CN101303703B - Drill system and method for threading throughhole - Google Patents
Drill system and method for threading throughhole Download PDFInfo
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- CN101303703B CN101303703B CN2007101022671A CN200710102267A CN101303703B CN 101303703 B CN101303703 B CN 101303703B CN 2007101022671 A CN2007101022671 A CN 2007101022671A CN 200710102267 A CN200710102267 A CN 200710102267A CN 101303703 B CN101303703 B CN 101303703B
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Abstract
A system and a method for arranging a threading through hole, which are embarked in the wiring software used for manufacturing a printed circuit board and include: pre-detecting the conversion layersof the differential line jitter arraigned by the wiring software in the printed circuit board so as to obtain the change situations of the reference layer of the differential line jitter in the circuitconversion process and the corresponding property of the reference layer thereof; carrying out analysis on the detected change situations of the reference layer of the differential line jitter in the circuit conversion process and the corresponding property of the reference layer thereof so as to judge whether or not a corresponding threading through hole needs to be arranged; searching in the su rrounding of the conversion through hole of the differential line jitter when the differential line jitter is needed to be provided with the threading through hole by analyzing so as to confirm a bestpreset arranging position; arranging the needed through hole on the best preset arranging position, thereby leading the threading through hole to provide a refluence route to the differential line ji tter so as to prevent the differential line jitter from generating an electromagnetic interference as well as improve the signal transmission capacity and the product quality of the printed circuit board.
Description
Technical field
The present invention relates to a kind of laying technology that connects through hole, more detailed it, relate to a kind of in the differential corresponding system and method that connects through hole of laying when line is changed layer and lays.
Background technology
At present, the Electronics Engineer normally finishes by all kinds of software programs (for example Protel software) for the configuration (Layout) of multilayer board.Wherein, because of advantages such as differential wave has at a high speed, the low-voltage amplitude of oscillation and low-power are subjected to more and more widely application, so in having wires design now, differential is a kind of comparatively common cabling mode to line.
But, in the layout process of printed circuit board (PCB), some is differential can change layer and lay an operation line because of designing requirement need to carry out in this printed circuit board (PCB), and should differentially lay to change layer through offering through hole line the time, its front and back two cablings reference layer partly that changes layer point also might correspondingly change.By way of example, if this is differential line is converted to the 3rd layer (L3) from the top layer (Top) of printed circuit board (PCB), the reference layer that changes the front and back two cablings part of layer point is the ground plane (GND) of the second layer (L2), and reference layer does not change, and this is differential to possess a complete return flow path to line; And if this differentially is converted to the 6th layer (L6) to line from the top layer (Top) of printed circuit board (PCB), reference layer with respect to the preceding cabling part of changing layer point is the ground plane (GND) of the second layer (L2), the reference layer that changes the back cabling part of layer point then is converted to the ground plane (GND) of the 7th layer (L7), reference layer changes, this is differential can't to provide a complete return flow path to line, influences signal transfer quality.
Above-mentioned for solving because of the change of changing layer back reference layer causes differentially can't providing the defective of return flow path to line, generally when offering through hole, also need consider to offer and connect through hole in the periphery of this through hole.The existing practice generally is at first to be judged whether and need offer and connect through hole in this differential layer bore periphery of changing to line according to the reference layer of the front and back two cablings part of changing layer point and situation that whether the reference layer attribute changes thereof by wiring installation teacher, and in determine to offer connect through hole after, check other circuit that (for example is 100mil) in this peripheral certain limit of changing layer through hole and lay situation and offer the position, offer and connect through hole for offer the position in this default the best to determine a default the best.
But, in the aforementioned prior art, because of whether needing to offer the judgement that connects through hole, and determine that default the best offers operation such as position and all finish with manual type by wiring installation teacher, work efficiency is lower.In addition, wiring installation teacher can offer the corresponding through hole that connects because artificial carelessness may be forgotten, and cause follow-up circuit to check wrong difficulty, even check (Design Rule Check with for example design rule, DRC) quote mistake, gathered because of the conversion bore periphery and to have finished other circuit, what cause determining the best of presetting offers position, the influence quality that connects through hole of offering.On the other hand, operating process is complicated, and too much spent time of human resources and cost are too high, seeks the production cost reduction to increase the manufacturer of product competitiveness to desiring most ardently, and obviously is extremely irrational.
