CN101356866B - 焊锡球搭载方法及焊锡球搭载装置 - Google Patents

焊锡球搭载方法及焊锡球搭载装置 Download PDF

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CN101356866B
CN101356866B CN2007800011184A CN200780001118A CN101356866B CN 101356866 B CN101356866 B CN 101356866B CN 2007800011184 A CN2007800011184 A CN 2007800011184A CN 200780001118 A CN200780001118 A CN 200780001118A CN 101356866 B CN101356866 B CN 101356866B
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solder ball
ball
mask
solder
printed substrate
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CN101356866A (zh
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丹野克彦
川村洋一郎
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Ibiden Co Ltd
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Abstract

本发明提供一种焊锡球搭载方法及焊锡球搭载装置，能将微细的焊锡球搭载于电极上。通过从位于球排列用掩模(16)的上方的搭载筒(24)吸引空气，从而聚集焊锡球(78s)。通过使印刷线路板(10)及球排列用掩模(16)在水平方向移动，从而使聚集于搭载筒(24)正下方的焊锡球(78s)在球排列用掩模(16)上移动，使焊锡球(78s)通过球排列用掩模(16)的开口(16a)向多层印刷线路板(10)的电极(75)落下。

Description

焊锡球搭载方法及焊锡球搭载装置
技术领域
本发明涉及一种用于将用于形成焊锡凸块的焊锡球搭载于印刷线路板上的焊锡球搭载方法及焊锡球搭载装置。
背景技术
为了将封装基板和IC芯片电连接而使用焊锡凸块。焊锡凸块通过以下工序形成。
(1)在形成于封装基板上的电极上印刷焊剂的工序。
(2)在印刷了焊剂的电极上搭载焊锡球的工序。
(3)进行回流焊、由焊锡球形成焊锡凸块的工序。
在将上述焊锡球搭载于电极上的工序中，例如，在专利文献1中公开的，用吸附头吸附焊锡球而将该焊锡球搭载于电极上。或者，如在专利文献2中公开的，使用设有多个开口的球排列用掩模使焊锡球落下到电极上。
专利文献1：日本专利1975429号
专利文献2：日本特开2001-358450号
专利文献3：日本特开2001-267731号
随着IC的高集成化，要求封装基板的焊锡凸块进一步小径化、窄间距化。因此，焊锡球直径比直径小于200μm的砂粒还小，在上述使用吸附头的方法中焊锡球的成品率下降，在并用球排列用掩模和刮板的方法中，由于焊锡凸块的高度的偏差而质量下降。
即，当焊锡球小直径化时，相对于表面积的重量比减小，产生由分子间力导致的焊锡球的吸附现象。
因此，出现如下问题：在使用了上述吸附头时，即使为了使焊锡球在电极上方自吸附头落下而压送空气，焊锡球会粘着于吸附头上而不落下，未形成焊锡凸块。
