CN101287331B - Conductive structure of electrically connected mat of circuit board - Google Patents
Conductive structure of electrically connected mat of circuit board Download PDFInfo
- Publication number
- CN101287331B CN101287331B CN2007100963127A CN200710096312A CN101287331B CN 101287331 B CN101287331 B CN 101287331B CN 2007100963127 A CN2007100963127 A CN 2007100963127A CN 200710096312 A CN200710096312 A CN 200710096312A CN 101287331 B CN101287331 B CN 101287331B
- Authority
- CN
- China
- Prior art keywords
- electric connection
- circuit board
- articulamentum
- connection pad
- conductive structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses electric conducting structures of electric connecting pads of a circuit board, which comprises the circuit board having a first surface and a second surface. The first surface of the circuit board is provided with a plurality of first electric connecting pads and second electric connecting pads. The electric conducting structure of the invention also comprises a metal layer which is formed on the first electric connecting pad and the second electric connecting pad, a first connecting layer which is formed on the first electric connecting pad, and a second connecting layer which is formed on the second electric connecting pad. Therefore, various electric connecting pads on the surface of the circuit board are provided with different electric conducting structures so as to connect different electric elements.
Description
Technical field
The present invention relates to a kind of conductive structure of electrically connected mat of circuit board, particularly relate to and a kind ofly be formed with the method for making of different conductive structures, to connect different electronic components at each electric connection pad of circuit board surface.
Background technology
Flourish along with electronic industry, the external form trend of electronic product is compact, then marches toward the R﹠D direction of high-performance, high function, high-speedization on function gradually.And crystal covering type (Flipchip) semiconductor packaging is a kind of advanced person's a semiconductor packaging, in existing Flip Chip, is in semiconductor integrated circuit (Integrated Circuit; IC) dispose electrode pad on the surface of chip, and on this electrode pad, be formed with solder bump, and on an organic circuit base plate for packaging, be formed with corresponding electric connection pad and solder bump, thereby provide this chip to be arranged on this base plate for packaging in the ventricumbent mode of electrical contact.
Because increasing product design trends towards miniaturization, high-speed, multi-functional, therefore, the range of application of Flip Chip will constantly enlarge, and become a kind of chip encapsulation technology of standard.Simultaneously for promoting the electrical quality of those electronic installations, promptly need in wherein being provided with for example passive devices such as resistance, electric capacity or inductance, and those passive devices adopt surface mount technology (SMT) to place on the circuit board to connect equally, thereby make pre-solder bump and SMD LED surface-mount device LED metal Connection Element and be stored on the circuit board, and both formed soldering tin material height and size are also inequality, are electrically conducted to have matching of dissimilar semiconductor elements with this.
And industry generally uses chemical deposition and mould printing technology (StencilPrinting Technology) to form the soldering tin material on the substrate at present.
Shown in Figure 1A to Fig. 1 E, mainly be to have in one to form an organic insulation protective layer 21 (solder mask) on the circuit board 20 of a plurality of electric connection pads 201 (pad), this insulating protective layer 21 patterned processing procedures and form a plurality of perforates 211 to manifest this electric connection pad 201 (shown in Figure 1A); Form a metal adhesion layer 22 (shown in Figure 1B) by one of sputter, evaporation, electroless-plating and chemical deposition; Form a soldering tin material 24 (shown in Fig. 1 D) with the adhesion layer 22 of template 23 with grid 23a in the mould printing mode again in part electric connection pad 201 surfaces of this circuit board 20; At last again via reflow (re-flow) processing procedure forming pre-solder bump 24 ' (shown in Fig. 1 E), thereby on electric connection pad 201, to form the metal adhesion layer or the soldering tin material of different materials.
But the mode with mould printing forms projection or welding tin ball, the thickness that forms is high more, formed height is wayward in the processing procedure of back segment, causes the projection after the reflow or the height inequality of welding tin ball, electrically connects chip or printed circuit board (PCB) and influence it.And the print solder material causes easily in the back welding process too much to form projection or welding tin ball that the soldering tin material fusion causes bridge joint phenomenon and short circuit problem on the electric connection pad of this circuit board, and the electric connection pad of thin space (Fine Pitch) can't be provided.A large amount of simultaneously use soldering tin materials also face environmental issue.
Above-mentioned problem has become present circuit board manufacturer to desire most ardently improved problem in fact.
