CN101352100B - Method and apparatus for encapsulating organic light emitting diodes - Google Patents
Method and apparatus for encapsulating organic light emitting diodes Download PDFInfo
- Publication number
- CN101352100B CN101352100B CN2006800501456A CN200680050145A CN101352100B CN 101352100 B CN101352100 B CN 101352100B CN 2006800501456 A CN2006800501456 A CN 2006800501456A CN 200680050145 A CN200680050145 A CN 200680050145A CN 101352100 B CN101352100 B CN 101352100B
- Authority
- CN
- China
- Prior art keywords
- glass substrate
- lid
- process chamber
- objective table
- vacuum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/80001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
- H01L2224/808—Bonding techniques
- H01L2224/80897—Mechanical interlocking, e.g. anchoring, hook and loop-type fastening or the like
- H01L2224/80898—Press-fitting, i.e. pushing the parts together and fastening by friction, e.g. by compression of one part against the other
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
Description
Claims (7)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050134759 | 2005-12-30 | ||
KR10-2005-0134759 | 2005-12-30 | ||
KR1020050134759A KR100689199B1 (en) | 2005-12-30 | 2005-12-30 | Encapsulation method of organic light emitting diodes and apparatus of the same |
PCT/KR2006/005782 WO2007078090A1 (en) | 2005-12-30 | 2006-12-27 | Method and apparatus for encapsulating organic light emitting diodes |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101352100A CN101352100A (en) | 2009-01-21 |
CN101352100B true CN101352100B (en) | 2010-06-16 |
Family
ID=38102327
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2006800501456A Expired - Fee Related CN101352100B (en) | 2005-12-30 | 2006-12-27 | Method and apparatus for encapsulating organic light emitting diodes |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR100689199B1 (en) |
CN (1) | CN101352100B (en) |
TW (1) | TW200725961A (en) |
WO (1) | WO2007078090A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104022234A (en) * | 2014-06-24 | 2014-09-03 | 深圳市华星光电技术有限公司 | OLED encapsulating equipment and encapsulating method of OLED panel |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101336018B (en) * | 2007-06-27 | 2011-05-25 | 东莞彩显有机发光科技有限公司 | Packaged solderless method and apparatus of organic electroluminescent device |
KR101432819B1 (en) * | 2007-12-29 | 2014-08-27 | 엘지디스플레이 주식회사 | Apparatus and method for fabricating organic electroluminescence display device |
KR101048667B1 (en) | 2009-06-08 | 2011-07-13 | (주)아이디에스 | Liquid Crystal Display Manufacturing Method |
CN102184935B (en) * | 2011-04-02 | 2012-08-08 | 东莞宏威数码机械有限公司 | OLED (Organic Light Emitting Diode) display screen packaging equipment and compression packaging method |
CN102270742B (en) * | 2011-08-29 | 2013-04-17 | 电子科技大学 | Organic optoelectronic device wrapper and device packaging method |
CN103187542B (en) * | 2011-12-29 | 2016-09-07 | 丽佳达普株式会社 | Organic illuminating element packaging system and organic illuminating element method for packing |
CN103247540B (en) * | 2012-02-08 | 2015-11-25 | 西安永电电气有限责任公司 | IGBT module sealed in unit, system and method |
CN102881825B (en) * | 2012-09-28 | 2015-08-05 | 京东方科技集团股份有限公司 | A kind of method of packaging system and encapsulation organic optoelectronic device |
KR101795678B1 (en) | 2016-01-27 | 2017-11-08 | 주식회사 선익시스템 | Encapsulation apparatus and method for encapsulating using the same |
CN115312472B (en) * | 2022-08-02 | 2024-02-23 | 江苏东海半导体股份有限公司 | Copper frame for packaging switch diode |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050248715A1 (en) * | 2002-03-15 | 2005-11-10 | Lg. Philips Lcd Co., Ltd. | System for fabricating liquid crystal display and method of fabricating liquid crystal display using the same |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3646788B2 (en) * | 2001-08-31 | 2005-05-11 | 英夫 吉田 | Method and apparatus for activation treatment of base material surface |
JP2003123996A (en) * | 2001-10-09 | 2003-04-25 | Sanee Denki Kk | Discharge lamp lighting circuit |
JP2005011648A (en) * | 2003-06-18 | 2005-01-13 | Sanyo Electric Co Ltd | Electroluminescent panel and manufacturing method of electroluminescent panel |
JP2005243413A (en) * | 2004-02-26 | 2005-09-08 | Sony Corp | Manufacturing method of display device |
-
2005
- 2005-12-30 KR KR1020050134759A patent/KR100689199B1/en not_active IP Right Cessation