另一方面，在使用球排列用掩模的方法中，由于焊锡球相互间的吸附现象而凝聚焊锡球。因此，在载置了球排列用掩模的状态时即使印刷线路板倾斜，焊锡球也不滚动，也不能使焊锡球从球排列用掩模的开口落下。即使在不使球排列用掩模倾斜、而由刮板输送的情况下，由于使凝聚了的焊锡球接触刮板地进行输送，因此会损伤焊锡球，从而如上所述由于焊锡凸块的高度偏差而质量下降。特别是在像积层式多层电路板上那样的表面凹凸较多的印刷线路板上难于由刮板不损伤焊锡球地输送焊锡球。
发明内容
本发明的目的在于提供一种能将微细的焊锡球搭载于焊盘上的焊锡球搭载方法及焊锡球搭载装置。
为了达到上述目的，技术方案1所述的焊锡球搭载方法，用于使用球排列用掩模将用于形成焊锡凸块的焊锡球搭载于印刷线路板的焊盘上，该球排列用掩模具有与印刷线路板的焊盘相对应的多个开口，其特征在于，
使具有与上述球排列用掩模相对的开口部的筒构件位于该球排列用掩模的上方，通过用该筒构件吸引空气，从而使焊锡球聚集到该筒构件正下方的球排列用掩模上，
通过使上述球排列用掩模及印刷线路板在水平方向移动，从而使聚集到上述筒构件正下方的焊锡球通过球排列用掩模的开口向印刷线路板的焊盘落下。
技术方案2所述的焊锡球搭载装置，用于将用于形成焊锡凸块的焊锡球搭载于印刷线路板的焊盘上，其特征在于，该焊锡球搭载装置具有：
球排列用掩模，该球排列用掩模具有与印刷线路板的焊盘对应的多个开口；
筒构件，该筒构件位于球排列用掩模的上方，通过从开口部吸引空气，从而使焊锡球聚集到开口部正下方；
移动机构，使上述球排列用掩模及印刷线路板在水平方向移动，通过使该球排列用掩模及印刷线路板在水平方向移动，从而使聚集到上述筒构件正下方的焊锡球通过球排列用掩模的开口向印刷线路板的焊盘落下。
根据技术方案1的焊锡球搭载方法、技术方案2的焊锡球搭载装置，使筒构件位于球排列用掩模的上方，通过从该筒构件的开口部吸引空气来聚集焊锡球，使球排列用掩模及印刷线路板在水平方向移动，从而使聚集于筒构件正下方的焊锡球在球排列用掩模上移动，并通过球排列用掩模的开口向印刷线路板的焊盘落下。因此，可以将微细的焊锡球确实地搭载到印刷线路板的所有焊盘上。此外，由于使焊锡球以非接触地方式移动，因此，与使用刮板的情况不同，可使焊锡球不损伤地搭载到焊盘上，可使焊锡凸块的高度均匀。另外，即使对于积层式多层电路板那样的、表面凹凸较多的印刷线路板也可适当地将焊锡球载置于焊盘上。此外，由于固定筒构件而使球排列用掩模及印刷线路板移动，与使筒构件移动相比较，可以将驱动部配置于印刷线路板的下侧，因此可以避免从具有可动构件的驱动部侧朝向印刷线路板落下异物的危险性。
在技术方案3的焊锡球搭载装置中，由于对应于印刷线路板宽度地排列多个筒构件，因此，仅是朝相对于筒构件的列方向垂直的方向输送球排列用掩模及印刷线路板，即可将焊锡球确实地搭载到印刷线路板的所有焊盘上。
在技术方案4的焊锡球搭载装置中，由于可由吸引筒回收残留于球排列用掩模上的焊锡球，因此，不会由于剩余的焊锡球残留而导致故障等问题。
在技术方案5的焊锡球搭载装置中，当使焊锡球在球排列用掩模上移动进行输送时，即使由于相互的撞击而使焊锡球带电，由于筒构件的至少焊锡球接触部位是由导电性构件构成，因此，小直径、轻质量的焊锡球不会由于静电附着到筒构件上，可确实地将焊锡球搭载到印刷线路板上。
附图说明
图1(A)是表示本发明的一个实施方式的焊锡球搭载装置的结构的结构图，图1(B)是从箭头B侧观看图1(A)的焊锡球搭载装置的向视图。
图2(A)是多层印刷线路板的定位说明图，图2(B)是向搭载筒供给焊锡球的说明图。
图3(A)是由搭载筒聚集焊锡球的说明图，图3(B)是由搭载筒聚集、引导焊锡球的说明图。
图4(A)是焊锡球向焊盘落下的说明图，图4(B)是由焊锡球除去筒除去焊锡球的说明图。
图5(A)、图5(B)、图5(C)是多层印刷线路板的制造工序的说明图。
图6是多层印刷线路板的剖视图。
图7是将IC芯片安装于图6所示的多层印刷线路板上、并载置到子板的状态的剖视图。
图8是第1实施方式的填充导通孔的说明图。