Summary of the invention
In view of the various shortcoming of above-mentioned prior art, main purpose of the present invention provides a kind of conductive structure of electrically connected mat of circuit board, and different conductive structures is provided, and uses for the electric connection of different electric connection pads.
Another purpose of the present invention provides a kind of conductive structure of electrically connected mat of circuit board, and can form the electric connection structure of fine rule road spacing (Fine pitch).
For reaching above-mentioned and other purpose, the preferable enforcement of the conductive structure of electrically connected mat of circuit board of the present invention comprises: one has first and second surperficial circuit board, and the first surface of this circuit board has a plurality of first, second electric connection pads; One metal level is formed on this first and second electric connection pad; One first articulamentum is formed on this first electric connection pad; And one second articulamentum, be formed on this second electric connection pad.
Above-mentioned this metal level is made with the electro-coppering material, and this first articulamentum is made with the plated metal adhesion layer, and this metal adhesion layer can be selected from wherein one of tin, silver, gold, tin/silver, tin/silver/copper, nickel/group that gold is formed.This second articulamentum is made with the plated solder material, and this soldering tin material can be selected from wherein one of tin, silver, gold, bismuth, lead and group that zinc is formed.
The present invention can form the metal level and first articulamentum on first electric connection pad, form metal level, first articulamentum and second articulamentum on this second electric connection pad, and forms the metal level and first articulamentum on the 3rd electric connection pad.In addition, aforementioned processing procedure is the conductive structure of Direct Electroplating formation optionally also, and need not to form metal level, and the different user demands that electrically connect so can be provided.
And this first electric connection pad surface is to form the metal adhesion layer as first articulamentum in the mode of electroplating, connect the SMD LED surface-mount device LED element, this second electric connection pad surface is to form soldering tin material as first articulamentum and second articulamentum in the mode of electroplating, to connect semiconductor chip, and the 3rd electric connection pad surface is to form the metal adhesion layer as first articulamentum in the mode of electroplating, with the ball pad (ball pad) as this circuit board.Because of electroplating process is with exposure, the formation resistance layer of developing perforate, and can overcome prior art stencilization method when thin bump pitch, i.e. processing procedure bottleneck of Chan Shenging, and electroplating process can accurately be controlled soldering tin material deposition quantity, avoid in the back welding process too much that the soldering tin material fusion causes the bridge joint phenomenon, and can form the electric connection structure of fine rule road spacing (Finepitch).
Description of drawings
Figure 1A to Fig. 1 E is the cross-sectional schematic that forms soldering tin material on the prior art circuits plate;
Fig. 2 A to Fig. 2 I is the conductive structure of electrically connected mat of circuit board of the present invention and the first embodiment cross-sectional schematic of method for making thereof; And
Fig. 3 A to Fig. 3 D is the conductive structure of electrically connected mat of circuit board of the present invention and the second embodiment cross-sectional schematic of method for making thereof.
The component symbol explanation
20,30 circuit boards
201 electric connection pads
21 insulating protective layers
211 perforates
22 adhesion layers
23 templates
The 23a grid
24 soldering tin materials
24 ', 37,38 pre-solder bumps
The 30a first surface
The 30b second surface
301 first electric connection pads
302 second electric connection pads
303 the 3rd electric connection pads
304a first insulating protective layer
304b second insulating protective layer
305a, 305b perforate
31a first conductive layer
31b second conductive layer
32a first resistance layer
32b second resistance layer
320a, 320b perforate
33 metal levels
34 first articulamentums
35a the 3rd resistance layer
The 350a perforate
35b the 4th resistance layer
36 second articulamentums
Embodiment
Below be that those skilled in the art can understand other advantage of the present invention and effect easily by the content that this specification disclosed by particular specific embodiment explanation embodiments of the present invention.
[first embodiment]
See also Fig. 2 A to Fig. 2 I, be the cross-sectional schematic of the method for making of the conductive structure of a kind of electrically connected mat of circuit board provided by the present invention.And described accompanying drawing is easy schematic diagram, only with the manufacture process of illustrative circuit board of the present invention.
