CN101296571A - Memory body device manufacturing carrier tool, manufacturing method and memory body device - Google Patents
Memory body device manufacturing carrier tool, manufacturing method and memory body device Download PDFInfo
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- CN101296571A CN101296571A CNA2007100979801A CN200710097980A CN101296571A CN 101296571 A CN101296571 A CN 101296571A CN A2007100979801 A CNA2007100979801 A CN A2007100979801A CN 200710097980 A CN200710097980 A CN 200710097980A CN 101296571 A CN101296571 A CN 101296571A
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Abstract
The invention relates to a manufacturing carrier of a memory device, a manufacturing method thereof and a portable memory device using the manufacturing method. The manufacturing carrier of the memory device comprises a motherboard, a middle cover and a top cover; the motherboard is used for holding and fixing a printed circuit board; wherein, the printed circuit board is used for forming a plurality of memory elements; while the middle cover is used for holding down the surrounding area of the printed circuit board and exposing the position of the printed circuit board, where the memory elements are formed; the printed circuit board is tightly clung to the surface of the motherboard by virtue of fixing the middle cover; while the top cover is used for covering the memory elements on the printed circuit board, that are formed by manufacturing process, and clamping the memory elements by virtue of external force to prevent influence on the memory elements caused by the deforming of the printed circuit board owing to thermal stress in a subsequent thermal process. The invention further provides an NAND type flash memory card with the overall dimension of length being not more than 31 mm, width being not more than 20 mm and thickness being not more than 1.6 mm, which is manufactured by the manufacturing method of the invention.
Description
Technical field
The invention relates to that a kind of memory device makes carrier, manufacture method and use the Portable memory device of this manufacture method.
Background technology
In recent years, electronic integrated circuit technology and material progress are quick, the volume of its wafer dwindles day by day, but function is become stronger day by day, extensively can saying so of using is borderless, therefore utilize product that electronic integrated circuit produces gradually towards compact kenel, e-dictionary, digital still camera and various numerical digit products or the like are too numerous to enumerate such as.And, because the wafer package technology is increasingly mature, have on the market single wafer or polycrystalline sheet are packaged in the quite thin card of thickness, can store the characteristic of a large amount of digital dates in the wafer, form a kind of extractable and changeable memory body littler (memory, i.e. storage medium, memory than the volume of existing magnetic record medium, internal memory below all is called memory body).This kind electronic medium is referred to as memory card.
And the SD memory card, it then is present widely used memory card, it is the abbreviation of safe numerical digit (SecureDigital) memory card, use for example standard of fast flash memory bank card (Flash Memory), be used at present on the portable devices, for example digital still camera, personal digital assistant (PDA) and multimedia player etc.And the technology of SD memory card is to build based on multimedia (Multi-Media) card (just so-called MMC) form, but the SD memory card is slightly thicker than mmc card.The SD memory card has the higher data transfer rate, and new standard more constantly.The size of general SD memory card is about 32 millimeters (mm) * 24 millimeter * 2.1 millimeters.
In recent years, because the demand of data storage volume is increased day by day, adding electronic product had towards compact trend, and the substrate area of memory card is also day by day dwindled.The SD memory card was also also released the specification of miniSD in 2003, so that dwindle the size of memory card, for example size is about 20 millimeters (mm) * 21.5 millimeter * 1.4 millimeters.
Yet, size with person's memory card is day by day dwindled, the size of the memory body crystal grain in the memory card is also along with dwindling, and employed printed circuit board (PCB) (Printed Circuit Board, PCB) also become thinner littler, under such condition, employed carrier in the manufacture process will be played the part of very crucial role.How to take into account the efficient of making memory card and avoid in the memory card element by improper destroyed be to be worth the problem thought deeply.
