CN101346632B - Probe card - Google Patents
Probe card Download PDFInfo
- Publication number
- CN101346632B CN101346632B CN2006800491242A CN200680049124A CN101346632B CN 101346632 B CN101346632 B CN 101346632B CN 2006800491242 A CN2006800491242 A CN 2006800491242A CN 200680049124 A CN200680049124 A CN 200680049124A CN 101346632 B CN101346632 B CN 101346632B
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- China
- Prior art keywords
- input
- output
- lead
- inspection
- probe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
An influence of cross talk between neighboring test subjects is suppressed. A probe card comprises a plurality of probes in contact with test subjects for carrying out at least either the input or output of an electric signal; a board having a wiring pattern corresponding to a circuit structure to generate a test signal; a plurality of input leads for transmitting an input signal to the test subjects, wherein one end terminals of the leads are electrically connected to either one of the plurality of the probes; a plurality of coaxial cables, one end terminals of which are electrically connected to the board and the other end terminals of which are electrically connected to either one of the plurality of the input leads or either one of the plurality of the probes; a plurality of output leads for transmitting an output signal from the test subjects, wherein one end terminals of the output leads are electrically connected to either one of the plurality of the probes; and a shielding plate provided at a region adjacent to places where the output leads connected to one of neighboring two test subjects cross with the input leads connected to the other test subject.
Description
Technical field
Employed probe when the present invention relates to a kind of inspection of simultaneously a plurality of inspection objects being stipulated.
Background technology
So far, for example on the driving circuit of the liquid crystal panel that constitutes LCD etc., known use is called as the formation that the IC of TAB (Tape Automated Bonding) or COF (the Chip On Film) TCP (TapeCarrier Package) of etc.ing encapsulates.This TCP is formed with on the surface on the film like base material of Wiring pattern of regulation, forms by carrying LSI semi-conductor chips such as (Large Scale Integrated Circuit).
When making TCP, identical with other the situation of SIC (semiconductor integrated circuit), for detecting defective products, carry out the inspection relevant with electrical characteristics.More specifically, electrical short and having or not of broken string to the Wiring pattern that forms on film substrate are checked (checking), or are carrying semi-conductor chip after semi-conductor chip is carried out the operating characteristic inspection etc. of the inspection signal of input and output regulation by Wiring pattern.
Yet SIC (semiconductor integrated circuit) in recent years has for realizing that high-speed computation is handled and uses high-frequency electric signal to come the structure of work.Under situation about being configured for by leads such as enameled wires to the Wiring construction of checking the high-frequency electric signal of object input and output, check the easy dull of waveform of signal, have and easily high-frequency is measured performance and produce the problem that hinders.Therefore, as the countermeasure of this problem, thereby a kind of check system (for example, with reference to patent documentation 1 and 2) of using concentric cable to realize transmitting the Wiring construction of checking signal is proposed.
Patent documentation 1: No. 2971706 communique of Japan's special permission
Patent documentation 2: No. 3357294 communique of Japan's special permission
But, by transmitting with respect to a plurality of inspection objects under the situation that high-frequency electric signal checks simultaneously, with respect to adjacent inspection object, near the distribution of the outgoing side of an input side of checking object and another inspection object, crosstalk sometimes.More specifically, under the situation that transmits high-frequency electric signal,, therefore when checking, produce big electromagnetic wave, can not ignore the influence of crosstalking sometimes other distribution owing to apply the above voltage of 3V as supply voltage.In the case, also can check sometimes to produce the influences such as noise that electromagnetic induction causes on the output distribution of object, thereby can not check at another.
Summary of the invention
The present invention proposes in view of the above problems, and purpose is to provide a kind of probe, and it can be suppressed at the influence of crosstalking between adjacent inspection object.