See also Fig. 2 A; one circuit board 30 is provided; this circuit board 30 has first surface 30a and second surface 30b; have the first different electric connection pad 301 of a plurality of sizes and second electric connection pad 302 in this first surface 30a; and have a plurality of the 3rd electric connection pads 303 at this second surface 30b; and this first and second surperficial 30a; 30b is formed with first and second insulating protective layer 304a respectively; 304b; it can be the welding resisting layer material (solder mask) of green lacquer, and is formed with a plurality of perforate 305a; 305b with appear this first; second and third electric connection pad 301; 302; 303.And perforate 305a, 305b that this circuit board 30 outermost first and second insulating protective layer 304a, 304b form form through patterning process such as exposure, developments.
Shown in Fig. 2 B, then the surface in this first insulating protective layer 304a and perforate 305a thereof forms one first conductive layer 31a, and the surface in this second insulating protective layer 304b and perforate 305b thereof forms the second conductive layer 31b, wherein, this first and second conductive layer 31a, 31b mainly is as the required current conduction path of follow-up electroplating metal material, it can be by metal, alloy or precipitation number layer metal level constitute, as be selected from copper, tin, nickel, chromium, titanium, wherein institutes of the group that copper-evanohm or tin-lead alloy etc. constituted form, and are with sputter, evaporation, one of electroless-plating and chemical deposition person forms; Maybe can use for example conducting polymer composites such as polyacetylene, polyaniline or organic sulfur polymer, and form this first and second conductive layer 31a, 31b with rotary coating (spin coating), ink jet printing (ink-jet printing), wire mark (screen printing) or impression modes such as (imprinting).
Shown in Fig. 2 C, on this first and second conductive layer 31a, 31b, form first and second resistance layer 32a, 32b respectively, and in this first and second resistance layer 32a, 32b, form a plurality of perforate 320a, 320b the first conductive layer 31a and the second conductive layer 31b respectively to expose these first, second and third electric connection pad, 301,302,303 surfaces.This first and second resistance layer 32a, 32b can be a photoresist layer such as dry film or liquid photoresistance (Photoresist) for example, it is to utilize modes such as printing, spin coating or applying to be formed at this first and second conductive layer 31a, 31b surface respectively, again by modes such as exposure, development patterning in addition, so that form a plurality of perforate 320a, 320b respectively among this first and second resistance layer 32a, the 32b, and described perforate 320a, 320b are to first, second and third electric connection pad, 301,302,303 positions that should circuit board surface.
Shown in Fig. 2 D, electroplate (Electroplating) processing procedure, by this first and second conductive layer 31a, the 31b current conduction path when electroplating, on first and second conductive layer 31a, the 31b on these first, second and third electric connection pad, 301,302,303 surfaces, to form metal level 33.Wherein, the material of this metal level 33 can be such as wherein one of metals such as lead, tin, silver, copper, gold, bismuth, antimony, zinc, nickel, zirconium, magnesium, indium, tellurium and gallium.But according to the experience of practical operation, because that copper be the plated material and the cost of maturation is lower, therefore, this metal level 33 to be being preferable by electro-coppering institute constitutor, but non-as limit.
Shown in Fig. 2 E, this circuit board 30 is continued to carry out electroplating process, by these metal level 33 tool conductive characteristics, and with this first and second conductive layer 31a, the 31b current conduction path when electroplating, be formed with first articulamentum 34 on described metal level 33, to electroplate, and this first articulamentum 34 is made with the plated metal adhesion layer, and this metal adhesion layer can be selected from wherein one of tin, silver, gold, tin/silver, tin/silver/copper, nickel/group that gold is formed.
In addition, also visual processing procedure needs, and need not to form this metal level 33 and can form the plated metal adhesion layer as first articulamentum 34 in this first and second resistance layer 32a, 32b perforate 320a, 320b.
Shown in Fig. 2 F, then on this first and second resistance layer 32a, 32b, form the 3rd and the 4th resistance layer 35a, 35b respectively, with first articulamentum 34 on metal level 33 surfaces that cover these the first and the 3rd electric connection pad 301,303 surfaces, and make among the 3rd resistance layer 35a forming many song perforate 350a to expose first articulamentum 34 on the metal level 33 that covers these second electric connection pad, 302 surfaces in second electric connection pad, 302 positions.Three, the 4th resistance layer 35a, 35b can be a photoresist layer such as dry film or liquid photoresistance (Photoresist) for example, it is to utilize modes such as printing, spin coating or applying to be formed at this first and second resistance layer 32a, 32b surface respectively, again by modes such as exposure, development patterning in addition, so that a plurality of perforate 350a of formation among the 3rd resistance layer 35a.
