CN101364454A - Thick-film circuit resistor paste based on aluminum insulation layer and preparation thereof - Google Patents
Thick-film circuit resistor paste based on aluminum insulation layer and preparation thereof Download PDFInfo
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- CN101364454A CN101364454A CNA2008101510769A CN200810151076A CN101364454A CN 101364454 A CN101364454 A CN 101364454A CN A2008101510769 A CNA2008101510769 A CN A2008101510769A CN 200810151076 A CN200810151076 A CN 200810151076A CN 101364454 A CN101364454 A CN 101364454A
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Abstract
The invention relates to thick-film circuit resistance slurry based on an aluminum insulating layer and a preparation method thereof. The resistance slurry comprises a solid-phase component and an organic binder in a ratio of (50-75):(50-25), wherein the ratio of aluminum powder to microcrystalline glass powder in the solid-phase component is (80-55):(20-45). The invention selects microcrystalline glass as the binder, which has an expansion coefficient matching with the aluminum insulating layer and can be well combined with the aluminum insulating layer. The preparation method comprises the following steps: (1) preparing the microcrystalline glass powder; (2) preparing the organic binder; (3) preparing metal powder; and (4) adding the microcrystalline glass powder, the organic binder and the metal powder into a ball milling tank, and ball-milling at a high speed to obtain the slurry. The resistance trace layer made from the resistance slurry has the advantages of low resistance, good compatibility with the aluminum insulating layer, good electrical conductivity, low metal consumption, low energy consumption, no pollution and the like.
Description
Technical field
The present invention relates to thick-film circuit resistor paste of a kind of insulating barrier and preparation method thereof, be specifically related to a kind of thick-film circuit resistor paste based on aluminum insulation layer and preparation method thereof.
Background technology
In the thick film circuit technique field, traditional substrate has ceramic substrate and metal, and the two all has its limitation.Ceramic substrate has Al
2O
3And AIN etc., its size is less, and bad mechanical property, the assembling difficulty.Metal substrate has steel plate and aluminium sheet etc., steel substrate has overcome the little problem of ceramic substrate size, rely on its excellent mechanical intensity and thermal conductivity to obtain very big development simultaneously, and Dongguan Long Ji Co., Ltd at home and the industrialization production of Hunan a company, but because its cost is higher, the aluminium sheet that people begin to attempt with relatively inexpensive replaces steel plate.
The fusing point of aluminium has only 660.37 ℃, this just requires the softening temperature of the devitrified glass in the thick-film circuit resistor paste lower, discovering in recent years, phosphate or borate seal glass can substitute current widely used leaded low-melting point sealing glass, are expected to solve the pollution problem of leaded for a long time low-melting sealing glass to environment.
United States Patent (USP) has been announced a kind of phosphate seal glass P5153151 number, and its mole consists of: Li
2O (0～15%), Na2O (0～20%), K
2O (5～10%), ZnO (0～45%), Ag
2O (0～25%)), Tl
2O (0～25%), PbO (0～20%), CuO (0～5%), CaO (0～20%), SrO (0～20%), P
2O
5(24～36%), Al
2O
3(0～5%), CeO
2(0～2%), BaO (0～20%), SnO (0～5%), Sb
2O
3(0～61%), Bi
2O
3(0～10%), B
2O
3(0～10%), the transition temperature of this glass are 300～340 ℃, and thermal coefficient of expansion is 135～180 * 10
-7/ ℃, the shortcoming of this glass is Tl
2The toxicity of O is very big, and simultaneously, the thermal coefficient of expansion of glass is bigger, can not be used for, low-expansion sealing-in.
Because the coefficient of expansion of metal powder is much larger than aluminum insulation layer, therefore the resistor track layer after burning till based on the thick-film resistor paste of aluminum insulation layer should have the less coefficient of expansion to be complementary with aluminum insulation layer, and the glassy phase in the slurry also should be compatible with the solid phase composition chemistry in the aluminum insulation layer simultaneously.
Summary of the invention
The present invention is based on the problem that prior art exists, and provides that a kind of resistance is low, printing is good, and it is good to burn till characteristic, and can with aluminum insulation layer be complementary based on thick-film circuit resistor paste of aluminum insulation layer and preparation method thereof.