For solving the above problems, and reach purpose, technical scheme 1 described invention is a kind of probe, be electrically connected between its circuit structure the signal of a plurality of inspection objects and generation inspection usefulness, and can carry out the input and output of the signal of described inspection usefulness to the part of described a plurality of inspection objects simultaneously at least, it is characterized in that having: constitute by conductive material, thereby contact the input of carrying out electric signal or a plurality of probes of output with described inspection object; Has substrate corresponding to the Wiring pattern of described circuit structure; One end is electrically connected on any of described a plurality of probes, thereby transmits a plurality of input leads of input signal to described inspection object; One end is electrically connected on described substrate, and the other end and described a plurality of inputs are with any of lead or any a plurality of concentric cable that are electrically connected of described a plurality of probes; One end is electrically connected on any of described a plurality of probes, thereby sends a plurality of output leads from the output signal of described inspection object; And constitute by conductive material, be arranged on two adjacent described inspection objects in one check that described output that object is connected is with lead and near the regional barricade that intersects with lead with another described input of checking that object is connected.
Technical scheme 3 described inventions, it is characterized in that, in technical scheme 1 described invention, with adjacent two described inspection objects in one check that described output that object is connected with near lead and the zone that the described input that is connected with another inspection object intersects with lead, also has the shield member that the described output that is connected with a described inspection object is assembled bunchy and is made of conductive material with lead.
The invention effect
According to probe of the present invention, it has: be made of conductive material, thereby contact a plurality of probes of the either party at least of the input of carrying out electric signal or output with checking object; Have corresponding to the substrate that generates the Wiring pattern of checking the circuit structure of using signal; One end is electrically connected on any of described a plurality of probes, thereby transmits a plurality of input leads of input signal to described inspection object; One end is electrically connected on described substrate, and the other end and described a plurality of inputs are with any of lead or any a plurality of concentric cable that are electrically connected of described a plurality of probes; One end is electrically connected on any of described a plurality of probes, thereby sends a plurality of output leads from the output signal of described inspection object; And constitute by conductive material, with adjacent two described inspection objects in one check described output that object is connected with lead and with another described input of checking that object is connected intersect with lead regional near the barricade of setting, thus, can be suppressed at the influence of crosstalking between adjacent inspection object.
Description of drawings
Fig. 1 is the vertical view that the summary of the probe of pattern ground expression one embodiment of the present invention constitutes;
Fig. 2 is pattern ground expression from the side that the arrow A direction of Fig. 1 is looked and the figure of the state when checking;
Fig. 3 is the vertical view that the summary of pattern ground expression TAB constitutes.
Among the figure
The 1-probe; The 2-probe; The 3-probe keeps tool; 3A, 3B-contact area; 4-input lead; The 5-concentric cable; 6-output lead; The 7-substrate; 7A, 7B-ground plane; The 8-barricade; The 9-shield member; 21-input terminal; 21G-input terminal group; 22,24,27,29-ground wire; 23,25,28-ground terminal; 26-output terminal; 26G-output terminal group; The 31-probe; 32-relaying substrate; The 33-intermediary layer; 45-scolding tin; The 51-heart yearn; The 52-shielding that is covered; The 71-terminal for connecting; 100-TAB; 100A, 100B-check object; The 101-electrode pad; 102A, 102B-input weld pad group; 103A, 103B-output weld pad group; 104A, 104B-semi-conductor chip.
Embodiment
Below, describe being used to implement preferred forms of the present invention (after, be called " embodiment ") with reference to accompanying drawing.And, accompanying drawing is a pattern, the ratio of the thickness that should note each several part and the thickness of the relation of width and each several part etc. sometimes also can be with reality different situations, certainly in the relation that also can comprise size each other to each other sometimes or the different part of ratio of accompanying drawing.
Fig. 1 is the vertical view that the summary of the probe of pattern ground expression one embodiment of the present invention constitutes.In addition, Fig. 2 is pattern ground expression from side that the arrow A direction of Fig. 1 is looked and the figure of the state when checking.In the probe 1 shown in these figure, on the base material of semiconductor-chip-mounting and the TAB that constitutes carries out being suitable for when checking or operating characteristic are checked in film like.