Shown in Fig. 2 G, form second articulamentums 36 in exposing the 34 surface telegram in reply platings of this first articulamentum, and this second articulamentum 36 is made with the plated solder material, this soldering tin material can be selected from wherein one of tin, silver, gold, bismuth, lead and group that zinc is formed.
Shown in Fig. 2 H, remove the 3rd, the 4th resistance layer 35a, 35b and first, second resistance layer 32a, 32b, and this first, second resistance layer 32a, 32b first, second conductive layer 31a, the 31b that are covered.Wherein, this first, second, third and the 4th resistance layer 32a, 32b, 35a, 35b remove with physics or chemical mode, and first, second conductive layer 31a, 31b that this first, second resistance layer 32a, 32b are covered remove in the microetch mode.
Shown in Fig. 2 I, afterwards, can carry out reflow (reflow-solder) processing procedure again, so that first, second articulamentum 34,36 on this second electric connection pad 302 forms a pre-solder bump 37 (solder bump) that coats this metal level 33 through reflow.
In the present embodiment, because this first articulamentum 34 is to be formed on the metal level 33 on the first, the 3rd electric connection pad 301,303 in the electrotinning mode, and metal level 33 surfaces on this second electric connection pad 302 form second articulamentum 36 with the plated solder material again, thereby can form the conductive structure of different materials respectively on this first, second and third electric connection pad 301,302,303 with plating mode.Wherein this first articulamentum 34 is made with the plated metal adhesion layer, this metal adhesion layer can be selected from wherein one of tin, silver, gold, tin/silver, tin/silver/copper, nickel/group that gold is formed, can supply to connect the SMD LED surface-mount device LED element, or use as ball pad (ballpad); And this second articulamentum 36 is made with the plated solder material, this soldering tin material can be selected from wherein one of tin, silver, gold, bismuth, lead and group that zinc is formed, to connect semiconductor chip, so promptly form the conductive structure of different materials, use for the electric connection of different needs with plating mode.
[second embodiment]
As Fig. 3 A to Fig. 3 D those shown is that of the present invention another implemented manufacture method, be in first articulamentum that earlier remove this second electric connection pad on layer on surface of metal different with last enforcement, and then electroplate formation second articulamentum, processing procedure is as described below in detail.
As shown in Figure 3A, be Fig. 2 F of embodiment before continuing, utilize for example etching (Etching) or electrolysis modes such as (Electrolyzing) to remove these metal level 33 lip-deep first articulamentums 34 of the perforate 350a that is arranged in the 3rd resistance layer 35a.
Shown in Fig. 3 B, electroplate on the metal level 33 in the perforate 350a of the 3rd resistance layer 35a and form second articulamentum 36.
Shown in Fig. 3 C, then remove the 3rd, the 4th resistance layer 35a, 35b and first, second resistance layer 32a, 32b, and this first, second resistance layer 32a, 32b first, second conductive layer 31a, the 31b that are covered.
Shown in Fig. 3 D, afterwards, carry out back welding process again, make second articulamentum 36 on this second electric connection pad 302 form a pre-solder bump 38 that coats this metal level 33 through reflow.
See also Fig. 3 C again, the present invention provides the conductive structure of electrically connected mat of circuit board again, be to comprise: one has the circuit board 30 of first and second surperficial 30a, 30b, and the first surface 30a of this circuit board 30 has a plurality of first, second electric connection pads 301,302; One metal level 33 and one first articulamentum 34 are to be formed on this first electric connection pad 301; And one metal level 33 and one second articulamentum 36 be to be formed on this second electric connection pad 302.In addition, the second surface 30b of this circuit board 30 has a plurality of the 3rd electric connection pads 303 again; And one metal level 33 and one first articulamentum 34 be to be formed on the 3rd electric connection pad 303.
Shown in Fig. 2 H, the conductive structure on this circuit board second electric connection pad 302 can comprise that again one first articulamentum 34 is formed between this metal level 33 and second articulamentum 36 for another example.
Shown in Fig. 2 I or Fig. 3 D, second articulamentum 36 on this second electric connection pad 302 can be formed with the pre-solder bump 37,38 of this metal level 33 of coating again through reflow.
