CN101320211A - Mold with micro-structure mould core and manufacturing method thereof - Google Patents
Mold with micro-structure mould core and manufacturing method thereof Download PDFInfo
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- CN101320211A CN101320211A CNA2008101169844A CN200810116984A CN101320211A CN 101320211 A CN101320211 A CN 101320211A CN A2008101169844 A CNA2008101169844 A CN A2008101169844A CN 200810116984 A CN200810116984 A CN 200810116984A CN 101320211 A CN101320211 A CN 101320211A
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Abstract
The invention relates to a mould with a micro-structural mould core and a manufacturing method thereof. The mould comprises a stencil; wherein, the stencil is formed by the abutting superposition of at least two sub-stencils; the stencil with a micro-structural mould core is embedded at one side of the stencil and to the sub-stencils of the bottom layer; the included angles of at least two etch stop faces of the sub-stencil, which composes the micro-structural mould core, with the horizontal plane are different. The micro-structural mould core with a plurality of groove shapes is realized through one stencil which is formed by the superposition of a plurality of sub-stencils and the arrangement of the etch stop faces of each sun-stencil with different included angles, and can be used for manufacturing the micro-structure of various shapes. The mould with a micro-structural mould core with various groove shapes are manufactured by the method which is that various groove shapes are formed through the tightly abutting of the sub-stencils with anisotropy and by utilizing the different etching anisotropic characteristics of each sub-stencil, and thus the micro-structure of various shapes, which can satisfy the multiple requirements of various photo-electronic devices can be obtained by the mould.
Description
Technical field
The present invention relates to little retrofit technology, relate in particular to the mould with microstructure core rod and the manufacture method thereof that are used to make the optoelectronic device microtexture.
Background technology
At present, LCD, integrated circuit (IC) chip and optical instrument of being used for holograph etc. all have microstructure.For example occupy the LCD of critical role in the flat pannel display field, its display mode is a transmissive liquid crystal display, requires backlight high-brightness, lightening.In order to improve back light source brightness, adopt prism film usually, this prism film is provided with microstructure, and the trickle prism structure of promptly arranging makes light focus on the center and observes certain angle, to increase axle center brightness.For side-light type back light, its light guide plate also is provided with the microstructure that is made of the site, and the site self structure in this microstructure all has certain influence to side-light type back light optical property and integral thickness with arranging.Above-mentioned these microstructures all form by the Mold Making with microstructure core rod.
In the prior art, be used to make the mould of microstructure or utilize stage property or cutting tool such as diamond processes, or carry out etching as masterplate material, utilize the anisotropy of monocrystalline silicon to obtain core rod with V groove structure with monocrystalline silicon.This V groove structure is made of the etching stop surface of monocrystalline silicon.The etching stop surface that constitutes core rod is identical with the angle of surface level.This then core rod is used for making the microstructures such as site of pinnacle structure.Referring to application number is that 200710175990.2 Chinese invention patent application " is made the core rod method of microstructure ".
But, utilize the cut core rod, very high to precision, the control device machine cooperation requirement of cutting tool, so the manufacturing process complexity, be difficult to realize industrialization; Though the etching technics manufacturing process is simple, but the mould of producing, its core rod microstructure form is single, the angle groove that a kind of angle is only arranged, and be the isosceles structure, therefore, can only produce the microstructure of the single isosceles of structure, and can not satisfy more demand, may the isosceles structure be not best structure as the lattice point structure on the light guide plate.
Summary of the invention
The objective of the invention is to propose a kind of mould and manufacture method thereof, to be used for making the more microstructure of multiform shape with microstructure core rod.
For achieving the above object, the invention provides a kind of mould, comprise masterplate with microstructure core rod, wherein,
Described masterplate is fitted by at least two sub-masterplates and is formed by stacking;
Described microstructure core rod is embedded in the one side of described masterplate, in the submodule version of the bottom, and has at least the etching stop surface of two submodule versions that constitute described microstructure core rods different with the angle of surface level.