Probe 1 has: a plurality of probes 2 that contact with electrode pad 101 that TAB100 is had, accommodate and keep the probe maintenance tool 3 of a plurality of probes 2 by the pattern of the Wiring pattern that is applicable to TAB100, in one end and a plurality of probes 2 TAB100 is carried out any a plurality of input that are electrically connected of probe 2 of signal input usefulness with leads 4, a plurality of concentric cable 5 that one end and input are connected with any other end of lead 4, the a plurality of outputs that in one end and a plurality of probes 2 probe 2 of exporting usefulness from the signal of TAB100 are electrically connected are with leads 6, thereby connect the other end of concentric cable 5 and the fixing substrate 7 of the other end that lead 6 is used in output, adjacent input with lead 4 and output with lead 6 between the setting electromagnetic wave block the barricade 8 of usefulness, and the shield member 9 of a plurality of outputs being assembled the tubulose of bunchy with lead 6.
Probe keeps tool 3 to have the structure that following part is stacked in regular turn: have the hole portion corresponding to the equipping position of probe 2, and accommodate and keep the probe 31 of a plurality of probes 2; Thereby the Wiring construction that is electrically connected with probe 2 is carried out the relaying substrate (space changing substrate) 32 of the conversion of space ground and substrate 7 relayings; And between relaying substrate 32 and substrate 7, be provided with and the intermediary layer 33 of relaying distribution.In addition, probe 2 is via relaying substrate 32 or intermediary layer 33, thereby also can be to make input directly contact the structure of realization electrical connection with lead 6 and probe 2 with lead 4 and output.
Probe 1 can check simultaneously that two are checked object, but generally can check a plurality of inspection objects simultaneously.In Fig. 1, with respect to each zone of checking object contact as contact area 3A, 3B.
Fig. 3 is the vertical view that the summary of pattern ground expression TAB100 constitutes.TAB100 as shown in the drawing on the base material that by thickness is the microscler film like that forms of the polyimide etc. about tens of μ m (micron), disposes a plurality of inspection objects regularly along its length direction.In Fig. 3, be illustrated in upward continuous two of forming of a TAB100 and check object 100A and 100B.
Check that object 100A has: send the input weld pad group 102A of the input signal of self-check device (tester, not shown is looked in electric-examination), send the output weld pad group 103A and the semi-conductor chip 104A of output signal to testing fixture.Check that similarly object 100B also has: import weld pad group 102B, output weld pad group 103B, reach semi-conductor chip 104B.The configuration pattern that constitutes a plurality of electrode pad 101 of importing weld pad group 102A and 102B and output weld pad group 103A and 103B is consistent with the configuration pattern of a plurality of probes 2 of probe maintenance tool 3.In Fig. 3, the distance of checking the output weld pad group 103A of object 100A and the input weld pad group 102B that checks object 100B is less than 4.75mm, and is very approaching.
Being input to the input signal of checking object 100A and 100B, is supply voltage that semi-conductor chip 104A and 104B are driven, high-frequency electric signal etc.Therefore, on input weld pad group 102A and 102B, comprise the signal input terminal of above-mentioned signal and the ground terminal of earthing potential supply usefulness.
When inspection has the TAB100 of above formation, check the electrode pad 101 of object 100A, the preceding end in contact of the probe 2 that keeps with the contact area 3A that keeps tool 3 by probe, on the other hand, check the preceding end in contact of the probe 2 that the electrode pad 101 of object 100B and the contact area 3B that is kept tool 3 by probe keep.
Then, the formation to probe 1 describes.Any is electrically connected with in lead 4 one ends and the probe 2 that is provided with on probe maintenance tool 3 in input, and on the other hand, any is electrically connected in the other end and the concentric cable 5, and probe 2 is electrically connected with concentric cable 5.Import with lead 4 by the single line or the formation of twisting thread such as enameled wire, leads.Output is same with lead 4 with lead 6 and input, also by formation such as enameled wires.In addition, too numerous and diverse for fear of record in Fig. 1 and Fig. 2, only put down in writing input lead 4, concentric cable 5, and the output part separately of lead 6, and, in Fig. 1, omitted the distribution of importing with lead 4 grades and ground-electrode.In addition, about the conveyer line (for example conveyer line of supply voltage supply usefulness) that does not transmit radio-frequency signal, also can will not import with lead 4 and be directly connected to substrate 7 via concentric cable 5.
