CN101325182A - Wiring substrate with reinforcing member - Google Patents

Wiring substrate with reinforcing member Download PDF

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Publication number
CN101325182A
CN101325182A CN 200810130235 CN200810130235A CN101325182A CN 101325182 A CN101325182 A CN 101325182A CN 200810130235 CN200810130235 CN 200810130235 CN 200810130235 A CN200810130235 A CN 200810130235A CN 101325182 A CN101325182 A CN 101325182A
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CN
China
Prior art keywords
stiffener
substrate
wiring substrate
resin
protrusion tab
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN 200810130235
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Chinese (zh)
Inventor
河边忠彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
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NGK Spark Plug Co Ltd
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Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Publication of CN101325182A publication Critical patent/CN101325182A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

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Abstract

A wiring substrate with a reinforcing member includes: a resin wiring substrate having a substrate principal surface, a substrate rear surface, and substrate side surfaces, forming a rectangular shape having four sides in plan view, and including a resin insulating layer and a conductor layer; and a reinforcing member formed in a rectangular frame shape which surrounds the four sides of the resin wiring substrate, and provided with an inner wall having a depression surface-joined to at least one of the substrate side surfaces, an outer peripheral portion of the substrate principal surface, and an outer peripheral portion of the substrate rear surface.

Description

The wiring substrate that has stiffener
The cross reference of related application
The application requires the Japanese patent application JP2007-158841 of submission on June 15th, 2007, and the rights and interests of the Japanese patent application JP2007-158842 that submitted on June 15th, 2007, and its full content is herein incorporated by reference, and is the same as described in detail.
Technical field
The present invention relates to have the wiring substrate of stiffener, described wiring substrate comprises the stiffener that is used to prevent resin wiring substrate warpage.
Background technology
Because IT changes, brought bigger variation to social structure as the popularizing of electronic equipment of personal computer or cell phone and so on.The core of this technology is large-scale semiconductive integrated circuit (LSI) technology, and for realizing the raising of computational speed, the operating frequency of this LSI (LSI chip) uprises day by day.In addition, the state (so-called semiconductor packages state) that is connected in upside-down mounting on the wiring substrate that is used to install LSI of LSI chip uses (for example, with reference to JP-A-2002-26500 (Fig. 1 etc.)) down.This LSI chip uses thermal coefficient of expansion to be generally 2.0ppm/ ℃ to about 5.0ppm/ ℃ semi-conducting material (for example, silicon etc.) formation.On the other hand, the wiring substrate that is used to install LSI typically uses the resin wiring substrate that thermal coefficient of expansion forms much larger than the resin material of semi-conducting material.As the example of this resin wiring substrate, such example is proposed traditionally, wherein built-in layer is formed on the front and back of the core substrate of being made by polymeric material.
Simultaneously, in recent years, the miniaturization along with the equipment of semiconductor packages will be installed on it requires miniaturization of resin wiring substrate and attenuation.Yet if the thickness of resin wiring substrate attenuation, particularly core substrate is set to for example 800 μ m or littler, the rigidity of resin wiring substrate reduces inevitable.In this case, when being used for the solder cools that flip-chip connects, the resin wiring substrate is subjected to the influence of the thermal stress that caused by the coefficient of thermal expansion differences between chip material and the baseplate material, and is easy to warpage on chip installed surface one side.Thus, often cause the cracking at chip join place, or open failure (open-failure) often occurs.That is to say, in the situation of the LSI chip configuration semiconductor packages of face, can occur to realize high-yield-ratio or reliability problems in the use.In addition, if the problem that the disposal ability of semiconductor packages reduces then appears in the miniaturization of resin wiring substrate.
In order to solve top problem, propose a kind of semiconductor packages 100 (with reference to Figure 13 and Figure 14), wherein used double-sided tape 104 (or scolder etc.) that metal armature 105 is attached on the surface (substrate interarea 102 or substrate back 103) of resin wiring substrate 101.Therefore, owing to suppressed the warpage of resin wiring substrate 101 by armature 105, and the joint between resin wiring substrate 101 and LSI chip 106 can produce cracking hardly, so yield tensile ratio uprises, reliability improves.In addition, because by pasting armature 105, the rigidity of semiconductor packages 100 uprises, the disposal ability of semiconductor packages 100 improves.
Summary of the invention
Simultaneously, because armature 105 has the only simple shape (plate shaped) that contacts of surface with resin wiring substrate 101, so must make the rigidity of armature itself higher so that can suppress the warpage of resin wiring substrate 101.Therefore, although can be to make armature 105 thickenings with imagining, whole semiconductor packages 100 thickenings, it may cause the expansion of semiconductor packages 100.Thus, be indispensable even form the armature 105 be subjected to the high rigidity metal material that stress influence can warpage yet.Yet because the metal material of high rigidity is normally expensive, so the manufacturing cost of armature 105 will raise, the manufacturing cost of semiconductor packages 100 will increase thus.
Make the present invention in view of the foregoing problems, and the purpose of this invention is to provide the wiring substrate that has stiffener, described wiring substrate can improve reliability and disposal ability, and can not increase the manufacturing cost of stiffener.
In addition, in above-mentioned LSI chip 106, because the raising of performance, it is big that the consumption of electric current is tending towards becoming.Therefore, must in resin wiring substrate 101, be provided for supplying with the feed path of big electric current.And, resin wiring substrate 101 has such structure, wherein the built-in layer that is made of resin insulating barrier and conductor layer is stacked on the front and back of core substrate, and feed path is the path of passing the via conductors of core substrate, a plurality of conductor layer and passing the via conductor of resin insulating barrier along its thickness direction by the thickness direction along it.
Yet,, should make large-scale design variation in order in resin wiring substrate 101, to provide feed path.Promptly allow to provide feed path, but owing to 101 attenuation of resin wiring substrate make conductor layer thin, so resistance is bigger.In addition, because the space, being difficult to increases the external diameter of via conductors or via conductor or increases its quantity, so resistance is bigger.Therefore, even owing to electric current is supplied with to substrate interarea 102 from substrate back 104 via feed path, but pressure drop becomes big, so can not guarantee big electric current supply to LSI chip 106.
In addition, because the armature 105 of traditional structure is the armature that only has the function of strengthening resin wiring substrate 11, so, be the further multifunction of armature if additional function is provided with taking into account.
Make preferred aspect of the present invention in view of the foregoing problems, its objective is provides a kind of wiring substrate that has stiffener, described wiring substrate can be supplied with big electric current from the conductor layer of the conductor layer on substrate back one side on substrate interarea one side, and need not to change the structure of resin wiring substrate; And described wiring substrate can improve reliability and disposal ability, and can not increase the manufacturing cost of stiffener.
Method as problem above solving, has a kind of wiring substrate that has stiffener, described wiring substrate comprises: the resin wiring substrate, it has substrate interarea, substrate back and substrate side surfaces, have the rectangular shape of four sides in the formation plane graph, and have the structure that wherein is stacked with resin insulating barrier and conductor layer; And stiffener, it forms the rectangular frame shape around four sides of described resin wiring substrate, and has at least one the recess that wall place face within it is connected to the peripheral part of the peripheral part of described substrate side surfaces, described substrate interarea and described substrate back.
Therefore, according to the present invention of said method, described stiffener face is connected at least two surfaces that are in four sides of resin wiring substrate.Thus, because four sides of resin wiring substrate can access reliable reinforcement, guaranteed to suppress the warpage of resin wiring substrate.Therefore, owing to prevented the defective that the warpage by the resin wiring substrate causes, improve so have the reliability of the wiring substrate of stiffener.In addition, owing to be connected by the face of stiffener with the resin wiring substrate, the rigidity that has the wiring substrate of stiffener uprises, and improves so have the disposal ability of the wiring substrate of stiffener.And, because stiffener has recess, and has the shape higher than pure flat shape stiffness, so need not to use the material of expensive and high rigidity to make the stiffener thickening or form the armature member.Thereby reliability and disposal ability can be improved, and need not to increase the manufacturing cost of stiffener.In preferred aspects of the invention, in the wiring substrate of the stiffener of on have, inventing, tabular binding post sheet is provided, described tabular binding post sheet is fixed to stiffener along the inner surface or the outer surface of stiffener, and form and contact, thereby be electrically connected described conductor layer with the conductor layer of resin wiring substrate and the conductor layer of the resin wiring substrate on substrate back one side on substrate interarea one side.
Therefore, according to the preferred aspect of foregoing invention, described stiffener face is connected at least two surfaces that are in four sides of resin wiring substrate.Therefore, along the inner surface of stiffener or outer surface tabular binding post sheet is fixed to stiffener and becomes easy.Thus, by travelling back across the outside of resin wiring substrate, can be electrically connected conductor layer on substrate interarea one side and the conductor layer on substrate back one side.Therefore, can big electric current be supplied to conductor layer on substrate interarea one side from the conductor layer on substrate back one side, and need not to change the structure of resin wiring substrate by tabular binding post sheet.
