CN101274480A - Gate cutting machine, gate cutting method and light plate producing method - Google Patents
Gate cutting machine, gate cutting method and light plate producing method Download PDFInfo
- Publication number
- CN101274480A CN101274480A CN 200710089674 CN200710089674A CN101274480A CN 101274480 A CN101274480 A CN 101274480A CN 200710089674 CN200710089674 CN 200710089674 CN 200710089674 A CN200710089674 A CN 200710089674A CN 101274480 A CN101274480 A CN 101274480A
- Authority
- CN
- China
- Prior art keywords
- gate
- formed parts
- lgp
- cut
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Laser Beam Processing (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The invention relates to a sprue cutting device which can cut a sprue part from a light guiding board body of a formed light guiding board component formed by injection molding and comprises a loading part used for loading the formed light guiding board component formed by injection molding, a laser irradiation unit, a suction socket and a suction unit, wherein, the laser irradiation unit conducts the relative movement along the margin between the sprue part of the formed light guiding board component loaded on the loading part and the light guiding board body while irradiating laser on the margin so as to cut the sprue part from the light guiding board body; the suction socket is arranged close to the margin by extension along the margin so as to suck gas generated due to the laser irradiation and the suction unit is connected at the suction socket. By adopting the sprue cutting device of the invention, no chip is produced and no stress is acted near a cut part or the sprue part can not be cut from the formed light guiding board component formed by injection molding roughly near the cut part.
Description
Technical field
The present invention relates to gate cutting machine, gate cutting method and adopt their manufacturing method of light conducting board, in detail, relate to gate cutting method, gate cutting machine and the manufacturing method of light conducting board that the gate part with the LGP formed parts by the injection molded manufacturing cuts off from light conducting plate body portion.
Background technology
Drip molding body for the injection molded spare of LGP that takes out from metal die etc., owing to the resin that hardens in cast gate is formed on the drip molding body as gate part, so after taking out injection molded spare, must carry out the operation (cast gate cutting) that this gate part is cut off from the drip molding body from metal die.
With the injection molded mode make liquid crystal indicator back side light (Japanese: the occasion of employed LGP バ Star Network ラ イ ト), also carry out the cutting of this cast gate.
The cutting of this cast gate usually with the so-called guillotine type cutter with the cutter that move up and down relatively (Japanese: ギ ロ チ Application カ Star one) or the cutter with discoid cutter of rotation wait and carry out.
But there are the following problems: when carry out cast gate when cutting with this cutter, certainly lead to smear metal, this smear metal is attached on the LGP and the damage LGP causes optical defect on LGP.
Also there are the following problems for this cutter: when cutting off gate part in the light conducting plate body portion from the LGP formed parts of injection molded, stress is applied on the LGP formed parts, so make LGP that undesirable birefringence takes place near the part that gate part is cut, optical characteristics descends.
In addition, also there are the following problems for this cutter: because the formed section of cutter is coarse, so section and near optical characteristics decline.
In the employed LGP of the back side of liquid crystal indicator light, the thickness of the incident end face side of light sources such as configuration CCFL is thicker, often adopts the cross sectional shape of thickness wedge shape of attenuation along with leaving incident end face.When making this LGP by injection molded, consider that resin injects reasons such as easness, generally the metal pattern chamber side in the incident end face side disposes cast gate, so in this LGP, the gate part that is formed on the incident end face side is cut from light conducting plate body portion.
Owing to be near the incident end face of LGP in order to make light from important zone that LGP penetrates equably, therefore, in the employed LGPs such as back side light of the liquid crystal indicator that requires the high optical characteristics of LGP, especially do not wish that stress is applied on this part when cast gate cuts, or make this face coarse.
Summary of the invention
The present invention makes in order to address this is that, purpose is to provide a kind of gate cutting machine, gate cutting method and manufacturing method of light conducting board, do not produce smear metal, and can or not make near the cut-away portions cursorily the light conducting plate body of the LGP formed parts of gate part behind the injection molded is cut near the stress application cut-away portions.
