CN101350296A - 一种晶圆背电极的制作方法及其晶圆 - Google Patents
一种晶圆背电极的制作方法及其晶圆 Download PDFInfo
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- CN101350296A CN101350296A CNA2008101983226A CN200810198322A CN101350296A CN 101350296 A CN101350296 A CN 101350296A CN A2008101983226 A CNA2008101983226 A CN A2008101983226A CN 200810198322 A CN200810198322 A CN 200810198322A CN 101350296 A CN101350296 A CN 101350296A
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- Die Bonding (AREA)
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Abstract
Description
划片刀型号 | 刀刃宽度(mm) | 刀刃长度(mm) | 适用划道宽度范围 |
NBC-ZH 103F-SE 27HCAA | 0.015~0.020 | 0.38~0.51 | ≥35um |
NBC-ZH 203O-SE 27HCBB | 0.020~0.025 | 0.51~0.64 | ≥40um |
NBC-ZH 203O-SE 27HCCC | 0.025~0.030 | 0.64~0.76 | ≥45um |
NBC-ZH 203O-SE 27HCDD | 0.030~0.035 | 0.76~0.89 | ≥50um |
NBC-ZH 203O-SE 27HCEE | 0.035~0.040 | 0.89~1.02 | ≥55um |
NBC-ZH 203O-SE 27HCEF | 0.040~0.045 | 0.89~1.02 | ≥60um |
参数项 | 范围 | 推荐值 |
Pick Delay: | 20~40ms | 25ms |
Bond Delay: | 10~40ms | 20ms |
芯片尺寸范围(mm) | 顶针型号 | 顶针帽伸出口径(mm) | 顶针顶出高度范围 | 推荐值 |
0.30~0.60 | PUN-W-0.70MM-17MM-10DG | 0.30 | 2600~3200 | 2800 |
0.60~0.90 | PUN-L17.00-OD0.70-A20DEG | 0.50 | 2600~3200 | 2850 |
0.90~3.00 | PUN-W-0.70MM-17MM-2PIN | 0.75 | 2600~3200 | 2800 |
项目 | 预加热区1 | 预加热区2 | 预加热区3 | 主温区 | 后加热区1 | 后加热区2 |
范围(℃) | 300~350 | 350~390 | 380~420 | 380~460 | 300~390 | 200~260 |
Claims (9)
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CN2008101983226A CN101350296B (zh) | 2008-09-02 | 2008-09-02 | 一种晶圆背电极的制作方法及其晶圆 |
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CN2008101983226A CN101350296B (zh) | 2008-09-02 | 2008-09-02 | 一种晶圆背电极的制作方法及其晶圆 |
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CN101350296A true CN101350296A (zh) | 2009-01-21 |
CN101350296B CN101350296B (zh) | 2011-05-18 |
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103576462A (zh) * | 2012-07-19 | 2014-02-12 | 无锡华润上华半导体有限公司 | 用于对背面湿法腐蚀后的晶片的正面进行光刻方法 |
CN103646956A (zh) * | 2013-12-25 | 2014-03-19 | 中国电子科技集团公司第四十四研究所 | 带保护膜ccd芯片封装工艺 |
CN103839839A (zh) * | 2014-03-26 | 2014-06-04 | 常州银河世纪微电子有限公司 | 芯片背面涂覆锡膏的装片方法 |
CN104155731A (zh) * | 2013-05-13 | 2014-11-19 | 上海鸿辉光通科技股份有限公司 | 一种plc芯片的粘接方法 |
CN106842820A (zh) * | 2017-03-28 | 2017-06-13 | 厦门市三安光电科技有限公司 | 一种可降低光阻气泡数量的晶圆背面涂布工艺 |
CN108767101A (zh) * | 2018-05-25 | 2018-11-06 | 苏州市汇涌进光电有限公司 | 一种led固晶方法 |
CN110867501A (zh) * | 2018-08-28 | 2020-03-06 | 山东浪潮华光光电子股份有限公司 | 一种GaAs基发光二极管芯片的切割方法 |
CN114618754A (zh) * | 2022-05-16 | 2022-06-14 | 四川上特科技有限公司 | 一种晶圆片玻璃浆填充装置 |
-
2008
- 2008-09-02 CN CN2008101983226A patent/CN101350296B/zh not_active Expired - Fee Related