The resin wiring substrate that constitutes the wiring substrate that has stiffener can be considered cost attribute, workability, insulation property, mechanical strength etc. and suitably selection.As the resin wiring substrate, use a kind of like this resin wiring substrate, it has substrate interarea, substrate back and four substrate side surfaces, forms in the plane graph to have the rectangular shape of four sides, and has the structure that wherein is stacked with resin insulating barrier and conductor layer.
Described resin insulating barrier can be considered insulation property, thermal resistance, moisture resistance etc. and suitably select.The suitable example that is used to form the polymeric material of resin insulating barrier comprises thermosetting resin, such as epoxy resin, phenolic resins, polyurethane resin, silicones and poly-imide resin; And thermoplastic resin, such as polycarbonate resin, acrylic resin, polyacetal resin and acrylic resin etc.In addition, can use the composite material and the resin-resin composite materials of these resins and organic fiber (such as Fypro) or glass fibre (glass fabric fiber and non-woven glass fibre), in described resin-resin composite materials, be injected in the three-dimensional netted resin base material (such as continuous poriferous polytetrafluoroethylene) based on fluorine such as the thermosetting resin of epoxy resin.
Conductor layer mainly is made of copper, and by known technology, forms such as subtractive method, semi-additive process or fully-additive process.More properly, for example, use technology such as etching, electroless copper or the electrolytic copper plating of Copper Foil.In addition,, form conductor layer, perhaps also can form conductor layer by the printing of conducting resinl etc. by carrying out etching by after forming film such as spraying plating or CVD technology.
In addition, metallic plate (metal-cored) can be arranged in the internal layer in the resin wiring substrate as core.Example as the metal that constitutes metallic plate has copper, copper alloy, is different from the metal simple-substance of copper or alloy etc.In addition, the resin wiring substrate can be such, and wherein resin insulating barrier and conductor layer alternately are formed on the core substrate (being formed from a resin).
The stiffener face that constitutes the wiring substrate have stiffener is connected at least one of peripheral part of the peripheral part of substrate side surfaces, substrate interarea and substrate back.Although the shape of stiffener be not special limit but arbitrarily, expect that having plane (inwall) is connected to the peripheral part of substrate side surfaces, substrate interarea and the peripheral part of substrate back with face.Therefore, the preferred peripheral part that for example uses the stiffener in L shaped cross section substantially to be connected to substrate side surfaces and substrate interarea with face; The stiffener in L shaped cross section is connected to the peripheral part of substrate side surfaces and substrate back with face substantially; The stiffener in U-shaped cross section is connected to the peripheral part of substrate side surfaces, substrate interarea and the peripheral part of substrate back etc. with face substantially.Especially, expectation uses the stiffener in cardinal principle U-shaped cross section to be connected to the peripheral part of substrate side surfaces, substrate interarea and the peripheral part of substrate back with face.Therefore, to have the situation in L shaped cross section substantially than stiffener higher because the rigidity of stiffener becomes, so the rigidity of resin wiring substrate further improves.In addition, because the selectable kind that is used for the formation material of stiffener further increases, material forms stiffener so can use cheaply, and the manufacturing cost of stiffener further reduces.
In addition, face is connected to substrate side surfaces, the example of the cardinal principle U-shaped cross section stiffener of the peripheral part of substrate interarea and the peripheral part of substrate back can comprise a such example, its center dant is by the stiffener main body, first protrusion tab and second protrusion tab constitute, described stiffener main body can contact with substrate side surfaces formation face, described first protrusion tab can be given prominence to and contact with the peripheral part formation face of substrate interarea to the center of resin wiring substrate from described stiffener main body, and described second protrusion tab can be given prominence to and contact with the peripheral part formation face of substrate back to the center of resin wiring substrate from described stiffener main body.In this case, preferably, make spacing between described first protrusion tab and described second protrusion tab less than the thickness of resin wiring substrate, the resin wiring substrate is clipped in the middle by described first protrusion tab and described second protrusion tab.Therefore, because three surfaces of the inner surface (inwall) of inner surface (inwall) that can be by comprising the stiffener main body, the inner surface (inwall) of first protrusion tab and second protrusion tab keep the resin wiring substrates, thereby, can more stably keep the resin wiring substrate.In addition, even do not use adhesive, stiffener also can be connected to the resin wiring substrate reliably.In addition, if use adhesive, then being connected between resin wiring substrate and the stiffener becomes more reliable.In addition, be installed on substrate interarea one side at for example semiconductor integrated circuit element, and substrate back one side is connected to the situation of the motherboard that is used for installing the resin wiring substrate, the thickness of preferred second protrusion tab is less than the thickness of first protrusion tab.Therefore, even owing to be fixed in the situation of resin wiring substrate at stiffener, the spacing between substrate back and the motherboard does not need to become too big yet, so can easily connect part and motherboard on substrate back one side.In addition, preferably, the overhang of first protrusion tab is set to the overhang greater than second protrusion tab.Thereby, because the rigidity of stiffener becomes higher less than the situation of the overhang of second protrusion tab than the overhang of first protrusion tab, so the rigidity of resin wiring substrate further improves.
Here, as top semiconductor integrated circuit element, use thermal coefficient of expansion less than 5.0ppm/ ℃ semiconductor integrated circuit element.The thermal coefficient of expansion of expectation semiconductor integrated circuit element is specially 2.0ppm/ ℃ or bigger and less than 5.0ppm/ ℃.The example of semiconductor integrated circuit element can comprise by thermal coefficient of expansion and is approximately the semiconductor integrated circuit element (LSI chip) that 4.0ppm/ ℃ silicon is made.Although semiconductor integrated circuit size of component and shape are not special the qualifications, expect that at least one side is 5.0mm or bigger.This be because, if use this large-sized semiconductor integrated circuit element, then thermal capacity trend increases, element is subjected to stress influence easily, therefore, has realized remaining the purpose of the present invention that the present invention solves.This be because, if use this thin semiconductor integrated circuit element, then thermal capacity trend increases, element is subjected to stress influence easily, therefore, has realized purpose of the present invention.
Herein, " thermal coefficient of expansion " of semiconductor integrated circuit element is meant the thermal coefficient of expansion in the direction (XY direction) vertical with thickness direction (Z direction), and indication is by the value between 0 ℃ and 100 ℃ of TMA (thermomechanical analyzer) measurement." TMA " is meant the equipment of carrying out thermo-mechanical analysis, for example appointed equipment in JPCA-BU01.
Preferably, stiffener is by making than the higher resin material of resin material rigidity that constitutes the resin wiring substrate.For example, preferably, stiffener is by making than the higher resin material of resin material Young's modulus that constitutes the resin wiring substrate.More specifically, suitably be that the Young's modulus that constitutes the resin material of stiffener is 50Gpa or bigger.This be because, if give stiffener itself higher rigidity, then the stiffener of face connection can provide higher rigidity for the resin wiring substrate, the resin wiring substrate becomes firmer for the stress that applies from the outside.In addition, this is because if use the stiffener with high rigidity, even then stiffener is made to such an extent that the very thin resin wiring substrate that also can be provides sufficiently high rigidity, therefore, will can not hinder the attenuation of the whole wiring substrate that has stiffener.In addition, have the condition of higher rigidity if stiffener satisfies it than resin wiring substrate, then stiffener can be made by pottery or metal.Yet based on the viewpoint of manufacturing cost or weight saving, preferred stiffener is generally by making than ceramic material and the more cheap and lighter resin material of metal material.
The suitable example that constitutes the resin material of stiffener comprises PB resin (polybutene resin), PA resin (polyamide), ABS resin (acrylonitrile butadient styrene), PBT resin (polybutylene terephthalate (PBT)), PPS resin (polyphenylene sulfide), PI resin (poly-imide resin), PC resin (polycarbonate resin) etc.In addition, can use the composite material of these resins and organic fiber (such as Fypro) or glass fibre (glass fabric fiber and non-woven glass fibre).
In addition, preferably, stiffener also has low thermal coefficient of expansion except that having high rigidity.The thermal coefficient of expansion of expectation stiffener is less than the thermal coefficient of expansion of resin insulating barrier, is specially 5ppm/ ℃ or bigger and less than 20ppm/ ℃.
Although the stiffener face is connected to the resin wiring substrate, the technology that face connects is not special the qualification, can adopt the known technologies such as attribute, shape of the material that is suitable for forming stiffener.For example, preferably, the inwall of recess is connected at least one of peripheral part of the peripheral part of substrate side surfaces, substrate interarea and substrate back by the adhesive face.Therefore, stiffener reliably and easily can be connected to the resin wiring substrate.For example, preferably, be attached on the tabular binding post sheet, and connect and be fixed at least one of peripheral part of the peripheral part of substrate side surfaces, substrate interarea and substrate back by adhesive by the inner surface portion of adhesive with stiffener.Therefore, tabular binding post sheet reliably and easily can be connected to stiffener, and stiffener reliably and easily can be connected to the resin wiring substrate.In addition, in the situation that stiffener is made of resin material, described adhesive comprises acryloid cement, the adhesive based on epoxy, cyanoacrylate adhesive, based on adhesive of rubber etc.In addition, in the situation that stiffener is made by metal material or ceramic material, described adhesive comprises with the adhesive of polymer as its main component.