In substrate 7, the ground plane 7A that earthing potential is fed to the inspection object 100A that contacts with the probe 2 of contact area 3A separates with the ground plane 7B that earthing potential is fed to the inspection object 100B that contacts with the probe 2 of contact area 3B.Thus, ground plane can be separated to the execution aspect (performance board level) of testing fixture, check that with respect to two object 100A and 100B can suppress ground plane cross talk effects each other in Min. ground.
In addition, on substrate 7, on separate areas, be provided with respect to the input of same inspection object and use terminal group 26G with exporting with terminal group 21G.Thus, can carry out layout to distribution in each mode of checking that input signal of object and output signal are not disturbed.
Conductive materials such as barricade 8 use aluminium are realized, and the output that is set at adjacent inspection object 100A with lead 6 and check the input of object 100B neighbouring with the zone that lead 4 intersects, promptly near the boundary of contact area 3A and contact area 3B, be connected with ground terminal 28 via ground wire 27.By this barricade 8 is set, can suppress the influence of crosstalking that produces with lead 4 with lead 6 and the input of checking object 100B by the output of checking object 100A.In addition, as long as the material of softness such as metal by thin film like or mesh realizes barricade 8, then installation becomes easy.
Secondly, with reference to Fig. 2 input is described with lead 4, concentric cable 5 and the output connection sample attitude with lead 6.Input is electrically connected with probe 2 via intermediary layer 33 and relaying substrate 32 with lead 4 one ends, and on the other hand, the other end is connected with the heart yearn 51 of concentric cable 5.Input is connected by scolding tin 45 with heart yearn 51 with lead 4.
In the end of concentric cable 5, in the end of the opposition side of a side that is connected with lead 4 with input, heart yearn 51 is connected with terminal 21 with the input of formation on substrate 7.Input is electrically connected with testing fixture with terminal 21, and concentric cable 5 is connected with terminal 21 with input by the one end and can transmits and check signal and supply voltage etc.In addition, distolateral at concentric cable 5, lining shielding 52 is connected with ground wire 22, and this ground wire 22 is connected with the ground terminal 23 that forms on substrate 7, shields 52 with respect to being covered and supplies earthing potentials.
The other end of concentric cable 5, heart yearn 51 is connected with lead 4 with input, and lining shields 52 and be connected with ground terminal 25 via ground wire 24, and supplies earthing potential.Like this, have the structure of supplying earthing potential from two ends by lining shielding 52 and keep stable earthing potential, suppress to pass to heart yearn 51 from the noise of outside.In addition, lining shielding 52 can wait by scolding tin with being connected of ground wire 22 and 24 and carry out.
Output is electrically connected with probe 2 via relaying substrate 32 with lead 6 one ends, and on the other hand, the other end is connected with terminal 26 with output on being arranged on substrate 7.
With the shield member 9 of a plurality of outputs, be connected with ground terminal 28 via ground wire 29 with lead 6 gathering bunchys.Thus, the electrostatic shielding effect brought of shield member 9 can further improve.
According to the probe of the one embodiment of the present invention of above explanation, it has: be made of conductive material, thereby contact a plurality of probes of the either party at least of the input of carrying out electric signal or output with checking object; Has substrate corresponding to the Wiring pattern of the circuit structure that generates the signal of checking usefulness; One end is electrically connected with any of described a plurality of probes, thereby described inspection object is transmitted a plurality of input leads of input signal; One end is electrically connected with described substrate, and the other end and described a plurality of inputs are with any of lead or any a plurality of concentric cable that are electrically connected of described a plurality of probes; One end is electrically connected with any of described a plurality of probes, thereby sends a plurality of output leads from the output signal of described inspection object; Constitute by conductive material, with adjacent two described inspection objects in one check described output that object is connected with lead and with another described input of checking that object is connected intersect with lead regional near the barricade of setting, thus, can be suppressed at the influence of crosstalking between adjacent inspection object.