Adopt the present invention, a kind of gate cutting machine that the light conducting plate body portion of the LGP formed parts of gate part behind the injection molded is cut can be provided, this gate cutting machine has released part, the laser illumination unit, attract mouth and attract the unit, described released part is used to put described LGP formed parts, described laser illumination unit relatively moves along the boundary portion that puts between the gate part of the LGP formed parts on the described released part and described light conducting plate body portion on one side, on one side laser is radiated at and makes its fusion and decomposition on this boundary portion, described gate part is cut from described light conducting plate body portion; Near described attraction mouthful was configured in described boundary portion along this boundary portion with extending, the gas that fusion and decomposition produced of the described boundary portion that will shine owing to laser was attracted; Described attraction unit is connected described attraction mouthful place.
Adopt this structure, owing to by the fusion and decomposition of laser generation gate part is cut from light conducting plate body portion, so do not produce smear metal when cutting, stress can not be applied on the LGP formed parts, and the optical characteristics of LGP is descended.In addition, utilize gas that laser generated the resin fusion and decomposition of boundary portion mouthful to attract by attracting, so though this gas is gas componant in detail produces and solidify, can be attached on the LGP surface and make the optical characteristics decline of LGP.
According to preferable form of the present invention, also have gas is blown to the insufflation unit used on the irradiation position of the described laser of irradiation.
Adopt this structure, can be more effectively from attracting mouthful to utilizing laser that the gas that the resin fusion and decomposition of boundary portion is generated is attracted.
According to another preferable form of the present invention, described insufflation unit is blown to described attraction mouth from the position relative with described attraction mouth on the irradiation position both sides of described laser.
Adopt this structure, can be more effectively from attracting mouthful to utilizing laser that the gas that the resin fusion and decomposition of boundary portion is generated is attracted.
According to another preferable form of the present invention, described laser illumination unit is installed on the slip-on head, and this slip-on head moves on the guide rail that disposes along this boundary portion above the described boundary portion.
According to another preferable form of the present invention, described insufflation unit is installed on the described slip-on head, the described below that attracts mouth to be configured in described boundary portion.
According to another preferable form of the present invention, described gate part is film gate (Japanese: the film gate portion of Xing Chenging Off イ Le system ゲ one ト).
Because common cast gate has the width quite narrower than the width of incident end face, so molten resin flows at a high speed in the metal die chamber from the cast gate of this narrow width when injection molded.Therefore, exist following problem: near the gate part of the LGP formed parts behind the injection molded, produce the stronger orientation of resin, birefringence etc. takes place easily in this part.To this,, can solve the problem of resin orientation by the film gate that adopts the resin inflow velocity to diminish.
But, when with in the past guillotine type cutter etc. when cutting by the film gate portion that uses the wide cut that the wide film gate of width produces, only carried out the incision of multi-disc, resin is just attached on the cutter of cutter and the incision that can not stipulate, and the length of the cutter of cutter is longer, the grinding cost rises, and therefore is difficult to film gate is applied to make the injection molded aspect of LGP.
According to another preferable form of the present invention, owing to gate part is cut off with laser, even so the cast gate cutting of long film gate portion of cut-off parts length, the problem that cast gate cutting that above-mentioned guillotine type cutter etc. produced is had can not take place yet, can carry out the cast gate cutting.
According to another form of the present invention, a kind of gate cutting method is provided, it is the gate cutting method that the gate part with the LGP formed parts behind the injection molded cuts from light conducting plate body portion, it is characterized in that having following operation: described LGP formed parts is put in the operation on the released part: along putting the boundary portion between the gate part of the described LGP formed parts on the described released part and described light conducting plate body portion and be radiated at laser on this boundary portion and make its fusion and decomposition, the cut-out operation that described gate part is cut from described light conducting plate body portion, described cut-out operation is on one side to being attracted one side to carry out owing to shine the gas that described laser generated.