In addition, preferably, stiffener is made of a plurality of track components, and forms rectangular frame shape by described a plurality of track components are connected to each other in their ends separately.In addition, stiffener can be the rail-like member, and can form rectangular frame shape by three bends that bending is arranged in the described rail-like member.Since structure in the situation that stiffener is made of a plurality of track components than in stiffener is the situation of rail-like member, becoming simpler, so the manufacturing cost of the stiffener of being made by a plurality of track components further reduces.On the other hand, if stiffener is the rail-like member, because track component process connected to one another is become unnecessary, so that the manufacturing of stiffener becomes is easy.Here, although the shape of each of plane graph middle orbit member is arbitrarily basically, but track component forms such shape, when being connected to each other, it becomes rectangular frame shape, for example, is roughly rod (being roughly I shape in plane graph) in plane graph, in plane graph, be roughly L shapedly, in plane graph, be roughly U-shaped etc.In addition, if track component forms identical shape, because the equipment that all track components can be identical formation, so the manufacturing cost of stiffener can further reduce.
The method of making stiffener comprises carries out the method for laser processing with the stiffener that cuts out rectangular frame shape to resin sheet, cut out a plurality of track components and described track component is connected to each other in their ends separately with the method for the stiffener that obtains rectangular frame shape by laser processing resin sheet, die-cut resin sheet is to obtain the method for stiffener, resin component element is injected mould obtains stiffener to solidify this resin component element method, and the method that obtains stiffener by the art of printing.
Stiffener can comprise conductor pin and terminal pad, part on the described conductor pin electrical connection inner surface side and the part on the outer surface side, described terminal pad setting on the outer surface and be connected to described conductor pin, and the tabular binding post sheet that provides in aspect the present invention is preferred can be connected to the end of the described conductor pin on the inner surface side.Therefore, electronic component can be installed on the outer surface of stiffener.In electronic component is installed in situation on the resin wiring substrate, if electronic component has defective, then not only electronic component but also resin wiring substrate also will become useless.On the other hand, as mentioned above electronic component being installed in the situation of stiffener, only need to reinstall electronic component.Therefore, the resin wiring substrate can not become useless.
The conductor layer of the resin wiring substrate on the tabular binding post sheet that constitutes the wiring substrate that has stiffener in the preferred aspect of the present invention and the substrate interarea side and the conductor layer formation of the resin wiring substrate on the substrate back side contact, thereby are electrically connected described conductor layer.Although tabular binding post sheet can be fixed to stiffener along the inner surface of stiffener, perhaps can be fixed to stiffener along the outer surface of stiffener, preferred tabular binding post sheet is fixed to stiffener along the inner surface of stiffener.Therefore, because tabular binding post sheet is subjected to the protection of stiffener, so can prevent owing to tabular binding post sheet contacts the short circuit that causes with other conductor component.In addition, can prevent the breakage, corrosion etc. of tabular binding post sheet.
As the material that the tabular binding post sheet that provides in the preferred aspect of the present invention is provided, it is desirable having conductive material (for example, conductive metallic material).For example, suitable uses such as iron, silver, copper, copper alloy, nickel, nickel alloy, tin, ashbury metal, alloy, tungsten, molybdenum based on iron nickel, described alloy such as invar alloy based on iron nickel is (based on the alloy of iron nickel, 36% nickel), so-called 42 alloys are (based on the alloy of iron nickel, 42% nickel) and so-called 50 alloys (based on the alloy of iron nickel, 50% nickel).
Preferably, the tabular binding post sheet that provides in preferred aspects of the invention is by making than the higher conducting metal of resin wiring substrate rigidity.For example, preferred tabular binding post sheet is by making than the higher conductive metallic material of resin material Young's modulus that constitutes the resin wiring substrate.More properly, suitably be that the Young's modulus that constitutes the conductive metallic material of stiffener is 50GPa or bigger.This be because, if give tabular binding post sheet itself higher rigidity, then stiffener and tabular binding post sheet can both provide higher rigidity for the resin wiring substrate, the resin wiring substrate becomes firmer for the stress that applies from the outside.
In addition, preferably, the tabular binding post sheet that provides in preferred aspects of the invention also has low thermal coefficient of expansion except that having high rigidity.Expect the thermal coefficient of expansion of the thermal coefficient of expansion of tabular binding post sheet, be specially 1ppm/ ℃ or bigger and less than 20ppm/ ℃ less than the resin wiring substrate.
Here, tabular binding post sheet is by known technology manufacturing.For example, as needs, can make tabular binding post sheet to form punching, groove etc. by the processing metal plate.As the processing method in this situation, can use such as etched chemical process method, and can use such as the cutting and the machining of punching.
In addition, preferably, the tabular binding post sheet that provides in the preferred aspect of the present invention is fixed on the stiffener along the inner surface of stiffener, the part of stiffener inner surface is formed with the pockets that is used to hold tabular binding post sheet, and the degree of depth of described pockets equals the thickness of tabular binding post sheet.If this structure is provided, when tabular binding post sheet is contained in the pockets, surperficial concordant on the tabular binding post sheet side on the edge of opening side of the inner surface of stiffener and pockets.Thus, even under tabular binding post sheet is arranged in situation between resin wiring substrate and the stiffener, also can guarantee the contact area between the surface (at least one in substrate side surfaces, substrate interarea and the substrate back) of the inner surface and the resin wiring substrate of stiffener.Therefore, can strengthen four sides of resin wiring substrate more reliably.In addition, because tabular binding post sheet remains the state that is contained in this pockets, so alignment is easy to.In addition, if adhesive is injected this pockets, the alignment of then tabular binding post sheet will be more reliable.
In addition, preferably, the tabular binding post sheet that provides in the preferred aspect of the present invention and substrate interarea form with conductor layer with power supply on the substrate back side and contact, perhaps with substrate interarea and substrate back side on conductor layer for grounding form and contact, thereby be electrically connected described power supply usefulness conductor layer and described conductor layer for grounding.Therefore, owing to can make big electric current flow through power supply with conductor layer or conductor layer for grounding, so the semiconductor integrated circuit element that is installed at least one of substrate interarea and substrate back can be operated reliably by tabular binding post sheet.
In addition, more preferably, provide a plurality of tabular binding post sheets, stiffener is made by dielectric resin material.Therefore, big electric current is flowed by described a plurality of tabular binding post sheets.And, because stiffener made by dielectric resin material, so can prevent the short circuit of feed path by each of tabular binding post sheet.
In addition, preferably, at stiffener by the stiffener main body, first protrusion tab and second protrusion tab constitute, described stiffener main body can contact with substrate side surfaces formation face, described first protrusion tab can be given prominence to and contact with the peripheral part formation face of substrate interarea to the center of resin wiring substrate from the stiffener main body, described second protrusion tab can from the stiffener main body to the center of resin wiring substrate outstanding and with situation that the peripheral part formation face of substrate back contacts, tabular binding post sheet is by the terminal plate main body, first protuberance and second protuberance constitute, described terminal plate main body can form with the stiffener main body with substrate side surfaces and contact, described first protuberance can be given prominence to and contact with the described first protrusion tab formation face with the peripheral part of substrate interarea to the center of resin wiring substrate from described terminal plate main body, and described second protuberance can be given prominence to and contact with the described second protrusion tab formation face with the peripheral part of substrate back to the center of resin wiring substrate from described terminal plate main body.
The overhang of first protuberance is set to the overhang greater than first protrusion tab, and the overhang of second protuberance is set to the overhang greater than second protrusion tab.Therefore, the conductor layer on the substrate interarea side at the peripheral part place of substrate interarea not only, and also the conductor layer on the substrate interarea side of the center of substrate interarea also can touch first protuberance.Similarly, the conductor layer on the substrate back side at the peripheral part place of substrate back not only, and also the conductor layer on the substrate back side of the center of substrate back also can touch second protuberance.Thus, by tabular binding post sheet, the conductor layer on the substrate interarea side can be connected more reliably with conductor layer on the substrate back side.
Description of drawings
Fig. 1 is a perspective schematic view, has shown the semiconductor packages among this embodiment.
Fig. 2 is a perspective schematic view, has shown this semiconductor packages.
Fig. 3 is a schematic cross sectional views, has shown this semiconductor packages.
Fig. 4 is the cutaway view that shows the critical piece of this semiconductor packages.
Fig. 5 is a perspective schematic view, has shown that armature is fixed to the state of resin wiring substrate.
Fig. 6 is a perspective schematic view, has shown the structure of armature.
Fig. 7 is a schematic cross sectional views, has shown the relation between armature and the tabular binding post sheet.
Fig. 8 is a front view, has shown the adjacent domain of the pockets in the armature.
Fig. 9 is the cutaway view that shows the critical piece of the semiconductor packages among another embodiment.
Figure 10 is the cutaway view that shows the critical piece of the semiconductor packages among the another embodiment.
Figure 11 is the cutaway view that shows again the critical piece of the semiconductor packages among the embodiment.
Figure 12 is the cutaway view that shows the critical piece of the semiconductor packages among another embodiment.
Figure 13 is a perspective schematic view, has shown the semiconductor packages in the conventional art.
