CN101368075B - Electrical insulation compound adhesive for high voltage electrical apparatus - Google Patents
Electrical insulation compound adhesive for high voltage electrical apparatus Download PDFInfo
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- CN101368075B CN101368075B CN2008100461479A CN200810046147A CN101368075B CN 101368075 B CN101368075 B CN 101368075B CN 2008100461479 A CN2008100461479 A CN 2008100461479A CN 200810046147 A CN200810046147 A CN 200810046147A CN 101368075 B CN101368075 B CN 101368075B
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- voltage electrical
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- electrical apparatus
- high voltage
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- 230000001070 adhesive effect Effects 0.000 title claims abstract description 23
- 239000000853 adhesive Substances 0.000 title claims abstract description 21
- 150000001875 compounds Chemical class 0.000 title claims description 16
- 238000010292 electrical insulation Methods 0.000 title claims description 14
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims abstract description 45
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims abstract description 30
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 claims abstract description 29
- 239000000843 powder Substances 0.000 claims abstract description 19
- 239000010445 mica Substances 0.000 claims abstract description 16
- 229910052618 mica group Inorganic materials 0.000 claims abstract description 16
- WSFQLUVWDKCYSW-UHFFFAOYSA-M sodium;2-hydroxy-3-morpholin-4-ylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CC(O)CN1CCOCC1 WSFQLUVWDKCYSW-UHFFFAOYSA-M 0.000 claims abstract description 15
- 235000010299 hexamethylene tetramine Nutrition 0.000 claims abstract description 14
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229920005989 resin Polymers 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 17
- GIUBHMDTOCBOPA-UHFFFAOYSA-N 3h-1,3-benzothiazole-2-thione;zinc Chemical compound [Zn].C1=CC=C2SC(S)=NC2=C1 GIUBHMDTOCBOPA-UHFFFAOYSA-N 0.000 claims description 15
- 239000004593 Epoxy Substances 0.000 claims description 15
- 229920000459 Nitrile rubber Polymers 0.000 claims description 15
- 229920003987 resole Polymers 0.000 claims description 15
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 13
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 13
- 239000004312 hexamethylene tetramine Substances 0.000 claims description 13
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 abstract description 11
- 239000002184 metal Substances 0.000 abstract description 11
- 230000032683 aging Effects 0.000 abstract description 5
- 239000004816 latex Substances 0.000 abstract description 3
- 229920000126 latex Polymers 0.000 abstract description 3
- 239000003822 epoxy resin Substances 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 229920000647 polyepoxide Polymers 0.000 abstract description 2
- 239000000126 substance Substances 0.000 abstract description 2
- 229920001342 Bakelite® Polymers 0.000 abstract 1
- 239000004637 bakelite Substances 0.000 abstract 1
- 229960004011 methenamine Drugs 0.000 abstract 1
- 150000002825 nitriles Chemical class 0.000 abstract 1
- PGNWIWKMXVDXHP-UHFFFAOYSA-L zinc;1,3-benzothiazole-2-thiolate Chemical compound [Zn+2].C1=CC=C2SC([S-])=NC2=C1.C1=CC=C2SC([S-])=NC2=C1 PGNWIWKMXVDXHP-UHFFFAOYSA-L 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 description 12
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- -1 phenol aldehyde Chemical class 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 238000010008 shearing Methods 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- RSWGJHLUYNHPMX-ONCXSQPRSA-N abietic acid Chemical compound C([C@@H]12)CC(C(C)C)=CC1=CC[C@@H]1[C@]2(C)CCC[C@@]1(C)C(O)=O RSWGJHLUYNHPMX-ONCXSQPRSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- MNAHQWDCXOHBHK-UHFFFAOYSA-N 1-phenylpropane-1,1-diol Chemical group CCC(O)(O)C1=CC=CC=C1 MNAHQWDCXOHBHK-UHFFFAOYSA-N 0.000 description 1
