CN101320775A - 硅衬底led的封装方法 - Google Patents
硅衬底led的封装方法 Download PDFInfo
- Publication number
- CN101320775A CN101320775A CNA2008101071333A CN200810107133A CN101320775A CN 101320775 A CN101320775 A CN 101320775A CN A2008101071333 A CNA2008101071333 A CN A2008101071333A CN 200810107133 A CN200810107133 A CN 200810107133A CN 101320775 A CN101320775 A CN 101320775A
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- Prior art keywords
- silicon substrate
- chip
- led
- solidifying
- led chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 title claims abstract description 28
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 22
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 22
- 239000010703 silicon Substances 0.000 title claims abstract description 22
- 238000005538 encapsulation Methods 0.000 title description 2
- 238000000034 method Methods 0.000 claims abstract description 24
- 239000003292 glue Substances 0.000 claims abstract description 20
- 239000000084 colloidal system Substances 0.000 claims abstract description 14
- 238000012856 packing Methods 0.000 claims abstract description 14
- 238000000465 moulding Methods 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims description 27
- 239000003822 epoxy resin Substances 0.000 claims description 15
- 229920000647 polyepoxide Polymers 0.000 claims description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 239000000741 silica gel Substances 0.000 claims description 2
- 229910002027 silica gel Inorganic materials 0.000 claims description 2
- 239000000843 powder Substances 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 4
- 238000012545 processing Methods 0.000 abstract description 2
- 230000002950 deficient Effects 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 238000012360 testing method Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 230000001795 light effect Effects 0.000 description 4
- 229910052594 sapphire Inorganic materials 0.000 description 4
- 239000010980 sapphire Substances 0.000 description 4
- 229910002601 GaN Inorganic materials 0.000 description 3
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000007667 floating Methods 0.000 description 3
- 238000004020 luminiscence type Methods 0.000 description 3
- 201000009310 astigmatism Diseases 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 238000012216 screening Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
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Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2008101071333A CN101320775B (zh) | 2008-07-21 | 2008-07-21 | Led封装过程中的固化方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008101071333A CN101320775B (zh) | 2008-07-21 | 2008-07-21 | Led封装过程中的固化方法 |
Publications (2)
Publication Number | Publication Date |
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CN101320775A true CN101320775A (zh) | 2008-12-10 |
CN101320775B CN101320775B (zh) | 2012-05-23 |
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Family Applications (1)
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CN2008101071333A Active CN101320775B (zh) | 2008-07-21 | 2008-07-21 | Led封装过程中的固化方法 |
Country Status (1)
Country | Link |
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CN (1) | CN101320775B (zh) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101514784A (zh) * | 2009-03-19 | 2009-08-26 | 中国计量学院 | 一种含有部分增光结构的大功率发光二极管 |
CN101980385A (zh) * | 2010-07-19 | 2011-02-23 | 宁波市瑞康光电有限公司 | 一种led封装方法、led及led照明装置 |
CN102121638A (zh) * | 2011-01-14 | 2011-07-13 | 深圳市联诚发科技有限公司 | 一种led灯、led灯制造方法以及相应led显示器 |
CN102157665A (zh) * | 2011-03-22 | 2011-08-17 | 湘能华磊光电股份有限公司 | 一种led芯片封装结构及其封装方法 |
CN102270713A (zh) * | 2011-07-28 | 2011-12-07 | 深圳市聚飞光电股份有限公司 | Led封装方法及led |