Adopt this method, gate part is cut open from light conducting plate body portion by the fusion that utilizes laser and produce, and when cutting smear metal does not take place, and stress can not be applied in the light conducting plate body portion.In addition, utilize gas that laser generated the resin fusion and decomposition of boundary portion mouthful to attract by attracting, so though this gas is gas componant in detail produces and solidify, can be attached on the LGP surface and make the optical characteristics decline of LGP.
According to another preferable form of the present invention,, described cut-out operation carries out on one side blowing to gas the irradiation position of the described laser on the described LGP formed parts on one side.
Adopt this method, can be more effectively from attracting mouthful to utilizing laser that the gas that the resin fusion and decomposition of boundary portion is generated is attracted.
According to another form of the present invention, a kind of manufacturing method of light conducting board is provided, this manufacturing method of light conducting board has the operation of utilizing above-mentioned gate cutting method that the light conducting plate body portion of the LGP formed parts of gate part behind the injection molded is cut.
Adopt this method, gate part is cut open from light conducting plate body portion by the fusion that utilizes laser and produce, and when cutting smear metal does not take place, and stress can not be applied in the light conducting plate body portion, and the optical characteristics of LGP is descended.
Adopt the present invention, a kind of gate cutting machine, gate cutting method and manufacturing method of light conducting board can be provided, smear metal can not take place, and stress can be applied near the cut-away portions of light conducting plate body portion or make near this cut-away portions coarsely, the light conducting plate body portion of the LGP formed parts of gate part behind the injection molded can be cut.
Description of drawings
Fig. 1 is the stereogram that carries out the LGP formed parts of cast gate cutting with the gate cutting machine of the preferable example of the present invention.
Fig. 2 is the vertical view of major part structure of the gate cutting machine of expression the present invention preferable example.
Fig. 3 is used to illustrate the structure of gate cutting machine of the preferable example of the present invention and the stereogram of action.
Fig. 4 is used to illustrate the structure of gate cutting machine of the preferable example of the present invention and the stereogram of action.
Fig. 5 is used to illustrate the structure of gate cutting machine of the preferable example of the present invention and the stereogram of action.
Fig. 6 is the enlarged drawing of LGP and alignment pin relation in the gate cutting machine of presentation graphs 2 to Fig. 5.
Fig. 7 be in the gate cutting machine of pattern ground presentation graphs 2 to Fig. 5 laser injection part and blow-off outlet and attract mouthful between the enlarged drawing that concerns of position.
The specific embodiment
Below, the gate cutting machine of the preferable example of the present invention is described with reference to the accompanying drawings.Fig. 1 is the stereogram that takes out back state from mold for injection molding that carries out the LGP formed parts 2 of cast gate cutting with the gate cutting machine 1 of the preferable example of the present invention, Fig. 2 is the vertical view of the primary structure of expression gate cutting machine 1, and Fig. 3 to Fig. 5 is the stereogram of gate cutting machine 1.
The LGP formed parts 2 that carries out the cast gate cutting with the gate cutting machine 1 of this example is to use as the LGP that liquid crystal indicator back side light is used, and is the drip molding by the film gate injection molded.As shown in Figure 1, LGP formed parts 2 has the 2a of light conducting plate body portion that interarea is rectangular tabular component, and the 2a of this light conducting plate body portion has thickness and grows limit wedge-shaped cross of attenuation gradually from a long limit to another.LGP formed parts 2 utilizes film gate to be located to become the metal die of thicker side end face side of incident end face and injection molded, is formed with film gate portion 4 in the incident end face side of the 2a of light conducting plate body portion.