Figure 14 is a schematic cross sectional views, has shown this semiconductor packages in the conventional art.
Figure 15 is a perspective schematic view, has shown the semiconductor packages among the another embodiment.
Figure 16 is an explanatory, has shown the structure of the armature among the another embodiment.
[Reference numeral]
11,11A, 11B, 11C, 11D: as the wiring substrate of the wiring substrate that has stiffener
31,27131A, 31B, 31C, 91: as the armature of stiffener
32,92,121,131: the outer surface of stiffener
33,93,132: the inner surface of stiffener
34: recess
35,36: track component
37: the stiffener main body
38,111,122: the first protrusion tabs
39,112: the second protrusion tabs
40: the resin wiring substrate
41: the substrate interarea
42: substrate back
43: substrate side surfaces
50: adhesive
53,54: resin insulating barrier
55: conductor layer
70: pockets
71: as the power supply of tabular binding post sheet with tabular binding post sheet
72: as the earthy tabular binding post sheet of tabular binding post sheet
73: as the power supply conductor of conductor layer on the substrate interarea side and the conductor layer on the substrate back side
74: as the earthy conductor of conductor layer on the substrate interarea side and the conductor layer on the substrate back side
75: the terminal plate main body
76: the first protuberances
77: the second protuberances
82,133: as the via conductors of conductor pin
83,134: terminal pad
272: the rail-like member
273: bend
L1: the overhang of first protuberance
L2: the overhang of second protuberance
Embodiment
Hereinafter with reference to the accompanying drawings one embodiment of the present of invention are described in detail.
As shown in Figures 1 to 4, the semiconductor packages 10 of this embodiment is PGA (pin grid arrays), and described PGA is made of the LSI chip 21 of wiring substrate 11 that has armature (wiring substrate that has stiffener) and semiconductor integrated circuit element.In addition, the form of semiconductor packages 10 is not limited only to PGA.For example, this semiconductor packages can be BGA (ball grid array), LGA (contact array encapsulation) etc.LSI chip 21 has the rectangular flat shape of 15.0mm (length) * 15.0mm (wide) * 0.8mm (thick), and is that 4.2ppm/ ℃ silicon is made by thermal coefficient of expansion.Unshowned circuit element is formed on the superficial layer on bottom surface 24 sides of LSI chip 21.In addition, a plurality of splicing ears 22 are arranged on bottom surface 24 sides of LSI chip 21 with the grid pattern.
On the other hand, the wiring substrate 11 that has armature comprises resin wiring substrate 40 and the armature 31 (hereinafter being called " armature ") that is used for wiring substrate, and described armature 31 is stiffeners.
And, of the present invention preferred aspect, the wiring substrate 11 that has an armature comprises resin wiring substrate 40, as the armature 31 of stiffener and three tabular binding post sheets (particularly, two power supply with tabular binding post sheet 71 and an earthy tabular binding post sheet 72).Resin wiring substrate 40 has a substrate interarea 41, substrate back 42 and four substrate side surfaces 43, and forms the rectangular shape that has four sides in the plane graph.And, resin wiring substrate 40 has the general rectangular slab core substrate of being made by glass-epoxy 44, and be built-in multi-layered wiring board, described multi-layered wiring board has the first built-in layer 51 on the core interarea 45 (end face of Fig. 4) that is arranged in core substrate 44, and has the second built-in layer 52 on the core back side 46 (bottom surface of Fig. 4) that is arranged in core substrate 44 equally.
As shown in Figure 4, the core substrate 44 of this embodiment has 50.0mm (length) * 50.0mm (wide) * 0.4mm (thick) general rectangular shape in plane graph.Core substrate 44 (XY direction) on in-plane has the thermal coefficient of expansion that is approximately 10 to 30ppm/ ℃ (being specially 18ppm/ ℃).In addition, the thermal coefficient of expansion of core substrate 44 is meant 0 ℃ and glass transition temperature (T g) between the mean value of measured value.And a plurality of via conductors 47 that pass the core interarea 45 and the core back side 46 are formed in the core substrate 44.Via conductors 47 is electrically connected the part that is positioned at the core substrate 44 on core interarea 45 sides and the core back side 46 sides.In addition, the inside of via conductors 47 is embedding for example occluder 48, such as epoxy resin.Equally, in the opening that the lid shape conductor of being made by copper coating 49 is formed in the via conductors 47, thus, blocked via conductors 47.
As shown in Figure 4, the first built-in layer 51 that is formed on the core interarea 45 of core substrate 44 has such structure, and wherein two resin insulating barriers 53 made by thermosetting resin (epoxy resin) and the conductor layer 55 that is made of copper are alternately stacked.In this embodiment, the thermal coefficient of expansion of resin insulating barrier 53 is 10 to 60ppm/ ℃ (being specially about 20ppm/ ℃).In addition, the thermal coefficient of expansion of resin insulating barrier 53 is meant 0 ℃ and glass transition temperature (T g) between the mean value of measured value.The a plurality of via conductors 58 that are connected to conductor layer 55 are formed in each of resin insulating barrier 53.In addition, via conductor 58 is the conformal paths (conformalvias) (wherein copper facing does not have the path of embedding fully form) that form by electrolytic copper plating.And a plurality of terminal pads 56 are formed on the surface of second resin insulating barrier 53 with array pattern.In addition, all be coated with the solder resist (not shown) on the almost whole surface of second resin insulating barrier 53.The opening (not shown) is formed on the predetermined point of solder resist, and wherein terminal pad 56 exposes by this opening, and a plurality of solder bumps 57 are arranged on the surface of terminal pad 56.Solder bump 57 is electrically connected to the face binding post 22 of LSI chip 21 respectively.Just, LSI chip 21 is installed on substrate interarea 41 sides of resin wiring substrate 40.In addition, will be filled into by the underfilling 61 that thermosetting resin is made in the gap between LSI chip 21 and the resin wiring substrate 40.
As shown in Figure 4, the second built-in layer 52 that is formed on the core back side 46 of core substrate 44 has and the above-mentioned first built-in layer 51 structure much at one.Just, the second built-in layer 52 has such structure, two resin insulating barriers 54 and the conductor layer 55 wherein made by thermosetting resin (epoxy resin) are alternately stacked, and the thermal coefficient of expansion of resin insulating barrier 54 is 10 to 60ppm/ ℃ (being specially about 20ppm/ ℃).
In addition, a plurality of via conductors 58 that are connected to conductor layer 55 are formed in each of resin insulating barrier 54.In addition, via conductor 58 is the conformal paths that form by electrolytic copper plating.And the pad that is electrically connected to conductor layer 55 59 of a plurality of PGA of being used for is formed on the bottom surface of second resin insulating barrier 54.In addition, the almost whole bottom surface of second resin insulating barrier 54 all is coated with the solder resist (not shown).The opening (not shown) is formed on the predetermined point of solder resist, and the pad 59 that wherein is used for PGA exposes by this opening.On the surface of the pad 59 that is used for PGA, a plurality of pins 60 that are used for being electrically connected with motherboard not shown in the figures are by being welded together.Equally, the wiring substrate 11 that has an armature shown in Fig. 1 to Fig. 4 is installed on the motherboard not shown in the figures by pin 60.
As shown in Fig. 1 to Fig. 8, armature 31 is the annular resin elements around 40 4 sides of resin wiring substrate (promptly constituting the side of four substrate side surfaces 43).Armature 31 among this embodiment has the general rectangular shape of 52.0mm (length) * 52.0mm (wide) * 2.0mm (thick) in plane graph.In addition, because surface (end face among Fig. 3) area of armature 31 is 588mm 2, and the area of the substrate interarea 41 of resin wiring substrate 40 is 2500mm 2So, the surface area of armature 31 approximately be substrate interarea 41 area 24%.Armature 31 is by forming than resin material (being glass-epoxy and epoxy resin among this embodiment) resin material (being polybutene resin among this embodiment) that rigidity is bigger that constitutes resin wiring substrate 40 (core substrate 44 and built-in layer 51 and 52).Thus, the thermal coefficient of expansion of armature 31 is set to the value less than the thermal coefficient of expansion of resin insulating barrier 53 and 54 (approximately 20ppm/ ℃), specifically is set to 15ppm/ ℃.And the Young's modulus of armature 31 is set to the value greater than the Young's modulus of resin wiring substrate 40 (being approximately 30Gpa), and is set to about 50Gpa.
As shown in Fig. 1,2,5 and 6, armature 31 constitutes (being specially the track component 36 that has substantial cylindrical in the track component 35 that has U-shaped roughly in the plane graph and the plane graph) by two track components.Track component 35 and 36 is connected to each other the end separately at them, forms the armature 31 of rectangular frame shape thus.
