CN101316498B - Heat sink assembly and electronic device using the same - Google Patents
Heat sink assembly and electronic device using the same Download PDFInfo
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- CN101316498B CN101316498B CN2007101098539A CN200710109853A CN101316498B CN 101316498 B CN101316498 B CN 101316498B CN 2007101098539 A CN2007101098539 A CN 2007101098539A CN 200710109853 A CN200710109853 A CN 200710109853A CN 101316498 B CN101316498 B CN 101316498B
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Abstract
The invention relates to a heat-dissipation module and an electronic device which applies the heat-dissipation module. The heat-dissipation module is arranged on an electronic component which is arranged on a circuit board. The heat-dissipation module comprises a heat-conducting element and an elastic sheet. The heat-conducting component is contacted with the surface of the electronic element. The elastic sheet is suspended on the surface of the heat-conducting element and comprises a panel and a plurality of extending elastic arms. The panel is provided with a convex point which is contacted with the surface of the heat-conducting element. The extending elastic arms externally extend from the edge of the panel and are fixed on the circuit board, so that elasticity is applied on the heat-conducting element by the convex point. The force application direction of the elasticity passes through the geometrical center of the surface of the electronic component.
Description
Technical field
The invention relates to a kind of module and use its electronic installation of dispelling the heat, and particularly relevant for a kind of electronic installation that has the heat radiation module of single-point contact shell fragment and use it.
Background technology
The frequency of processor is more and more high in computer system, and the speed of calculation process is also more and more fast, and the importance of the module that therefore dispels the heat promotes relatively.The heat radiation module is got rid of the used heat in the system, with the problem of avoiding system overheat to be caused, is one of important indicator of monolithic stability degree and usefulness comparation and assessment.
Please Figure 1 shows that a kind of schematic diagram of heat radiation module 10 of traditional electronic devices simultaneously with reference to Fig. 1 and Fig. 2, Figure 2 shows that the profile of heat radiation module of the traditional electronic devices of Fig. 1.Traditional heat radiation module 10 comprises a shell fragment 14, a heat conducting element 13 and a samming element 12.Heat conducting element 13 is to be arranged on the samming element 12, and samming element 12 is to be arranged on the electronic component 11.Heat conducting element 13, samming element 12 and electronic component 11 are arranged on the circuit board 15.Shell fragment 14 tools, one dull and stereotyped 14a and several extend elasticity arm 14b.In general, extend four fixing hole 14c that elasticity arm 14b goes up the tool symmetry, and tool bending part 14f.Heat conducting element 13, samming element 12 and electronic component 11 are be arranged at shell fragment 14 following, and fixing hole 14c system is locked on several corresponding screw holes 16, make shell fragment 14 form an elastic force P (as shown in Figure 2).
As shown in Figure 2, elastic force P system acts on the geometric center L on electronic component 11 surfaces, and the used heat that electronic component 11 is produced sees through samming sheet 12 and is sent to heat conducting element 13.Yet, use the shell fragment 14 of four fixing hole 14c of symmetry can't effectively save the shared space of heat radiation module 10.
Moreover traditional heat radiation module 10 is easy to generate the situation that elastic force departs from geometric center L.Please refer to Fig. 3 A and 3B, it is depicted as the shortcoming of the heat radiation module 10 of traditional electronic devices.In Fig. 3 A, because width and the thickness of each extension elasticity arm 14b are inequality, the arm of force that makes each extend elasticity arm 14b is unequal, so elastic force P departs from geometric center L.In Fig. 3 B,, make the arm of force that extends elasticity arm 14b unequal, so elastic force P depart from geometric center L because the position of fixing hole 14c is asymmetric.Elastic force P departs from geometric center L and causes heat conducting element 13 discontinuity, so the used heat of electronic component 11 can't effectively reach heat conducting element 13, and then the effect of influence heat radiation module 10 and reduce the stability of heat radiation module 10.
If desire keeps elastic force to act on the centre line L of electronic component 11, need by the material, width, the thickness that change shell fragment 14 or be maintained fixed the position symmetry of hole 14c, extend on elasticity arm 14b in each to form the identical arm of force, make elastic force P be positioned on the centre line L and proportionality action in heat conducting element 13.Yet this practice must calculate respectively that the arm of force that extends elasticity arm 14b adjusts again, and design process is not only complicated and time-consuming.