For example, manufacturing meets the memory card of miniSD specification, only 1.4 millimeters of thickness, therefore, employed printed circuit board (PCB) (PCB) must be below 0.16 millimeter, and such specification, in the manufacture process of memory card, circuit board manufacturer can't overcome the problem of circuit board bending, just the alleged curved problem of plate of industry.And such subject under discussion also is to cause to use surface stuck encapsulation (Surface MountedTechnology, under be called for short SMT) factory's installation elements smoothly, or the problem of in reflow (Reflow) processing procedure, being out of shape, cause the problem of empty weldering in the time of so will making welding, and may make fast flash memory bank (Flash Memory) short circuit.This also is to make the memory card manufacturer fine ratio of product (Yield Rate) that meets the miniSD specification at present can't break through one of reason of 60%.
Though the mode that has circuit board manufacturer to propose modification layout on pcb board links to each other edges of boards, just proposes connector (Edge Connector) mode of golden finger.But so also can't overcome above-mentioned problem, cause yield also can't effectively promote.
In addition, in surface stuck packaging SMT manufacturer, also the someone uses two formulas that comprise base plate and loam cake to make carrier, utilize loam cake to push down every fast flash memory bank, so that overcome the curved problem of pcb board, but the practice in past only adds loam cake before carrying out reflow (Reflow) processing procedure, the thermal deformation in the time of only overcoming reflow, and the plate that has produced in the time of can't overcoming the PCB supplied materials is bent problem.Therefore, these two formulas are made the yield that carrier also only can improve 10%-15%, but because need extra operating procedure, cause and waste unnecessary man-hour.
Summary of the invention
Purpose of the present invention is exactly to provide a kind of memory device to make carrier, manufacture method and using the Portable memory device of this manufacture method, can effectively overcome the curved problem of pcb board, can significantly promote the yield of manufacturing.
Purpose of the present invention is exactly to provide a kind of memory device to make carrier, manufacture method and using the Portable memory device of this manufacture method, can effectively solve surface stuck encapsulation (SurfaceMounted Technology, the beneath SMT that is called for short) in the processing procedure, piece, integrated circuit (the Integrated Circuit that need stick together smoothly, IC) skew or part are empty welds and problem of short-circuit, can significantly promote the yield of manufacturing.
Memory device proposed by the invention is made carrier, comprises base plate middle cover and loam cake.This base plate is in order to place and fixed printed circuit board, and wherein this printed circuit board (PCB) is in order to form a plurality of memory cells.And middle cover is in order to pushing down the peripheral region of printed circuit board (PCB), and exposes the position that printed circuit board (PCB) forms above-mentioned memory cell, by fixing middle cover so that printed circuit board (PCB) is close to the surface of base plate.And loam cake is in order to covering the memory cell that forms on the printed circuit board (PCB), and via external force memory cell clamped to prevent that printed circuit board (PCB) from influencing memory cell because of thermal stress deformation.
Utilization memory device proposed by the invention is made the manufacture method of carrier, and wherein this memory device manufacturing carrier comprises base plate, middle cover and loam cake.Above-mentioned manufacture method comprises fixed printed circuit board on base plate, and wherein printed circuit board (PCB) is in order to form a plurality of memory cells.After carrying out a paste solder printing program, middle cover is seated on base plate and the printed circuit board (PCB), and push down the peripheral region of printed circuit board (PCB), expose the position that printed circuit board (PCB) forms above-mentioned memory cell, by fixing middle cover so that printed circuit board (PCB) is close to the surface of base plate.Then carry out the piece program of surface stuck encapsulation (SMT), then put loam cake and in this, cover, and need be pressed onto above-mentioned memory cell, and memory cell is clamped to prevent that printed circuit board (PCB) from influencing memory cell because of thermal stress deformation via external force.
The Portable memory device that the above-mentioned manufacture method of use proposed by the invention is finished, be an a kind of NAND fast-flash memory body device that meets the miniSD specification, its manufacture method comprise fixed thickness at the printed circuit board (PCB) below 0.2 millimeter on base plate, wherein printed circuit board (PCB) is in order to form the memory cell of a plurality of miniSD of meeting specifications.Then carry out the paste solder printing program, then middle cover is seated on base plate and the printed circuit board (PCB), and push down the peripheral region of printed circuit board (PCB), expose the position that printed circuit board (PCB) forms above-mentioned memory cell, by fixing middle cover so that printed circuit board (PCB) is close to the surface of base plate.Then carry out the piece program of surface stuck encapsulation (SMT).Then put loam cake, and need be pressed onto each memory cell, and memory cell is clamped to prevent that printed circuit board (PCB) from influencing memory cell because of thermal stress deformation via external force.