- LRWZZZWJMFNZIK-UHFFFAOYSA-N 2-chloro-3-methyloxirane Chemical compound CC1OC1Cl LRWZZZWJMFNZIK-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- NDTNEAIKTSZYCF-XWNHBAMRSA-N [(1R,4aR,4bR,10aR)-1,4a-dimethyl-7-propan-2-yl-2,3,4,4b,5,6,10,10a-octahydrophenanthrene-1-carbonyl] (1R,4aR,4bR,10aR)-1,4a-dimethyl-7-propan-2-yl-2,3,4,4b,5,6,10,10a-octahydrophenanthrene-1-carboxylate Chemical compound C([C@@H]1[C@@]2(C)CCC3)CC(C(C)C)=CC1=CC[C@H]2[C@]3(C)C(=O)OC(=O)[C@]1(C)CCC[C@@]2(C)[C@H]1CC=C1C=C(C(C)C)CC[C@@H]12 NDTNEAIKTSZYCF-XWNHBAMRSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 1
- 239000003502 gasoline Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000010687 lubricating oil Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229910052628 phlogopite Inorganic materials 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 235000013824 polyphenols Nutrition 0.000 description 1
- 239000013535 sea water Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention provides a high-voltage electrical apparatus insulated adhesive, which comprises the following components by weight portion: 150 to 160 portions of bakelite, 30 to 40 portions of epoxide resin, 10 to 12 portions of methenamine, 100 to 110 portions of nitrile latex, 5 to 8 portions of 2-mercaptobenzothiazole zinc salt, 2 to 4 portions of accelerant PX, 2 to 4 portions of zinc naphthenate, 30 to 35 portions of colophony, 200 to 220 portions of benzene, 100 to 120 portions of acetone, 20 to 22 portions of toluene diisocyanate, and 50 to 80 portions of mica powder. The high-voltage electrical apparatus insulated adhesive has excellent bonding properties, ageing resistance and chemical mediator resistance as well as excellent insulating properties, which is applicable for bonding metal units, and in particular applicable for manufacturing of high-voltage electrical apparatuses and equipment.
Description
Technical field
The present invention relates to tackiness agent, the thermosetting adhesive of, good heat resistance bonding, good insulating especially for High-Voltage Electrical Appliances.
Background technology
Phenol formaldehyde tackifier is the tackiness agent with resol (adopting phenol and formaldehyde reaction to make) main component.Because it can form thermoplastic resin or thermosetting resin reaction conditions difference (containing the auxiliary agent difference).Modified phenolic adhesive has cost lower (being lower than epoxy adhesive), resistance toheat characteristics preferably, but has brittle shortcoming.And for high-voltage electrical equipment, its operating ambient temperature height, severe corrosive, insulation level requires high.The performance index of existing modified phenolic adhesive still can not satisfy above-mentioned requirements, exist bonding strength, toughness and ageing-resistant performance aspect to remain the problem that further improves for bonding between the metal not of the same race, between metal and the plastics.
Summary of the invention
The purpose of this invention is to provide a kind of electrical insulation compound adhesive for high voltage electrical apparatus, be intended to the resistance toheat strengthening its toughness, bond strength and ageing-resistant performance and further improve tackiness agent, can be applicable to that especially various High-Voltage Electrical Appliances are bonding.
The object of the present invention is achieved like this: a kind of electrical insulation compound adhesive for high voltage electrical apparatus, form by weight by following component:
Resol 150～160, Resins, epoxy 30～40, hexamethylenetetramine 10～12, nitrile rubber 100～110, zinc 2-mercaptobenzothiazole salt 5～8, promotor PX 2～4, zinc naphthenate 2～4, rosin 30～35, benzene 200～220, acetone 100～120, tolylene diisocyanate 20～22, mica powder 50～80.