附图标记的简单说明
10：印刷线路板
12：上下移动轴
14：XYθ吸引台
16：球排列用掩模
16a：开口
18：剩余量检测传感器
20：焊锡球搭载装置
22：焊锡球供给装置
24：搭载筒(筒构件)
26：吸引箱
44：掩模夹具
46：校准照相机
61：球除去筒
66：吸引箱
68：吸附焊锡球除去吸引装置
75：焊盘
80：焊剂
具体实施方式
首先，参照图6及图7说明使用本发明第1实施例的焊锡球搭载方法及搭载装置制造的多层印刷线路板10的结构。图6表示该多层印刷线路板10的剖视图，图7表示在图6所示的多层印刷线路板10上安装IC芯片90、并载置到子板94的状态。如图6所示，在多层印刷线路板10中，在芯基板30的两面形成导体电路34。芯基板30的上表面和背面通过通孔36而连接。
另外，在芯基板30的导体电路34上隔着层间树脂绝缘层50形成有形成导体电路层的导体电路58。导体电路58通过导通孔60与导体电路34连接。在导体电路58上隔着层间树脂绝缘层150形成导体电路158。导体电路158通过形成于层间树脂绝缘层150上的导通孔160与导体电路58连接。
在导通孔160、导体电路158的上层形成有阻焊层70，在该阻焊层70的开口71上设置镀镍层72及镀金层74，从而形成焊盘75。在上表面的焊盘75上形成焊锡凸块78U，在下表面的焊盘75上形成BGA(焊锡球网格阵列)78D。
如图7中所示，多层印刷线路板10的上表面侧的焊锡凸块78U连接于IC芯片90的电极92。另一方面，下表面的B GA78D连接于子板94的连接盘96。
图5是表示在多层印刷线路板10上形成焊锡凸块的工序的说明图。
如图5(A)所示，在将焊盘75形成于表面的阻焊层70的开口71处的多层印刷线路板10的表面上印刷焊剂80。如图5(B)所示，使用后述的焊锡球搭载装置将微小的焊锡球78s(例如日立金属公司制、タムラ公司制，直径40μm以上、小于200μm)搭载于多层印刷线路板10上侧的焊盘75上。为了对应精细化，最好是直径小于200μm的焊锡球。若焊锡球直径小于40μm，则由于焊锡球过轻而难于落下到焊盘上。另一方面，当焊锡球直径超过200μm时，反而由于过重而不能使焊锡球聚集到筒构件内，容易出现未载有焊锡球的焊盘。
此后，如图5(C)所示，用在专利文献1中公开的以往技术中的吸附头吸附通常直径(直径250μm)的焊锡球78L，将其载置于多层印刷线路板10下侧的焊盘75上。此后，在回流焊炉中加热，如图6所示那样在多层印刷线路板10上侧以60μm～150μm的间距形成例如2000个焊锡凸块78U，在下侧以2mm的间距形成例如250个BGA78D。当间距小于60μm时，难于制造适于该间距的焊锡球。当间距超过150μm时，虽然在本方法中可没有任何问题地制造，但即使由以往技术的方法也可制造。另外，如图7所示，通过回流焊而通过焊锡凸块78U搭载IC芯片90后，通过BGA78D将搭载了IC芯片90的多层印刷线路板10安装于子板94上。
参照图1说明将微小(直径小于200μm)的焊锡球78s搭载于参照图5(B)所述的多层印刷线路板的焊盘上的焊锡球搭载装置。
图1(A)是表示本发明的一个实施方式的焊锡球搭载装置的结构的结构图，图1(B)是从箭头B侧观看图1(A)的焊锡球搭载装置的向视图。
焊锡球搭载装置20包括：定位保持多层印刷线路板10的XYθ吸引台14；升降该XYθ吸引台14的上下移动轴12；具有与多层印刷线路板的焊盘75对应的开口的球排列用掩模16；引导焊锡球的搭载筒(筒构件)24；对搭载筒24施加负压的吸引箱26；用于回收剩余的焊锡球的球除去筒61；对该球除去筒61施加负压的吸引箱66；保持回收了的焊锡球的球除去吸引装置68；夹持球排列用掩模16的掩模夹具44；用于对多层印刷线路板10进行摄像的校准照相机46；检测位于搭载筒24下方的焊锡球残余量的残余量检测传感器18；及根据由残余量检测传感器18检测出的残余量将焊锡球向搭载筒24侧供给的焊锡球供给装置22。