In addition, as shown in Fig. 3 to Fig. 8, armature 31 (track component 35 and 36) has inner surface 33 and outer surface 32, and forms the roughly cross section of U-shaped, and described cross section has the recess 34 that is made of stiffener main body 37, first protrusion tab 38 and second protrusion tab 39 at place, one side.Armature main body 37 is parallel to substrate side surfaces 43 and is provided with, and is suitable for and can contacts with substrate side surfaces 43 formation faces.First protrusion tab 38 is suitable for can be outstanding to the center of resin wiring substrate 40 from first end (upper end Fig. 4) of stiffener main body 37, contacts with the peripheral part of substrate interarea 41 (promptly except that as the position the chip area of LSI chip 21 installation regions) formation face thus.Described second protrusion tab 39 is suitable for can be outstanding to the center of resin wiring substrate 40 from second end (lower end Fig. 4) of stiffener main body 37, contacts with peripheral part (promptly removing the position in the zone that has pin 60) the formation face of substrate back 42 thus.In addition, in this embodiment, the width of stiffener main body 37 (among Fig. 4 from top to bottom height) is set to 2.0mm.The outstanding length (overhang) of first protrusion tab 38 and second protrusion tab 39 is set to be equal to each other, and is set to about 2.0mm in this embodiment.In addition, the spacing between first protrusion tab 38 and second protrusion tab 39 is slightly larger than the thickness of resin wiring substrate 40, and is set to 0.8mm in this embodiment.In addition, the thickness of the stiffener main body 37 and first protrusion tab 38 is arranged so that armature 31 can obtain desirable rigidity, and it is set to 0.5mm or bigger and 1.5mm or littler (being 1.0mm in this embodiment).On the other hand, the thickness of second protrusion tab 39 is set to littler than the thickness of the stiffener main body 37 and first protrusion tab 38, so that being connected between the pin 60 on resin wiring substrate 40 1 sides and the motherboard, and it is set to 0.05mm or bigger and 0.5mm or littler (being 0.1mm or bigger and 0.2mm or littler in this embodiment).
In addition, as shown in Fig. 3 and Fig. 4, the inwall 33 of recess 34 connects (connection and fixing) to substrate side surfaces 43, the peripheral part of substrate interarea 41 and the peripheral part of substrate back 42 by adhesive 50 planes.In addition, the adhesive 50 of this embodiment is epobond epoxyns.
To shown in Figure 7, be connected to armature 31 as Fig. 1 at the tabular binding post sheet 71 that provides aspect preferred of the present invention and each inner surface 33 of 72 along armature 31 (being specially track component 35).Definitely, the inner surface 33 of track component 35 is formed with a plurality of pockets 70 (with reference to Fig. 7 and Fig. 8), and tabular binding post sheet 71 and 72 is contained in respectively in this pockets 70.In addition, pockets 70 is arranged in the track component 35 away from each other.In addition, tabular no better than binding post sheet 71 of the degree of depth of pockets 70 and 72 thickness, and the width of the tabular no better than binding post sheet 71 of the width of pockets 70 and 72 (being 2mm or bigger and 5mm or littler in this embodiment).
Tabular binding post sheet 71 that provides in preferred aspects of the invention and each of 72 are made by the conductive metallic material (being copper and copper conductor metal in this embodiment) that has higher rigidity than the resin material that constitutes resin wiring substrate 40 (core substrate 44 and built-in layer 51 and 52) (being glass-epoxy and epoxy resin in this embodiment), and form the roughly cross section of U-shaped by crooked metal sheet.Therefore, tabular binding post sheet 71 and 72 each thermal coefficient of expansion are set to the thermal coefficient of expansion (18ppm/ ℃) than core substrate 44 or the littler value of thermal coefficient of expansion (approximately 20ppm/ ℃) of resin insulating barrier 53 and 54, and specifically are set to 16.8ppm/ ℃.In addition, tabular binding post sheet 71 and 72 each Young's modulus are set to the value bigger than the Young's modulus of resin wiring substrate 40, and are set to about 130Gpa.
As shown in Fig. 3,4,7 etc., tabular binding post sheet 71 that provides in preferred aspects of the invention and each of 72 are made of terminal plate main body 75, first protuberance 76 and second protuberance 77.Terminal plate main body 75 be arranged in parallel with substrate side surfaces 43 and stiffener main body 37, and is suitable for and can contacts with stiffener main body 37 (bottom surface of a pockets 70) formation face with substrate side surfaces 43.First protuberance 76 is suitable for can be outstanding to the center of resin wiring substrate 40 from first end (upper end Fig. 4) of terminal plate main body 75, so that contact with first protrusion tab 38 (bottom surface of pockets 70) formation face with the peripheral part of substrate interarea 41.Second protuberance 77 is suitable for can be from second end (lower end Fig. 4) of terminal plate main body 75 to the center of resin wiring substrate 40 outstanding (along the direction identical with first protuberance 76), so that contact with second protrusion tab 39 (bottom surface of pockets 70) formation face with the peripheral part of substrate back 42.In addition, with the width of terminal plate main body 75 (among Fig. 4 from top to bottom height), promptly the spacing between first protuberance 76 and second protuberance 77 is set to about 0.8mm in this embodiment.The overhang of first protuberance 76 is set to the overhang greater than first protrusion tab 38, and the overhang of second protuberance 77 is set to the overhang greater than second protrusion tab 39.And the thickness of terminal plate main body 75, first protuberance 76 and second protuberance 77 is set to about 0.1mm in this embodiment.
As shown in Fig. 3,4 etc., tabular binding post sheet 71 that provides in preferred aspects of the invention and each of 72 are attached to by adhesive on each the inner surface of pockets 70.In addition, it is identical with the adhesive 50 of the recess 34 that is applied to armature 31 to be applied to the adhesive of inner surface of pockets 70.
In addition, the conductor layer of the resin wiring substrate 40 on the tabular binding post sheet 71 that provides in preferred aspects of the invention and each of 72 and substrate interarea 41 1 sides and the conductor layer of the resin wiring substrate 40 on substrate back 42 1 sides form and contact, thus the electric connecting conductor layer.More properly, each power supply with tabular binding post sheet 71 and the power supply that is connected to the terminal pad 56 on the substrate interarea 41 with conductor layer 73, and the power supply that is connected to the pad that is used for PGA 59 on the substrate back 42 conductor layer 73 formation contacts, thereby be electrically connected two power supplys conductor layer 73.At length, power supply is electrically connected to the power supply conductor layer 73 that is formed on the substrate interarea 41 with the end of first protuberance 76 of tabular binding post sheet 71 by scolder 78 (with reference to Fig. 4).On the other hand, power supply is electrically connected to the power supply conductor layer 73 that is formed on the substrate back 42 with the end of second protuberance 77 of tabular binding post sheet 71 by scolder 79 (with reference to Fig. 4).That is to say, power supply has constituted the bypass path of feed path with tabular binding post sheet 71, and this feed path waits electric current supply is arrived LSI chip 21 via the pad 59 that is used for PGA (power supply with conductor layer 73), via conductor 58, conductor layer 55, via conductors 47, terminal pad 56 (power supply with conductor layer 73).
As shown in Fig. 3 and Fig. 4, earthy tabular binding post sheet 72 that provides in preferred aspects of the invention and the conductor layer for grounding 74 that is connected to the terminal pad 56 on the substrate interarea 41, and the conductor layer for grounding 74 formation contacts that are connected to the pad that is used for PGA 59 on the substrate back 42, thereby be electrically connected this two conductor layer for grounding 74.At length, the end of first protuberance 76 of earthy tabular binding post sheet 72 is electrically connected to the conductor layer for grounding 74 that is formed on the substrate interarea 41 by the scolder (not shown).On the other hand, the end of second protuberance 77 of earthy tabular binding post sheet 72 is electrically connected to the conductor layer for grounding 74 that is formed on the substrate back 42 by the scolder (not shown).That is to say, earthy tabular binding post sheet 72 has constituted the bypass path in following path, and promptly it has passed through to be used for pad 59 (conductor layer for grounding 74), via conductor 58, conductor layer 55, via conductors 47, terminal pad 56 (conductor layer for grounding 74) of PGA etc.
Next, will the manufacture method of the semiconductor packages 10 of this embodiment be described.
At first, make and prepare resin wiring substrate 40 in advance by traditional known technology.By following manufacturing resin wiring substrate 40.At first, prepare to cover the copper lamination, wherein Copper Foil is attached on the base material both sides of (length) * 50.0mm (the wide) * 0.4mm (thick) that has 50.0mm.In addition, use YAG laser or CO 2Laser is carried out laser drilling, passes the through hole that covers the copper lamination thereby be formed on position given in advance.Next, by carrying out according to traditional known technology after electroless copper and electrolytic copper plating form via conductors 47, occluder 48 is filled in the via conductors 47.And after copper facing was carried out in the both sides of covering the copper lamination, to covering the further etching of Copper Foil of copper lamination both sides, thereby composition went out to cover shape conductor 49.More properly, after carrying out electroless copper, exposure and development, thus the plated resist of formation given pattern.Under this state, after carrying out electrolytic copper plating by the use chemical plating copper layer as public electrode, resist layer at first is melted and removes, and removes unnecessary chemical plating copper layer by etching then.Thus, obtained core substrate 44.
Next, photosensitive epoxy resin is deposited on the core interarea 45 and the core back side 46 of core substrate 44, and carry out exposure and development, thus forming first resin insulating barrier 53 and 54 (40 μ m are thick), described first resin insulating barrier 53 and 54 has blind hole in the position that will form via conductors 58.In addition, carry out electrolytic copper plating according to traditional known technology (for example, semi-additive process), thereby at the inner formation of blind hole via conductor 58, and on resin insulating barrier 53 and 54, form conductor layer 55.