Has the better heat-resisting performance at existing phenol aldehyde adhesive, but there is weakness more crisp, loss of properties on aging, the present invention adopts resol (to react under an acidic catalyst condition with xylenol and formaldehyde, xylenol mol consumption surpasses the mol consumption of formaldehyde), mixes with Resins, epoxy (adding Resins, epoxy), add hexamethylenetetramine (be urotropine, as solidifying agent) again and the generation heat-reactive phenolic resin to improve thermotolerance and the insulating property and the snappiness of tackiness agent; Simultaneously, add rosin (contain the unsaturated compound of sylvic acid and abietic anhydride, activity is bigger), to improve its adhesiveproperties; Zinc 2-mercaptobenzothiazole salt (C
14H
8N
2S
4Z
nBe dissolved in organic solvents such as acetone, benzene), promotor PX (N, N '-diethyl phenylbenzene zinc dithiocarbamate, C
18H
20N
2S
4Z
n) be tackifier, add in the latex and play anti-aging effect, can improve the adhesiveproperties of tackiness agent metal greatly, zinc naphthenate (Zinc naphthenate) can prevent the oxidation corrosion of metal parts effectively mainly as the rust inhibitor of metal products.Mica powder 300 orders are preferably selected white mica or phlogopite for use, can further improve resistance toheat, acid-proof alkaline and the electrical apparatus insulation performance of modified phenolic adhesive).
The performance index of tackiness agent of the present invention are as follows after tested:
1, the bonding strength of metal (aluminium alloy) under the differing temps
Temperature (℃)-30 20 100 150 200
Shearing resistance (MPa) 〉=20 〉=30 〉=12 〉=10 〉=8
2, to the bonding stripping strength 70～80KN/M of aluminium alloy;
3, heat aging performance: 200 ℃, shearing resistance is 8～10Mpa (MPa) after 400 hours.
4, chemical mediator-resitant property: soaked 1 month in gasoline, ethanol, lubricating oil, seawater, performance is constant.
This tackiness agent be widely used between the different metal or metal and plastics between bonding, be specially adapted to the bonding making of the electrical equipment of 100～150 ℃ of working temperatures, insulation level F level.
Embodiment
This tackiness agent (together following) by weight is composed as follows: resol 150～160, Resins, epoxy 30～40, hexamethylenetetramine 10～12, nitrile rubber 100～110, zinc 2-mercaptobenzothiazole salt 5～8, promotor PX 2～4, zinc naphthenate 2～4, rosin 30～35, benzene 200～220, acetone 100～120, tolylene diisocyanate 20～22, mica powder 50～80.
Embodiment 1:
The electrical insulation compound adhesive for high voltage electrical apparatus component is composed as follows:
Resol 150, Resins, epoxy 35, hexamethylenetetramine 10, nitrile rubber 100, zinc 2-mercaptobenzothiazole salt 6, promotor PX 3, zinc naphthenate 3, rosin 30, benzene 200, acetone 100, tolylene diisocyanate 20, mica powder 60.
Embodiment 2:
The electrical insulation compound adhesive for high voltage electrical apparatus component is composed as follows:
Resol 160, Resins, epoxy 40, hexamethylenetetramine 12, nitrile rubber 110, zinc 2-mercaptobenzothiazole salt 6, promotor PX 3, zinc naphthenate 3, rosin 30, benzene 200, acetone 100, tolylene diisocyanate 20, mica powder 60.
Embodiment 3:
The electrical insulation compound adhesive for high voltage electrical apparatus component is composed as follows:
Resol 160, Resins, epoxy 30, hexamethylenetetramine 12, nitrile rubber 110, zinc 2-mercaptobenzothiazole salt 8, promotor PX 4, zinc naphthenate 4, rosin 35, benzene 220, acetone 120, tolylene diisocyanate 22, mica powder 80.
Embodiment 4:
The electrical insulation compound adhesive for high voltage electrical apparatus component is composed as follows:
Resol 150, Resins, epoxy 38, hexamethylenetetramine 10, nitrile rubber 100, zinc 2-mercaptobenzothiazole salt 6, promotor PX 3, zinc naphthenate 3, rosin 30, benzene 200, acetone 100, tolylene diisocyanate 20, mica powder 60.