对应于焊盘区域的大小朝Y方向排列多个搭载筒24及球除去筒61。另外，搭载筒24及球除去筒61也可形成为与多个焊盘区域对应的大小。在此，Y方向是比较方便的，也可朝X方向排列。XYθ吸引台14对搭载焊锡球的多层印刷线路板10进行定位、吸附、保持、修正、输送。在此，在印刷线路板10上输送时，XYθ吸引台14也可以同时输送被掩模夹具44夹持的球排列用掩模16。校准照相机46检测XYθ吸引台14上的多层印刷线路板10的校准标记，根据检测出的位置，调整多层印刷线路板10和球排列用掩模16的位置。残余量检测传感器18通过光学的方法检测焊锡球的残余量。
第1实施方式的焊锡球搭载装置20，由于固定搭载筒24而使球排列用掩模16及印刷线路板10移动，与使搭载筒24移动相比较，可以将驱动部(XYθ吸引台14)配置于印刷线路板10的下侧，因此可以避免从具有可动构件的驱动部侧朝向印刷线路板落下异物的危险性。
下面，参照图2～图4说明由焊锡球搭载装置20进行的焊锡球的搭载工序。
(1)多层印刷线路板的位置识别、修正。
如图2(A)所示，由校准照相机46识别多层印刷线路板10的校准标记34M，由XYθ吸引台14相对于球排列用掩模16修正多层印刷线路板10的位置。即，调整位置，以使球排列用掩模16的开口16a分别与多层印刷线路板10的焊盘75对应。另外，在此为了图示方便，仅表示出1张多层印刷线路板10，但是实际上，焊锡球搭载到多张构成多层印刷线路板的工作单尺寸的多层印刷线路板上，形成焊锡凸块后再被切分成单片的多层印刷线路板。
(2)供给焊锡球
如图2(B)所示，从焊锡球供给装置22向搭载筒24侧定量供给焊锡球78s。
(3)搭载焊锡球
如图3(A)所示，使搭载筒24位于在球排列用掩模16的上方并且与该球排列用掩模保持规定的间隙(例如焊锡球直径的100％～300％)，通过从吸引部24B吸引空气，使搭载筒和印刷线路板间的间隙的流速为5m/sec～50m/sec，使焊锡球78s聚集到该搭载筒24的开口部24A正下方的球排列用掩模16上。此后，如图3(B)、图4(A)及图1(B)和图1(A)所示，通过XYθ吸引台14将印刷线路板10与球排列用掩模16沿X轴朝水平方向输送。由此，随着球排列用掩模16及印刷线路板10的输送使聚集到搭载筒24正下方的焊锡球78s移动，并通过球排列用掩模16的开口16a使焊锡球78s向多层印刷线路板10的焊盘75落下，从而搭载到多层印刷线路板10的焊盘75上。由此，在多层印刷线路板10侧的所有焊盘上依次排列焊锡球78s。
(4)除去附着焊锡球
如图4(B)所示，通过输送印刷线路板10及球排列用掩模16，将剩余的焊锡球78s引导至在球排列用掩模16上没有开口16a的位置后，由球除去筒61将其吸引除去。
(5)取出基板
从XYθ吸引台14拆下多层印刷线路板10。
根据本实施方式的焊锡球搭载方法、焊锡球搭载装置20，通过使搭载筒24位于球排列用掩模16的上方，从该搭载筒24的开口部24B吸引空气，从而聚集焊锡球78s，通过朝水平方向输送球排列用掩模16及印刷线路板10，从而使聚集了的焊锡球78s在球排列用掩模16上移动，通过球排列用掩模16的开口16a使焊锡球78s向多层印刷线路板10的焊盘75落下。由此，可确实地将微细的焊锡球78s搭载到多层印刷线路板10的所有焊盘75上。另外，由于使焊锡球78s以非接触的方式移动，因此，与使用刮板的情况不同，可不损伤焊锡球地将其搭载于焊盘75上，可使焊锡凸块78U的高度均匀。由此，IC等电子部件的安装性优良、安装后的热循环试验、高温高湿试验等耐环境试验性优良。另外，由于不依存于产品的平面度，因此，即使是表面具有较多凹凸的印刷线路板，也可将焊锡球适当地载置到焊盘上。另外，由于可将微小的焊锡球确实地载置到焊盘上，因此，即使焊盘间距为60～150μm间距、阻焊剂的开口直径为40～100μm的印刷线路板上，也可在所有凸块上形成凸块高度稳定的焊锡凸块。