-
2006
- 2006-12-26 TW TW095148865A patent/TW200725961A/en unknown
- 2006-12-27 WO PCT/KR2006/005782 patent/WO2007078090A1/en active Application Filing
- 2006-12-27 CN CN2006800501456A patent/CN101352100B/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050248715A1 (en) * | 2002-03-15 | 2005-11-10 | Lg. Philips Lcd Co., Ltd. | System for fabricating liquid crystal display and method of fabricating liquid crystal display using the same |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104022234A (en) * | 2014-06-24 | 2014-09-03 | 深圳市华星光电技术有限公司 | OLED encapsulating equipment and encapsulating method of OLED panel |
CN104022234B (en) * | 2014-06-24 | 2016-10-26 | 深圳市华星光电技术有限公司 | OLED sealed in unit and the method for packing of oled panel |
Also Published As
Publication number | Publication date |
---|---|
KR100689199B1 (en) | 2007-03-02 |
CN101352100A (en) | 2009-01-21 |
WO2007078090A1 (en) | 2007-07-12 |
TW200725961A (en) | 2007-07-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101352100B (en) | Method and apparatus for encapsulating organic light emitting diodes | |
CN100530752C (en) | Organic electro luminescence device and fabrication method thereof | |
JP4227134B2 (en) | Flat panel display manufacturing method, flat panel display, and flat panel display panel | |
US7554264B2 (en) | Flat panel display including at least one substrate having a groove | |
CN100592530C (en) | Organic electro-luminescence display device and fabricating method thereof | |
CN108666349B (en) | Color filter substrate, manufacturing method thereof and WOLED display | |
US20070057295A1 (en) | Substrate bonding method and apparatus | |
CN104505465A (en) | OLED packaging structure and packaging method thereof | |
TW587397B (en) | Organic EL element and method of manufacturing the same | |
KR20030090419A (en) | Encapsulation method of organic electro luminescence device and organic electro luminescence panel using the same | |
JP2007066775A (en) | Manufacturing method of organic el element and organic el element | |
KR20050010333A (en) | Organic electro luminescence display device | |
KR20030084234A (en) | Dual Panel Type Organic Electroluminescent Device and Method for Fabricating the same | |
KR20050112318A (en) | Manufacturing method of plat panel display device, plat panel display device, and panel of plat panel display device | |
WO2018152897A1 (en) | Oled packaging method and oled packaging structure | |
JP2006253097A (en) | Spontaneous light-emitting panel and its manufacturing method | |
US20190035855A1 (en) | Package structure and packaging method for organic electroluminescence element and display device | |
CN101931058A (en) | Packaging structure and packaging method of organic electroluminescent device | |
JP4736602B2 (en) | Organic EL element sealing method and sealing device | |
KR101124557B1 (en) | OLED used flexible display substrate | |
KR101085274B1 (en) | Method For encapsulating organic light emitting diode | |
KR20030068654A (en) | Method for manufacturing Organic Electro Luminescent Display Device with both sides light emitting | |
US20050062414A1 (en) | Organic electroluminescence display package and method for packaging the same | |
KR100370921B1 (en) | An Organic Electro-Luminescence Display Panel By Dual Hardening Process And Fabricating Method Thereof | |
US10283730B2 (en) | OLED encapsulation method and OLED encapsulation structure |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: DOOSAN ENGINEERING + CONSTRUCTION CO., LTD. Free format text: FORMER OWNER: MIYAKOYAMA MECATEC KABUSHIKI KAISHA Effective date: 20111008 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20111008 Address after: Seoul, South Korea Patentee after: Doosan Engineering Building Co Address before: Gyeongnam, South Korea Patentee before: Miyakoyama MECATEC Kabushiki Kaisha |
|
ASS | Succession or assignment of patent right |
Owner name: SNU PRECISION CO., LTD. Free format text: FORMER OWNER: DOOSAN ENGINEERING + CONSTRUCTION CO., LTD. Effective date: 20111215 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20111215 Address after: Seoul, South Korea Patentee after: SNU Precision Co., Ltd. Address before: Seoul, South Korea Patentee before: Doosan Engineering Building Co |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100616 Termination date: 20171227 |
|
CF01 | Termination of patent right due to non-payment of annual fee |