Embodiment 5:
The electrical insulation compound adhesive for high voltage electrical apparatus component is composed as follows:
Resol 160, Resins, epoxy 34, hexamethylenetetramine 12, nitrile rubber 110, zinc 2-mercaptobenzothiazole salt 6, promotor PX 3, zinc naphthenate 3, rosin 30, benzene 200, acetone 100, tolylene diisocyanate 20, mica powder 60.
Embodiment 6:
The electrical insulation compound adhesive for high voltage electrical apparatus component is composed as follows:
Resol 160, Resins, epoxy 32, hexamethylenetetramine 12, nitrile rubber 110, zinc 2-mercaptobenzothiazole salt 8, promotor PX 4, zinc naphthenate 4, rosin 35, benzene 220, acetone 120, tolylene diisocyanate 22, mica powder 80.
In the said components, nitrile rubber (acrylonitrile content 25～35%) is for being 30% in acrylonitrile content, with the oil-proofness (the high corresponding oil-proofness of acrylonitrile content is better) that improves tackiness agent.
All can not adopt epoxy resin ingredient (preparation method does not change) in the foregoing description 1～6 prescription, the corresponding reduction about 5～10% of the shearing resistance of its corresponding tackiness agent, simultaneously, material cost decreases.The all available butadiene latex of nitrile rubber in the foregoing description 1～6 prescription replaces (preparation method does not change).
Compound method:
1, resol (pressed powder), Resins, epoxy (general name that contains the resin of epoxide group, mainly by epoxy chloropropane and Polyphenols as, polycondensations such as dihydroxyphenyl propane form.The high-molecular weight pressed powder), colophonium powder (fineness 100 orders), mica powder, urotropine (white crystalline powder) join in the mixed solvent of benzene and acetone, mix stand-by, as the A component;
2, zinc 2-mercaptobenzothiazole salt (Zinc2-mercaptobenzothiazole), promotor PX and tolylene diisocyanate (liquid) are joined in the nitrile rubber as the B component;
3, above-mentioned A, B component are added mixing together one-tenth glue.
Using method: after applying glue is bonding, solidifying pressure 0.1～0.2Mpa, 20 ℃ of solidification values, 24 hours set times.
High-Voltage Electrical Appliances such as high-power transformer are in the welding machine application scenario, because the working temperature height, heat dissipation problem is a major issue.Tackiness agent of the present invention can be suitable for the manufacturing of this class high-power transformer.
The present invention is widely used between the metal, bonding between metal and the plastics, is specially adapted to high-voltage electrical equipment, as the making of equipment such as high-tension transformer, primary cut-out, high-tension current transmitter, voltage disconnect.
Claims (4)
1. electrical insulation compound adhesive for high voltage electrical apparatus is characterized in that: be made up of by weight following component:
Resol 150～160, Resins, epoxy 30～40, hexamethylenetetramine 10～12, nitrile rubber 100～110, zinc 2-mercaptobenzothiazole salt 5～8, promotor PX 2～4, zinc naphthenate 2～4, rosin 30～35, benzene 200～220, acetone 100～120, tolylene diisocyanate 20～22, mica powder 50～80.
2. according to the described electrical insulation compound adhesive for high voltage electrical apparatus of claim 1, it is characterized in that: described component is composed as follows:
Resol 150, Resins, epoxy 35, hexamethylenetetramine 10, nitrile rubber 100, zinc 2-mercaptobenzothiazole salt 6, promotor PX 3, zinc naphthenate 3, rosin 30, benzene 200, acetone 100, tolylene diisocyanate 20, mica powder 60.
3. according to the described electrical insulation compound adhesive for high voltage electrical apparatus of claim 1, it is characterized in that: described component is composed as follows:
Resol 160, Resins, epoxy 30, hexamethylenetetramine 12, nitrile rubber 110, zinc 2-mercaptobenzothiazole salt 8, promotor PX 4, zinc naphthenate 4, rosin 35, benzene 220, acetone 120, tolylene diisocyanate 22, mica powder 80.