In sum, the present invention can form the metal level and first articulamentum on first electric connection pad, form metal level, first articulamentum and second articulamentum on this second electric connection pad, and forms the metal level and first articulamentum on the 3rd electric connection pad.In addition, aforementioned processing procedure is the conductive structure of Direct Electroplating formation optionally also, and need not to form metal level, and the different user demands that electrically connect so can be provided.
And this first electric connection pad surface is to form the metal adhesion layer as first articulamentum in the mode of electroplating, connect the SMD LED surface-mount device LED element, this second electric connection pad surface is to form soldering tin material as first articulamentum and second articulamentum in the mode of electroplating, to connect semiconductor chip, and the 3rd electric connection pad surface is to form the metal adhesion layer as first articulamentum in the mode of electroplating, with the ball pad (ball pad) as this circuit board.The present invention forms conductive structure with electroplating process, and can overcome the processing procedure bottleneck of prior art stencilization method, and can form the electric connection structure of fine rule road spacing (Fine pitch).
In addition, in the method for the present invention, and can be before forming second articulamentum, remove first articulamentum that is covered in layer on surface of metal on second electric connection pad earlier, make the follow-up composition that is formed at second articulamentum on this metal level stable, the conductive structure that can avoid finally being formed at simultaneously on second electric connection pad produces the metal interface problem owing to the existence of first articulamentum.
The foregoing description only is illustrative principle of the present invention and effect thereof, but not is used to limit the present invention.Any those skilled in the art all can be under spirit of the present invention and category, and the foregoing description is modified and changed.Therefore, the scope of the present invention should be foundation with the scope of claims.
Claims (10)
1. the conductive structure of an electrically connected mat of circuit board comprises:
One has first and second surperficial circuit board, and the first surface of this circuit board has a plurality of first, second electric connection pads;
One first insulating protective layer is formed on this first surface, first and second electric connection pad, and is formed with a plurality of perforates to appear this first and second electric connection pad;
One electroplated metal layer, be formed on this first and second electric connection pad, wherein, the electroplated metal layer on this first electric connection pad is in the perforate of recessed this first insulating protective layer, and the electroplated metal layer on this second electric connection pad is protruding surface in this first insulating protective layer;
One first electroplates articulamentum, is formed on the electroplated metal layer on this first electric connection pad, to connect the SMD LED surface-mount device LED element; And
One second electroplates articulamentum, is formed on the electroplated metal layer on this second electric connection pad, to connect semiconductor chip.
2. the conductive structure of electrically connected mat of circuit board according to claim 1 comprises that again the second surface of this circuit board has a plurality of the 3rd electric connection pads, and is formed with this electroplated metal layer and this first plating articulamentum on the 3rd electric connection pad.
3. the conductive structure of electrically connected mat of circuit board according to claim 1 and 2 comprises that again this first plating articulamentum is that the electroplated metal layer and second that is formed on this second electric connection pad is electroplated between the articulamentum.
4. the conductive structure of electrically connected mat of circuit board according to claim 1, wherein, this electroplated metal layer is made with the electro-coppering material.
5. the conductive structure of electrically connected mat of circuit board according to claim 1, wherein, first to electroplate articulamentum be made with the plated metal adhesion layer for this.
6. the conductive structure of electrically connected mat of circuit board according to claim 5, wherein, this metal adhesion layer is selected from wherein one of tin, silver, gold, tin/silver, tin/silver/copper, nickel/group that gold is formed.
7. the conductive structure of electrically connected mat of circuit board according to claim 1, wherein, second to electroplate articulamentum be made with the plated solder material for this.
8. the conductive structure of electrically connected mat of circuit board according to claim 7, wherein, this soldering tin material is selected from wherein one of tin, silver, gold, bismuth, lead and group that zinc is formed.
9. the conductive structure of electrically connected mat of circuit board according to claim 1, wherein, second on this second electric connection pad electroplate articulamentum multiple through reflow to be formed with a pre-solder bump that coats this electroplated metal layer.