Summary of the invention
In view of this, present invention is directed to a kind of module and use its electronic installation of dispelling the heat, utilize single-point contact shell fragment to apply elastic force in heat conducting element, and shell fragment is positioned at the geometric center of electronical elements surface in fact, make the elastic force stepless action to heat conducting element, to improve the radiating effect of heat radiation module.Moreover, utilize the characteristic of single-point contact shell fragment, when extending the unequal arm of force of elasticity arm tool, the heat radiation module still has good effect, and then improves stability.
According to an aspect of the present invention, a kind of heat radiation module is proposed.Heat radiation module system is arranged at an electronic component, and electronic component system is arranged at a circuit board.The heat radiation module comprises a heat conducting element and a shell fragment.Heat conducting element contact electronical elements surface.Shell fragment is suspended in the heat conducting element surface, and comprises dull and stereotyped and several extension elasticity arms.Flat board has a salient point, salient point thermal contact conductance element surface.Extension elasticity arm system is stretched out by plate edge and is fixed in circuit board, makes salient point apply an elastic force in heat conducting element.The application of force direction system of elastic force is by the geometric center of electronical elements surface.
According to a further aspect in the invention, a kind of electronic installation is proposed.Electronic installation comprises a circuit board, an electronic component and a heat radiation module.Electronic component is arranged at circuit board.The heat radiation module comprises a heat conducting element and a shell fragment.Heat conducting element contact electronical elements surface.Shell fragment is suspended in the heat conducting element surface, and comprises dull and stereotyped and several extension elasticity arms.Flat board has a salient point, salient point thermal contact conductance element surface.Extension elasticity arm system is stretched out by plate edge and is fixed in circuit board, makes salient point apply an elastic force in heat conducting element.The application of force direction system of elastic force is by the geometric center of electronical elements surface.
For foregoing of the present invention can be become apparent, a preferred embodiment cited below particularly, and cooperate appended graphicly, be described in detail below:
Description of drawings
Figure 1 shows that a kind of schematic diagram of heat radiation module of traditional electronic devices;
Figure 2 shows that the profile of heat radiation module of the traditional electronic devices of Fig. 1;
Fig. 3 A and 3B are depicted as the shortcoming of the heat radiation module of traditional electronic devices;
Figure 4 shows that schematic diagram according to the electronic installation of a preferred embodiment of the present invention;
Figure 5 shows that the profile of the electronic installation of Fig. 4;
Figure 6 shows that the assembly drawing of the electronic installation of Fig. 4; And
Fig. 7 A and 7B are depicted as the schematic diagram of the extension elasticity arm tool arm of force inequality of shell fragment.
Embodiment
Please Figure 4 shows that schematic diagram simultaneously with reference to Fig. 4 and Fig. 5, Figure 5 shows that the profile of the electronic installation 100 of Fig. 4 according to the electronic installation 100 of a preferred embodiment of the present invention.In order to clearly demonstrate, Fig. 4 decomposes each assembly of electronic installation 100 and upset.Electronic installation 100 comprises a circuit board 25, an electronic component 21 and a heat radiation module 20.Electronic component 21 is to be arranged at circuit board 25.Electronic component 21 for example is a process chip, electric capacity or transformer etc.In the present embodiment, electronic component 21 is to be that example explains with a process chip.Heat radiation module 20 comprises a heat conducting element 23 and a shell fragment 24.Heat conducting element 23 is contacted with electronic component 21 surfaces, is sent to heat conducting element 23 so that used heat sheds in order to the used heat that electronic component 21 is produced.Heat conducting element 23 can comprise a San Re Sushi sheet or a super heat-conductive pipe (Heat pipe).Shell fragment 24 is suspended in heat conducting element 23 surfaces and comprises a dull and stereotyped 24a and several extension elasticity arms 24b, as shown in Figure 5.
Dull and stereotyped 24a has a salient point 24d, and salient point 24d system is contacted with heat conducting element 23 surfaces.Extension elasticity arm 24b is stretched out by dull and stereotyped 24a edge and is fixed in circuit board 25, makes salient point 24d apply an elastic force P in heat conducting element 23.The application of force direction system of elastic force P is by the geometric center L on electronic component 21 surfaces.In present embodiment, be several screw holes 26 that several fixing holes 24c of utilizing a plurality of screws 28 will extend elasticity arm 24b is fixed in circuit board 25, shell fragment 24 is out of shape slightly and produces an elastic force P.Yet extending elasticity arm 24b can also be fixed in circuit board 25 by spring.Elastic force P sees through heat conducting element 23 and acts on electronic component 21, makes the used heat of electronic component 21 be sent to heat conducting element 23.Because the application of force direction of elastic force P system is by the geometric center L on electronic component 21 surfaces, so elastic force P system acts on electronic component 21 fifty-fifty, makes electronic component 21 surfaces contact with 20 whole of the maintenances of heat radiation module.