For achieving the above object, resistance slurry of the present invention comprises: by the solid phase composition: microcrystalline glass powder, Fine Aluminum Powder and organic binder bond are formed, the weight ratio of solid phase composition and organic binder bond is 50～75:50～25, and wherein the weight ratio of Fine Aluminum Powder and microcrystalline glass powder is 80～55:20～45 in the solid phase composition;
Said microcrystalline glass powder is P
2O
5～ZnO～K
2O～B
2O
3～SnO
2Be low-melting point leadless crystallizing glass, contain by weight: 35～55% P
2O
5, 35～50% ZnO, 5～10% K
2O, 0～10% B
2O
3, 0～10% SnO
2, 0～5% SiO
2, 0～2% Li
2O, 2～5% Al
2O
3With 0～1.5% CuO;
It is the Fine Aluminum Powder of 3～7 μ m that said aluminum metal powder adopts granularity;
Said machine binding agent contains by weight: 75～98% terpinol, 0～15% citric acid tri butyl ester, 0.5～5% ethyl cellulose, 0～2% NC Nitroncellulose, 0.1～5% rilanit special and 0.1～5% lecithin.
Preparation method of the present invention is:
1) preparation of microcrystalline glass powder
By weight percentage with 35～55% P
2O
5, 35～50% ZnO, 5～10% K
2O, 0～10% B
2O
3, 0～10% SnO
2, 0～5% SiO
2, 0～2% Li
2O, 2～5% Al
2O
3Mix in batch mixer with 0～1.5% CuO and to be placed on melting in the high temperature resistance furnace; Smelting temperature is 800～1200 ℃, is incubated 1～5 hour, and shrend then obtains the glass slag; Place the planetary ball mill ball milling to obtain particle diameter in 3～5 hours glass slag drying less than 5 microns microcrystalline glass powder;
2) preparation of aluminium powder
Earlier with the metallic aluminium fusion, when treating that the fusion metal is superheated to 200～300 ℃ in the high speed disc atomizer in full hermetic container, and to adopt cooldown rate under inert gas protection be that the chilling atomising device of 105～107K/s carries out powder by atomization, the aluminium powder of the atomizing pipeline of portion by the inert gas shielding spray column that is delivered to cyclone separator and secondary band screen pack from container carries out gas solid separation, and drying obtains the Fine Aluminum Powder that particle mean size is 3～7 μ m;
3) preparation of organic binder bond
By weight with the lecithin of 75～98% terpinol, 0～15% citric acid tri butyl ester, 0.5～5% ethyl cellulose, 0～2% NC Nitroncellulose, 0.1～5% rilanit special and 0.1～5% 50～100 ℃ of dissolvings;
4) pulp preparation
Place ball grinder with 1200 commentaries on classics/min microcrystalline glass powder, organic binder bond and metallic aluminium powder, ball milling obtained resistance slurry in 3 hours, solid phase composition wherein: the weight ratio of microcrystalline glass powder, Fine Aluminum Powder and organic binder bond is 50～75:50～25, and the weight ratio of Fine Aluminum Powder and microcrystalline glass powder is 80～55:20～45 in the solid phase composition.
The present invention selects P for use
2O
5～ZnO～K
2O～B
2O
3～SnO
2Be low-melting point leadless crystallizing glass as the bonding phase, by to P
2O
5～ZnO～K
2O～B
2O
3～SnO
2The adjusting of the microcrystalline glass in series coefficient of expansion, vitrification point, softening temperature makes it the coefficient of expansion with the thick-film resistor track layer of aluminium powder, the compound formation of organic solvent and mates with aluminum insulation layer and have a good binding performance; Select for use multicomponent alcohols main solvent to replace one pack system alcohols main solvent, make slurry that in various degree volatilization all be arranged in process such as print, dry, burn till the preparation of the main solvent of different evaporation rates and boiling point, avoided solvent to concentrate defectives such as the volatilization appearance is dry and cracked, pin hole; This resistance slurry printing characteristic is good, burn till characteristic good, thus the resistance track of invention resistance slurry preparation has that resistance is low, compatible with the aluminum insulation layer material, conductivity well and the heating efficiency advantages of higher.