Therefore, how to overcome the defective of above-mentioned prior art, but and then provide the differential situation of change of a kind of Auto-Sensing to connect through hole to judge whether to need to offer in view of the above to line reference layer and reference layer attribute thereof in changing layer operation, and determine that in the conversion bore periphery default the best offers the position, avoid the mistake that causes because of manual operation in the prior art, the flow process that simplifies the operation and saving activity duration, and improve the efficient of work, real is present problem demanding prompt solution.
Summary of the invention
In view of the defective of above-mentioned prior art, fundamental purpose of the present invention is to provide a kind of can automatic the laying connect through hole in the differential process of changing layer laying to line, to provide return flow path to the differential system and method for offering that connects through hole to line.
The system and method for offering that connects through hole of another object of the present invention is to provide a kind of simplified operation flow process, saving the activity duration and reduce production costs.
For reaching above-mentioned purpose and other, the invention provides a kind of system that offers that connects through hole, it carries extremely in order to make printed circuit board (PCB) (Printed CircuitBoard by data processing equipment, PCB) in the wiring software, in order to provide return flow path to this wiring software lay differential to line (Differential Pair), this system that offers that connects through hole comprises: in order to detecting by this wiring software lay differential to the conversion number of plies of line in this printed circuit board (PCB), be taken in the line transfer process this differential to line reference layer and the detecting module of the changing condition of corresponding reference layer attribute; Connect the condition of offering of through hole in order to foundation, this detecting module is detected this differential the reference layer of line and the changing condition of corresponding reference layer attribute thereof are analyzed, need offer and this differential analysis module of connecting through hole corresponding judging whether line; In order to differential line need being offered when connecting through hole, search for to determine that a default the best offers the location finding module of position in this differential conversion bore periphery to line when obtain this by this analysis module analysis; And be used to that this location finding module is determined should default the best to be offered the position and offer the required module of offering that connects through hole.
In a kind of kenel of the present invention, this wiring software has the report generation module, be used to offer finish this and connect through hole after, this is offered the result tests and generate an analysis report.
In a kind of kenel of the present invention, this condition of offering that connects through hole only be meant when this reference layer change with and corresponding reference layer attribute when not changing, the beginning need to lay and this differential to line corresponding connect through hole.And in a preferred embodiment, this reference layer attribute is for example bus plane and ground plane.And this connect through hole also have one with the corresponding attribute of reference layer attribute.
The present invention also provides a kind of method of offering that connects through hole, this method of offering that connects through hole comprises: (1) detecting by wiring software lay differential to the conversion number of plies of line in this printed circuit board (PCB), differential to be taken in the line transfer process this to the reference layer of line and the changing condition of corresponding reference layer attribute thereof; (2) according to the condition of offering that connects through hole, to this institute detect this differential to line reference layer and the changing condition of corresponding reference layer attribute analyze with judge whether to offer with this differential to line corresponding connect through hole, if, execution in step (3) then, if not, process ends step then; (3) search for to determine that a default the best offers the position in this differential conversion bore periphery line; And (4) offer the position in this default the best and offer the required through hole that connects, and provides return flow path differential to line to this to make this connect through hole
Than existing configuration technology, the system and method for offering that connects through hole of the present invention, be carry out differential to line change layer operation the time, be detected in advance whether this differential reference layer and corresponding reference layer attribute thereof to line changes in the line transfer process, and this changing condition analyzed to determine whether to offer connect through hole, and when offering operation, search for to determine that a default the best offers the position for offering the required through hole that connects to changing bore periphery, thereby provide return flow path differential to line to this, solve owing to need in the prior art to offer the problem that easily expends plenty of time and inefficiency, increase work efficiency and reduce production costs with manual type.
Description of drawings
Fig. 1 is the basic framework block schematic diagram that connects the system that offers of through hole of the present invention;
Fig. 2 is the schematic flow sheet that connects the method for offering of through hole of the present invention;
Fig. 3 is the step S200 of the method for offering that connects through hole of the present invention and the more detailed schematic flow sheet of S202; And
Fig. 4 is an Application Example synoptic diagram offering system and method that connects through hole of the present invention.
Description of reference numerals
1 connects the system that offers 10 detecting modules of through hole
12 analysis modules, 14 location finding modules
16 offer module 2 wiring software
20 report generation modules, 3 printed circuit board (PCB)s
400 is differential to line 410 conversion through holes
421,422 reference layers, 430 default the bests are offered the position
440 connect through hole S200 to S208 step
S300 to S306 step
Embodiment
Below by particular specific embodiment explanation embodiments of the present invention, the personage who is familiar with this skill can understand other advantage of the present invention and effect easily by the content that this instructions disclosed.The present invention also can be implemented or be used by other different specific embodiment, and the every details in this instructions also can be based on different viewpoints and application, carries out various modifications and change under the spirit of the present invention not deviating from.