For above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, preferred embodiment cited below particularly, and cooperate appended graphicly, be described in detail below.
Description of drawings
Figure 1A～1C and Fig. 2 A～2C illustrate the memory device of preferred embodiment of the present invention respectively and make carrier, comprise base plate that Figure 1A, 1B and 1C illustrate respectively, middle cover and on cover and look schematic diagram, Fig. 2 A, 2B and 2C then are the end views of base plate, middle cover and loam cake.
Fig. 3 illustrates the manufacture method detail flowchart of utilization memory device manufacturing proposed by the invention carrier.
Fig. 4 A～Fig. 4 E explanation utilization memory device proposed by the invention is made the detail flowchart of the manufacture method of carrier.
110: base plate 112: guide pillar
114: louvre 116:PCB Board position
118: bearing mark 150: the direction of reservation
120: middle cover 122: hole
124: groove 126: bearing mark
128: protuberance 130: loam cake
132: hole 134: ledge
410: chock 420: base plate
422: guide pillar 424: bearing mark
430:PCB plate 440: middle cover
442: bearing mark 450: loam cake
Embodiment
The present invention proposes the Portable memory device that a kind of memory device is made carrier, manufacture method and used this manufacture method, can effectively overcome printed circuit board (PCB) (Printed Circuit Board, PCB) the curved problem of plate, also can solve surface stuck encapsulation (Surface Mounted Technology effectively, the beneath SMT that is called for short) in the processing procedure, piece, the integrated circuit (IntegratedCircuit that need stick together smoothly, IC) skew or part are empty welds or problem of short-circuit, can significantly promote the yield of manufacturing.
A kind of memory device proposed by the invention is made carrier, it is a kind of three-member type carrier, comprise base plate, middle cover and loam cake, please on shown in Figure 1A, 1B and the 1C, look schematic diagram respectively, Fig. 2 A, 2B and 2C then are the end views that base plate, middle cover and loam cake are described respectively, for more clearly demonstrating, beneath in conjunction with Figure 1A～1C and 2A～2C explanation.
What Figure 1A and 2A were shown is in one embodiment of the invention, the memory device that proposes make on the base plate 110 of carrier and look schematic diagram and end view.Have guide pillar 112 at this base plate 110 respectively in order to four corners of printed circuit board (PCB) (PCB) position of putting fast flash memory bank (Flash Memory), fixing in order to allow the location hole of pcb board be inserted in the back.Then comprise several louvres 114 around the base plate 110, in addition,, also have many louvres, so that in manufacture process, can do the usefulness of heat radiation putting 116 places, fast flash memory bank pcb board position.In addition, unified in order to make the carrier direction, in three-member type carrier proposed by the invention, each part all has a bearing mark, so that be unlikely to put mistake during fabrication, for example has bearing mark 118 on the base plate among Fig. 1 110, towards the direction 150 of subscribing.
What Figure 1B and 2B were shown is in one embodiment of the invention, the memory device that proposes make on the middle cover 120 of carrier and look schematic diagram and end view, comprising two hole 122 and most grooves 124 up and down in order to the carrying loam cake in order to expose the fast flash memory bank on the pcb board, in addition, also comprise the bearing mark 126 that is unlikely to put mistake when making.In addition, there are many protuberances 128 hole 122 positions in order to expose fast flash memory bank, can be in order to further fixedly PCB.