Next, photosensitive epoxy resin is deposited on first resin insulating barrier 53 and 54, carry out exposure and development, thereby form second resin insulating barrier 53 and 54 (40 μ m are thick), described second resin insulating barrier 53 and 54 has blind hole in the position that will form via conductors 58.In addition, carry out electrolytic copper plating according to traditional known technology, thereby at the inner via conductor 58 that forms of blind hole.And, terminal pad 56 (and further, power supply in the preferred aspect of the present invention is with conductor layer 73 and conductor layer for grounding 74) be formed on second resin insulating barrier 53, and the pad 59 (power supply in the preferred aspect of the present invention with conductor layer 73 and conductor layer for grounding 74) and further, that is used for PGA is formed on second resin insulating barrier 54.
Afterwards, solder resist is formed on second resin insulating barrier 53 and 54.Next, execution exposure and development under the state of predetermined mask are being set, terminal pad 56 thereby composition is sent as an envoy in the solder resist or be used for the pad 59 (power supply in the preferred aspect of the present invention with conductor layer 73 and conductor layer for grounding 74) and further, of PGA) opening that exposes.Thus, finished the expection resin wiring substrate 40 that on the both sides of resin wiring substrate 40, has built-in layer 51 and 52.
Afterwards, in resin wiring substrate 40, on a plurality of terminal pads 56, form roughly hemispheric solder bump 57.The technology that forms solder bump 57 is not limited especially, but can adopt known technology, such as printing process or electro-plating method.Next, will sell 60 surfaces that are installed in the pad 59 that is used for PGA by welding.Afterwards, LSI chip 21 is placed on the substrate interarea 41 of resin wiring substrate 40.At this moment, surperficial binding post 22 on LSI chip 21 1 sides and the terminal pad 56 on resin wiring substrate 40 1 sides are in alignment with each other.Then, make its backflow and each of surperficial binding post 22 and each of terminal pad 56 are linked together by each of solder bump 57 being heated to about 200 ℃ temperature.Afterwards, will fill also hot curing in the gap between LSI chip 21 and the resin wiring substrate 40 as the thermosetting resin of underfilling 61.
In addition, make and prepare to be used to strengthen the armature 31 of resin wiring substrate 40 in advance.Armature 31 is for example by following manufacturing.At first, by connecting the first mould (not shown) and the second mould (not shown) form and volume identical shaped with the track component 35 that has U-shaped roughly in plane graph in inside cavity.In this state, in heating, will have after thermoplastic polybutene resin is filled in this cavity, cool off then, be molded into track component 35.Afterwards, if first mould and second mould are separated from each other, then molded track component 35 is taken out.Similarly, by connecting the 3rd mould (not shown) and the 4th mould (not shown) form and volume identical shaped with the track component 36 that has general rod shaped in plane graph in inside cavity.In this state, the heating in be filled into polybutene resin in this cavity after, cool off then, be molded into track component 36.Afterwards, if the 3rd mould and the 4th mould are separated from each other, then molded track component 36 is taken out.
In addition, in preferred aspects of the invention, make and prepare each of tabular binding post sheet 71 and 72 in advance.The tabular binding post sheet 71 and 72 that provides in preferred aspects of the invention is for example by following manufacturing.At first, will be arranged on the counterdie of die-cut mould as the metallic plate of tabular binding post sheet 71 and 72 (being copper coin and conductor metal plate in this embodiment) subsequently.Then, reduce the patrix of die-cut mould.At this moment, metallic plate is cut edge, thereby form the intermediate products of tabular binding post sheet 71 and 72.Afterwards, if the intermediate products of tabular binding post sheet 71 and 72 are crooked and form roughly U-shaped cross-section at predetermined point, tabular binding post sheet 71 and 72 have then been finished.
In preferred aspects of the invention, next,, and tabular binding post sheet 71 and 72 inserted pockets 70 respectively with adhesive application each to the pockets 70 of track component 35.In this state, if adhesive dries and curing, then tabular binding post sheet 71 and 72 is fixed to track component 35.
Next, adhesive 50 is applied to the recess 34 of track component 35, and resin wiring substrate 40 is inserted in the recesses 34 (with reference to Fig. 5).In addition, adhesive 50 is applied in the recess 34 of track component 36, and with adhesive application to the end face 30 (with reference to Fig. 5) that is arranged on track component 35 two ends.In addition, it is identical to be applied in the adhesive 50 that is applied to recess 34 among adhesive in the pockets 70 and the present invention in the adhesive that is applied to end face 30 and the preferred aspect of the present invention.Then, the two ends (top end face of first protrusion tab 38 and second protrusion tab 39) of track component 36 are formed with the two ends (end face 30) of track component 35 contact, and in the recess 34 with the peripheral part insertion track component 36 of resin wiring substrate 40.In this state, if adhesive dries and curing, then track component 35 is connected to each other with 36 adhesives by their ends and is in the same place, thereby forms the armature 31 of rectangular frame shape.In addition, armature 31 is connected by dry adhesive 50 with curing and is fixed to resin wiring substrate 40, has obtained the semiconductor packages of the present invention 10 shown in Fig. 1 thus.In preferred aspects of the invention, then, if first protuberance 76 of tabular binding post sheet 71 and 72 is connected to conductor layer (conductor layer 73 and 74) on substrate interarea 41 1 sides by scolder 78, and second protuberance 77 of tabular binding post sheet 71 and 72 is connected to conductor layer (conductor layer 73 and 74) on substrate back 42 1 sides by scolder 79, and then the semiconductor packages 10 of the preferred aspect of the present invention is achieved.In addition, because in preferred aspects of the invention, the adhesive that track component 35 is connected with 36 adhesives connected to one another, with armature 31 and is fixed to the adhesive 50 of resin wiring substrate 40 and tabular binding post sheet 71 and 72 is fixed to track component 35 at room temperature (under non-heated condition) is dry and solidify, so resin wiring substrate 40 can not be subjected to the influence of thermal stress.
Therefore, according to this embodiment, can obtain following effect.
(1) according to the wiring substrate 11 with armature of this embodiment, armature 31 faces are connected to a plurality of surfaces (substrate interarea 41, substrate back 42, substrate side surfaces 43) that are in 40 4 sides of resin wiring substrate.Thus, owing to four sides of resin wiring substrate 40 can be guaranteed to be strengthened, so can guarantee to suppress the warpage of resin wiring substrate 40.Therefore, owing to the defective that has prevented to cause, improve so have the reliability of the wiring substrate 11 of armature by resin wiring substrate 40 warpages.And because resin wiring substrate 40 warpage hardly, substrate back 42 becomes smooth thus, can be installed on the motherboard so can guarantee semiconductor packages 10.In addition, owing to be connected with the face of resin wiring substrate 40 by armature 31, the rigidity with wiring substrate 11 of armature uprises, and improves so have the disposal ability of the wiring substrate 11 of armature.And, because armature 31 has recess 34, and has the shape higher than pure flat shape stiffness, so the material that need not to make armature 31 thickenings or use expensive and high rigidity forms armature 31.Thereby reliability and disposal ability can be improved, and need not to increase the manufacturing cost of armature 31.
(2) by a plurality of track components 35 and 36 are connected to each other in their ends separately, form the armature 31 of this embodiment of frame shape with rectangle.Therefore, owing to can form armature 31 by having track component relatively simple for structure 35 and 36, so the manufacturing cost of armature 31 further reduces.
(3) the outstanding length of first protrusion tab 38 of this embodiment is about 2.0mm, and first protrusion tab 38 is the only part of the peripheral part of covered substrate interarea 41 only.Therefore, because the expose portion of substrate interarea 41 becomes big, so not only LSI chip 21 but also the electronic component except LSI chip 21 all can easily be installed on the substrate interarea 41.The overhang of tabular binding post sheet 71 that provides in preferred aspects of the invention in addition, and 72 first protuberance 76 is greater than the overhang of first protrusion tab 38.For this reason, even be arranged at LSI chip 21 (or electronic component) under the situation of core of substrate interarea 41, also can guarantee tabular binding post sheet 71 and 72 with being electrically connected of LSI chip 21 (or electronic component).
(4) at the wiring substrate 11 of armature (wiring substrate 11 with the present invention's armature aspect preferred with this embodiment, tabular binding post sheet 71 and 72 is arranged on wherein) in, armature 31 faces of being configured to are connected to a plurality of surfaces (substrate interarea 41, substrate back 42 and substrate side surfaces 43) that are in 40 4 sides of resin wiring substrate.For this reason, along the inner surface 33 of armature 31 tabular binding post sheet 71 and 72 is fixed to armature 31 and becomes easy.Thus, by travelling back across the outside of resin wiring substrate 40, can be electrically connected the conductor layer (conductor layer 73 and 74) on conductor layer (conductor layer 73 and 74) and substrate back 42 1 sides on substrate interarea 41 1 sides.Therefore, can by tabular binding post sheet 71 and 72 will be bigger electric current supply to conductor layer (conductor layer 73 and 74) on substrate interarea 41 1 sides from the conductor layer (conductor layer 73 and 74) on substrate back 42 1 sides, and need not to change the structure of resin wiring substrate 40.Therefore, bigger electric current can be supplied to reliably the LSI chip 21 that is electrically connected to power supply usefulness conductor layer 73.