Film gate portion 4 has: the central portion 4a of general triangular that is positioned at the incident end face substantial middle of LGP formed parts 2; Runner (the Japanese: the 4b of portion ラ Application Na one) that extends upward from central portion 4a; And the elongated left and right sides quadrate part 4c that extends respectively to two side ends from central portion 4a.Left and right sides quadrate part 4c extends to the front of two side ends always.In detail, left and right sides quadrate part 4c is the inner side place end of d (for example 5mm to 10mm) in distance two side ends length, is formed with par 2b near two side ends.That is, in this example, when from mold for injection molding taking-up moulding, the side is formed with par 2b, the 2b that length is d (for example 5mm to 10mm) in the two side ends of LGP formed parts 2.
The following describes the structure of gate cutting machine 1.To shown in Figure 5, gate cutting machine 1 has released part 6,8 as Fig. 2, and this released part 6,8 puts the LGP formed parts 2 that gate part 4 is cut. Released part 6,8 is made of 2 parallel board members, and these 2 parallel board members are installed on the framework F of gate cutting machine 1 to horizontal (width of LGP formed parts 2) extension ground level.
Dispose ways 10,10 in the both sides of released part 6,8. Ways 10,10 leaves than the wide slightly interval of LGP formed parts 2 width of carrying out the cast gate cutting and is installed on the framework F with released part 6,8 quadratures with extending.Constitute and put on released part 6,8 LGP formed parts 2 both side edges butts and to its structure that leads.
In the anterior position of released part 6,8, pair of right and left alignment pin 12,12 is installed on the framework F.Alignment pin 12,12 has " L " glyph shape, base portion 12a is from foreign side position and ways 10 inwardly side's extension orthogonally of ways 10, at the interior position of ways 10, curve the right angle from the top of base portion 12a and the bend 12b that extends is configured to extend to released part 6,8 directions.In addition, the bend front-end configuration of " L " shape becomes with the par 2b, the 2b that put LGP formed parts 2 two side ends on released part 6,8 to connect.
Rear position at released part 6,8 disposes thrust piece 14, this thrust piece 14 and the rear end butt that puts the LGP formed parts 2 on released part 6,8, LGP formed parts 2 is pressed against on the alignment pin 12,12, on released part 6,8, LGP formed parts 2 is positioned at assigned position.In this example, thrust piece 14 is board members of rectangle, utilizes the drive source of cylinder etc. to move (moving forward and backward) to the arrow A direction.
On ways 10,10 fixed bar 16 is installed, the LGP formed parts 2 after 16 pairs of this fixed bars are located by alignment pin 12 and thrust piece 14 is fixed.Fixed bar 16 is the center with the fulcrum P that establishes at one end, can and the position to be kept away (Fig. 2, Fig. 3) of ways 10 configured in parallel and and ways 10 quadratures and extend to put between the extrusion position (Fig. 4) on the LGP formed parts 2 of released part 6,8 and rotate to the arrow B direction.Fixed bar 16 is being waited to keep away when rotating between position and the extrusion position, by putting in the top of the LGP formed parts 2 of released part 6,8, and does not contact with the surface of LGP formed parts 2.
In addition, fixed bar 16 is at extrusion position (Fig. 4), move up and down between position and the lower position up, and the top position is the position of leaving upward in the LGP formed parts 2 of released part 6,8 from putting, and lower position is and put in the upper surface position contacting of the LGP formed parts 2 of released part 6,8.The lower surface of the fixed bar 16 that contacts at the upper surface with LGP formed parts 2 posts rubber 18, when fixed bar 16 is configured in lower position, contact with the upper surface of LGP formed parts 2, fixed bar 16 can be clamped (fixing) with LGP formed parts 2 reliably.
The gate cutting machine 1 of this example has the attraction pipeline 22 that attraction mouth 20 is located at the top, and this attraction mouth 20 is along putting in the 2a of light conducting plate body portion and the extension of the boundary portion between the gate part 4 of the LGP formed parts 2 of released part 6,8.In detail, attract mouth 20 to be configured in the oblique below anterior position of gate part 4 along the leading edge of gate part 4 with extending.Attraction pipeline 22 is connected with not shown suction device (attraction unit), can attract from attracting mouthfuls 20.As described attraction unit, for example can enumerate dust catcher, sweeper, suction air pump etc.