Embodiment
Embodiment 1:1) preparation of microcrystalline glass powder: by weight percentage with 40% P
2O
5, 38% ZnO, 7% K
2O, 2% B
2O
3, 3% SnO
2, 5% SiO
2, 1% Li
2O, 3% Al
2O
3Mix in batch mixer with 1% CuO and to be placed on melting in the high temperature resistance furnace; Smelting temperature is 800 ℃, is incubated 5 hours, and shrend then obtains the glass slag; Place the planetary ball mill ball milling to obtain particle diameter in 3 hours glass slag drying less than 5 microns microcrystalline glass powder;
2) preparation of aluminium powder: earlier with the metallic aluminium fusion, when treating that the fusion metal is superheated to 200 ℃ in the high speed disc atomizer in full hermetic container, and to adopt cooldown rate under inert gas protection be that the chilling atomising device of 105K/s carries out powder by atomization, the aluminium powder of the atomizing pipeline of portion by the inert gas shielding spray column that is delivered to cyclone separator and secondary band screen pack from container carries out gas solid separation, and drying obtains the Fine Aluminum Powder that particle mean size is 3～7 μ m;
3) preparation of organic binder bond: by weight with the lecithin of 75% terpinol, 15% citric acid tri butyl ester, 5% ethyl cellulose, 2% NC Nitroncellulose, 1% rilanit special and 2% 70 ℃ of dissolvings;
4) pulp preparation: place ball grinder with 1200 commentaries on classics/min microcrystalline glass powder, organic binder bond and metallic aluminium powder, ball milling obtained resistance slurry in 3 hours, solid phase composition wherein: the weight ratio of microcrystalline glass powder, Fine Aluminum Powder and organic binder bond is 50:50, and the weight ratio of Fine Aluminum Powder and microcrystalline glass powder is 80:20 in the solid phase composition.
Embodiment 2:1) preparation of microcrystalline glass powder: by weight percentage with 35% P
2O
5, 50% ZnO, 5% K
2O, 3% B
2O
3, 2% SnO
2With 5% Al
2O
3Be placed on melting in the high temperature resistance furnace with in batch mixer, mixing; Smelting temperature is 1000 ℃, is incubated 3 hours, and shrend then obtains the glass slag; Place the planetary ball mill ball milling to obtain particle diameter in 5 hours glass slag drying less than 5 microns microcrystalline glass powder;
2) preparation of aluminium powder: earlier with the metallic aluminium fusion, when treating that the fusion metal is superheated to 250 ℃ in the high speed disc atomizer in full hermetic container, and to adopt cooldown rate under inert gas protection be that the chilling atomising device of 106K/s carries out powder by atomization, the aluminium powder of the atomizing pipeline of portion by the inert gas shielding spray column that is delivered to cyclone separator and secondary band screen pack from container carries out gas solid separation, and drying obtains the Fine Aluminum Powder that particle mean size is 3～7 μ m;
3) preparation of organic binder bond: by weight with the lecithin of 98% terpinol, 0.5% ethyl cellulose, 0.8% NC Nitroncellulose, 0.6% rilanit special and 0.1% 90 ℃ of dissolvings;
4) pulp preparation: place ball grinder with 1200 commentaries on classics/min microcrystalline glass powder, organic binder bond and metallic aluminium powder, ball milling obtained resistance slurry in 3 hours, solid phase composition wherein: the weight ratio of microcrystalline glass powder, Fine Aluminum Powder and organic binder bond is 75:25, and the weight ratio of Fine Aluminum Powder and microcrystalline glass powder is 55:45 in the solid phase composition.