10. the conductive structure of electrically connected mat of circuit board according to claim 3, wherein, second on this second electric connection pad electroplate articulamentum and first electroplate articulamentum multiple through reflow to be formed with a pre-solder bump that coats this metal level.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100963127A CN101287331B (en) | 2007-04-10 | 2007-04-10 | Conductive structure of electrically connected mat of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100963127A CN101287331B (en) | 2007-04-10 | 2007-04-10 | Conductive structure of electrically connected mat of circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101287331A CN101287331A (en) | 2008-10-15 |
| CN101287331B true CN101287331B (en) | 2010-12-08 |
Family
ID=40059221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007100963127A Active CN101287331B (en) | 2007-04-10 | 2007-04-10 | Conductive structure of electrically connected mat of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101287331B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI470759B (en) * | 2011-11-01 | 2015-01-21 | Unimicron Technology Corp | Package substrate and fabrication method thereof |
| US11876004B2 (en) | 2017-09-29 | 2024-01-16 | Lg Innotek Co., Ltd. | Printed circuit board |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120032337A1 (en) * | 2010-08-06 | 2012-02-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Flip Chip Substrate Package Assembly and Process for Making Same |
| US10347507B2 (en) | 2017-09-29 | 2019-07-09 | Lg Innotek Co., Ltd. | Printed circuit board |
| CN109686719B (en) * | 2017-10-18 | 2021-09-21 | 群创光电股份有限公司 | Electronic device and display equipment comprising same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050017355A1 (en) * | 2003-05-27 | 2005-01-27 | Chien-Kang Chou | Water level processing method and structure to manufacture two kinds of bumps, gold and solder, on one wafer |
| US20050037601A1 (en) * | 2003-08-13 | 2005-02-17 | Shih-Ping Hsu | Semiconductor package substrate having contact pad protective layer formed thereon and method for fabricating the same |
-
2007
- 2007-04-10 CN CN2007100963127A patent/CN101287331B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050017355A1 (en) * | 2003-05-27 | 2005-01-27 | Chien-Kang Chou | Water level processing method and structure to manufacture two kinds of bumps, gold and solder, on one wafer |
| US20050037601A1 (en) * | 2003-08-13 | 2005-02-17 | Shih-Ping Hsu | Semiconductor package substrate having contact pad protective layer formed thereon and method for fabricating the same |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI470759B (en) * | 2011-11-01 | 2015-01-21 | Unimicron Technology Corp | Package substrate and fabrication method thereof |
| US11876004B2 (en) | 2017-09-29 | 2024-01-16 | Lg Innotek Co., Ltd. | Printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101287331A (en) | 2008-10-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7350298B2 (en) | Method for fabricating circuit board with conductive structure | |
| US7705456B2 (en) | Semiconductor package substrate | |
| US8164003B2 (en) | Circuit board surface structure and fabrication method thereof | |
| US20060219567A1 (en) | Fabrication method of conductive bump structures of circuit board | |
| CN100452342C (en) | Method for manufacturing board with built-in device and board with built-in device, and method for manufacturing printed wiring board and printed wiring board | |
| JP2005217388A (en) | Pre-solder structure of semiconductor package substrate and its manufacturing method | |
| TWI301740B (en) | Method for fabricating circuit board with electrically connected structure | |
| US7659193B2 (en) | Conductive structures for electrically conductive pads of circuit board and fabrication method thereof | |
| US7419897B2 (en) | Method of fabricating circuit board having different electrical connection structures | |
| CN101287331B (en) | Conductive structure of electrically connected mat of circuit board | |
| CN101388376B (en) | Semi-conductor package substrate construction | |
| US20080185711A1 (en) | Semiconductor package substrate | |
| CN103748977A (en) | Component-mounting printed circuit board and manufacturing method for same | |
| CN100534263C (en) | Circuit board conductive lug structure and making method | |
| CN103404244A (en) | Printed circuit board and method for manufacturing same | |
| CN1980530A (en) | Method for making circuit-board conductive lug structure | |
| CN101567356B (en) | Circuit board structure and manufacture method thereof | |
| US7135377B1 (en) | Semiconductor package substrate with embedded resistors and method for fabricating same | |
| CN1980538A (en) | Method for forming circuit-board electric connection end | |
| US20060094156A1 (en) | Semiconductor package substrate with embedded resistors and method for fabricating the same | |
| CN101360388B (en) | Electricity connection terminal construction of circuit board and preparation thereof | |
| KR100714774B1 (en) | Printed circuit board having alloyed solder bump | |
| CN100525589C (en) | A manufacturing method of formation of circuit board electricity connection end | |
| CN100369242C (en) | Pre-soldering arrangement for semiconductor packaging substrate and method for making same | |
| TWI301736B (en) | Electrical connecting pad of circuit board having conductive structure and method for fabricating the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |