CN101273254A - System and method for sensing differential pressure - Google Patents
System and method for sensing differential pressure Download PDFInfo
- Publication number
- CN101273254A CN101273254A CNA2006800350441A CN200680035044A CN101273254A CN 101273254 A CN101273254 A CN 101273254A CN A2006800350441 A CNA2006800350441 A CN A2006800350441A CN 200680035044 A CN200680035044 A CN 200680035044A CN 101273254 A CN101273254 A CN 101273254A
- Authority
- CN
- China
- Prior art keywords
- rete
- differential pressure
- resonant
- induction system
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0001—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means
- G01L9/0008—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means using vibrations
- G01L9/0019—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means using vibrations of a semiconductive element
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
- G01L9/06—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of piezo-resistive devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
A differential pressure sensing system is provided. The sensing system includes a membrane layer having a channel extending diametrically therein, and including one or more cavities provided radially outbound of the channel and at least one resonant beam disposed in the channel and configured to oscillate at a desired frequency. The system further includes sensing circuitry configured to detect oscillation of the at least one resonant beam indicative of deformation in the membrane layer.
Description
Technical field
Present invention relates in general to sensor, more specifically, relate to resonance differential pressure pick-up (resonantdifferential pressure sensor).
Background technology
Traditional differential pressure sensors design is used for the pressure reduction between definite sensor both sides.For example, traditional differential pressure sensors passes through to estimate the net effect of the pressure of two relevant ranges to one or more parts of sensor, detects two pressure reduction between the zone.When using in the industrial environment in harshness, conventional pressure sensor requires firmer structure usually.For example, if differential pressure pick-up is exposed to the environment that pressure is higher and/or temperature is higher, then the exposed component of pressure transducer then has benefited from enough firm in to tolerate the structure of these conditions.
Yet for these traditional differential pressure sensors, the feature and the attribute that help working in this high pressure (promptly harsh) environment can cause negative effect to the resolution of sensor.That is, for example enough firm traditional differential pressure sensors with the tolerance hyperbaric environment can not detect between two relevant ranges magnitude less than the pressure reduction of environment pressure reduction.For example, enough firm can tolerate 5000 pounds/square inch (psi) and with the resonance differential pressure pick-up of upward pressure do not have usually enough resolution characteristiies with test example as+/-pressure reduction of 10psi.This is because comprise vacuum in the annular seal space of traditional resonating pressure sensor between pressure sensor diaphragm, thereby acts at high pressure under the situation of each barrier film, and it is protruding inside that barrier film can be tending towards.
Therefore, need the pressure sensitive system and method that has high-resolution differential pressure sensing capability and for example tolerate high line pressure can be provided.
Summary of the invention
According to an aspect of the present invention, provide the differential pressure induction system.This system comprises rete and at least one resonant beam, has the passage that radially extends in this rete and comprises the one or more chambeies that radially are arranged on outside the passage, and this at least one resonant beam is arranged in the passage and with required hunting of frequency.This system also comprises the vibration that is used for detecting at least one resonant beam that the indication rete is out of shape.
In another embodiment of the invention, provide differential pressure pick-up, this differential pressure pick-up comprises fixed support (fixed support structure) and is connected to first rete and second rete on the fixed support.First and second retes limit at least one chamber jointly therein.This sensor also comprises and being arranged in the chamber and with the resonant member of resonant frequency vibration, and is bonded on first and second retes and is connected to one or more table tops on the resonant member.Table top is used for the distortion that first rete produces is passed to second rete and at least one resonant member.
In alternate embodiment of the present invention, provide the manufacture method of differential pressure pick-up.This method is included in to be provided with in the fixed support and comprises first rete of first passage and second rete that comprises second channel is set in this fixed support, makes win rete and second rete formation film and first passage and second channel formation close passage.This close passage extends to the periphery of film.This method also is included in close passage and is mounted slidably at least one resonant beam in etched one or more chambeies in the periphery of film.One or more pillars support at least one resonant beam in these one or more chambeies of film outer part office.
In conjunction with the accompanying drawings, according to the following detailed description of the preferred embodiment of the invention, these and other advantage and feature be easy to understand more.
Description of drawings
Fig. 1 is the synoptic diagram of the differential pressure induction system of exemplary embodiment of the present invention;
Fig. 2 is the sectional view of the differential pressure pick-up of exemplary embodiment of the present invention;
Fig. 3 is the exploded view of the differential pressure pick-up of exemplary embodiment of the present invention;
Fig. 4 is the sectional view of the differential pressure pick-up of exemplary embodiment of the present invention;
Fig. 5 is the sectional view of the differential pressure pick-up of embodiment of the present invention.
Embodiment
In paragraph subsequently, the method for measuring pressure reduction in the industrial system will be described in detail in.After this Shuo Ming method provides and is convenient to the measurement of the high-resolution pressure reduction in the high line pressure environment.As skilled in the art to understand, and as prerequisite, line pressure is the pressure of independent action in barrier film, and acts on two surfaces of barrier film (in single barrier film differential pressure pick-up) or the difference that acts between the line pressure of two barrier films (in two barrier film differential pressure pick-ups) is called pressure reduction.After this in conjunction with the accompanying drawings, only for example, various aspects of the present invention are described.
Generally with reference to figure 1, with reference to the pressure sensitive system specialization pressure sensitive method that totally is expressed as mark 10.Yet, should be understood that following pressure transducer can be applicable to various devices and system, the application that is used for described pressure sensitive only is so a kind of application.Fig. 1 illustrates industrial synoptic diagram with exemplary pressure induction system 10 of differential pressure pick-up 12.For example, commercial Application includes but not limited to the differential pressure measurement in stringing application, petroleum drilling and mining application, ship and the chemistry manufacturing application, has only enumerated the some of them example here.Commercial Application also can comprise pipeline, pressure chamber, fluid device (flow device) or similar application.With regard to this discussion, as skilled in the art to understand, differential pressure pick-up 12 is arranged on commercial unit 14 for example in pressure chamber, fluid device, pump line (pump line), mixing chamber or the similar application.
In exemplary embodiment, telecommunication circuit 28 receive from the data-signal 34 of treatment circuit 26 and with this data signal transmission at a distance, for example shown in remote monitoring center 32.Telecommunication circuit 28 comprises makes it can be to the hardware and/or the software of remote monitoring center 32 transmission of data signals 34.In various embodiments, telecommunication circuit 28 according to cellular protocol, wireless protocols, radio frequency protocol etc. to remote monitoring center 32 transmission of data signals.Obviously, those skilled in the art are to be understood that the communication protocol that can adopt any kind.
Refer now to Fig. 2, illustrate and be used for for example sectional view of a kind of exemplary embodiment of the differential pressure pick-up 36 of system 10 of pressure sensitive system.Pressure transducer 36 comprises to the fixed support 38 that support structure is provided as two retes 40 and 42 of barrier film.Fixed support 38 can be configured to circular structure, rectangular structure, square structure body or can help measuring any sealing or the open architecture body of pressure reduction between two pressurized environment.In this embodiment, two barrier films 40 and 42 are connected on the fixed support 38, thereby form chamber 44 and limit chamber 44 by these structures.Can vacuumize so that vacuum area is encapsulated in it chamber 44.
Resonant member or resonant beam 46 are arranged in the chamber 44.Can be by embedding the electrostatic actuator excitation resonant beam 46 of control circuit 22 shown in Figure 1.Thereby, can make resonant beam 46 with its natural reonant frequency vibration.Yet when resonant beam 46 during through strain that the distortion of strained for example pressure reduction causes, the resonant frequency of resonant beam vibration departs from natural reonant frequency.Can demarcate this variation or the skew of resonant frequency, with the power of the reading size of pressure, gravity, stress etc. for example.Sensor 36 also comprises a set of mesas 48 and 50.Resonant beam 46 is clipped between the table top 48 and can places along sensor 36 central authorities' symmetries, passes table top 50 simultaneously.Although show among Fig. 2 to have three set of mesas, can construct the table top of any amount.As shown in the figure, central table top 50 can be configured to the area of the area of its covering greater than table top 48 coverings on every side.The component that the central table top 50 that area is bigger will vertically act on rete 40 passes to rete 42, and vice versa, thereby allows the distortion of resonant member 46 to be directly proportional with the pressure differential that acts on two retes.The area that one skilled in the art will appreciate that table top is big more, and the loss that rete 40 and 42 line-pressure sensitivity cause is more little.