Further, heat conducting element 23 comprises more that preferably one all presses element 29 with average mark shot power P, as shown in Figure 4.Salient point 24d is contacted with and all presses element 29 surfaces, makes elastic force P via all pressing element 29 and seeing through heat conducting element 23 stepless actions in electronic component 21, as shown in Figure 5.In the present embodiment, all press element 29 for example be copper or aluminium material to increase thermal conductivity, so all press element 29 also to can be other rigidity material, in order to average elastic force P.
In addition, please refer to Fig. 6, it is depicted as the assembly drawing of the electronic installation 100 of Fig. 4.All press element 29 to comprise several reference columns 29a, and the dull and stereotyped 24a of shell fragment 24 comprises several location holes 24e corresponding to reference column 29a, reference column 29a passes the horizontal displacement of location hole 24e with Location resilient piece 24, as shown in Figure 6.Because shell fragment 24 is subjected to the restriction of reference column 29a, makes salient point 24d remain in the geometric center L between electronic component 21 tables, and situation such as deflection can not take place.
The number of right location hole 24e and reference column 29a is not limited thereto, but the horizontal displacement person of any Location resilient piece 24 all can be applicable to this.
In addition, heat conducting element 23 preferably more comprises a samming element 22, as shown in Figure 4.Samming element 22 is contacted with electronic component 21 surfaces.Because the used heat of electronic component 21 not necessarily is evenly distributed, samming element 22 makes the used heat of electronic component 21 can conduct to heat conducting element 23 fast in order to the used heat of even dispersion electronic component 21.
As shown in Figure 5, shell fragment 24 is the rigidity material in the present embodiment, and extends elasticity arm 24b and have a bending part 24f, and each extends elasticity arm 24f and provides one fen respectively to the elastic force (not shown) with synthetic elastic force P.The material of right shell fragment 24 and shape system are not restricted to this, and any effect person who reaches the enough elastic force P of formation all can be applicable to herein.In addition, the shell fragment 24 of present embodiment is that to extend elasticity arm 24b with three be that example is done explanation (as shown in Figure 4), right quantity system of extending elasticity arm 24b is not limited thereto, the quantity system of extending elasticity arm 24b can design according to peripheral space, but all can be applicable to this as long as extend elasticity arm 24b fixation spring tab.
Present embodiment system does explanation to have identical branch to the extension elasticity arm 24b of elastic force, and the extension elasticity arm 24b of right unequal dispersion elastic force also can reach effect.Please refer to Fig. 7 A and 7B, it is depicted as the schematic diagram of the different arm of forces of extension elasticity arm 24b tool of shell fragment 24.Each of shell fragment 24 is extended elasticity arm 24b and may be caused the arm of force unequal because of different width, length and thickness, and the angle of extending between the elasticity arm 24b also may cause the arm of force unequal, makes shell fragment 24 produce crooked situation.Because the salient point 24d of shell fragment 24 only is contacted with the upper surface of heat conducting element 23, so elastic force P still can act on the geometric center on electronic component 21 surfaces.
That is to say to have the different arm of forces even extend elasticity arm 24b, elastic force P still acts on the geometric center L on electronic component 21 surfaces.Therefore,, and extend between the elasticity arm 24b and have angle same though the extension elasticity arm 24b cording of present embodiment has same widths, length and thickness, so extend elasticity arm 24b length, width and thickness and between angle not limited thereto.As long as shell fragment 24 is the horizontal displacement with single salient point 24d thermal contact conductance element 23 surfaces and Location resilient piece 24, can keep elastic force P still to act on the geometric center L on electronic component 21 surfaces, and do not need to design especially length, width and the thickness that each extends elasticity arm 24b, and between angle.
Above-mentioned according to preferred embodiment of the present invention the heat radiation module and use its electronic installation, system utilizes single-point contact shell fragment to apply elastic force in heat conducting element, and shell fragment is in fact the geometric center that is positioned at electronical elements surface, make the elastic force stepless action to heat conducting element, the radiating effect that not only improves the heat radiation module has more multiple advantages, below only enumerates the part advantage and is described as follows:
The first, salient point system is contacted with and all presses element surface, in order to average elastic force and make elastic force see through heat conducting element fifty-fifty to put on electronic component, contact with whole of heat conducting element to keep electronic component.
The second, samming element contact electronical elements surface is in order to disperse the used heat of electronic component equably, to promote heat conducting usefulness.
