CN101340803A - Fixture construction - Google Patents
Fixture construction Download PDFInfo
- Publication number
- CN101340803A CN101340803A CNA2007101278635A CN200710127863A CN101340803A CN 101340803 A CN101340803 A CN 101340803A CN A2007101278635 A CNA2007101278635 A CN A2007101278635A CN 200710127863 A CN200710127863 A CN 200710127863A CN 101340803 A CN101340803 A CN 101340803A
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- China
- Prior art keywords
- screw
- reference column
- fixed structure
- fixed
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
The invention provides a fixed structure which is used for fixing a heat dissipation element on the chip of a printing circuit board; a plurality of studs and a positioning column are arranged on the printing circuit board. The fixed structure comprises a fixed plate; wherein, the fixed plate is provide with a plurality of elastic sheets, a plurality of screw holes and a position limit hole. The screw holes are respectively on the elastic sheets; furthermore, the position limit hole is adjacent to one of the screw holes. Furthermore, the fixed plate is positioned on the studs and the positioning column respectively by the screw holes and the positioning hole so as to lead the fixed plate to be fixed on the heat dissipation element and the chip.
Description
Technical field
The relevant a kind of fixed structure of the present invention, and the structure of the position of relevant a kind of fixedly heat dissipation element particularly.
Background technology
In order to make the computer can be faster and deal with data data in large quantities, the computer producer must manage to quicken the processing speed of the chip of computer inside, yet raising along with the chip processing speed, its heat that is produced in the running is also increasing, therefore just needs good heat abstractor that heat is discharged.
The mostly direct contact chip of traditional heat abstractor, so the heat that chip produced will be passed to heat abstractor by heat conducting mode.Yet, in case heat abstractor is not good with contacting of chip chamber, will make heat conducting efficient greatly reduce, and then the heat that causes chip to produce can't be discharged smoothly by heat abstractor.
Summary of the invention
The purpose of this invention is to provide a kind of fixed structure,, make chip on the heat dissipation element contact print circuit board in order to the fixing position of heat dissipation element.
According to fixed structure of the present invention, it is in order to be fixed in heat dissipation element on the chip of printed circuit board (PCB), and group is provided with a plurality of double-screw bolts and a reference column on the described printed circuit board (PCB).This fixed structure comprises fixed head.Wherein, have a plurality of shell fragments, a plurality of screw and a spacing hole on the fixed head.Described screw lays respectively on the shell fragment, and the contiguous described screw of spacing hole one of them.In addition, reference column has two parts, and the diameter of the first part reference column is greater than the diameter of spacing hole, and the diameter of the second part reference column is less than the diameter of spacing hole; And fixed head is positioned on double-screw bolt and the reference column by screw and spacing hole respectively, and fixed head is fixed on heat dissipation element and the chip.
Adopt the advantage of such scheme of the present invention to be, the present invention is the fixing position of heat dissipation element not only, and after the assembler was attached to reference column with screw, the nut lower edge of screw also can be restrained the position of fixed head, bore excessive stress to avoid chip.
Description of drawings
For above and other objects of the present invention, feature, advantage can be become apparent, preferred embodiment of the present invention is elaborated below with reference to accompanying drawing:
Figure 1 shows that stereogram according to the fixed structure of one embodiment of the invention;
Figure 2 shows that along the profile of Fig. 1 middle conductor A '-A; And
Figure 3 shows that the profile of fixed structure according to another embodiment of the present invention.
Embodiment
With reference to Fig. 1 and Fig. 2, wherein Figure 1 shows that the stereogram of fixed structure according to an embodiment of the invention, and Figure 2 shows that along the profile of Fig. 1 middle conductor A-A '.As shown in the figure, present embodiment provides a kind of fixed structure, and it can be fixed in heat dissipation element 110 on the chip 140 of printed circuit board (PCB) 150, and group is provided with a plurality of double- screw bolt 170a, 170b, 170c, 170d and a reference column 190 on the described printed circuit board (PCB) 150.This fixed structure comprises fixed head 120.Wherein, have a plurality of shell fragment 122a, 122b, 122c, 122d, a plurality of screw 124a, 124b, 124c, 124d and a spacing hole 126 on the fixed head.Described screw 124a, 124b, 124c, 124d lay respectively on shell fragment 122a, 122b, 122c, the 122d, and spacing hole 126 contiguous screw 124a.In addition, fixed head 120 is positioned on double- screw bolt 170a, 170b, 170c, 170d and the reference column 190 by screw 124a, 124b, 124c, 124d and spacing hole 126 respectively, and fixed head 120 is fixed on heat dissipation element 110 and the chip 140.