另外，由于是由吸引力引导焊锡球，因此，可防止焊锡球的凝聚、附着。另外，通过调整搭载筒24的数量，从而可对应各种大小的工件(工作单尺寸的多层印刷线路板)，因此，可灵活地适用于多品种、少量生产。
如图1(B)所示，在本实施方式的焊锡球搭载装置中，由于与工件(工作单尺寸的多层印刷线路板)宽度对应地沿Y方向排列多个搭载筒24，因此，只要朝相对于搭载筒24的列方向垂直的方向(X方向)输送球排列用掩模16及印刷线路板10，即可使焊锡球确实地搭载于多层印刷线路板10的所有焊盘75上。
另外，由于可以由球除去筒61回收残留在球排列用掩模16上的焊锡球78s，因此，不会由于剩余的焊锡球残留而导致故障等问题。
下面，说明按照实施例的焊锡球搭载方法制造的焊锡凸块与按照以往技术的方法制造的焊锡凸块进行比较试验的结果。
实施例
(1)印刷线路板的制作
使用双面覆铜层叠板(例如日立化成工业株式会社制造的MCL-E-67)作为原始材料，用公知的方法在该基板上形成通孔导体及导体电路。此后，用公知的方法(例如2000年6月20日由日刊工业报社发行的“积层式多层印刷线路板”(高木清著))交替地层叠层间绝缘层和导体电路层，在最外层的导体电路层中形成用于与IC电连接的、由直径150μm、间距150μm、50×50个(格子状配置)焊盘构成的焊盘组。在其上形成市场上出售的阻焊剂，在焊盘上用照相法形成直径100μm的开口。在此，由导通孔构成的连接焊盘(在导通孔的上方并与其相邻地形成焊锡凸块)最好是填充导通孔(filled via)，其表面的凹下量、凸出量相对于导体电路158的导体厚度为，如图8(A)所示，凹下量(自上端面凹入的凹入量)P1最好为-5μm以下的范围，以及如图8(B)所示，凸出量(从上部平坦面突出的突出量)P2最好为+5μm以下的范围。当填充导通孔的凹下量超过5μm(-5μm)时，由焊锡球和填充导通孔构成的连接焊盘的触点减少，因此，当形成焊锡凸块时，润湿性变差，容易在焊锡内卷入空穴，或容易成为未搭载状态(遗漏凸块)。另一方面，由于当超过5μm时，导体电路158的厚度变厚，因此，不利于精细化。
(2)搭载焊锡球
在由(1)制作的印刷线路板的表面(IC安装面)涂覆市场出售的松香系焊剂。此后，将其搭载到上述本发明的焊锡球搭载装置的吸附台上，使用CCD照相机识别印刷线路板及焊锡球搭载用掩模的校准标记，并使印刷线路板与焊锡球搭载用掩模对位。在此，焊锡球搭载用掩模使用在与印刷线路板的焊盘对应的位置具有直径110μm开口的Ni制金属掩模，该金属掩模的厚度为25μm～50μm，此外也可使用SUS制或聚酰亚胺制的焊锡球搭载用掩模。另外，形成于焊锡球搭载用掩模上的开口直径最好是所使用的焊锡球直径的1.1～1.5倍。然后，以与焊盘区域对应的大小(是焊盘区域的1.2～3倍)，保持2倍焊锡球直径的间隙地使高度200mm的搭载筒位于印刷线路板上，将焊锡球直径80μm的Sn63Pb37焊锡球(日立金属公司制)载置到搭载筒周围近旁的焊锡球搭载用掩模上。
在本实施例中，焊锡球使用Sn/Pb焊锡，但也可是从Sn和Ag、Cu、In、Bi、Zn等的范围里选择的无Pb焊锡。然后，从搭载筒上部24B吸引空气，将搭载筒与印刷线路板间的间隙的流速调整为5～35m/sec，使焊锡球聚集到搭载筒内。此后，以移动速度40mm/sec输送球排列用掩模16及印刷线路板10来使焊锡球移动，使焊锡球从焊锡球搭载用掩模的开口部落下并且将焊锡球搭载到焊盘上。然后，除去焊锡球搭载用掩模的多余的焊锡球后，从焊锡球搭载装置分别拆下焊锡球搭载用掩模和印刷线路板。最后，将上述制作的印刷线路板投入到设定为230度的回流焊中形成焊锡凸块。
比较例1
