CN101292576B - 适合于安装在基板上的器件和安装表面安装设备的方法 - Google Patents
适合于安装在基板上的器件和安装表面安装设备的方法 Download PDFInfo
- Publication number
- CN101292576B CN101292576B CN2006800392923A CN200680039292A CN101292576B CN 101292576 B CN101292576 B CN 101292576B CN 2006800392923 A CN2006800392923 A CN 2006800392923A CN 200680039292 A CN200680039292 A CN 200680039292A CN 101292576 B CN101292576 B CN 101292576B
- Authority
- CN
- China
- Prior art keywords
- supporting device
- substrate
- conductor
- surface equipment
- equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10484—Obliquely mounted
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10651—Component having two leads, e.g. resistor, capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (16)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05109811 | 2005-10-21 | ||
EP05109811.9 | 2005-10-21 | ||
PCT/IB2006/053768 WO2007046045A2 (en) | 2005-10-21 | 2006-10-13 | A component adapted for being mounted on a substrate and a method of mounting a surface mounted device |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101292576A CN101292576A (zh) | 2008-10-22 |
CN101292576B true CN101292576B (zh) | 2012-05-02 |
Family
ID=37872435
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2006800392923A Active CN101292576B (zh) | 2005-10-21 | 2006-10-13 | 适合于安装在基板上的器件和安装表面安装设备的方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US8045334B2 (zh) |
EP (1) | EP1943888B1 (zh) |
KR (1) | KR101242653B1 (zh) |
CN (1) | CN101292576B (zh) |
AT (1) | ATE438287T1 (zh) |
DE (1) | DE602006008173D1 (zh) |
TW (1) | TW200738088A (zh) |
WO (1) | WO2007046045A2 (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ITPD20080068A1 (it) * | 2008-02-26 | 2009-08-27 | Easy Internat S R L | Lampada a led e metodo per la sua progettazione |
US20120176785A1 (en) * | 2011-01-10 | 2012-07-12 | GEM-SUN Technologies Co., Ltd. | Structure improvement of led lamp |
KR102058012B1 (ko) * | 2013-12-19 | 2020-01-22 | 어플라이드 머티어리얼스, 인코포레이티드 | 교체가능한 램프를 위한 어댑터 |
EP2938170A1 (de) * | 2014-04-23 | 2015-10-28 | odelo GmbH | Halter für SMD-Leuchtdiode |
CN104486900A (zh) * | 2014-11-07 | 2015-04-01 | 广东风华高新科技股份有限公司 | 用于电路板的支撑件及其制备方法 |
US10952324B2 (en) * | 2019-04-15 | 2021-03-16 | Facebook Technologies, Llc | Spacer for surface mountable electronic components |
CN110165036B (zh) * | 2019-04-15 | 2021-11-09 | 深圳技术大学 | 一种新型表贴发光器件 |
CN112018594A (zh) * | 2020-07-31 | 2020-12-01 | 深圳市聚飞光电股份有限公司 | 一种光源投射器及其制作方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1531088A (zh) * | 2003-03-17 | 2004-09-22 | ������������ʽ���� | 半导体装置、电子设备及它们的制造方法,以及电子仪器 |
EP1519145A1 (de) * | 2003-09-29 | 2005-03-30 | Siemens Aktiengesellschaft | Anordnung mit einem Sensor |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5118300A (en) * | 1991-05-23 | 1992-06-02 | Amp Incorporated | Active electrical connector |
JPH0542718A (ja) | 1991-08-09 | 1993-02-23 | Ricoh Co Ltd | 半導体発光装置 |
US5277612A (en) * | 1992-04-21 | 1994-01-11 | Chrysler Corporation | Carrier for guiding and supporting semiconductor devices |
JPH0715021A (ja) * | 1993-06-18 | 1995-01-17 | Hitachi Ltd | 半導体受光装置 |
JP2001094146A (ja) | 1999-09-21 | 2001-04-06 | Rohm Co Ltd | 発光素子およびその製造方法 |
ATE441950T1 (de) * | 2001-04-03 | 2009-09-15 | Kureha Corp | Ic-fassung |
JP2002329893A (ja) | 2001-05-02 | 2002-11-15 | Kansai Tlo Kk | Led面発光装置 |
JP2003264299A (ja) | 2002-03-11 | 2003-09-19 | Honda Motor Co Ltd | 受光装置、発光装置及び光無線通信装置 |
JP2004146571A (ja) | 2002-10-24 | 2004-05-20 | Sharp Corp | 複合半導体基板および半導体装置および複合半導体基板の製造方法 |
US7201507B2 (en) | 2003-12-25 | 2007-04-10 | Ichikoh Industries, Ltd. | Projector type vehicle light |
US8376578B2 (en) * | 2009-06-12 | 2013-02-19 | Lg Innotek Co., Ltd. | Lighting device |
-
2006
- 2006-10-13 DE DE602006008173T patent/DE602006008173D1/de active Active
- 2006-10-13 US US12/090,884 patent/US8045334B2/en active Active
- 2006-10-13 WO PCT/IB2006/053768 patent/WO2007046045A2/en active Application Filing
- 2006-10-13 AT AT06809589T patent/ATE438287T1/de not_active IP Right Cessation
- 2006-10-13 CN CN2006800392923A patent/CN101292576B/zh active Active
- 2006-10-13 KR KR1020087012183A patent/KR101242653B1/ko active IP Right Grant
- 2006-10-13 EP EP06809589A patent/EP1943888B1/en active Active
- 2006-10-18 TW TW095138429A patent/TW200738088A/zh unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1531088A (zh) * | 2003-03-17 | 2004-09-22 | ������������ʽ���� | 半导体装置、电子设备及它们的制造方法,以及电子仪器 |
EP1519145A1 (de) * | 2003-09-29 | 2005-03-30 | Siemens Aktiengesellschaft | Anordnung mit einem Sensor |
Also Published As
Publication number | Publication date |
---|---|
US20080314624A1 (en) | 2008-12-25 |
TW200738088A (en) | 2007-10-01 |
JP2009512979A (ja) | 2009-03-26 |
JP5011303B2 (ja) | 2012-08-29 |
CN101292576A (zh) | 2008-10-22 |
EP1943888A2 (en) | 2008-07-16 |
ATE438287T1 (de) | 2009-08-15 |
KR101242653B1 (ko) | 2013-03-19 |
US8045334B2 (en) | 2011-10-25 |
EP1943888B1 (en) | 2009-07-29 |
KR20080059319A (ko) | 2008-06-26 |
WO2007046045A2 (en) | 2007-04-26 |
DE602006008173D1 (de) | 2009-09-10 |
WO2007046045A3 (en) | 2007-07-12 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Holland Ian Deho Finn Patentee after: KONINKLIJKE PHILIPS N.V. Address before: Holland Ian Deho Finn Patentee before: Koninklijke Philips Electronics N.V. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170308 Address after: Eindhoven Patentee after: KONINKLIJKE PHILIPS N.V. Address before: Holland Ian Deho Finn Patentee before: KONINKLIJKE PHILIPS N.V. |
|
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Eindhoven Patentee after: Signify Holdings Ltd. Address before: Eindhoven Patentee before: KONINKLIJKE PHILIPS N.V. |