See also Fig. 1, it is the basic framework block schematic diagram that connects the system that offers of through hole of the present invention.This system that offers 1 that connects through hole carry in order to by as data processing equipments such as personal computer, mobile computer, workstation carry out in the wiring software 2 of making printed circuit board (PCB), in order to provide return flow path to this wiring software 2 laid differential to line.In present embodiment, this wiring software 2 can be for example but is not defined as EDA, Protel etc., this differential can be for example to line but be not defined as HW High Way.
As shown in the figure, the system that offers 1 that connects through hole of the present invention comprises: detecting module 10, analysis module 12, location finding module 14 and offer module 16.
This detecting module 10 in order to detecting by wiring software 2 laid differential to the conversion number of plies of line in this printed circuit board (PCB), differential to be taken in the line transfer process this to the reference layer of line and the changing condition of corresponding reference layer attribute thereof.In present embodiment, this is differential to be able to conversion line and to lay layer by offering the conversion through hole line.Reference layer specifically comprises bus plane and ground plane.
This analysis module 12 is in order to according to a condition of offering that connects through hole, to this detecting module 10 detect this differential to line reference layer and the changing condition of corresponding reference layer attribute analyze with judge whether to offer with this differential to line corresponding connect through hole.In present embodiment, this offers that condition is meant if two cablings reference layer does not partly change before and after should be differential line being referred to change, and does not then need to offer to connect through hole; If the reference layer of two cablings part changes before and after should be differential line being referred to change, and the attribute of two reference layers of change also changes, and then do not need to offer to connect through hole; But have this differential line is referred to change before and after the reference layer of two cablings part change, but the reference layer attribute of two reference layers that change is not when changing, the beginning need to lay and this differential to line corresponding connect through hole.
This location finding module 14 is in order to obtaining this and differentially need offer when connecting through hole line when analyzing by this analysis module 12, searches for to determine that a default the best offers the position in this differential conversion through hole (via) periphery to line.In present embodiment, this default the best is offered the position and is positioned at this conversion bore periphery certain limit (for example being 100mil) and keeps for example place, 45 degree pitch angle with the conversion through hole.And in another embodiment,, then can correspondingly dwindle hunting zone (for example for 35mil), and carry out suitable adjustment in follow-up if this conversion bore periphery has been densely covered with other signal lead.
This offers module 16 is to be used to this location finding module 14 fixed default the bests offer the position and offer the required through hole that connects, thereby making this connect through hole provides return flow path differential to line to this, differential to prevent this to line generation electromagnetic interference (EMI), avoid in prior art, needing to offer the problem that easily expends plenty of time and inefficiency, increase work efficiency and reduce production costs with manual type.In addition, connect in the via process in offering of present embodiment, this offer module 16 also comprise to laid connect through hole provide one with the corresponding attribute of reference layer attribute.
In addition, this wiring software 2 has report generation module 20, in order to follow-up in offer by this module 16 offer finish this and connect through hole after, this is offered the result tests and generate an analysis report, thereby make adjustment in follow-up for laying the slip-stick artist.In present embodiment, this check can be for example for design rule check (Design Rule Check, DRC).
By the system that offers that connects through hole 1 of the present invention carry out of the present invention connect through hole offer method flow as shown in Figure 2, the method of offering that connects through hole of the present invention comprises following detailed implementation step: at step S200, make detecting module 10 detect in advance by wiring software 2 laid differential to the conversion number of plies of line in this printed circuit board (PCB), differential to be taken in the line transfer process this to the reference layer of line and the changing condition of corresponding reference layer attribute thereof.Subsequently, execution in step S202.
At step S202, make this analysis module 12 according to a condition of offering that connects through hole, to this detecting module 10 detect this differential to line reference layer and the changing condition of corresponding reference layer attribute analyze with judge whether to offer with this differential to line corresponding connect through hole.If, execution in step S204 then; Otherwise, if not, execution in step S208 then.
At step S204, make this location finding module 14 search for definite one default the best and offer the position in this differential conversion bore periphery to line.Subsequently, execution in step S206.
At step S206, making this offer module 16 offers the position in these location finding module 14 determined default the bests and offers the required through hole that connects, and give the through hole of being laid that connects can the attribute corresponding with reference layer, thereby provide return flow path differential to line to this, differential to prevent this to line generation electromagnetic interference (EMI).
