CN101302645A - Plating bath circulating device of electroplating production facility - Google Patents

Plating bath circulating device of electroplating production facility Download PDF

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Publication number
CN101302645A
CN101302645A CNA2008101096699A CN200810109669A CN101302645A CN 101302645 A CN101302645 A CN 101302645A CN A2008101096699 A CNA2008101096699 A CN A2008101096699A CN 200810109669 A CN200810109669 A CN 200810109669A CN 101302645 A CN101302645 A CN 101302645A
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China
Prior art keywords
major trough
circulation groove
filter
plating bath
production facility
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CNA2008101096699A
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Chinese (zh)
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CN101302645B (en
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匡优新
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Wuxi Xingyi Intelligent Environment Equipment Co Ltd
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Individual
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Abstract

The invention relates to a plating bath circulation device used in electroplating production equipment. The plating bath circulation device can solve the problem of insufficient inner space of a main bath, prolongs the service life of a solution and reduces workpiece pollution at the same time. The circulation device comprises the main bath and a circulation bath, and is characterized in that: the bottom of the main bath is an inclined bottom and is provided with a bottom valve; the main bath is provided with an overflow port; the output end of the overflow port is connected with the circulation bath through a pipeline, while the circulation bath is connected with the main bath through a filter; the outlet of the bottom valve of the main bath is connected with the filter; and the outlet of the filter is connected with the main bath through a pipeline.

Description

Plating bath circulating device in a kind of electroplating production facility
(1) technical field
The present invention relates to electroplating solution is filtered clean, reductive equipment, be specially plating bath circulating device in a kind of electroplating production facility.
(2) background technology
At present, the filtration cycle system in the known electroplating device is that several groups of filters filter major trough and single the coupling together of circulation groove.Auxiliary heating system or cooling system generally are installed in the circulation groove.One end of filter inlet pipe is fixed on the major trough bottom, going out Guan Yiduan is fixed in the circulation groove, the inlet pipe of another filter is fixed in the circulation groove, go out pipe and be fixed on the major trough middle part, such first filter squeezed into circulation groove with solution with major trough after tentatively filtering, in circulation groove, advanced heating or cooling, and then squeezed into major trough, formed a recycle system by the filter filtration.The major trough turnover filter of this filtering system must be identical, promptly what are got, throw into also what are, so when the words of few one of filter quantity just might be filtered unclean, many one words just form the situation of the wasting of resources, if there is one to filter damage, another also just can not be worked, otherwise just has the situation of dried groove or tankful; Because the pipeline of filter is bigger, the space is no problem in the circulation groove simultaneously, but major trough can cause the not enough situation in space because the interior auxiliary of groove is more; In addition owing in major trough, all be the filter pipe, be can't be clean with being deposited on bottom land and swimming in the contaminant filter of liquid level, bring pollution to workpiece easily, unfavorable to prolonging the solution life-span simultaneously.
(3) summary of the invention
At the problems referred to above, the invention provides plating bath circulating device in a kind of electroplating production facility, it can solve the problem of insufficient space in the major trough groove, prolongs the work-ing life of solution, reduces workpiece pollution simultaneously.
Its technical scheme is: it comprises major trough, circulation groove, it is characterized in that: the bottom land of described major trough is the tilting bottom land, described bottom land is provided with bottom valve, described major trough is provided with overflow port, the output terminal of described overflow port is by the pipe connection circulation groove, and described circulation groove connects described major trough by filter; The bottom valve delivery port of described major trough connects filter, and the delivery port of described filter is by the described major trough of pipe connection.
It is further characterized in that: described circulation groove is provided with weak current electrolyzer and added automatically system; The volume of described circulation groove is a major trough volume sum 1/6; Described overflow port and bottom valve are opened the same side at cell body, and the overflow port of several groups of major troughs is parallel with one another by pipeline, gather then to be connected to circulation groove; Described bottom valve is offered the bottommost that places the bottom angled face; The overflow port of described major trough is than circulation groove height height.
After the present invention adopts said structure, avoided the single filtering situation of filter, the quantity of filter no longer is restricted, and one goes wrong simultaneously, and other filter can also be worked equally; The overflow port of major trough and bottom valve effective filter deposition is set at bottom land with swim in the impurity of liquid level, prolong the work-ing life of solution.
(4) description of drawings
Fig. 1 is a vertical view of the present invention;
Fig. 2 is a left view of the present invention.
(5) embodiment
See Fig. 1, Fig. 2, the present invention includes major trough 1, circulation groove 7, the bottom land 13 of major trough 1 is the tilting bottom land, bottom land 13 is provided with bottom valve 12, major trough 1 is provided with overflow port 14, and the output terminal of overflow port 14 connects circulation groove 7 by pipeline 5, and circulation groove 7 connects major trough 1 by filter 6; Bottom valve 12 delivery ports of major trough 1 connect filter 9, the delivery port of filter 9 connects major trough 1 by pipeline 4, this filter 9 is squeezed into the solution in the major trough 1 again major trough 1 and the impurity of bottom land is seethed through filtering, and these impurity will filter out through filter 9.Circulation groove 7 is provided with weak current electrolyzer and added automatically system; 10 is that electrolytic zinc-coated steel sheet, 11 is direct supply, and 15 is to add pump, 16 automatically to be the strong solution groove.The volume of circulation groove 7 is 1/6 of major trough 1 a volume sum; Overflow port 14 and bottom valve 12 are opened the same side at cell body, and the overflow port 14 of several groups of major troughs is parallel with one another by pipeline 5, gather then to be connected to circulation groove 7; Bottom valve 12 is arranged at the bottommost of bottom angled face; The overflow port 14 of major trough 1 is highly higher than circulation groove 7.When the solution in the circulation groove 7 is squeezed into major trough 1, the liquid level of major trough 1 can rise, and when lifting height was higher than the seat of overflow port 14, surface solution can drive floating impurity and flow to little overflow port 14 together, finally flow to circulation groove 7, filter out by the filter 6 of circulation groove 7.2,3,4,8 be respectively pipeline.
Among the present invention, the weak current electrolyzer is exactly to increase the anode and cathode electrolytic zinc-coated steel sheet in groove, and the metal ion that major trough 1 plating electrolysis is fallen reduces in circulation groove, and the solution after the reduction is squeezed into major trough 1 again and electroplated.Added automatically system is meant when the weak current electrolyzer can't restore, electroplating the metal that needs in the solution will be fewer and feweri, at this moment the solution that adds high density by added automatically system in circulation groove 7 improves the concentration of electroplating solution, prolong its life-span, added automatically system adds by ampere hour system, and one group of workpiece enters major trough 1 plating exactly, needs how many metal ions, how many ions electrolysis can reduce, and also needs to add how many ions.Circulation groove 7 can also can be installed heating, cooling tube with the same in the past simultaneously, and the exchange groove in the time of can doing big the processing uses.