To (Fig. 2 is not shown) shown in Figure 5, above released part 6,8, guide rail 24 is configured to extend to LGP formed parts 2 widths that put in released part 6,8 as Fig. 3.Guide rail 24 utilize not shown driver element along the trapped orbit 26 of ways 10, the 10 foreign side positions that are installed in released part 6,8 tops and forwards, backwards direction (arrow C direction) move.In detail, guide rail 24 can move between going-back position and progressive position, this going-back position is in the rear of thrust piece 14, and this progressive position is to put in the 2a of light conducting plate body portion of the LGP formed parts 2 of released part 6,8 and the top of the boundary portion between the gate part 4.
Slidably slide head 32 is installed on the guide rail 24, and this slide head 32 is equipped with: laser is shone the laser injection part 28 that puts on the LGP formed parts 2 of released part 6,8; Blow out the inflatable mouth 30 of gases such as nitrogen with laser light irradiation position to LGP formed parts 2.As the insufflation unit (not shown) that is connected with inflatable mouth 30, for example can enumerate (point type) air blast, fan machine, air gun, air-blowing pouring chamber etc.
When guide rail 24 is in progressive position, laser injection part 28 is configured to: laser is shone put on the 2a of light conducting plate body portion and the boundary portion between the gate part 4 of the LGP formed parts 2 of released part 6,8, make the resin fusion and decomposition of boundary portion, can from light conducting plate body portion 2, gate part 4 be cut.
Below incision (cast gate cutting) action that utilizes 1 pair of gate part of gate cutting machine is described.
At first, guide rail 24 is configured in going-back position, and thrust piece 14 is retreated, again fixed bar 16 is configured in position to be kept away, under such state, put on released part 6,8 (Fig. 2, Fig. 3) at the LGP formed parts 2 (Fig. 1) that will make by injection molded between the ways 10,10 with mechanical arm etc.
Because the interval of ways 10,10 is wideer slightly than the width of LGP formed parts 2, so LGP formed parts 2 is roughly located at width by being configured between the ways 10,10.
Then, make cylinder action that thrust piece 14 is advanced along arrow A, push LGP formed parts 2 to alignment pin 12, make and expose, between thrust piece 14 and alignment pin 12, seize LGP formed parts 2 on both sides by the arms location at par 2b, the 2b at LGP formed parts 2 two ends and the bend 12b top butt (Fig. 6) of alignment pin 12.
Then, making fixed bar 16 is that middle mind-set extrusion position (top position) for example rotates to general horizontal direction with fulcrum P.At this moment, fixed bar 16 is by putting above the LGP formed parts 2 on the released part 6,8, not with the surperficial butt of LGP formed parts 2.Then, make the fixed bar 16 that is configured in extrusion position (top position) drop to lower position, the rubber 18 below fixed bar 16 are pressed to the below with LGP formed parts 2, be fixed on and released part 6,8 between (Fig. 4).Simultaneously, make guide rail 24 move to progressive position along arrow C.This moment, slide head 32 was pre-configured in the distolateral of guide rail 24.
Then, make the suction device action, and the laser L that will be sent by laser injection part 28 makes the boundary portion fusion and decomposition to the 2a of light conducting plate body portion of LGP formed parts 2 and 34 irradiations of the boundary portion between the gate part 4, slide head 32 is moved on one side from an end of guide rail 24 to the other end along arrow D, gate part 4 is cut from the 2a of light conducting plate body portion.As laser, can use infrared laser (carbon dioxide laser, YAG laser), ultraviolet laser (Ai Ke Sigma laser (Japanese: エ キ シ マ レ one ザ), UV-Ar ion laser)) etc.