In the technique scheme, described masterplate can be fitted by three sub-masterplates and is formed by stacking; Described submodule version can be made by single crystal material; The angle that constitutes the etching stop surface of submodule version of described microstructure core rod and surface level from top to bottom increases gradually, reduces gradually, reduces earlier afterwards to increase or increase afterwards earlier and reduces.
The masterplate of mould by a plurality of submodule version stacks are formed, and be provided with the etching stop surface that forms each submodule version of different angles with surface level, realize having the microstructure core rod of multiple groove shape, thereby can be used for making the microstructure of multiple shape.
The present invention also provides a kind of method that is used to make the mould with microstructure core rod that above-mentioned any technical scheme provides, and comprising:
Have anisotropic submodule version applying stack, formation masterplate with at least two; The anisotropy difference that has two sub-masterplates in the described submodule version at least;
At the surface coated photoresist of described masterplate, and on described photoresist, be provided for making the mask of microstructure, expose;
The photoresist that removal is exposed;
Remove the part of photoresist on the etching masterplate,, form the microstructure core rod until the submodule version of the bottom.
The said method technical scheme also can comprise: remove the photoresist that is not exposed.
Having anisotropic submodule version applying stack with at least two can be specially:
Have anisotropic submodule version applying with three and superpose, wherein, have the anisotropy difference of two sub-masterplates at least.
Anisotropic submodule version is folded to fit tightly together above-mentioned method for making by having, and by the different etching anisotropy characteristics of each submodule version, form multiple groove shape, produced the mould of microstructure core rod, satisfied various optoelectronic devices microstructure various requirement, multiple shape thereby utilize this mould can obtain to have with multiple groove shape.
Below by drawings and Examples, technical scheme of the present invention is described in further detail.
Description of drawings
Fig. 1 has the structural representation of the mould embodiment one of microstructure core rod for the present invention;
Fig. 2 has the structural representation of the mould embodiment two of microstructure core rod for the present invention;
Fig. 3 has the structural representation of the mould embodiment three of microstructure core rod for the present invention;
Fig. 4 has the structural representation of the mould embodiment four of microstructure core rod for the present invention;
Fig. 5 is used to make the process flow diagram of the method embodiment of the mould with microstructure core rod for the present invention;
Fig. 6 is used for making the synoptic diagram behind the method embodiment masterplate coating photoresist of the mould with microstructure core rod for the present invention;
Fig. 7 is used for making the synoptic diagram behind the resist exposure of method embodiment reticle surface of the mould with microstructure core rod for the present invention;
The method embodiment that Fig. 8 is used for making the mould with microstructure core rod for the present invention removes the synoptic diagram after the reticle surface photoresist is exposed part;
Fig. 9 is used for making the synoptic diagram that forms core rod behind the method embodiment etching masterplate of the mould with microstructure core rod for the present invention.
Embodiment
In the embodiment of the invention, the mould with microstructure core rod comprises masterplate, and described masterplate is fitted by at least two sub-masterplates and is formed by stacking; Described microstructure core rod is embedded in the one side of described masterplate, in the submodule version of the bottom, and has at least the etching stop surface of two submodule versions that constitute described microstructure core rods different with the angle of surface level.
Because masterplate is fitted by at least two sub-masterplates and is formed by stacking, and makes the submodule version etching stop surface that forms the microstructure core rod may have different angles with surface level; And, the submodule version can be made by single crystal material, difference according to the submodule plate material, have at least the etching stop surface of two submodule versions that constitute the microstructure core rods different with the angle of surface level, thereby formed microstructure core rod with multiple etching stop surface angle structure, satisfied multiple microstructure demand, can produce the structure that satisfies the leaded light demand more by the mould in the present embodiment as the lattice point structure on the light guide plate.