4. according to the described electrical insulation compound adhesive for high voltage electrical apparatus of claim 1, it is characterized in that: described component is composed as follows:
Resol 150, Resins, epoxy 38, hexamethylenetetramine 10, nitrile rubber 100, zinc 2-mercaptobenzothiazole salt 6, promotor PX 3, zinc naphthenate 3, rosin 30, benzene 200, acetone 100, tolylene diisocyanate 20, mica powder 60.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100461479A CN101368075B (en) | 2008-09-24 | 2008-09-24 | Electrical insulation compound adhesive for high voltage electrical apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100461479A CN101368075B (en) | 2008-09-24 | 2008-09-24 | Electrical insulation compound adhesive for high voltage electrical apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101368075A CN101368075A (en) | 2009-02-18 |
| CN101368075B true CN101368075B (en) | 2011-12-28 |
Family
ID=40412075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008100461479A Active CN101368075B (en) | 2008-09-24 | 2008-09-24 | Electrical insulation compound adhesive for high voltage electrical apparatus |
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| CN (1) | CN101368075B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107011839B (en) * | 2016-01-28 | 2020-09-15 | 北京保利世达科技有限公司 | Liquid wax and preparation method thereof |
| CN106543943A (en) * | 2016-10-28 | 2017-03-29 | 无锡市永兴金属软管有限公司 | A kind of conducting metal ripple pipe binder being modified based on trivalent chromic ion and preparation method thereof |
| TWI621675B (en) * | 2016-12-21 | 2018-04-21 | Adhesive composition, treated fabric and composite laminate | |
| CN107227133A (en) * | 2017-06-01 | 2017-10-03 | 合肥尚强电气科技有限公司 | A kind of High-Voltage Electrical Appliances Heat Conductive Insulation Adhesive and preparation method thereof |
| CN108641643A (en) * | 2018-04-28 | 2018-10-12 | 安徽富煌门窗幕墙有限公司 | A kind of impervious aluminium alloy adhesive of anticorrosion and preparation method thereof |
| CN109181626A (en) * | 2018-09-28 | 2019-01-11 | 黄旭东 | A kind of cell sealant |
| CN110510624A (en) * | 2019-08-30 | 2019-11-29 | 徐州金亚粉体有限责任公司 | A kind of high temperature resistant mica powder manufacturing process |
| CN111763489A (en) * | 2020-05-29 | 2020-10-13 | 安徽老石人石业有限公司 | High-strength adhesive for compounding natural granite marble and various artificial materials |
| CN114196358A (en) * | 2021-12-24 | 2022-03-18 | 山东工业陶瓷研究设计院有限公司 | Epoxy resin binder and preparation method and application thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3451537A (en) * | 1966-02-28 | 1969-06-24 | Minnesota Mining & Mfg | Pressure-sensitive adhesive tape |
| CN1170748A (en) * | 1996-07-12 | 1998-01-21 | 王蒲剑 | High-grade heat-resistant and fire-retardant resin glue for encapsulation and impregnation |
| CN1322789A (en) * | 2001-05-16 | 2001-11-21 | 北京建筑工程学院 | Organic adhesive |
-
2008
- 2008-09-24 CN CN2008100461479A patent/CN101368075B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3451537A (en) * | 1966-02-28 | 1969-06-24 | Minnesota Mining & Mfg | Pressure-sensitive adhesive tape |
| CN1170748A (en) * | 1996-07-12 | 1998-01-21 | 王蒲剑 | High-grade heat-resistant and fire-retardant resin glue for encapsulation and impregnation |
| CN1322789A (en) * | 2001-05-16 | 2001-11-21 | 北京建筑工程学院 | Organic adhesive |
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| CN101368075A (en) | 2009-02-18 |
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Effective date of registration: 20130118 Address after: Tsing Hua Road Qingyang District of Chengdu City, Sichuan Province, No. 24 610071 Patentee after: Sichuan Electric power Research Institute Patentee after: State Grid Corporation of China Address before: Tsing Hua Road Qingyang District of Chengdu City, Sichuan Province, No. 24 610071 Patentee before: Sichuan Electric power Research Institute |