Three, elastic force system is sent to electronic component by the salient point of shell fragment through heat conducting element.Utilize the design of this single-point contact, the transmission of elastic force can not be subjected to the influence of shell fragment shape or fixing hole position, and need not calculate each arm of force that extends elasticity arm and can keep the geometric center that elastic force acts on electronical elements surface.Convenience when therefore having promoted assembling also more saves time, and more can freely dispose the assembly in the electronic installation.
Four, can see through the method that reduces extension elasticity arm quantity, the space of more effective use electronic installation in addition.
The 5th moreover, if crooked situation takes place shell fragment, elastic force still can act on the geometric center of electronical elements surface by salient point, has therefore more promoted the stability of heat radiation module.
In sum, though the present invention discloses as above with a preferred embodiment, so it is not in order to limit the present invention.The persond having ordinary knowledge in the technical field of the present invention, without departing from the spirit and scope of the present invention, when being used for a variety of modifications and variations.Therefore, protection scope of the present invention is as the criterion when looking the accompanying Claim book person of defining.
Claims (28)
1. a heat radiation module is applied to an electronic component, and above-mentioned electronic component is arranged on the circuit board, it is characterized in that above-mentioned heat radiation module comprises:
One heat conducting element contacts above-mentioned electronical elements surface; And
One shell fragment is suspended in above-mentioned heat conducting element surface, and above-mentioned shell fragment comprises:
One flat board has a salient point, contacts above-mentioned heat conducting element surface; And
A plurality of extension elasticity arms are stretched out and are fixed in the foregoing circuit plate by above-mentioned plate edge, make above-mentioned salient point apply an elastic force in above-mentioned heat conducting element, and the application of force direction of above-mentioned elastic force is by the geometric center of above-mentioned electronical elements surface.
2. heat radiation module according to claim 1 is characterized in that above-mentioned shell fragment is the rigidity material.
3. heat radiation module according to claim 1 is characterized in that above-mentioned these extend elasticity arm and have a bending part, to form above-mentioned elastic force.
4. heat radiation module according to claim 1 is characterized in that each above-mentioned extension elasticity arm provides one fen respectively to elastic force with synthetic above-mentioned elastic force, and above-mentioned these branches are unequal to elastic force.
5. heat radiation module according to claim 1 is characterized in that above-mentioned width and length that these extend elasticity arm are unequal.
6. heat radiation module according to claim 1, it is characterized in that above-mentioned these extend elasticity arms between angle unequal.
7. heat radiation module according to claim 1 is characterized in that above-mentioned these extend elasticity arm and are fixed on the foregoing circuit plate with screw.
8. heat radiation module according to claim 1 is characterized in that above-mentioned these extend elasticity arm and are fixed on the foregoing circuit plate with spring.
9. heat radiation module according to claim 1 is characterized in that above-mentioned heat conducting element comprises that one all presses element, and in order to the above-mentioned elastic force of average dispersion, above-mentioned salient point is contacted with the above-mentioned element surface of all pressing.
10. heat radiation module according to claim 9, it is characterized in that the above-mentioned element of all pressing comprises at least one reference column, the above-mentioned flat board of above-mentioned shell fragment comprises at least one location hole, and above-mentioned reference column is corresponding and be arranged in above-mentioned location hole, to locate the horizontal displacement of above-mentioned shell fragment.
11. heat radiation module according to claim 9 is characterized in that the above-mentioned element of all pressing is the rigidity material.
12. heat radiation module according to claim 9 is characterized in that the above-mentioned element of all pressing is copper or aluminum metal.
13. heat radiation module according to claim 1 is characterized in that above-mentioned heat conducting element comprises a samming element, contacts above-mentioned electronical elements surface, in order to the heat energy of the above-mentioned electronic component of even dispersion.
14. heat radiation module according to claim 1 is characterized in that above-mentioned heat conducting element comprises a San Re Sushi sheet or a super heat-conductive pipe.
15. an electronic installation is characterized in that comprising:
One circuit board;
One electronic component is arranged on the foregoing circuit plate; And
One heat radiation module comprises:
One heat conducting element contacts above-mentioned electronical elements surface; And
One shell fragment is suspended in above-mentioned heat conducting element, and above-mentioned shell fragment comprises:
One flat board has a salient point, contacts above-mentioned heat conducting element surface; And
A plurality of extension elasticity arms are stretched out and are fixed on the foregoing circuit plate by above-mentioned plate edge, make above-mentioned salient point apply an elastic force in above-mentioned heat conducting element, and the application of force direction of above-mentioned elastic force is by the geometric center of above-mentioned electronical elements surface.