In Fig. 1, fixed head 120 is to be fixed on heat dissipation element 110 and the chip 140 with screw 130a, 130b, 130c, 130d.More particularly.These screws 130a, 130b, 130c, 130d can pass screw 124a, 124b, 124c, 124d respectively and shell fragment 122a, 122b, 122c, 122d are attached on double- screw bolt 170a, 170b, 170c, the 170d.In addition.Fixed structure also can comprise a location screw 180a, and this set screw 180a can be attached on the reference column 190 in advance.Thus, when the assembler locks screw 130b, the nut lower edge 180 of set screw 180a can be restrained the position of fixed head 120, to avoid pullling tin ball on the chip 140 because of fixed head 120 displacement.
More particularly, when the fixed structure of assembly drawing 1, the assembler can carry out the following step in regular turn: (1) is attached to set screw 180a on the reference column 190; (2) screw 130b is attached on the double-screw bolt 170b; (3) screw 130a is attached on the double-screw bolt 170a; (4) screw 130c, 130d are attached to respectively on double-screw bolt 170c, the 170d.Thus, when locking screw 130b, the nut lower edge 180 of set screw 180a will be restrained shell fragment 122a, make it unlikely warpage.Therefore, when the assembler then locks screw 130a, chip will can not damage because of bearing excessive stress.In addition, set screw 180a also can restrain the position of heat dissipation element 110 simultaneously, and heat dissipation element 110 can not turn clockwise when making assembling, and it is stressed so will to reduce chip 140, and allows the phenomenon of printed circuit board (PCB) 150 distortion slow down.
As shown in Figure 2, the fixed structure of present embodiment also can comprise backboard 160, and described double- screw bolt 170a, 170b, 170c, 170d and reference column 190 are to be extended to form by backboard 160.Should be appreciated that though the backboard 160 of Fig. 2 is depicted as the entity backboard, this does not limit the present invention.When printed circuit board (PCB) next-door neighbour casing was provided with, the assembler also can select directly with casing not need additionally to install additional backboard behind printed circuit board (PCB) as backboard.
In Fig. 2, the height of reference column 190 is higher than double-screw bolt 170a, 170b.Particularly, the reference column 190 of Fig. 2 has two parts, first partly the diameter of reference column 192 greater than the diameter of spacing hole 126, second partly the diameter of reference column 194 then less than the diameter of spacing hole 126.More particularly, spacing hole 126 wears and is positioned on the second part reference column 194.Thus, the user can restrain shell fragment 122a between the nut lower edge 180 and the first part reference column 192 of set screw 180a as long as use general screw as set screw 180a.Wherein, the height of the first part reference column 192 can be identical with the height of chip 140, makes that the plane of its location and the plane of chip are contour after spacing hole 126 penetrates reference column 190 location, to avoid being pressed onto chip when locking.
In addition, provide elasticity strength to force heat dissipation element 110 and chip 140 to be fitted though the fixture of Fig. 1 is shell fragment 122a, 122b, 122c, 122d with flexible material, this does not limit the present invention.For instance, screw 130a, the 130b of Fig. 1,130c, 130d also can be replaced (as shown in Figure 3) by Spring screws, and provide elasticity strength to force heat dissipation element 110 and chip 140 to be fitted whereby.
More particularly, double-screw bolt 170a, the 170b of Fig. 3 is last can to have spring 172, and the two ends of this spring 172 prop up nut lower edge and shell fragment 122a, the 122b of screw 130a, 130b respectively.When the user locks screw 130a, 130b, spring 172 will be under pressure and be out of shape, and push shell fragment 122a, the 122b of fixed head 120, make heat dissipation element 110 and chip 140 fit.In addition, in another embodiment of the present invention, described spring 172 also can be replaced by any elastic ring with flexible material.