Embodiment 3:1) preparation of microcrystalline glass powder: by weight percentage with 55% P
2O
5, 35% ZnO, 6% K
2O, 1% SiO
2, 2% Al
2O
3Mix in batch mixer with 1% CuO and to be placed on melting in the high temperature resistance furnace; Smelting temperature is 1200 ℃, is incubated 1 hour, and shrend then obtains the glass slag; Place the planetary ball mill ball milling to obtain particle diameter in 4 hours glass slag drying less than 5 microns microcrystalline glass powder;
2) preparation of aluminium powder: earlier with the metallic aluminium fusion, when treating that the fusion metal is superheated to 300 ℃ in the high speed disc atomizer in full hermetic container, and to adopt cooldown rate under inert gas protection be that the chilling atomising device of 107K/s carries out powder by atomization, the aluminium powder of the atomizing pipeline of portion by the inert gas shielding spray column that is delivered to cyclone separator and secondary band screen pack from container carries out gas solid separation, and drying obtains the Fine Aluminum Powder that particle mean size is 3～7 μ m;
3) preparation of organic binder bond: by weight with the lecithin of 80% terpinol, 10% citric acid tri butyl ester, 3% ethyl cellulose, 1% NC Nitroncellulose, 2% rilanit special and 4% 60 ℃ of dissolvings;
4) pulp preparation: place ball grinder with 1200 commentaries on classics/min microcrystalline glass powder, organic binder bond and metallic aluminium powder, ball milling obtained resistance slurry in 3 hours, solid phase composition wherein: the weight ratio of microcrystalline glass powder, Fine Aluminum Powder and organic binder bond is 60:40, and the weight ratio of Fine Aluminum Powder and microcrystalline glass powder is 70:30 in the solid phase composition.
Embodiment 4:1) preparation of microcrystalline glass powder: by weight percentage with 36% P
2O
5, 38% ZnO, 10% K
2O, 1% B
2O
3, 5% SnO
2, 3% SiO
2, 1.5% Li
2O, 4% Al
2O
3Mix in batch mixer with 1.5% CuO and to be placed on melting in the high temperature resistance furnace; Smelting temperature is 900 ℃, is incubated 4 hours, and shrend then obtains the glass slag; Place the planetary ball mill ball milling to obtain particle diameter in 3.5 hours glass slag drying less than 5 microns microcrystalline glass powder;
2) preparation of aluminium powder: earlier with the metallic aluminium fusion, when treating that the fusion metal is superheated to 280 ℃ in the high speed disc atomizer in full hermetic container, and to adopt cooldown rate under inert gas protection be that the chilling atomising device of 106K/s carries out powder by atomization, the aluminium powder of the atomizing pipeline of portion by the inert gas shielding spray column that is delivered to cyclone separator and secondary band screen pack from container carries out gas solid separation, and drying obtains the Fine Aluminum Powder that particle mean size is 3～7 μ m;
3) preparation of organic binder bond: by weight with the lecithin of 90% terpinol, 5% citric acid tri butyl ester, 1% ethyl cellulose, 0.5% NC Nitroncellulose, 2.5% rilanit special and 1% 70,90,60,80,50,100,85,75 ℃ of dissolvings;
4) pulp preparation: place ball grinder with 1200 commentaries on classics/min microcrystalline glass powder, organic binder bond and metallic aluminium powder, ball milling obtained resistance slurry in 3 hours, solid phase composition wherein: the weight ratio of microcrystalline glass powder, Fine Aluminum Powder and organic binder bond is 55:45, and the weight ratio of Fine Aluminum Powder and microcrystalline glass powder is 60:40 in the solid phase composition.