In addition, according to present embodiment, can Min. ground when suppressing to check simultaneously a plurality of inspection object the input of sixty-four dollar question point between adjacent inspection object with lead with export with the influence of crosstalking between the lead.
And then, according to present embodiment, thereby form ground plane by check that according to each object separates on the zones of different of substrate, can suppress from the ground connection side checking the influence of object on Min. ground.
In addition, according to present embodiment, with respect to the input of same inspection object with terminal group with export and separate formation in the zones of different of substrate with terminal group, thereby check that respectively input signal of object and output signal can not disturb.
In addition, according to present embodiment, by having shield member owing to constitute not via repeating signal halfway with the relay part of distribution etc., therefore simple constitute under the shielding operation easy, and can realize the distribution that shield effectiveness is good.
(other embodiment)
More than, describe in detail being used to implement preferred forms of the present invention, but the present invention is not limited in an above-mentioned embodiment.For example, in an above-mentioned embodiment, will export by shield member and to assemble bunchy, but the power lead at input side power supply voltage is covered with lead.
In addition, in an above-mentioned embodiment, as prerequisite, but also can make it with single-ended (single end) load mode corresponding to RSDS (Reduced Swing Differential Signaling) or LVDS differential load modes such as (Low Voltage Differential Signaling).In the case, also can the mode of the paired twisted of lead be sought to check being connected of object and testing fixture by using.
In addition, probe of the present invention also can be useful in a plurality of of TAB various element in addition and check simultaneously.
Like this, the present invention can be included in this various embodiment of not putting down in writing etc., also can do not break away from by the claim scope apply various design alteration etc. in the scope of specific technical thought.
Industrial applicibility
As previously discussed, probe card of the present invention, useful when the inspection of stipulating simultaneously with respect to a plurality of inspection objects, be particularly useful for the inspection of the TCP of TAB or COF etc.
Claims (5)
1. probe, be electrically connected between its circuit structure the signal of a plurality of inspection objects and generation inspection usefulness, and can carry out the input and output of the signal of described inspection usefulness to the part of described a plurality of inspection objects simultaneously at least, it is characterized in that having:
Constitute by conductive material, thereby contact the input of carrying out electric signal or a plurality of probes of output with described inspection object;
Has substrate corresponding to the Wiring pattern of described circuit structure;
One end is electrically connected on any of described a plurality of probes, thereby transmits a plurality of input leads of input signal to described inspection object;
One end is electrically connected on described substrate, and the other end and described a plurality of inputs are with any of lead or any a plurality of concentric cable that are electrically connected of described a plurality of probes;
One end is electrically connected on any of described a plurality of probes, thereby sends a plurality of output leads from the output signal of described inspection object; And
Constitute by conductive material, be arranged on two adjacent described inspection objects in one check that described output that object is connected is with lead and near the regional barricade that intersects with lead with another described input of checking that object is connected.
2. probe as claimed in claim 1 is characterized in that,
Described substrate has to described a plurality of inspection object supply earthing potentials, and checks that object separates the ground plane that forms in the zones of different of this substrate according to each.
3. probe as claimed in claim 1 is characterized in that,
With adjacent two described inspection objects in one check that described output that object is connected with near lead and the zone that the described input that is connected with another inspection object intersects with lead, also has the shield member that the described output that is connected with a described inspection object is assembled bunchy and is made of conductive material with lead.
4. probe as claimed in claim 3 is characterized in that,
Described substrate has to described a plurality of inspection object supply earthing potentials, and checks that object separates the ground plane that forms in the zones of different of this substrate according to each.