In addition, another difference of Fig. 3 and Fig. 2 is that the set screw 180a of Fig. 3 directly is attached on the backboard 160, and does not need reference column.
Though the present invention discloses as above with embodiment; yet it is not in order to qualification the present invention, any person skilled in the art person, without departing from the spirit and scope of the present invention; when can doing various changes that are equal to and retouching, so protection scope of the present invention is when looking being as the criterion that claims define.
Claims (9)
1. a fixed structure in order to a heat dissipation element is fixed on the chip on the printed circuit board (PCB), is organized on the described printed circuit board (PCB) and is provided with a plurality of double-screw bolts and a reference column, it is characterized in that described fixed structure comprises at least:
One fixed head has a plurality of shell fragments, a plurality of screw and a spacing hole on it, described a plurality of screws are positioned on described a plurality of shell fragment, and the contiguous described a plurality of screws of described spacing hole one of them;
Wherein, described reference column has two parts, and the diameter of the first part reference column is greater than the diameter of described spacing hole, and the diameter of the second part reference column is less than the diameter of described spacing hole; And described fixed head is positioned on described a plurality of double-screw bolt and the described reference column by described a plurality of screws and described spacing hole respectively, and described fixed head is fixed on described heat dissipation element and the described chip.
2. fixed structure according to claim 1 is characterized in that, it is characterized in that described fixed head is to be fixed on described heat dissipation element and the described chip with screw.
3. fixed structure according to claim 1 is characterized in that it also comprises a backboard.
4. fixed structure according to claim 3 is characterized in that, described a plurality of double-screw bolts and described reference column are to be extended to form by described backboard.
5. fixed structure according to claim 1 is characterized in that described shell fragment is made by flexible material.
6. fixed structure according to claim 1 is characterized in that at least one of described a plurality of double-screw bolts also comprises a spring.
7. fixed structure according to claim 1 is characterized in that at least one of described a plurality of double-screw bolts also comprises an elastic ring.
8. fixed structure according to claim 1 is characterized in that, the height of described reference column is higher than described a plurality of double-screw bolt.
9. fixed structure according to claim 1 is characterized in that, described spacing hole wears and is positioned on the described second part reference column.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101278635A CN101340803B (en) | 2007-07-06 | 2007-07-06 | Fixture construction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101278635A CN101340803B (en) | 2007-07-06 | 2007-07-06 | Fixture construction |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101340803A true CN101340803A (en) | 2009-01-07 |
| CN101340803B CN101340803B (en) | 2010-09-01 |
Family
ID=40214721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101278635A Active CN101340803B (en) | 2007-07-06 | 2007-07-06 | Fixture construction |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101340803B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101989649A (en) * | 2010-05-25 | 2011-03-23 | 东莞宏威数码机械有限公司 | Limiting device |
| CN110351992A (en) * | 2019-07-25 | 2019-10-18 | 天津七一二通信广播股份有限公司 | The LTE module radiator structure and installation method of rail locomotive TAU communication equipment |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6501647B1 (en) * | 2001-01-09 | 2002-12-31 | Dell Products L.P. | Computer with thermal cooling and a thermal cooling system and method |
| CN2572732Y (en) * | 2002-09-26 | 2003-09-10 | 纬创资通股份有限公司 | Heat sink for heat-producing component on circuit board |
| CN2582336Y (en) * | 2002-11-19 | 2003-10-22 | 英业达股份有限公司 | Radiation apparatus having elastic positioning function |
-
2007
- 2007-07-06 CN CN2007101278635A patent/CN101340803B/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101989649A (en) * | 2010-05-25 | 2011-03-23 | 东莞宏威数码机械有限公司 | Limiting device |
| CN101989649B (en) * | 2010-05-25 | 2012-05-02 | 东莞宏威数码机械有限公司 | Limiting device |
| CN110351992A (en) * | 2019-07-25 | 2019-10-18 | 天津七一二通信广播股份有限公司 | The LTE module radiator structure and installation method of rail locomotive TAU communication equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101340803B (en) | 2010-09-01 |
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