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103576462A (zh) * | 2012-07-19 | 2014-02-12 | 无锡华润上华半导体有限公司 | 用于对背面湿法腐蚀后的晶片的正面进行光刻方法 |
CN103576462B (zh) * | 2012-07-19 | 2016-08-17 | 无锡华润上华半导体有限公司 | 用于对背面湿法腐蚀后的晶片的正面进行光刻方法 |
CN104155731A (zh) * | 2013-05-13 | 2014-11-19 | 上海鸿辉光通科技股份有限公司 | 一种plc芯片的粘接方法 |
CN103646956A (zh) * | 2013-12-25 | 2014-03-19 | 中国电子科技集团公司第四十四研究所 | 带保护膜ccd芯片封装工艺 |
CN103646956B (zh) * | 2013-12-25 | 2016-07-06 | 中国电子科技集团公司第四十四研究所 | 带保护膜ccd芯片封装工艺 |
CN103839839A (zh) * | 2014-03-26 | 2014-06-04 | 常州银河世纪微电子有限公司 | 芯片背面涂覆锡膏的装片方法 |
CN103839839B (zh) * | 2014-03-26 | 2016-07-06 | 常州银河世纪微电子有限公司 | 芯片背面涂覆锡膏的装片方法 |
CN106842820A (zh) * | 2017-03-28 | 2017-06-13 | 厦门市三安光电科技有限公司 | 一种可降低光阻气泡数量的晶圆背面涂布工艺 |
CN106842820B (zh) * | 2017-03-28 | 2020-12-11 | 厦门市三安集成电路有限公司 | 一种可降低光阻气泡数量的晶圆背面涂布工艺 |
CN108767101A (zh) * | 2018-05-25 | 2018-11-06 | 苏州市汇涌进光电有限公司 | 一种led固晶方法 |
CN110867501A (zh) * | 2018-08-28 | 2020-03-06 | 山东浪潮华光光电子股份有限公司 | 一种GaAs基发光二极管芯片的切割方法 |
CN114618754A (zh) * | 2022-05-16 | 2022-06-14 | 四川上特科技有限公司 | 一种晶圆片玻璃浆填充装置 |
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CN101350296B (zh) | 2011-05-18 |
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Address after: 526020 Guangdong city of Zhaoqing province Fenghua Fenghua Electronic Industrial City Road No. 18 Patentee after: Guangdong Fenghua Advanced Technology Holding Co.,Ltd. Patentee after: GUANGDONG FENGHUA SEMICONDUCTOR TECHNOLOGY Co.,Ltd. Patentee after: ZHAOQING FENGHUA XINGU MICROELECTRONIC Co.,Ltd. Address before: 526020 Guangdong city of Zhaoqing province Fenghua Fenghua Electronic Industrial City Road No. 18 Patentee before: Guangdong Fenghua Advanced Technology Holding Co.,Ltd. Patentee before: GUANGZHOU YUEJING HIGH TECHNOLOGY Co.,Ltd. Patentee before: ZHAOQING FENGHUA XINGU MICROELECTRONIC Co.,Ltd. |
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Effective date of registration: 20160310 Address after: 526020 Guangdong city of Zhaoqing province Fenghua Fenghua Electronic Industrial City Road No. 18 Patentee after: Guangdong Fenghua Advanced Technology Holding Co.,Ltd. Patentee after: GUANGDONG FENGHUA SEMICONDUCTOR TECHNOLOGY Co.,Ltd. Address before: 526020 Guangdong city of Zhaoqing province Fenghua Fenghua Electronic Industrial City Road No. 18 Patentee before: Guangdong Fenghua Advanced Technology Holding Co.,Ltd. Patentee before: GUANGDONG FENGHUA SEMICONDUCTOR TECHNOLOGY Co.,Ltd. Patentee before: ZHAOQING FENGHUA XINGU MICROELECTRONIC Co.,Ltd. |
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