Fig. 1 has the structural representation of the mould embodiment one of microstructure core rod for the present invention, masterplate 11 is that submodule version 111, submodule version 112 and 113 applyings of submodule version are formed by stacking by three sub-masterplates, microstructure core rod 12 is embedded in the one side of masterplate 11, in the submodule version 113 of the bottom.Constitute the submodule version 111 of microstructure core rod 12, the etching stop surface of submodule version 112 and submodule version 113 is all different with the angle of surface level, from top to bottom, angle reduces gradually, the etching stop surface 114 of submodule version 111 and the angle α maximum of surface level, take second place with the angle β of surface level in the etching stop surface 115 of submodule version 112, the etching stop surface 116 of submodule version 113 and the angle γ minimum of surface level, thereby obtain approximate Parabolic microstructure core rod 12, utilize this core rod 12 can make microstructure with para-curve bulge-structure, lattice point structure as the light guide plate bottom, because projection has a plurality of etchings stop surface, therefore can increase lattice point structure to reflection of light, thereby improve the brightness of light guide plate.If approached the microstructure core rod of parabolic type groove structure more, can further increase the number of submodule version, and suitably reduce the thickness of each submodule version.
Fig. 2 has the structural representation of the mould embodiment two of microstructure core rod for the present invention.In the present embodiment, masterplate 21 is fitted by submodule version 211, submodule version 212 and submodule version 213 and is formed by stacking; Microstructure core rod 22 is made of the etching stop surface of submodule version 211, the etching stop surface of submodule version 212 and the etching stop surface of submodule version 213.The etching stop surface of submodule version 211, submodule version 212 and submodule version 213 and the angle of surface level from top to bottom increase gradually, promptly, the etching stop surface of submodule version 211 and the angle minimum of surface level, the etching stop surface of submodule version 212 and the angle of surface level take second place, the etching stop surface of submodule version 213 and the angle maximum of surface level.The microstructure core rod 22 that obtains can be used to make the raised line shape microstructure of point of top.
Fig. 3 has the structural representation of the mould embodiment three of microstructure core rod for the present invention.In the present embodiment, masterplate 31 is fitted by submodule version 311, submodule version 312 and submodule version 313 and is formed by stacking; Microstructure core rod 32 is made of the etching stop surface of submodule version 311, the etching stop surface of submodule version 312 and the etching stop surface of submodule version 313.The etching stop surface of submodule version 311, submodule version 312 and submodule version 313 and the angle of surface level from top to bottom increase afterwards earlier and reduce, that is, the angle of the etching stop surface of submodule version 312 and surface level is greater than the etching stop surface of submodule version 311 and submodule version 313 and the angle of surface level.The microstructure core rod 32 that obtains can be used to make the more blunt raised line shape microstructure in top.
Fig. 4 has the structural representation of the mould embodiment four of microstructure core rod for the present invention.In the present embodiment, masterplate 41 is fitted by submodule version 411, submodule version 412 and submodule version 413 and is formed by stacking; Microstructure core rod 42 is made of the etching stop surface of submodule version 411, the etching stop surface of submodule version 412 and the etching stop surface of submodule version 413.The etching stop surface of submodule version 411, submodule version 412 and submodule version 413 and the angle of surface level from top to bottom increase afterwards earlier and reduce, that is, the angle of the etching stop surface of submodule version 412 and surface level is less than the etching stop surface of submodule version 411 and submodule version 413 and the angle of surface level.The microstructure core rod 42 that obtains can be used to make the raised line shape microstructure of point of broad top, bottom.
The embodiment of the invention is used for making that the foregoing description provides that any has the method for the mould of microstructure core rod, can comprise:
Have anisotropic submodule version applying stack, formation masterplate with at least two; The anisotropy difference that has two sub-masterplates in the described submodule version at least;
Surface coated photoresist at described masterplate;
On described photoresist, be provided for making the mask post-exposure of microstructure;
The photoresist that removal is exposed;
Remove the part of photoresist on the etching masterplate,, form the microstructure core rod until the submodule version of the bottom.