At step S208, continue to carry out other laying operation by wiring software 2.
Follow-up, also can make the report generation module 20 of this this wiring software 2, this is offered the result test and generate an analysis report, thereby make adjustment in follow-up for laying the slip-stick artist.
Please continue to consult Fig. 3, it is the step S200 of the method for offering that connects through hole of the present invention and the more detailed step explanation of S202.At step S300, make detecting module 10 detect in advance by wiring software 2 laid differential to the conversion number of plies of line in this printed circuit board (PCB), and judge whether this differential reference layer to line changes in the line transfer process, if change, execution in step S302 then; Otherwise if do not change, execution in step S306 is then analyzed to draw to need not to offer by analysis module 12 and connects through hole.
At step S302, make this detecting module 10 judge further whether the pairing reference layer attribute of reference layer of this change changes, if change, then goes to step S306, draw to need not to offer by analysis module 12 analyses and connect through hole; Otherwise, if change, execution in step S304 then.
At step S304, make analysis module 12 change and the unaltered changing condition analysis of reference layer attribute obtains offering and connects through hole according to above-mentioned reference layer.
See also Fig. 4, its show of the present invention connect through hole offer system and method one Application Example synoptic diagram.As shown in the figure, the differential conversion through hole 410 that line 400 is offered by wiring software 2 and be converted to the 6th layer (L6) from the top layer (Top) of printed circuit board (PCB) 3, wherein, the reference layer 421 that changes the preceding cabling part of layer is the ground plane (GND) of the second layer (L2), the reference layer 422 that changes the cabling part behind the layer then is converted to the ground plane (GND) of the 7th layer (L7), and reference layer changes but the reference layer attribute does not change.Need offer according to the condition of offering that connects through hole and to connect through hole, so in this conversion through hole 410 peripheries determine the bests of presetting offer position 430 with offer have an attribute corresponding with ground plane (GND) connect through hole 440, thereby making this connect through hole 440 provides return flow path differential to line to this, differential to prevent this to line 400 generation electromagnetic interference (EMI), promote signal transfer quality.
In sum, the system and method for offering that connects through hole of the present invention, be carry out differential to line change layer operation the time, detect differential in advance to the conversion number of plies of line in printed circuit board (PCB), to judge whether this differential reference layer and corresponding reference layer attribute thereof to line changes in the line transfer process, and this situation of change analyzed to determine whether to offer connect through hole, and when offering operation, search for to determine that a default the best offers the position to changing bore periphery, thereby offer the required through hole that connects in view of the above, can provide return flow path differential to line to this, use and prevent that this is differential to line generation electromagnetic interference (EMI), promote signal transfer quality, solve, increase work efficiency really and reduce production costs owing to need in the prior art to offer the problem that easily expends plenty of time and inefficiency with manual type.
The foregoing description only is illustrative principle of the present invention and effect thereof, but not is used to limit the present invention, that is the present invention in fact still can do other change.Therefore, any those skilled in the art all can make amendment to the foregoing description under spirit of the present invention and category.So the scope of the present invention, claims are listed as the aforementioned.
Claims (8)
1. system that offers that connects through hole, it carries in order to making by data processing equipment in the wiring software of printed circuit board (PCB), in order to provide return flow path to this wiring software lay differential to line, this system that offers that connects through hole comprises:
Detecting module, its in order to detecting by this wiring software lay differential to the conversion number of plies of line in this printed circuit board (PCB), differential to be taken in the line transfer process this to the reference layer of line and the changing condition of corresponding reference layer attribute thereof;
Analysis module, it connects the condition of offering of through hole in order to foundation, this detecting module is detected this differentially to be analyzed the reference layer of line and the changing condition of corresponding reference layer attribute thereof, with judge whether to offer with this differential to line corresponding connect through hole, wherein, this condition of offering that connects through hole only be meant when this reference layer change with and corresponding reference layer attribute when not changing, just need laying and this differential to line corresponding connect through hole;
The location finding module, it be in order to differentially need offering when connecting through hole line when obtain this by this analysis module analysis, searches for to determine that a default the best offers the position in this differential conversion bore periphery to line; And
Offer module, it is used to, and this location finding module is determined should default the best to be offered the position and offers the required through hole that connects, and provides return flow path differential to line to this thereby make this connect through hole.