At this moment, because constituting the gas G that fusion generated of the resin of LGP formed parts 2 blows away to attraction mouthful 20 directions by the gas (for example nitrogen or air) that blows out from inflatable mouth 30 shown in Fig. 7 arrow E like that, by attracting mouthful 20 attractions, be removed rapidly again near the of LGP formed parts 2.
When slide head 32 arrived the other end of guide rail 24, gate part 4 was cut open the reception that drops to the below from the 2a of light conducting plate body portion fully.
Then, after making guide rail 24 retreat, make fixed bar 16 to rise to the top position, turn back to and wait to keep away the position and thrust piece 14 is retreated and remove fixing to LGP formed parts 2, the 2a of light conducting plate body portion that will cut behind the gate part 4 with mechanical arm (not shown) takes off and is sent to next operation from released part 6,8, finishes incision (cast gate cutting).
As mentioned above, the 2a of light conducting plate body portion behind the incision gate part to processing such as its incident end face enforcement machining, makes LGP as required.
The present invention is not limited to above-mentioned example, can do various changes and distortion in the scope of the technical conceive that claim is put down in writing.
In above-mentioned example, the LGP formed parts that carries out cast gate cutting is the LGP formed parts that is injection molding the film gate portion that has of shaping with film gate, but the present invention also can be suitable for carrying out LGP formed parts behind the injection molded or the cast gate of other formed parts cuts with other cast gate.
In above-mentioned example, lightguide plate fixing formed parts, structure that the laser illumination unit is moved are illustrated, also can be fixed laser illumination unit and structure that the LGP formed parts is moved.
Claims (6)
1. gate cutting machine is the gate cutting machine that the light conducting plate body portion of the LGP formed parts of gate part behind the injection molded is cut, it is characterized in that,
Have released part, laser illumination unit, attract mouth and attract the unit,
This released part is used to put the described LGP formed parts behind the described injection molded;
Described laser illumination unit relatively moves along the boundary portion that puts between the gate part of the LGP formed parts on the described released part and described light conducting plate body portion on one side, on one side laser is shone on this boundary portion, described gate part is cut from described light conducting plate body portion;
Described attraction mouth will be attracted because of the gas that the laser irradiation is produced near being configured in described boundary portion along this boundary portion with extending;
Described attraction unit is connected with described attraction mouth.
2. gate cutting machine as claimed in claim 1 is characterized in that,
Also have gas is blown to the insufflation unit of using on the irradiation position of the described laser on the described LGP formed parts.
3. gate cutting machine as claimed in claim 1 or 2 is characterized in that,
Described gate part is the film gate portion that is formed by film gate.
4. gate cutting method is the gate cutting method that the gate part with the LGP formed parts behind the injection molded cuts from light conducting plate body portion, it is characterized in that having following operation:
Described LGP formed parts is put operation on released part;
Along putting the boundary portion between the gate part of the described LGP formed parts on the described released part and described light conducting plate body portion and laser is radiated on this boundary portion, the cut-out operation that described gate part is cut from described light conducting plate body portion,
Described cut-out operation is attracted to carry out on one side to the gas that generates owing to the described laser of irradiation on one side.
5. gate cutting method as claimed in claim 4 is characterized in that,
The irradiation position that described cut-out operation blows to gas the described laser on the described LGP formed parts on one side carries out on one side.