In the present embodiment, can be provided with dot matrix pattern or linear array pattern on the mask, expose by the photoresist of the pattern on the mask to part to be etched on the masterplate; And then utilize the different anisotropy of submodule version, make each submodule version in etching process, produce the etching stop surface with the different angles of surface level, thereby on a plurality of submodule versions are fitted the template that forms, produce the mould of microstructure core rod with a plurality of angles of inclination structure.
Fig. 5 is used to make the process flow diagram of the method embodiment of the mould with microstructure core rod for the present invention, and present embodiment is an example with the mould among the mfg. moulding die embodiment one, and manufacture process comprises:
Step 51, choose three and have different anisotropic submodule versions, promptly submodule version 111, submodule version 112 and submodule version 113 fit tightly and are superimposed, and form masterplate 11;
Step 52, at topmost submodule version 111 surface coated one deck photoresists 61, as shown in Figure 6; And under the mask that is provided with the linear array pattern hides, the masterplate 11 that is coated with photoresist is exposed, as shown in Figure 7; The photoresist that is hidden by mask is not exposed, the photoresist part 71 that obtains being exposed;
The photoresist part 71 that step 53, removal are exposed, as shown in Figure 8, the part that masterplate 11 surface exposures are to be etched;
Step 54, the zone of adopting mode etching masterplate 11 surperficial parts to be etched such as dry etching or wet etching promptly not to be coated with by photoresist 61, because each straton masterplate is and has anisotropic material, and the anisotropy that has is all inequality, actual needs according to mold insert structure, by selecting to have certain anisotropic submodule version in step 51, and corresponding thickness is set, can etch the microstructure core rod that meets demand, as shown in Figure 9.Utilize etching agent in zone that described reticle surface is not covered by photoresist each submodule version of etching successively or one by one; The etching stop surface that each submodule version forms after the etching from top to bottom progressively reduces with the angle of masterplate 11 bottom surfaces, obtains being similar to the core rod 12 of parabolic type groove structure.If will be similar to the core rod of parabolic type groove structure more, can in step 51, suitably adjust each straton masterplate thickness, and more submodule version is set, can etch parabolic type groove microstructure core rod.
Remove the photoresist 61 that is not exposed, obtain mould as shown in Figure 1 with microstructure core rod 12.
Similarly, said method embodiment can be used for making any one mould that provides among the above-mentioned mould embodiment, and different is that when in step 51 masterplate being set, the number of submodule version, thickness and anisotropy are different.
Above-mentioned mould embodiment, by a plurality of submodule version stacks are formed a masterplate, and the etching stop surface of each submodule version is arranged to have different angles with surface level, realize having the microstructure core rod of multiple groove shape, thereby can be used for making the microstructure of multiple shape.Anisotropic submodule version is folded to fit tightly together above-mentioned manufacture method embodiment by having, and by the different etching anisotropy characteristics of each submodule version, form multiple groove shape, produced the mould of microstructure core rod with multiple groove shape, thereby utilize this mould can obtain to have the microstructure that satisfies the various requirement of various optoelectronic devices, as the microstructure of lens surface in the optical device in the holograph, microstructure such as the groove in the integrated circuit (IC) chip is little.
It should be noted that at last: above embodiment only in order to technical scheme of the present invention to be described, is not intended to limit; Although with reference to previous embodiment the present invention is had been described in detail, those of ordinary skill in the art is to be understood that: it still can be made amendment to the technical scheme that aforementioned each embodiment put down in writing, and perhaps part technical characterictic wherein is equal to replacement; And these modifications or replacement do not make the essence of appropriate technical solution break away from the spirit and scope of various embodiments of the present invention technical scheme.
Claims (10)
1, a kind of mould with microstructure core rod comprises masterplate, it is characterized in that,
Described masterplate is fitted by at least two sub-masterplates and is formed by stacking;
Described microstructure core rod is embedded in the one side of described masterplate, in the submodule version of the bottom, and has at least the etching stop surface of two submodule versions that constitute described microstructure core rods different with the angle of surface level.