Embodiment 5:1) preparation of microcrystalline glass powder: by weight percentage with 38% P
2O
5, 35% ZnO, 8% K
2O, 10% B
2O
3, 2.5% SnO
2, 2% SiO
2, 2% Li
2O, 2% Al
2O
3Mix in batch mixer with 0.5% CuO and to be placed on melting in the high temperature resistance furnace; Smelting temperature is 1100 ℃, is incubated 2 hours, and shrend then obtains the glass slag; Place the planetary ball mill ball milling to obtain particle diameter in 3.8 hours glass slag drying less than 5 microns microcrystalline glass powder;
2) preparation of aluminium powder: earlier with the metallic aluminium fusion, when treating that the fusion metal is superheated to 220 ℃ in the high speed disc atomizer in full hermetic container, and to adopt cooldown rate under inert gas protection be that the chilling atomising device of 105K/s carries out powder by atomization, the aluminium powder of the atomizing pipeline of portion by the inert gas shielding spray column that is delivered to cyclone separator and secondary band screen pack from container carries out gas solid separation, and drying obtains the Fine Aluminum Powder that particle mean size is 3～7 μ m;
3) preparation of organic binder bond: by weight with the lecithin of 74% terpinol, 12% citric acid tri butyl ester, 4.5% ethyl cellulose, 1.5% NC Nitroncellulose, 3% rilanit special and 5% 50 ℃ of dissolvings;
4) pulp preparation: place ball grinder with 1200 commentaries on classics/min microcrystalline glass powder, organic binder bond and metallic aluminium powder, ball milling obtained resistance slurry in 3 hours, solid phase composition wherein: the weight ratio of microcrystalline glass powder, Fine Aluminum Powder and organic binder bond is 70:30, and the weight ratio of Fine Aluminum Powder and microcrystalline glass powder is 75:25 in the solid phase composition.
Embodiment 6:1) preparation of microcrystalline glass powder: by weight percentage with 36% P
2O
5, 36% ZnO, 5% K
2O, 5% B
2O
3, 10% SnO
2, 4% SiO
2, 0.5% Li
2O, 2.8% Al
2O
3Mix in batch mixer with 0.7% CuO and to be placed on melting in the high temperature resistance furnace; Smelting temperature is 850 ℃, is incubated 4.5 hours, and shrend then obtains the glass slag; Place the planetary ball mill ball milling to obtain particle diameter in 4.2 hours glass slag drying less than 5 microns microcrystalline glass powder;
2) preparation of aluminium powder: earlier with the metallic aluminium fusion, when treating that the fusion metal is superheated to 240 ℃ in the high speed disc atomizer in full hermetic container, and to adopt cooldown rate under inert gas protection be that the chilling atomising device of 107K/s carries out powder by atomization, the aluminium powder of the atomizing pipeline of portion by the inert gas shielding spray column that is delivered to cyclone separator and secondary band screen pack from container carries out gas solid separation, and drying obtains the Fine Aluminum Powder that particle mean size is 3～7 μ m;
3) preparation of organic binder bond: by weight with the lecithin of 84.9% terpinol, 8% citric acid tri butyl ester, 4% ethyl cellulose, 0.1% rilanit special and 3% 100 ℃ of dissolvings;
4) pulp preparation: place ball grinder with 1200 commentaries on classics/min microcrystalline glass powder, organic binder bond and metallic aluminium powder, ball milling obtained resistance slurry in 3 hours, solid phase composition wherein: the weight ratio of microcrystalline glass powder, Fine Aluminum Powder and organic binder bond is 65:35, and the weight ratio of Fine Aluminum Powder and microcrystalline glass powder is 65:35 in the solid phase composition.
Embodiment 7:1) preparation of microcrystalline glass powder: by weight percentage with 39% P
2O
5, 45% ZnO, 5% K
2O, 8% SnO
2, 1% SiO
2With 2% Al
2O
3In batch mixer, mix and be placed on melting in the high temperature resistance furnace; Smelting temperature is 1050 ℃, is incubated 3.5 hours, and shrend then obtains the glass slag; Place the planetary ball mill ball milling to obtain particle diameter in 4.6 hours glass slag drying less than 5 microns microcrystalline glass powder;
2) preparation of aluminium powder: earlier with the metallic aluminium fusion, when treating that the fusion metal is superheated to 280 ℃ in the high speed disc atomizer in full hermetic container, and to adopt cooldown rate under inert gas protection be that the chilling atomising device of 107K/s carries out powder by atomization, the aluminium powder of the atomizing pipeline of portion by the inert gas shielding spray column that is delivered to cyclone separator and secondary band screen pack from container carries out gas solid separation, and drying obtains the Fine Aluminum Powder that particle mean size is 3～7 μ m;
3) preparation of organic binder bond: by weight with the lecithin of 84% terpinol, 3% citric acid tri butyl ester, 2.7% ethyl cellulose, 1.8% NC Nitroncellulose, 5% rilanit special and 3.5% 85 ℃ of dissolvings;
4) pulp preparation: place ball grinder with 1200 commentaries on classics/min microcrystalline glass powder, organic binder bond and metallic aluminium powder, ball milling obtained resistance slurry in 3 hours, solid phase composition wherein: the weight ratio of microcrystalline glass powder, Fine Aluminum Powder and organic binder bond is 72:28, and the weight ratio of Fine Aluminum Powder and microcrystalline glass powder is 63:37 in the solid phase composition.
Embodiment 8:1) preparation of microcrystalline glass powder: by weight percentage with 40% P
2O
5, 40% ZnO, 9% K
2O, 5% B
2O
3, 0.8% Li
2O, 4% Al
2O
3Mix in batch mixer with 1.2% CuO and to be placed on melting in the high temperature resistance furnace; Smelting temperature is 950 ℃, is incubated 2.5 hours, and shrend then obtains the glass slag; Place the planetary ball mill ball milling to obtain particle diameter in 4.8 hours glass slag drying less than 5 microns microcrystalline glass powder;
2) preparation of aluminium powder: earlier with the metallic aluminium fusion, when treating that the fusion metal is superheated to 260 ℃ in the high speed disc atomizer in full hermetic container, and to adopt cooldown rate under inert gas protection be that the chilling atomising device of 105K/s carries out powder by atomization, the aluminium powder of the atomizing pipeline of portion by the inert gas shielding spray column that is delivered to cyclone separator and secondary band screen pack from container carries out gas solid separation, and drying obtains the Fine Aluminum Powder that particle mean size is 3～7 μ m;
3) preparation of organic binder bond: by weight with the lecithin of 92% terpinol, 6% citric acid tri butyl ester, 1% ethyl cellulose, 0.2% NC Nitroncellulose, 0.5% rilanit special and 0.3% 75 ℃ of dissolvings;
4) pulp preparation: place ball grinder with 1200 commentaries on classics/min microcrystalline glass powder, organic binder bond and metallic aluminium powder, ball milling obtained resistance slurry in 3 hours, solid phase composition wherein: the weight ratio of microcrystalline glass powder, Fine Aluminum Powder and organic binder bond is 58:42, and the weight ratio of Fine Aluminum Powder and microcrystalline glass powder is 74:26 in the solid phase composition.
Claims (2)
1. based on the thick-film circuit resistor paste of aluminum insulation layer, it is characterized in that: by the solid phase composition: microcrystalline glass powder, Fine Aluminum Powder and organic binder bond are formed, the weight ratio of solid phase composition and organic binder bond is 50～75:50～25, and wherein the weight ratio of Fine Aluminum Powder and microcrystalline glass powder is 80～55:20～45 in the solid phase composition;
Said microcrystalline glass powder is P
2O
5～ZnO～K
2O～B
2O
3～SnO
2Be low-melting point leadless crystallizing glass, contain by weight: 35～55% P
2O
5, 35～50% ZnO, 5～10% K
2O, 0～10% B
2O
3, 0～10% SnO
2, O～5% SiO
2, O～2% Li
2O, 2～5% Al
2O
3With 0～1.5% CuO;
It is the Fine Aluminum Powder of 3～7 μ m that said aluminum metal powder adopts granularity;
Said machine binding agent contains by weight: 75～98% terpinol, 0～15% citric acid tri butyl ester, 0.5～5% ethyl cellulose, 0～2% NC Nitroncellulose, 0.1～5% rilanit special and 0.1～5% lecithin.