What Fig. 1 C and 2C were shown is in one embodiment of the invention, the memory device that proposes make on the loam cake 130 of carrier and look schematic diagram and end view, comprising a plurality of hole 132 and most ledges 134 up and down in order to be seated in the middle cover groove in order to expose fast flash memory bank, in addition, also comprise the bearing mark 136 that is unlikely to put mistake when making.These holes 132 can be used as the louvre of fast flash memory bank.
Use memory device proposed by the invention to make the manufacture method of carrier, detail flowchart as shown in Figure 3.At first,, base plate is placed on the chock, or other have on the manufacturing pedestal of insulation according to step 310.Then,, place printed circuit board (PCB) (PCB) on base plate, and on four guide pillars that four location holes of pcb board are inserted in, so that fixing pcb board as step 320.Then,, carry out the paste solder printing program, to form needed tin cream between follow-up surface stuck encapsulation required element that sticks together of (SMT) processing procedure and the pcb board as step 330.Then,, middle cover proposed by the invention is seated on base plate and the pcb board, and confirms whether push down pcb board, and pcb board need be flattened as step 340.In one embodiment, can in cover and use for example strong magnets or the like have combining of active force so that do one with base plate, allow the pcb board can be as the pressing of expection.
Then, carry out the piece program of surface stuck encapsulation (SMT), so that finish the required element that sticks together as step 350.Then, as step 360, put loam cake, need be pressed onto the memory body of each,, for example use strong magnets that memory body is tightly clamped then as step 370, so can avoid PCB because of reflow (Reflow) program followed because of thermal stress deformation, cause the memory body displacement and empty weldering or short circuit.
In the concrete manufacture method of utilization memory device manufacturing proposed by the invention carrier,
Use memory device proposed by the invention to make the manufacture method of carrier, detail flowchart is shown in Fig. 4 A～Fig. 4 E.At first, shown in Fig. 4 A, base plate 420 is placed on the chock 410.Then, shown in Fig. 4 B, place printed circuit board (PCB) (pcb board) 430 on base plate 420, and on four guide pillars 422 that 430 4 location holes of pcb board are inserted in, so that fixing pcb board, then, carry out the paste solder printing program, to form needed tin cream between follow-up surface stuck encapsulation required element that sticks together of (SMT) processing procedure and the pcb board.Then, shown in Fig. 4 C, middle cover 440 is seated on base plate 420 and the pcb board 430, and the direction that the bearing mark 442 of middle cover 440 must be consistent with the bearing mark 424 of base plate 420.
Then shown in Fig. 4 D, after carrying out the piece program of surface stuck encapsulation (SMT), then shown in Fig. 4 E, put loam cake 450, need be pressed onto the memory body of each this moment, for example use strong magnets that memory body is tightly clamped, so can avoid pcb board 430 to be out of shape because of thermal stress, cause the memory body displacement and empty weldering or short circuit in follow-up reflow (Reflow) program.
The present invention proposes a kind of memory device and makes carrier and manufacture method, can effectively overcome the curved problem of printed circuit board (PCB) (PCB) plate, also can solve effectively in surface stuck encapsulation (SMT) processing procedure, piece, integrated circuit (the Integrated Circuit that need stick together smoothly, IC) skew or part are empty welds or problem of short-circuit, can significantly promote the yield of manufacturing.
Above-mentioned memory device is made carrier and manufacture method, if be used in the NAND type fast-flash memory body device that for example meets the miniSD specification, beneath abbreviation miniSD memory card.NAND type fast flash memory bank is to line up in the mode of " page or leaf ", and each page or leaf has the storage area of 256 or 512 bit groups (Byte) and the auxiliary space of 8 or 16 bit groups.And released the auxiliary space that one page has the main space and the 64 bit groups of 2048 bit groups recently.Auxiliary space be mainly used to deposit error correcting code (Error Correction Code, ECC), memory body damages the data of mark and archives economy.Form a block (block) by these " pages or leaves ".The read and write of NAND type fast flash memory bank can " page or leaf " be a unit, and deletion will be unit with the block then.