2, the mould with microstructure core rod according to claim 1 is characterized in that, described masterplate is fitted by three sub-masterplates and is formed by stacking.
3, the mould with microstructure core rod according to claim 1 is characterized in that, described submodule version is made by single crystal material.
4, according to each described mould among the claim 1-3, it is characterized in that, constitute the etching stop surface of submodule version of described microstructure core rod and the angle of surface level and from top to bottom increase gradually with microstructure core rod.
5, according to each described mould among the claim 1-3, it is characterized in that, constitute the etching stop surface of submodule version of described microstructure core rod and the angle of surface level and from top to bottom reduce gradually with microstructure core rod.
6, according to each described mould among the claim 1-3, it is characterized in that, constitute the etching stop surface of submodule version of described microstructure core rod and the angle of surface level and from top to bottom reduce earlier afterwards to increase with microstructure core rod.
According to each described mould among the claim 1-3, it is characterized in that 7, the angle that constitutes the etching stop surface of submodule version of described microstructure core rod and surface level increases afterwards earlier and reduces from top to bottom with microstructure core rod.
8, a kind ofly be used for making each described method of aforesaid right requirement 1-7, it is characterized in that, comprising with mould of microstructure core rod:
Have anisotropic submodule version applying stack, formation masterplate with at least two; The anisotropy difference that has two sub-masterplates in the described submodule version at least;
At the surface coated photoresist of described masterplate, and on described photoresist, be provided for making the mask of microstructure, expose;
The photoresist that removal is exposed;
Remove the part of photoresist on the etching masterplate,, form the microstructure core rod until the submodule version of the bottom.
9, manufacture method according to claim 8 is characterized in that, also comprises:
Remove the photoresist that is not exposed.
10, according to Claim 8 or 9 described manufacture methods, it is characterized in that, will two have the stack of fitting of anisotropic submodule version at least and be specially:
Have anisotropic submodule version applying with three and superpose, wherein, have the anisotropy difference of two sub-masterplates at least.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101169844A CN101320211B (en) | 2008-07-22 | 2008-07-22 | Mold with micro-structure mould core and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101169844A CN101320211B (en) | 2008-07-22 | 2008-07-22 | Mold with micro-structure mould core and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN101320211A true CN101320211A (en) | 2008-12-10 |
| CN101320211B CN101320211B (en) | 2011-02-16 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104972271A (en) * | 2015-04-22 | 2015-10-14 | 天津大学 | Method for manufacturing mold core of microstructure array device |
| CN111678417A (en) * | 2020-06-18 | 2020-09-18 | 重庆捷尔博模具科技有限公司 | Detection tool for detecting die parts |
| CN111678416A (en) * | 2020-06-18 | 2020-09-18 | 重庆捷尔博模具科技有限公司 | Die part detection process |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5225376A (en) * | 1990-05-02 | 1993-07-06 | Nec Electronics, Inc. | Polysilicon taper process using spin-on glass |
| CN1060821C (en) * | 1997-08-06 | 2001-01-17 | 复旦大学 | Mask-nonmask etching tech. for multi-layer silicon micro-mechanism structure |
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2008
- 2008-07-22 CN CN2008101169844A patent/CN101320211B/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104972271A (en) * | 2015-04-22 | 2015-10-14 | 天津大学 | Method for manufacturing mold core of microstructure array device |
| CN111678417A (en) * | 2020-06-18 | 2020-09-18 | 重庆捷尔博模具科技有限公司 | Detection tool for detecting die parts |
| CN111678416A (en) * | 2020-06-18 | 2020-09-18 | 重庆捷尔博模具科技有限公司 | Die part detection process |
| CN111678417B (en) * | 2020-06-18 | 2021-09-10 | 重庆捷尔博模具科技有限公司 | Detection tool for detecting die parts |
| CN111678416B (en) * | 2020-06-18 | 2021-09-14 | 重庆捷尔博模具科技有限公司 | Die part detection process |
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| Publication number | Publication date |
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| CN101320211B (en) | 2011-02-16 |
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