sub-housing 312 and the Buffer Unit 33 of explanation body unit 31.In the present embodiment, most Buffer Units 33 are arranged at two relative side S2 of the first sub-housing 312 respectively, and coat the bent angle K in four corners simultaneously.These places all are the parts that body unit 31 is vulnerable to external force when dropping or being impacted, and can reduce the impact of external force for main frame 311 in the presence of Buffer Unit 33.
In addition, the first sub-housing 312 has more most first perforation 3121, and the joint portion 331 of Buffer Unit 33 and buffer part 332 also have corresponding respectively first perforation of most individual second perforation 333 3121 formation.Thus, the first sub-housing 312 and Buffer Unit 33 can pass second perforation, 333 and first perforation 3121 and the part (for example CD-ROM drive) of the first sub-housing 312 with main frame 311 screwed togather by most screw (not shown).
Then, see also shown in Fig. 4 B, in the display unit 32 with the explanation present embodiment, the situation that combines of the 4th sub-housing 323 and Buffer Unit 34,35. Buffer Unit 34,35 is arranged at least a portion of the 4th sub-housing 323, in the present embodiment, two Buffer Units 34 are arranged at the bent angle K in two relative side S2 of the 4th sub-housing 323 and four corners respectively, and another Buffer Unit 35 is arranged at the front side edge S3 of the 4th sub-housing 323.These places all are that display unit 32 is vulnerable to the part of outside destroy when dropping or being impacted, and can reduce the impact of external force for display floater 321 so Buffer Unit 34,35 is set.
The person of noting, be arranged at the Buffer Unit 35 of the 4th sub-housing 323 front side edge S3, its buffer part 352 only coats the two ends of joint portion 351, so is 351 to have coated the middle part C with antenna module for fear of the joint portion, and then influences the reception effect of whole electronic installation 3 (as Fig. 4 C).At last, see also shown in Fig. 4 C, it finishes schematic diagram for first sub-housing 312, second sub-housing the 313, the 3rd sub-housing 322 of the electronic installation 3 of present embodiment and the 4th sub-housing 323 combine with Buffer Unit 33,34 and 35.
Moreover electronic installation 2,3 does not also exceed with PDA or notebook computer, and different electronic installations is according to identical crashproof anti-demand of falling, and also can utilize the Buffer Unit set-up mode with the identical material of the present invention, and the shape of Buffer Unit then can change voluntarily certainly.
In sum, a kind of electronic installation of the present invention can have the Buffer Unit of shock-absorbing and absorption impact in metal shell side and/or corner by setting, when electronic installation is clashed into or when eminence drops, can absorb impact by Buffer Unit, avoid electronic installation to produce and damage.In addition; the present invention more utilizes high impact plastic material to protect electronic installation; see through the method for double-material jet formation, make metal shell and plastic material carry out heat and fuse and close, avoid the situation generation that is difficult for mutually combining and comes off easily because of unlike material between Buffer Unit and metal shell whereby.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.

Claims (11)