6. a manufacturing method of light conducting board is characterized in that,
Has the operation that claim utilized 4 or 5 described gate cutting methods cut the light conducting plate body portion of the LGP formed parts of gate part behind the injection molded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710089674 CN101274480A (en) | 2007-03-26 | 2007-03-26 | Gate cutting machine, gate cutting method and light plate producing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710089674 CN101274480A (en) | 2007-03-26 | 2007-03-26 | Gate cutting machine, gate cutting method and light plate producing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101274480A true CN101274480A (en) | 2008-10-01 |
Family
ID=39994536
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200710089674 Pending CN101274480A (en) | 2007-03-26 | 2007-03-26 | Gate cutting machine, gate cutting method and light plate producing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101274480A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102043189A (en) * | 2011-01-28 | 2011-05-04 | 苏州茂立光电科技有限公司 | Light guide plate and manufacturing method thereof |
| CN104890197A (en) * | 2015-06-17 | 2015-09-09 | 张三义 | Automatic cutting system and method for gate of injection part |
| CN108790064A (en) * | 2018-05-25 | 2018-11-13 | 歌尔股份有限公司 | A kind of automatic cutting means |
| CN109571882A (en) * | 2018-10-31 | 2019-04-05 | 歌尔股份有限公司 | A kind of moulding cast gate cutting method |
| CN112872337A (en) * | 2020-12-07 | 2021-06-01 | 青岛万盛铸造有限公司 | Automatic sprue cutting device |
-
2007
- 2007-03-26 CN CN 200710089674 patent/CN101274480A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102043189A (en) * | 2011-01-28 | 2011-05-04 | 苏州茂立光电科技有限公司 | Light guide plate and manufacturing method thereof |
| CN104890197A (en) * | 2015-06-17 | 2015-09-09 | 张三义 | Automatic cutting system and method for gate of injection part |
| CN108790064A (en) * | 2018-05-25 | 2018-11-13 | 歌尔股份有限公司 | A kind of automatic cutting means |
| CN109571882A (en) * | 2018-10-31 | 2019-04-05 | 歌尔股份有限公司 | A kind of moulding cast gate cutting method |
| WO2020088181A1 (en) * | 2018-10-31 | 2020-05-07 | 歌尔股份有限公司 | Method for cutting running gate off of injection-molded part |
| CN112872337A (en) * | 2020-12-07 | 2021-06-01 | 青岛万盛铸造有限公司 | Automatic sprue cutting device |
| CN112872337B (en) * | 2020-12-07 | 2022-03-18 | 青岛万盛铸造有限公司 | Automatic sprue cutting device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101274480A (en) | Gate cutting machine, gate cutting method and light plate producing method | |
| ES2733960T3 (en) | Mold to produce resin product and production procedure | |
| JP5046776B2 (en) | Gate cut device and method | |
| KR20090013686A (en) | Molding mold for light guide plate and method for molding light guiding plate | |
| JP2008265107A (en) | Ejector of light guide plate and ejection method of light guide plate | |
| CN209504800U (en) | A kind of injection mold of achievable mould inscribe | |
| JP4873698B2 (en) | Cutting apparatus and cutting method for resin molded product | |
| TW567136B (en) | Device for removing an injection-molded substrate from an injection-molding tool and injection-molding machine equipped with same | |
| JP3895551B2 (en) | Assembly of optical members | |
| KR20080079091A (en) | Gate cutting apparatus, gate cutting method, and method for manufacturing a light guiding body | |
| CN110153564B (en) | Marking pretreatment automatic device for sensor housing insert core and use method | |
| JP2007098911A (en) | Gate cutter, gate cutting method and manufacturing method of light guide body | |
| JP2007111953A (en) | Resin molding apparatus | |
| JP4002004B2 (en) | Rotary separator | |
| CN210360802U (en) | Integrative device of light guide plate cutting polishing | |
| US20110156330A1 (en) | Platform and method for supporting a workpiece to be cut from sheet material | |
| CN208392529U (en) | A kind of frame injection mold | |
| CN205951199U (en) | Automatic cut side sprue and push up mechanism to one side | |
| CN214562628U (en) | Rapid forming injection mold for nose pads of glasses | |
| JP4778766B2 (en) | Resin molding equipment | |
| JP2020019146A (en) | Method for mounting mold of vertical injection molding machine | |
| CN217434872U (en) | Optical lens piece injection mold with burr is maintained | |
| CN105451960B (en) | Injection-molded object, injection molding molding method and injection molding shaping mould tool | |
| CN105965803A (en) | Side gate breaking structure | |
| CN219360129U (en) | Mould is used in electronic components production and processing |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20081001 |