16. electronic installation according to claim 15 is characterized in that above-mentioned shell fragment is the rigidity material.
17. electronic installation according to claim 15 is characterized in that above-mentioned these extend elasticity arm and have a bending part, to form above-mentioned elastic force.
18. electronic installation according to claim 15 is characterized in that each above-mentioned extension elasticity arm provides one fen respectively to elastic force with synthetic above-mentioned elastic force, above-mentioned these branches are unequal to elastic force.
19. electronic installation according to claim 15 is characterized in that above-mentioned width and length that these extend elasticity arm are unequal.
20. electronic installation according to claim 15, it is characterized in that above-mentioned these extend elasticity arms between angle unequal.
21. electronic installation according to claim 15 is characterized in that above-mentioned these extend elasticity arm and are fixed on the foregoing circuit plate with screw.
22. electronic installation according to claim 15 is characterized in that above-mentioned these extend elasticity arm and are fixed on the foregoing circuit plate with spring.
23. electronic installation according to claim 15 is characterized in that above-mentioned heat conducting element comprises that one all presses element, in order to the above-mentioned elastic force of average dispersion, and the above-mentioned element surface of all pressing of above-mentioned salient point contact.
24. electronic installation according to claim 23, it is characterized in that the above-mentioned element of all pressing comprises at least one reference column, the above-mentioned flat board of above-mentioned shell fragment comprises at least one location hole, and above-mentioned reference column is corresponding to above-mentioned location hole, and pass above-mentioned location hole, to locate the horizontal displacement of above-mentioned shell fragment.
25. electronic installation according to claim 23 is characterized in that the above-mentioned element of all pressing is the rigidity material.
26. electronic installation according to claim 23 is characterized in that the above-mentioned element of all pressing is copper or aluminum metal.
27. electronic installation according to claim 15 is characterized in that above-mentioned heat conducting element comprises a samming element, contacts above-mentioned electronical elements surface, in order to the heat energy of the above-mentioned electronic component of even dispersion.
28. electronic installation according to claim 15 is characterized in that above-mentioned heat conducting element comprises a San Re Sushi sheet or a super heat-conductive pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101098539A CN101316498B (en) | 2007-05-31 | 2007-05-31 | Heat sink assembly and electronic device using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101098539A CN101316498B (en) | 2007-05-31 | 2007-05-31 | Heat sink assembly and electronic device using the same |
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| Publication Number | Publication Date |
|---|---|
| CN101316498A CN101316498A (en) | 2008-12-03 |
| CN101316498B true CN101316498B (en) | 2011-04-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101098539A Active CN101316498B (en) | 2007-05-31 | 2007-05-31 | Heat sink assembly and electronic device using the same |
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| Country | Link |
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| CN (1) | CN101316498B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10978372B1 (en) * | 2019-11-11 | 2021-04-13 | Google Llc | Heat sink load balancing apparatus |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1277459A (en) * | 1999-06-11 | 2000-12-20 | 托马斯-贝茨国际公司 | LGA clamping mechanism |
| US6317325B1 (en) * | 2000-02-23 | 2001-11-13 | Lucent Technologies Inc. | Apparatus for protecting circuit pack assemblies from thermal and electromagnetic effects |
| CN2676162Y (en) * | 2004-02-27 | 2005-02-02 | 张寅啸 | Weep meter |
| CN2681335Y (en) * | 2004-02-27 | 2005-02-23 | 珍通科技股份有限公司 | Heat sink |
| CN1725476A (en) * | 2004-07-21 | 2006-01-25 | 台达电子工业股份有限公司 | Heat sink device |
-
2007
- 2007-05-31 CN CN2007101098539A patent/CN101316498B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1277459A (en) * | 1999-06-11 | 2000-12-20 | 托马斯-贝茨国际公司 | LGA clamping mechanism |
| US6317325B1 (en) * | 2000-02-23 | 2001-11-13 | Lucent Technologies Inc. | Apparatus for protecting circuit pack assemblies from thermal and electromagnetic effects |
| CN2676162Y (en) * | 2004-02-27 | 2005-02-02 | 张寅啸 | Weep meter |
| CN2681335Y (en) * | 2004-02-27 | 2005-02-23 | 珍通科技股份有限公司 | Heat sink |
| CN1725476A (en) * | 2004-07-21 | 2006-01-25 | 台达电子工业股份有限公司 | Heat sink device |
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| CN101316498A (en) | 2008-12-03 |
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