At this moment, because the size of miniSD memory card is about 20 millimeters (mm) * 21.5 millimeter * 1.4 millimeters.Because only 1.4 millimeters of the thickness of miniSD memory card, therefore, employed printed circuit board (PCB) (PCB) must be below 0.2 millimeter, and the superthin PCB plate of such specification, if in conventional process, will meet with sizable problem, cause yield to promote effectively.Yet, use memory device proposed by the invention to make carrier and its manufacture method, yield can rise to more than the 90-95%.
In addition, make the time of the panel (Panel) of a fast flash memory bank (Flash Memory), comprise SMT piece, sight check, change lid and go out or the like step, approximately need about 80 seconds with using clip.Yet, use memory device proposed by the invention to make carrier and its manufacture method, owing to use for example powerful absorption of magnet instead, and save the time of changing lid, make the visual inspection personnel that situation about being offset behind the more sufficient time adjustment SMT piece can be arranged, so, for the time of the panel (Panel) of making a fast flash memory bank, only need 45-55 second under the equal number condition,, more can promote efficient except having promoted the yield.
Above-mentioned use memory device proposed by the invention is made carrier and its manufacture method, and also can be used in other needs extremely thin pcb board, and for example thickness is in the memory card manufacturing below 0.2 millimeter.CF memory card (Compact Flash Memory Card) for example, MS memory card (Memory StickCard), MS Duo memory card (Memory Stick Duo), MMC memory card (Multi Media Card), RS MMC memory card (Reduced Size Multi Media Card), SD memory card (Secure DigitalCard), Mini SD memory card (Mini Secure Digital Card), μ memory card (μ Card), RS μ memory card (Reduced Size μ Card) ... wait the small memory card of other similar functions.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (17)
1, a kind of memory device is made carrier, it is characterized in that comprising:
One base plate, in order to place and to fix a printed circuit board (PCB), wherein this printed circuit board (PCB) is in order to form a plurality of memory cells;
One middle cover in order to pushing down the peripheral region of this printed circuit board (PCB), and exposes the position that this printed circuit board (PCB) forms those memory cells, by fixing this middle cover so that this printed circuit board (PCB) is close to this surface of this base plate; And
One loam cake in order to covering those memory cells that forms on this printed circuit board (PCB), and is clamped those memory cells to prevent that this printed circuit board (PCB) from influencing those memory cells because of thermal stress deformation via an external force.
2, memory device according to claim 1 is made carrier, it is characterized in that described base plate has a plurality of guide pillars, in order to allow a plurality of location holes of this printed circuit board (PCB) entangle so as to fixing.
3, memory device according to claim 1 is made carrier, it is characterized in that described middle cover side has one first magnetic regions, can push down this printed circuit board (PCB) by magnetic force when this middle cover is placed on this base plate.
4, memory device according to claim 1 is made carrier, it is characterized in that described loam cake cover on this printed circuit board (PCB) when forming those memory cells, employed this external force is the absorption affinity of a magnet.
5, memory device according to claim 1 is made carrier, and the thickness that it is characterized in that described printed circuit board (PCB) is below 0.2 millimeter.
6, memory device according to claim 1 is made carrier, it is characterized in that described memory cell is a NAND type fast flash memory bank, and formed this memory device is a memory card that meets the miniSD specification.
7, memory device according to claim 1 is made carrier, it is characterized in that described memory cell is a NAND type fast flash memory bank, be not more than a memory card of 1.6 millimeters of 31 millimeters of length, 20 millimeters of width and thickness and formed this memory device is overall dimensions.
8, a kind of manufacture method of using memory device to make carrier, wherein this memory device manufacturing carrier comprises a base plate, a middle cover and a loam cake, it is characterized in that this method comprises:
Fix a printed circuit board (PCB) on this base plate, wherein this printed circuit board (PCB) is in order to form a plurality of memory cells;
Carry out a paste solder printing program;
This middle cover is seated on this base plate and this printed circuit board (PCB), and pushes down the peripheral region of this printed circuit board (PCB), expose the position that this printed circuit board (PCB) forms those memory cells, by fixing this middle cover so that this printed circuit board (PCB) is close to this surface of this base plate;
Carry out the piece program of surface stuck encapsulation (SMT); And
Put this loam cake, and need be pressed onto those memory cells, and those memory cells are clamped to prevent that this printed circuit board (PCB) from influencing those memory cells because of thermal stress deformation via an external force.