2. based on the preparation method of the thick-film circuit resistor paste of aluminum insulation layer, it is characterized in that:
1) preparation of microcrystalline glass powder
By weight percentage with 35～55% P
2O
5, 35～50% ZnO, 5～10% K
2O, 0～10% B
2O
3, 0～10% SnO
2, 0～5% SiO
2, 0～2% Li
2O, 2～5% Al
2O
3Mix in batch mixer with 0～1.5% CuO and to be placed on melting in the high temperature resistance furnace; Smelting temperature is 800～1200 ℃, is incubated 1～5 hour, and shrend then obtains the glass slag; Place the planetary ball mill ball milling to obtain particle diameter in 3～5 hours glass slag drying less than 5 microns microcrystalline glass powder;
2) preparation of aluminium powder
Earlier with the metallic aluminium fusion, when treating that the fusion metal is superheated to 200～300 ℃ in the high speed disc atomizer in full hermetic container, and to adopt cooldown rate under inert gas protection be that the chilling atomising device of 105～107K/s carries out powder by atomization, the aluminium powder of the atomizing pipeline of portion by the inert gas shielding spray column that is delivered to cyclone separator and secondary band screen pack from container carries out gas solid separation, and drying obtains the Fine Aluminum Powder that particle mean size is 3～7 μ m;
3) preparation of organic binder bond
By weight with the lecithin of 75～98% terpinol, 0～15% citric acid tri butyl ester, 0.5～5% ethyl cellulose, 0～2% NC Nitroncellulose, 0.1～5% rilanit special and 0.1～5% 50～100 ℃ of dissolvings;
4) pulp preparation
Place ball grinder with 1200 commentaries on classics/min microcrystalline glass powder, organic binder bond and metallic aluminium powder, ball milling obtained resistance slurry in 3 hours, solid phase composition wherein: the weight ratio of microcrystalline glass powder, Fine Aluminum Powder and organic binder bond is 50～75:50～25, and the weight ratio of Fine Aluminum Powder and microcrystalline glass powder is 80～55:20～45 in the solid phase composition.
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|---|---|---|---|
| CNA2008101510769A CN101364454A (en) | 2008-09-23 | 2008-09-23 | Thick-film circuit resistor paste based on aluminum insulation layer and preparation thereof |
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|---|---|---|---|
| CNA2008101510769A CN101364454A (en) | 2008-09-23 | 2008-09-23 | Thick-film circuit resistor paste based on aluminum insulation layer and preparation thereof |
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| CN102351426A (en) * | 2011-08-25 | 2012-02-15 | 浙江荣泰科技企业有限公司 | Glass-mica composite material, manufacturing method and application thereof |
| CN105873248A (en) * | 2016-05-11 | 2016-08-17 | 东莞珂洛赫慕电子材料科技有限公司 | Low-temperature sintering paste for heating film and preparation method thereof |
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| CN101866745A (en) * | 2010-06-21 | 2010-10-20 | 陕西科技大学 | Low-temperature lead-free packaging slurry for mica capacitor and preparation method thereof |
| CN102351426A (en) * | 2011-08-25 | 2012-02-15 | 浙江荣泰科技企业有限公司 | Glass-mica composite material, manufacturing method and application thereof |
| CN105873248A (en) * | 2016-05-11 | 2016-08-17 | 东莞珂洛赫慕电子材料科技有限公司 | Low-temperature sintering paste for heating film and preparation method thereof |
| CN105873248B (en) * | 2016-05-11 | 2019-06-07 | 东莞珂洛赫慕电子材料科技有限公司 | A kind of heating film low-temperature sintering slurry and preparation method thereof |
| CN106397840A (en) * | 2016-08-31 | 2017-02-15 | 安徽斯迈尔电子科技有限公司 | Method for preparing organic carrier in resistance paste |
| CN111454674A (en) * | 2019-01-21 | 2020-07-28 | 磐采股份有限公司 | Conductive adhesive and solar cell applying same |
| CN110862785A (en) * | 2019-11-28 | 2020-03-06 | 郑州登电银河科技有限公司 | Laminating and laminating method of environment-friendly glue and ceramic green ceramic chip for screen printing |
| CN111528529A (en) * | 2020-04-30 | 2020-08-14 | 四川三联新材料有限公司 | Heating element of heating appliance and preparation method thereof |
| CN112225458A (en) * | 2020-08-13 | 2021-01-15 | 航天特种材料及工艺技术研究所 | High-temperature-resistant low-expansion-coefficient bonding slurry for ceramic matrix composite and preparation method thereof |
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