1. an electronic installation is characterized in that, comprises:
One body unit, have one first sub-housing, one second sub-housing and a main frame, the above-mentioned first sub-housing and the above-mentioned second sub-housing coat above-mentioned main frame, and the above-mentioned first sub-housing or the above-mentioned second sub-housing are a metal shell, and above-mentioned metal shell has most holes; And
At least one Buffer Unit, be arranged at least a portion of above-mentioned metal shell, above-mentioned Buffer Unit has a joint portion and a buffer part, above-mentioned binding site is between above-mentioned buffer part and above-mentioned metal shell, the part of above-mentioned joint portion is passed above-mentioned these holes and is fused with above-mentioned metal-back body heat and closes, and wherein above-mentioned joint portion and above-mentioned buffer part are double-material jet formation.
2. electronic installation according to claim 1 is characterized in that, wherein the material of above-mentioned metal shell is an almag.
3. electronic installation according to claim 1 is characterized in that wherein the material of above-mentioned joint portion is selected from the group that acrylonitrile-butadiene-styrene copolymer and Merlon constitute.
4. electronic installation according to claim 1 is characterized in that, wherein the material of above-mentioned buffer part is thermoplastics type's elastomer.
5. electronic installation according to claim 4 is characterized in that, wherein above-mentioned thermoplastics type's elastomer is thermoplastics type's rubber or thermoplastics type's polyurethane.
6. an electronic installation is characterized in that, comprises:
One body unit has one first sub-housing, one second sub-housing and a main frame, and the above-mentioned first sub-housing and the above-mentioned second sub-housing coat above-mentioned main frame;
One display unit, have one the 3rd sub-housing, one the 4th sub-housing and a display floater, the above-mentioned the 3rd sub-housing and the above-mentioned the 4th sub-housing coat above-mentioned display floater, one of them is a metal shell at least for the above-mentioned first sub-housing, the above-mentioned second sub-housing, the above-mentioned the 3rd sub-housing or the above-mentioned the 4th sub-housing, and above-mentioned metal shell has most holes; And
At least one Buffer Unit, be arranged at least a portion of above-mentioned metal shell, above-mentioned Buffer Unit has a joint portion and a buffer part, above-mentioned binding site is between above-mentioned buffer part and above-mentioned metal shell, the part of above-mentioned joint portion is passed above-mentioned these holes and is fused with above-mentioned metal-back body heat and closes, and wherein above-mentioned joint portion and above-mentioned buffer part are double-material jet formation.
7. electronic installation according to claim 6 is characterized in that, wherein the material of above-mentioned metal shell is an almag.
8. electronic installation according to claim 6 is characterized in that wherein the material of above-mentioned joint portion is selected from the group that acrylonitrile-butadiene-styrene copolymer and Merlon constitute.
9. electronic installation according to claim 6 is characterized in that, wherein the material of above-mentioned buffer part is thermoplastics type's elastomer.
10. electronic installation according to claim 9 is characterized in that, wherein above-mentioned thermoplastics type's elastomer is thermoplastics type's rubber or thermoplastics type's polyurethane.
11. electronic installation according to claim 6 is characterized in that, wherein when above-mentioned electronic installation was closed, the above-mentioned second sub-housing and the above-mentioned the 3rd sub-housing were superimposed with each other.
CN2007101427358A 2007-08-17 2007-08-17 Electronic device Active CN101370365B (en)

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Application Number Priority Date Filing Date Title
CN2007101427358A CN101370365B (en) 2007-08-17 2007-08-17 Electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2007101427358A CN101370365B (en) 2007-08-17 2007-08-17 Electronic device

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Publication Number Publication Date
CN101370365A CN101370365A (en) 2009-02-18
CN101370365B true CN101370365B (en) 2011-01-19

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102905484A (en) * 2011-07-28 2013-01-30 英业达股份有限公司 Portable electronic device enclosure
CN103429016B (en) * 2012-05-14 2016-08-17 联想(北京)有限公司 A kind of casting of electronic device and apply the casing of this housing, electronic equipment

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0570138A2 (en) * 1992-05-12 1993-11-18 International Business Machines Corporation Portable disk storage apparatus
CN2419750Y (en) * 2000-02-28 2001-02-14 张智 Mobile communication equipment with elastic deforming soft casing
CN1902564A (en) * 2004-01-07 2007-01-24 陶氏环球技术公司 Impact-resistant case with sealable opening

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0570138A2 (en) * 1992-05-12 1993-11-18 International Business Machines Corporation Portable disk storage apparatus
CN2419750Y (en) * 2000-02-28 2001-02-14 张智 Mobile communication equipment with elastic deforming soft casing
CN1902564A (en) * 2004-01-07 2007-01-24 陶氏环球技术公司 Impact-resistant case with sealable opening

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