9, manufacture method according to claim 8 is characterized in that described middle cover side has one first magnetic regions, can push down this printed circuit board (PCB) by magnetic force when this middle cover is placed on this base plate.
10, manufacture method according to claim 8, it is characterized in that described loam cake cover on this printed circuit board (PCB) when forming those memory cells, employed this external force is the absorption affinity of a magnet.
11, manufacture method according to claim 8, the thickness that it is characterized in that described printed circuit board (PCB) is below 0.2 millimeter.
12, manufacture method according to claim 8 it is characterized in that described memory cell is a NAND type fast flash memory bank, and formed this memory device is a memory card that meets the miniSD specification.
13, manufacture method according to claim 8, it is characterized in that described memory cell is a NAND type fast flash memory bank, and formed these memory device overall dimensions are not more than a memory card of 1.6 millimeters of 31 millimeters of length, 20 millimeters of width and thickness.
14, a kind of manufacturing meets the manufacture method of a memory device of miniSD specification, it is characterized in that comprising:
Fix a thickness at the printed circuit board (PCB) below 0.2 millimeter on this base plate, wherein this printed circuit board (PCB) is in order to form the memory cell of a plurality of miniSD of meeting specifications;
Carry out a paste solder printing program;
This middle cover is seated on this base plate and this printed circuit board (PCB), and pushes down the peripheral region of this printed circuit board (PCB), expose the position that this printed circuit board (PCB) forms those memory cells, by fixing this middle cover so that this printed circuit board (PCB) is close to this surface of this base plate;
Carry out the piece program of surface stuck encapsulation (SMT); And
Put this loam cake, and need be pressed onto those memory cells, and those memory cells are clamped to prevent that this printed circuit board (PCB) from influencing those memory cells because of thermal stress deformation via an external force.
15, manufacture method according to claim 14, it is characterized in that described loam cake cover on this printed circuit board (PCB) when forming those memory cells, employed this external force is the absorption affinity of a magnet.
16, an a kind of memory device that meets the miniSD specification comprises at least one NAND type fast flash memory bank, by the described manufacture method manufacturing of claim 14.
17, a kind of apparent size is not more than a memory card of 1.6 millimeters of 31 millimeters of length, 20 millimeters of width and thickness, comprises at least one NAND type fast flash memory bank, by the described manufacture method manufacturing of claim 14.
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| CN2007100979801A CN101296571B (en) | 2007-04-25 | 2007-04-25 | Memory body device manufacturing carrier tool, manufacturing method and memory body device |
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| CN2007100979801A CN101296571B (en) | 2007-04-25 | 2007-04-25 | Memory body device manufacturing carrier tool, manufacturing method and memory body device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101890605A (en) * | 2010-07-08 | 2010-11-24 | 株洲南车时代电气股份有限公司 | Power semiconductor chip welding device |
| CN112004336A (en) * | 2020-08-18 | 2020-11-27 | 苏州春秋电子科技股份有限公司 | Onboard rectangular CPU welding process |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO1994014306A1 (en) * | 1992-12-17 | 1994-06-23 | Siemens Aktiengesellschaft | Device with a plastic substrate to accept and hold an electronic module |
| JP2004127734A (en) * | 2002-10-03 | 2004-04-22 | Molex Inc | Connector for card |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101890605A (en) * | 2010-07-08 | 2010-11-24 | 株洲南车时代电气股份有限公司 | Power semiconductor chip welding device |
| CN112004336A (en) * | 2020-08-18 | 2020-11-27 | 苏州春秋电子科技股份有限公司 | Onboard rectangular CPU welding process |
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| CN101296571B (en) | 2010-12-08 |
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