2. the system that offers that connects through hole according to claim 1, wherein, this wiring software also has the report generation module, be used to offer finish this and connect through hole after, this is offered the result tests and generate an analysis report.
3. the system that offers that connects through hole according to claim 1, wherein, this offer module also be included in the process of offering to laid connect through hole provide one with the corresponding attribute of reference layer attribute.
4. the system that offers that connects through hole according to claim 1, wherein, this reference layer attribute comprises bus plane and ground plane.
5. method of offering that connects through hole, it carries in order to making by data processing equipment in the wiring software of printed circuit board (PCB), in order to provide return flow path to this wiring software lay differential to line, this method of offering that connects through hole comprises:
1) detecting by wiring software lay differential to the conversion number of plies of line in this printed circuit board (PCB), differential to be taken in the line transfer process this to the reference layer of line and the changing condition of corresponding reference layer attribute thereof;
2) according to the condition of offering that connects through hole, to this institute detect this differential to line reference layer and the changing condition of corresponding reference layer attribute analyze with judge whether to offer with this differential to line corresponding connect through hole, if then execution in step 3, if not, process ends step then; Wherein, this condition of offering that connects through hole only be meant when this reference layer change with and corresponding reference layer attribute when not changing, just need laying and this differential to line corresponding connect through hole;
3) search for to determine that a default the best offers the position in this differential conversion bore periphery line; And
4) offer the position in this default the best and offer the required through hole that connects, provide return flow path differential to line to this to make this connect through hole.
6. the method for offering that connects through hole according to claim 5, also be included in offer finish this and connect through hole after, this is offered the result tests and generate an analysis report.
7. the method for offering that connects through hole according to claim 5, wherein, step 4 also comprise to laid connect through hole provide one with the corresponding attribute of reference layer attribute.
8. the method for offering that connects through hole according to claim 5, wherein, this reference layer attribute comprises bus plane and ground plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101022671A CN101303703B (en) | 2007-05-09 | 2007-05-09 | Drill system and method for threading throughhole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101022671A CN101303703B (en) | 2007-05-09 | 2007-05-09 | Drill system and method for threading throughhole |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101303703A CN101303703A (en) | 2008-11-12 |
| CN101303703B true CN101303703B (en) | 2010-04-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101022671A Active CN101303703B (en) | 2007-05-09 | 2007-05-09 | Drill system and method for threading throughhole |
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| CN (1) | CN101303703B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102930080B (en) * | 2012-10-09 | 2015-01-14 | 无锡江南计算技术研究所 | Rear panel large-small-hole drilling data processing method and rear panel manufacturing method |
| CN103077285A (en) * | 2013-01-18 | 2013-05-01 | 浪潮电子信息产业股份有限公司 | Dual-hole design method for increasing loops |
| CN103593526A (en) * | 2013-11-15 | 2014-02-19 | 浪潮电子信息产业股份有限公司 | Design method for automatically searching copper foil clearances in stacks of PCBs |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6898772B1 (en) * | 2002-01-22 | 2005-05-24 | Cadence Design Systems, Inc. | Method and apparatus for defining vias |
| CN1836238A (en) * | 2003-06-16 | 2006-09-20 | 日本电气株式会社 | Printed circuit wiring board designing support device, printed circuit board designing method, and its program |
-
2007
- 2007-05-09 CN CN2007101022671A patent/CN101303703B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6898772B1 (en) * | 2002-01-22 | 2005-05-24 | Cadence Design Systems, Inc. | Method and apparatus for defining vias |
| CN1836238A (en) * | 2003-06-16 | 2006-09-20 | 日本电气株式会社 | Printed circuit wiring board designing support device, printed circuit board designing method, and its program |
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| CN101303703A (en) | 2008-11-12 |
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Effective date of registration: 20141124 Address after: 200122 Shanghai City, Pudong New Area source deep road, No. 1122 Patentee after: STATE GRID SHANGHAI MUNICIPAL ELECTRIC POWER Co. Address before: 510640 Guangdong city of Guangzhou province Tianhe District gold Yinglu No. 1 was 1106 room two Patentee before: GUANGDONG HUABO ENTERPRISE MANAGEMENT CONSULTING Co.,Ltd. Effective date of registration: 20141124 Address after: 510640 Guangdong city of Guangzhou province Tianhe District gold Yinglu No. 1 was 1106 room two Patentee after: GUANGDONG HUABO ENTERPRISE MANAGEMENT CONSULTING Co.,Ltd. Address before: Taipei City, Taiwan, China Patentee before: Yingda Co.,Ltd. |