(5) since the tabular binding post sheet 71 that provides in preferred aspects of the invention and 72 by making, so four sides of resin wiring substrate 40 not only can be by armature 31 but also can be by tabular binding post sheet 71 and 72 reinforcements than the higher conductive metallic material of resin material rigidity that constitutes resin wiring substrate 40.Thus, because more reliable, and prevented from more reliably the defective that causes by this warpage from further to improve so have the reliability of the wiring substrate 11 of armature to the inhibition of resin wiring substrate 40 warpages.
In addition, can carry out following modification to this embodiment.
As shown in Figure 9, the armature 91 that electronic component 81 wherein can be installed on the outer surface 92 is arranged among the wiring substrate 11D with armature that constitutes semiconductor packages 10D.In this case, armature 91 comprises via conductors 82 (conductor pin) and terminal pad 83, part on described via conductors 82 electrical connection inner surfaces 93 1 sides and the part on outer surface 92 1 sides, described terminal pad 83 is arranged on inner surface 93 and the outer surface 92, and is connected to via conductors 82.Power supply is connected to the terminal pad 83 of via conductors 82 ends that are arranged on inner surface 93 1 sides with tabular binding post sheet 71, and electronic component 81 is connected to the terminal pad 83 of via conductors 82 ends that are arranged on outer surface 92 1 sides.
Therefore, even electronic component 81 has defective, can reinstall electronic component 81, resin wiring substrate 40 can not become useless yet.In addition, as electronic component, for example there is overleaf or has on the side chip (for example, chip transistor, chip diode, chip resistor, chip capacitor, chip coil etc.) of a plurality of terminals.
In the above-described embodiment, the spacing between first protrusion tab 38 and second protrusion tab 39 is slightly larger than the thickness of resin wiring substrate 40.Yet, can make spacing between first protrusion tab 38 and second protrusion tab 39 less than the thickness of resin wiring substrate 40, and can resin wiring substrate 40 be clipped in the middle by first protrusion tab 38 and second protrusion tab 39.Therefore, can make spacing between first protuberance 76 and second protuberance 77 less than the thickness of resin wiring substrate 40, and can resin wiring substrate 40 be clipped in the middle by first protuberance 76 and second protuberance 77.Thus, even do not use adhesive 50, also armature 31 can be connected to resin wiring substrate 40 reliably.In addition, if use adhesive 50, then being connected between resin wiring substrate 40 and the armature 31 becomes more reliable.
The armature 31 of the foregoing description is made of a plurality of track components 35 and 36, and by formation rectangular frame shape that track component 35 and 36 is connected to each other in their ends separately.
In addition, as shown in Figure 15 and 16, can be by making rail-like member 272 at its each bend 273 crooked 90 ° of armatures 271 that rectangular frame shape is provided with three bends 273.In addition, three bends 273 are arranged in the rail-like member 272 with regular spaces.Thereby, because as top embodiment track component 35 and 36 processes connected to one another are become unnecessary, so that the manufacturing of armature 271 becomes is easy.
Although the armature of top embodiment 31 is around four sides of resin wiring substrate 40, these four sides do not need to be centered on.In addition, provide tabular binding post sheet 71 and 72 of the present invention aspect preferred, and described tabular binding post sheet 71 and 72 not the indispensable parts of the present invention.
The wiring substrate with armature 11 of the semiconductor packages 10 of embodiment comprises armature 31 above constituting, and wherein the outstanding length of first protrusion tab 38 and second protrusion tab 39 is set to be equal to each other.In addition, although substrate back 42 has high strength owing to the pad 59 that is used for PGA (with pin 60) almost is arranged on the whole surface, substrate interarea 41 has low-intensity in the core owing to IC chip 21 is arranged on.
Therefore, as shown in Figure 10, wherein the overhang L1 of first protrusion tab 111 is set to be arranged among the wiring substrate 11A with armature that constitutes semiconductor packages 10A greater than the armature 31A of the overhang L2 of second protrusion tab 112.Here, the overhang L1 of first protrusion tab 111 is set to 4mm, and the second overhang L2 of second protrusion tab 112 is set to 2mm.In addition, first protrusion tab 111 is set to thicker than second protrusion tab 112.More specifically, the thickness of first protrusion tab 111 is set to 0.5mm or bigger and 1.5mm or littler (being 1.0mm among Figure 10), and the thickness of second protrusion tab 112 is set to 0.05mm or bigger and 0.5mm or littler (being 0.1mm or bigger and 0.2mm or littler among Figure 10).Therefore, because the rigidity of armature 31A becomes bigger, so the rigidity of resin wiring substrate 40 further improves.
As shown in Figure 11, armature 31B can be arranged among the wiring substrate 11B that constitutes semiconductor packages 10B, and printed circuit board (PCB) P1 can be arranged on the outer surface 121 (end face) of armature 31B with armature.In addition, because that first protrusion tab 122 of armature 31B is set to is thicker than the height from the surface (being end face Figure 11) of substrate interarea 41 to IC chips 21, so printed circuit board (PCB) P1 will can not touch IC chip 21.That is to say that armature 31B had both had the function of strengthening resin wiring substrate 40, played the effect that is inserted in the distance piece between resin wiring substrate 40 and the printed circuit board (PCB) P1 again.
As shown in Figure 12, armature 31C can be arranged among the wiring substrate 11C that constitutes semiconductor packages 10C, and printed circuit board (PCB) P1 can be arranged on the outer surface 131 (end face) of armature 31C with armature.And, part on electrical connection inner surface 132 1 sides and the via conductors 133 of the part on outer surface 131 1 sides can be arranged among the armature 31C, the terminal pad 134 that is arranged on inner surface 132 and the outer surface 131 and is connected to via conductors 133 can be set up, and solder bump 135 can be arranged on the terminal pad 134.Thus, the power supply on resin wiring substrate 40 1 sides is electrically connected by via conductors 133, terminal pad 134 and solder bump 135 with the substrate-side terminal pad 136 of tabular binding post sheet 71 and printed circuit board (PCB) P1.
Armature 31 among the top embodiment is formed by polybutene resin.Yet armature 31 can be formed by other resin material, and can be by such as formation such as the metal material of invar alloy (based on the alloy of iron nickel, 36% nickel), ceramic materials.Armature 31 by such as invar alloy (based on the alloy of iron nickel, 36% nickel) under the situation that metal material forms, in the wiring substrate (wherein being provided with tabular binding post sheet 71 and 72) with the present invention's armature aspect preferred, insulating material is inserted between armature 31 and tabular binding post sheet 71 and 72.In addition, if armature 31 is formed by metal material, then can be by the electromagnetic wave of armature 31 shieldings from static or noise source.
Next, list technical thought hereinafter by the foregoing description institute GPRS.
(1) semiconductor packages that comprises the wiring substrate that has stiffener comprises: the resin wiring substrate, it has substrate interarea, substrate back and substrate side surfaces, have the rectangular shape of four sides in the formation plane graph, and have the structure that wherein is stacked with resin insulating barrier and conductor layer; Stiffener, it forms the rectangular frame shape around four sides of described resin wiring substrate, and has at least one the recess that wall place face within it is connected to the peripheral part of the peripheral part of substrate side surfaces, substrate interarea and substrate back; And the semiconductor integrated circuit element, it is installed at least one of substrate interarea and substrate back.
(2) wiring substrate that has a stiffener comprises: the resin wiring substrate, and it has substrate interarea, substrate back and substrate side surfaces, forms in the plane graph to have the rectangular shape of four sides, and has the structure that wherein is stacked with resin insulating barrier and conductor layer; And stiffener, it forms the rectangular frame shape around four sides of described resin wiring substrate.Described stiffener is made of a plurality of track components with recess, and by a plurality of track components are connected to each other and form the frame shape of rectangle in the end separately at it, described recess can be connected at least one of peripheral part of the peripheral part of substrate side surfaces, substrate interarea and substrate back at one place, a side face.
(3) wiring substrate that has a stiffener comprises: the resin wiring substrate, and it has substrate interarea, substrate back and substrate side surfaces, forms in the plane graph to have the rectangular shape of four sides, and has the structure that wherein is stacked with resin insulating barrier and conductor layer; And stiffener, it forms the rectangular frame shape around four sides of described resin wiring substrate.Described stiffener is made of a plurality of track components with recess, and by a plurality of track components are connected to each other and form the frame shape of rectangle in the end separately at it, described recess can be connected at least one of peripheral part of the peripheral part of substrate side surfaces, substrate interarea and substrate back at one place, a side face.Described a plurality of track component makes described recess by the stiffener main body, the second outstanding protrusion tab constitutes from outstanding first protrusion tab of stiffener main body and along the direction identical with first protrusion tab from the stiffener main body.Spacing between first protrusion tab and second protrusion tab is less than the thickness of resin wiring substrate.Described resin wiring substrate can be clipped in the middle by first protrusion tab and second protrusion tab.