Claims (6)

1, plating bath circulating device in a kind of electroplating production facility, it comprises major trough, circulation groove, it is characterized in that: the bottom land of described major trough is the tilting bottom land, described bottom land is provided with bottom valve, described major trough is provided with overflow port, the output terminal of described overflow port is by the pipe connection circulation groove, and described circulation groove connects described major trough by filter; The bottom valve delivery port of described major trough connects filter, and the delivery port of described filter is by the described major trough of pipe connection.
2, according to plating bath circulating device in the described a kind of electroplating production facility of claim 1, it is characterized in that: described circulation groove is provided with weak current electrolyzer and added automatically system.
3, according to plating bath circulating device in the described a kind of electroplating production facility of claim 2, it is characterized in that: the volume of described circulation groove is a major trough volume sum 1/6.
4, according to plating bath circulating device in the described a kind of electroplating production facility of claim 3, it is characterized in that: described overflow port and bottom valve are opened the same side at cell body, and the overflow port of several groups of major troughs is parallel with one another by pipeline, gather then to be connected to circulation groove.
5, according to plating bath circulating device in the described a kind of electroplating production facility of claim 4, it is characterized in that: described bottom valve opening is arranged at the bottommost of bottom angled face.
6, according to plating bath circulating device in the described a kind of electroplating production facility of claim 5, it is characterized in that: the overflow port of described major trough is than circulation groove height height.
CN 200810109669 2008-06-09 2008-06-09 Plating bath circulating device of electroplating production facility Active CN101302645B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200810109669 CN101302645B (en) 2008-06-09 2008-06-09 Plating bath circulating device of electroplating production facility

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200810109669 CN101302645B (en) 2008-06-09 2008-06-09 Plating bath circulating device of electroplating production facility

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CN101302645A true CN101302645A (en) 2008-11-12
CN101302645B CN101302645B (en) 2012-12-05

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102031553A (en) * 2011-01-11 2011-04-27 哈尔滨工业大学 Local electroplating device for micro parts
CN102851728A (en) * 2012-08-10 2013-01-02 梅州市志浩电子科技有限公司 System and method for plating solution circulating filtration
CN103820840A (en) * 2014-03-12 2014-05-28 延康汽车零部件如皋有限公司 Method for improving smoothness and brightness of electroplating copper-plate
CN112359386A (en) * 2020-10-22 2021-02-12 徐钟华 Anodic oxidation device is used in aluminium alloy production

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3339483B2 (en) * 1999-12-27 2002-10-28 明 川口 Weir member, liquid tank and article processing device
CN2937161Y (en) * 2006-08-14 2007-08-22 中国铝业股份有限公司 Electroplating liquid circulation device for electroplating production
CN201301356Y (en) * 2008-06-09 2009-09-02 匡优新 Plating tank circulation device in electroplating production equipment

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102031553A (en) * 2011-01-11 2011-04-27 哈尔滨工业大学 Local electroplating device for micro parts
CN102851728A (en) * 2012-08-10 2013-01-02 梅州市志浩电子科技有限公司 System and method for plating solution circulating filtration
CN103820840A (en) * 2014-03-12 2014-05-28 延康汽车零部件如皋有限公司 Method for improving smoothness and brightness of electroplating copper-plate
CN112359386A (en) * 2020-10-22 2021-02-12 徐钟华 Anodic oxidation device is used in aluminium alloy production

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Address before: 214151 Jiangsu province Wuxi city Huishan District Outang Dongfeng Industrial Park

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Denomination of invention: Plating bath circulating device of electroplating production facility

Effective date of registration: 20131224

Granted publication date: 20121205

Pledgee: Agricultural Bank of China Limited by Share Ltd. Wuxi science and Technology Branch

Pledgor: WUXI XINGYI PAINTING AND ENVIRONMENTAL PROTECTION EQUIPMENT Co.,Ltd.

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Pledgee: Agricultural Bank of China Limited by Share Ltd. Wuxi science and Technology Branch

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Registration number: 2013990001018

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Address after: 214153 Jiangsu city of Wuxi province Huishan Qianqiao Outang Dongfeng Industrial Park

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