除了改变在实施例中的将焊锡球供给到焊盘的方法以外，其余与实施例相同。
即，使用以往技术的方法，使用刮板使焊锡球移动，从而使焊锡球从焊锡球搭载用的开口部落下而将焊锡球搭载到焊盘上。
评价试验
在回流焊后，使用KEYENCE公司制的激光显微镜VX-8500随机地测定50个自阻焊剂上表面起的凸块高度。
结果
          凸块平均高度  凸块高度偏差
实施例    35.22μm      1.26
比较例    32.64μm      2.00
根据该结果可知，即使是使用相同的焊锡球，在本发明的实施例中，凸块高度高，凸块高度的偏差小。这是因为，在本发明的实施例中，由于焊锡球不会被刮板等削去一部分，因此，维持初始的焊锡球原来的体积地将其搭载于焊盘上。
另外，准备100个由实施例及比较例得到的印刷线路板并搭载了IC。进行IC搭载基板的导通检测，求出其成品率。结果，实施例的印刷线路板的成品率为100％，而比较例的成品率为76％。此后，从正品随机地各取10个试样，进行1000次的
Figure B2007800011184D00132
分钟的热循环试验，从印刷线路板的背面(与IC安装面相反的面)通过IC再次测定与印刷线路板背面相连的特定电路的连接电阻的变化量。连接电阻的变化量是((热循环后的连接电阻-初始值的连接电阻)/初始值的连接电阻)×100。该值超过10％时为不合格。
          不合格的个数
实施例    0
比较例    3
根据该结果可知，在本发明中，由于凸块高度的偏差较小，因此，凸块的连接可靠性高。
另外，在本实施例中，搭载筒24由SUS不锈钢、Ni、Cu等导电性金属构成，在焊锡球搭载装置20侧接地。在此，当使焊锡球在球排列用掩模16上移动地进行输送时，即使由于相互的撞击而使焊锡球带电，小直径、轻质量的焊锡球也不会由于静电附着到搭载筒24上，可确实地将焊锡球搭载到印刷线路板上。并且，搭载筒24可以使用混入了石墨粉的导电性树脂制造，还可以使用在树脂构件表面通过蒸镀等被覆铝等的导电性金属膜23而成的构件，还可以使用在树脂构件21的下端及内周面上粘贴了铜箔等导电性金属箔23f而成的构件。

Claims (6)

1.一种焊锡球搭载方法，其使用球排列用掩模将用于形成焊锡凸块的焊锡球搭载于印刷线路板的焊盘上，该球排列用掩模具有与印刷线路板的焊盘相对应的多个开口，其特征在于，
使具有与上述球排列用掩模相对的开口部的筒构件位于该球排列用掩模的上方，通过用该筒构件吸引空气，从而使焊锡球聚集到该筒构件正下方的球排列用掩模上，
通过使上述球排列用掩模及印刷线路板在水平方向移动，从而使聚集到上述筒构件正下方的焊锡球通过球排列用掩模的开口向印刷线路板的焊盘落下。
2.一种焊锡球搭载装置，其将用于形成焊锡凸块的焊锡球搭载于印刷线路板的焊盘上，其特征在于，该焊锡球搭载装置具有：
球排列用掩模，该球排列用掩模具有与印刷线路板的焊盘对应的多个开口；
筒构件，该筒构件位于球排列用掩模的上方，通过从开口部吸引空气，从而使焊锡球聚集到开口部正下方；
移动机构，使上述球排列用掩模及印刷线路板在水平方向移动，通过使该球排列用掩模及印刷线路板在水平方向移动，从而使聚集到上述筒构件正下方的焊锡球通过球排列用掩模的开口向印刷线路板的焊盘落下。
3.根据权利要求2所述的焊锡球搭载装置，其特征在于，对应于印刷线路板的宽度排列了多个上述筒构件。
4.根据权利要求2或3所述的焊锡球搭载装置，其特征在于，具有用于回收残留于上述球排列用掩模上的焊锡球的吸引筒。
5.根据权利要求2或3所述的焊锡球搭载装置，其特征在于，上述筒构件的至少焊锡球接触部位由导电性材料构成。
6.根据权利要求4所述的焊锡球搭载装置，其特征在于，上述筒构件的至少焊锡球接触部位由导电性材料构成。
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