CN103044073A (zh) * | 2012-12-11 | 2013-04-17 | 杭州杭科光电股份有限公司 | 用于led面光源的陶瓷基板的表面处理工艺 |
CN105505271A (zh) * | 2015-11-26 | 2016-04-20 | 东莞市国正精密电子科技有限公司 | 一种显示屏专用高灰度显示led灌封胶及其应用工艺 |
CN107452855A (zh) * | 2017-08-17 | 2017-12-08 | 旭宇光电(深圳)股份有限公司 | 贴片led无模封装方法 |
CN117012882A (zh) * | 2023-09-28 | 2023-11-07 | 天津德高化成新材料股份有限公司 | 一种高墨色一致性led显示屏的封装方法及其应用 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100401536C (zh) * | 2004-06-18 | 2008-07-09 | 江苏稳润光电有限公司 | 白光发光二极管的制造方法 |
CN100557828C (zh) * | 2004-11-24 | 2009-11-04 | 深圳市蓝科电子有限公司 | 白光二极管制造方法 |
CN100345316C (zh) * | 2005-04-04 | 2007-10-24 | 江苏奥雷光电有限公司 | 大功率发光二极管荧光粉涂层工艺 |
CN2922135Y (zh) * | 2006-04-11 | 2007-07-11 | 杭州士兰明芯科技有限公司 | 高亮度、高可靠性的蓝宝石衬底基发光二极管 |
CN100474646C (zh) * | 2007-01-11 | 2009-04-01 | 宁波安迪光电科技有限公司 | 白光发光二极管的封装方法 |
-
2008
- 2008-07-21 CN CN2008101071333A patent/CN101320775B/zh active Active
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101514784A (zh) * | 2009-03-19 | 2009-08-26 | 中国计量学院 | 一种含有部分增光结构的大功率发光二极管 |
CN101980385A (zh) * | 2010-07-19 | 2011-02-23 | 宁波市瑞康光电有限公司 | 一种led封装方法、led及led照明装置 |
CN102121638A (zh) * | 2011-01-14 | 2011-07-13 | 深圳市联诚发科技有限公司 | 一种led灯、led灯制造方法以及相应led显示器 |
CN102157665A (zh) * | 2011-03-22 | 2011-08-17 | 湘能华磊光电股份有限公司 | 一种led芯片封装结构及其封装方法 |
CN102270713A (zh) * | 2011-07-28 | 2011-12-07 | 深圳市聚飞光电股份有限公司 | Led封装方法及led |
CN103044073A (zh) * | 2012-12-11 | 2013-04-17 | 杭州杭科光电股份有限公司 | 用于led面光源的陶瓷基板的表面处理工艺 |
CN105505271A (zh) * | 2015-11-26 | 2016-04-20 | 东莞市国正精密电子科技有限公司 | 一种显示屏专用高灰度显示led灌封胶及其应用工艺 |
CN107452855A (zh) * | 2017-08-17 | 2017-12-08 | 旭宇光电(深圳)股份有限公司 | 贴片led无模封装方法 |
CN117012882A (zh) * | 2023-09-28 | 2023-11-07 | 天津德高化成新材料股份有限公司 | 一种高墨色一致性led显示屏的封装方法及其应用 |
CN117012882B (zh) * | 2023-09-28 | 2023-12-22 | 天津德高化成新材料股份有限公司 | 一种高墨色一致性led显示屏的封装方法及其应用 |
Also Published As
Publication number | Publication date |
---|---|
CN101320775B (zh) | 2012-05-23 |
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Application publication date: 20081210 Assignee: Crystal energy photoelectric (Changzhou) Co., Ltd. Assignor: Lattice Power (Jiangxi) Co., Ltd. Contract record no.: 2012360000083 Denomination of invention: Encapsulation of silicon substrate LED Granted publication date: 20120523 License type: Common License Record date: 20121213 |
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Owner name: JIANGXI LATTICEBRIGHT CORPORATION Free format text: FORMER OWNER: LATTICE POWER (JIANGXI) CORPORATION Effective date: 20140130 |
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Effective date of registration: 20140130 Address after: 330096 main building, No. 699, No. 101 North Sihu Road, Nanchang hi tech Zone, Jiangxi Patentee after: Jiangxi Latticebright Corporation Address before: 330029, No. 699 AI Sihu Road, Nanchang hi tech Development Zone, Jiangxi, China Patentee before: Lattice Power (Jiangxi) Co., Ltd. |
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CP01 | Change in the name or title of a patent holder | ||
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Address after: 330096 Main Workshop No. 699 101, Aixi Hubei Road, Nanchang High-tech Zone, Jiangxi Province Patentee after: JIANGXI LATTICEPOWER SEMICONDUCTOR Corp. Address before: 330096 Main Workshop No. 699 101, Aixi Hubei Road, Nanchang High-tech Zone, Jiangxi Province Patentee before: JIANGXI LATTICEBRIGHT Corp. |
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EC01 | Cancellation of recordation of patent licensing contract |
Assignee: LATTICE POWER (CHANGZHOU) Corp. Assignor: LATTICE POWER (JIANGXI) Corp. Contract record no.: 2012360000083 Date of cancellation: 20220228 |
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