5. as each the described probe in the claim 1 to 4, it is characterized in that,
Described substrate has with respect to the input end subgroup of described a plurality of inspection objects and output terminal subgroup,
Input with respect to same described inspection object separates formation with terminal group in the zones of different of this substrate with output with terminal group.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP380381/2005 | 2005-12-28 | ||
| JP2005380381A JP4757630B2 (en) | 2005-12-28 | 2005-12-28 | Probe card |
| PCT/JP2006/325756 WO2007074765A1 (en) | 2005-12-28 | 2006-12-25 | Probe card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101346632A CN101346632A (en) | 2009-01-14 |
| CN101346632B true CN101346632B (en) | 2011-03-30 |
Family
ID=38217985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006800491242A Expired - Fee Related CN101346632B (en) | 2005-12-28 | 2006-12-25 | Probe card |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP4757630B2 (en) |
| KR (1) | KR101021253B1 (en) |
| CN (1) | CN101346632B (en) |
| TW (1) | TW200734650A (en) |
| WO (1) | WO2007074765A1 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5260163B2 (en) * | 2008-07-02 | 2013-08-14 | 日置電機株式会社 | Measuring apparatus and measuring method |
| JP5260164B2 (en) * | 2008-07-04 | 2013-08-14 | 日置電機株式会社 | Measuring apparatus and measuring method |
| KR101115958B1 (en) * | 2009-12-11 | 2012-02-22 | (주)기가레인 | Probe card |
| KR101455540B1 (en) * | 2013-10-07 | 2014-11-04 | 주식회사 세디콘 | Probe card |
| CN103926433B (en) * | 2014-03-20 | 2016-06-08 | 上海华力微电子有限公司 | Probe |
| TWI620940B (en) * | 2016-11-14 | 2018-04-11 | 旺矽科技股份有限公司 | Probe card and multi-signal transmission board |
| KR101962529B1 (en) * | 2017-01-03 | 2019-03-26 | 주식회사 텝스 | Vertical ultra-low leakage current probe card for dc parameter test |
| US10914757B2 (en) | 2019-02-07 | 2021-02-09 | Teradyne, Inc. | Connection module |
| WO2023243250A1 (en) * | 2022-06-14 | 2023-12-21 | 住友電気工業株式会社 | Crosstalk measuring method and crosstalk measuring probe |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1638082A (en) * | 2003-12-24 | 2005-07-13 | 株式会社瑞萨科技 | Fabrication method of semiconductor integrated circuit device |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR0138618B1 (en) * | 1993-08-04 | 1998-06-15 | 이노우에 아끼라 | Vertical probe tester card with coaxial probes |
| KR950021486A (en) * | 1993-12-14 | 1995-07-26 | 문정환 | Noise shield of integrated device |
| KR100227283B1 (en) * | 1997-08-22 | 1999-11-01 | 김충환 | Probe card for high frequency |
| JP2002257898A (en) * | 2001-03-06 | 2002-09-11 | Nec Corp | Structure of probe for inspecting semiconductor device and method of making the same |
| JP2003344494A (en) * | 2002-05-24 | 2003-12-03 | Nec Micro Systems Ltd | Emulator probe |
| JP2004117247A (en) * | 2002-09-27 | 2004-04-15 | Advantest Corp | Prober interface device for semiconductor testing device and device interface system for semiconductor testing device |
| KR100702003B1 (en) * | 2003-01-18 | 2007-03-30 | 삼성전자주식회사 | Probe card |
-
2005
- 2005-12-28 JP JP2005380381A patent/JP4757630B2/en not_active Expired - Fee Related
-
2006
- 2006-12-25 KR KR1020087018416A patent/KR101021253B1/en not_active IP Right Cessation
- 2006-12-25 CN CN2006800491242A patent/CN101346632B/en not_active Expired - Fee Related
- 2006-12-25 WO PCT/JP2006/325756 patent/WO2007074765A1/en active Application Filing
- 2006-12-27 TW TW095149164A patent/TW200734650A/en not_active IP Right Cessation
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1638082A (en) * | 2003-12-24 | 2005-07-13 | 株式会社瑞萨科技 | Fabrication method of semiconductor integrated circuit device |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2004-117247A 2004.04.15 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200734650A (en) | 2007-09-16 |
| JP4757630B2 (en) | 2011-08-24 |
| JP2007178406A (en) | 2007-07-12 |
| KR101021253B1 (en) | 2011-03-11 |
| CN101346632A (en) | 2009-01-14 |
| KR20080083020A (en) | 2008-09-12 |
| TWI324256B (en) | 2010-05-01 |
| WO2007074765A1 (en) | 2007-07-05 |
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