(4) semiconductor packages that comprises the wiring substrate that has stiffener comprises: the resin wiring substrate, it has substrate interarea, substrate back and substrate side surfaces, have the rectangular shape of four sides in the formation plane graph, and have the structure that wherein is stacked with resin insulating barrier and conductor layer; Stiffener, it is arranged in the part that belongs to resin wiring substrate side, and has at least one the inner surface that face is connected to the peripheral part of the peripheral part of substrate side surfaces, substrate interarea and substrate back; Tabular binding post sheet, it forms and contacts with the conductor layer of resin wiring substrate and the conductor layer of the resin wiring substrate on the substrate back side on the substrate interarea side, thereby is electrically connected described conductor layer; And the semiconductor integrated circuit element, it is installed at least one of substrate interarea and substrate back.
(5) have the stiffener of the binding post sheet that is fixed on the resin wiring substrate, described resin wiring substrate has substrate interarea, substrate back and substrate side surfaces, have the rectangular shape of four sides in the formation plane graph, and have the structure that wherein is stacked with resin insulating barrier and conductor layer.The stiffener that has the binding post sheet comprises: stiffener, and it can be arranged in the part that belongs to resin wiring substrate side, and has at least one the inner surface that face is connected to the peripheral part of the peripheral part of substrate side surfaces, substrate interarea and substrate back; With tabular binding post sheet, its inner surface or outer surface along stiffener is fixed to stiffener, and forms and to contact with conductor layer and the conductor layer on the substrate back side on the substrate interarea side, thereby is electrically connected described conductor layer.
(6) wiring substrate that has a stiffener comprises: the resin wiring substrate, and it has substrate interarea, substrate back and substrate side surfaces, forms in the plane graph to have the rectangular shape of four sides, and has the structure that wherein is stacked with resin insulating barrier and conductor layer; Stiffener, it is arranged in the part that belongs to resin wiring substrate side, and has at least one the inner surface that face is connected to the peripheral part of the peripheral part of substrate side surfaces, substrate interarea and substrate back; And tabular binding post sheet, its inner surface or outer surface along stiffener is fixed to stiffener, and form and contact, thereby be electrically connected described conductor layer with the conductor layer of resin wiring substrate and the conductor layer of the resin wiring substrate on the substrate back side on the substrate interarea side.Described stiffener is made of a plurality of track components, and forms rectangular frame shape by described a plurality of track components are connected to each other in their ends separately.
Although invention has been described about preferred embodiment and modification thereof above, but it will be understood by those of skill in the art that, under the situation that does not depart from scope and spirit of the present invention, other distortion and modification also can realize in these preferred embodiments.

Claims (18)

1. wiring substrate that has stiffener comprises:
The resin wiring substrate, it has substrate interarea, substrate back and substrate side surfaces, forms in the plane graph to have the rectangular shape of four sides, and comprises resin insulating barrier and conductor layer; And
Stiffener, it forms the rectangular frame shape around four sides of described resin wiring substrate, and being provided with inwall, described inwall has face and is connected at least one recess in the peripheral part of the peripheral part of described substrate side surfaces, described substrate interarea and described substrate back.
2. the wiring substrate that has stiffener according to claim 1, wherein, described stiffener comprises a plurality of track components, and by the end separately at described track component described a plurality of track components is connected to each other and forms the frame shape of rectangle.
3. the wiring substrate that has stiffener according to claim 1, wherein, described stiffener is the rail-like member, and is arranged on the frame shape that three bends in the described rail-like member form rectangle by bending.
4. according to claim 2 or the 3 described wiring substrates that have stiffener, wherein, the described inwall of described recess connects by adhesive and is fixed in the described peripheral part of the described peripheral part of described substrate side surfaces, described substrate interarea and described substrate back at least one.
5. according to each described wiring substrate that has stiffener of claim 1 to 3, wherein, described stiffener is configured so that described recess is by the stiffener main body, first protrusion tab and second protrusion tab constitute, described stiffener main body can contact with described substrate side surfaces formation face, described first protrusion tab can be given prominence to and contact with the described peripheral part formation face of described substrate interarea to the center of described resin wiring substrate from described stiffener main body, described second protrusion tab can be given prominence to and contact with the described peripheral part formation face of described substrate back to the center of described resin wiring substrate from described stiffener main body, and described second protrusion tab has the smaller thickness than described first protrusion tab.
6. according to each described wiring substrate that has stiffener of claim 1 to 3, wherein, described stiffener is configured so that described recess is by the stiffener main body, first protrusion tab and second protrusion tab constitute, described stiffener main body can contact with described substrate side surfaces formation face, described first protrusion tab can be given prominence to and contact with the described peripheral part formation face of described substrate interarea to the center of described resin wiring substrate from described stiffener main body, described second protrusion tab can be given prominence to and contact with the described peripheral part formation face of described substrate back to the center of described resin wiring substrate from described stiffener main body
Spacing between described first protrusion tab and described second protrusion tab is less than the thickness of described resin wiring substrate, and
Described resin wiring substrate is clipped in the middle by described first protrusion tab and described second protrusion tab.
7. the wiring substrate that has stiffener according to claim 5, wherein, the overhang of described first protrusion tab is greater than the overhang of described second protrusion tab.
8. the wiring substrate that has stiffener according to claim 6, wherein, the overhang of described first protrusion tab is greater than the overhang of described second protrusion tab.
9. according to each described wiring substrate that has stiffener of claim 1 to 3, wherein, described stiffener is by making than the higher resin material of resin material rigidity that constitutes described resin wiring substrate.
10. according to each described wiring substrate that has stiffener of claim 1 to 3, further comprise tabular binding post sheet, described tabular binding post sheet is connected to described stiffener along the inner surface or the outer surface of described stiffener, and with described substrate interarea one side on the conductor layer of resin wiring substrate and the described conductor layer on described substrate back one side contact, be electrically connected described conductor layer thus.
11. the wiring substrate that has stiffener according to claim 10, wherein, described tabular binding post sheet is connected to described stiffener along the described inner surface of described stiffener, the part of the described inner surface of described stiffener is formed with the pockets that is used to hold described tabular binding post sheet, and the degree of depth of described pockets equals the thickness of described tabular binding post sheet.
12. the wiring substrate that has stiffener according to claim 10, wherein, described tabular binding post sheet be formed on power supply conductor layer on described substrate interarea and the described substrate back, or be formed on described substrate interarea and contact to be electrically connected to described conductor layer with conductor layer for grounding formation on the described substrate back.
13. the wiring substrate that has stiffener according to claim 10 wherein, be provided with a plurality of described tabular binding post sheets, and described stiffener is made by dielectric resin material.
14. the wiring substrate that has stiffener according to claim 10, wherein, described stiffener is by making than the higher resin material of resin material rigidity that constitutes described resin wiring substrate, and described tabular binding post sheet is by making than the higher conductive metallic material of described resin wiring substrate rigidity.
15. the wiring substrate that has stiffener according to claim 10, wherein, the described inner surface of described stiffener partly is attached on the described tabular binding post sheet by adhesive, and connects and be fixed in the peripheral part of the peripheral part of described substrate side surfaces, described substrate interarea or described substrate back at least one by described adhesive.
16. the wiring substrate that has stiffener according to claim 10, wherein, described stiffener is by the stiffener main body, first protrusion tab and second protrusion tab constitute, described stiffener main body can contact with described substrate side surfaces formation face, described first protrusion tab can be given prominence to and contact with the described peripheral part formation face of described substrate interarea to the center of described resin wiring substrate from described stiffener main body, described second protrusion tab can be given prominence to and contact with the described peripheral part formation face of described substrate back to the center of described resin wiring substrate from described stiffener main body
Described tabular binding post sheet is by the terminal plate main body, first protuberance and second protuberance constitute, described terminal plate main body can form with described stiffener main body with described substrate side surfaces and contact, described first protuberance can be given prominence to and contact with the described first protrusion tab formation face with the described peripheral part of described substrate interarea to the center of described resin wiring substrate from described terminal plate main body, described second protuberance can be given prominence to and contact with the described second protrusion tab formation face with the described peripheral part of described substrate back to the center of described resin wiring substrate from described terminal plate main body
The overhang of described first protuberance is greater than the overhang of described first protrusion tab, and
The overhang of described second protuberance is greater than the overhang of described second protrusion tab.
17. the wiring substrate that has stiffener according to claim 16, wherein, the described overhang of described first protrusion tab is greater than the described overhang of described second protrusion tab.
18. the wiring substrate that has stiffener according to claim 10,
Wherein, described stiffener comprises conductor pin and terminal pad, and described conductor pin is electrically connected a part on the described inner surface side and the part on the described outer surface side, and described terminal pad is arranged on the described outer surface, and is connected to described conductor pin, and
Described tabular binding post sheet is connected to the end of the described conductor pin on the described inner surface side.
CN 200810130235 2007-06-15 2008-06-16 Wiring substrate with reinforcing member Pending CN101325182A (en)

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