It should be noted that in chamber 44 table top 48 can be placed between fixed support 38 and the table top 50 asymmetricly.The asymmetric placement of table top 48 can be based on the line pressure susceptibility.The asymmetry of table top helps eliminating the line-pressure sensitivity of two retes 40 and 42.
With reference to figure 3, illustrate the exploded view of differential pressure pick-up 37.As shown in the figure, pressure transducer 37 comprises the fixed support 38 that supports two retes or barrier film 40 and 42. Barrier film 40,42 and fixed support 38 are encapsulated in vacuum pressure in the chamber that wherein forms.This chamber comprises by beam supporter 54 and is connected to block 52 on the fixed support 38.Arrange one or more resonant member 56, for example resonant beam by block 52.Utilize table top 48 that barrier film 40,42 and block 52 are bonded together.As shown in the figure, compare central table top 50 with other table top 48 bigger, and this table top 50 is for connecting the single structure body of barrier film 40 and 42.This structure helps transmitting and is applied to the acting force that the pressure on the barrier film 40 causes, and with the power of equilibrium activity in barrier film 42, vice versa.Thereby, if P
1For acting on the pressure of barrier film 40, P
2For acting on the pressure of barrier film 42, and if P
1>P
2, then barrier film 40 and 42 with front and back move down, be P thereby make block 52 and pressure differential
1~P
2Being directly proportional, ground is horizontal to be moved.Laterally moving of block 52 causes resonant member 56 that strain takes place.
By embedding the electrostatic actuator excitation resonant member 56 of control circuit shown in Figure 1 22.Resonant member 56 has natural reonant frequency, when being energized or during energy supply, resonant member 56 is vibrated with natural reonant frequency.Yet, when resonant member 56 when strained, the resonant frequency of resonant member vibration departs from natural reonant frequency.Demarcate this variation or the skew of resonant frequency, with the power of the reading size of pressure, gravity, stress etc. for example.
Fig. 4 is the sectional view of the alternate embodiment of differential pressure pick-up 58.Pressure transducer 58 comprises fixed support 38, and fixed support 38 is provided with two barrier films or rete 60 and 62.Barrier film 60 and 62 is supported and is engaged with this mesa structure body 64 by big mesa structure body 64.In manufacture process, fixed support 38 and mesa structure body 64 can comprise two-layer fixed support and two-layer mesa structure body, engage this two-layer fixed support and two-layer mesa structure body then, thereby form single fixed support and single mesa structure body.Resonant beam or resonant member 66 are passed the passage in the table top 64.Construct this resonant member 66, make its two end supports on the less table top 68 of two column shapes.
The running of sensor 58 and above similar referring to figs. 2 and 3 described pressure transducer embodiment.When size is P
1Pressure act on barrier film 60 and size for P
2Pressure when acting on barrier film 62, P for example wherein
1>P
2, two barrier films 60 and 62 will move down together with mesa structure body 64.Mesa structure body 68 impels resonant member 66 to the next door swing, rather than guide pressure difference P
1~P
2The power that causes moves down resonant member 66.Thereby, can obtain pressure reduction P
1~P
2High precision readings.Should be noted in the discussion above that if central table top structure 64 is big inadequately have the possibility of local dent so in barrier film 60 and 62, this is because line pressure P
1And P
2Can be very high, reach the size of several thousand psi approximately, and enclose vacuum pressure by the chamber that fixed support 38 and barrier film form.Thereby, one skilled in the art will appreciate that central table top 64 can be configured to run through the chamber that is formed by fixed support 38 and barrier film 60,62 and extend, to reduce stress.Thereby in one embodiment, table top 64 can be used as single rete, wherein has the passage that allows resonant member to pass.This structure is the flat structure with the passage that radially extends to outer wall.
Fig. 5 is the sectional view of alternate embodiment with differential pressure pick-up 70 of single rete.As described above with reference to Figure 4, pressure transducer 70 also comprise fixed support 38, by prolonging a barrier film 72 that the big mesa structure body of central authorities forms, being placed on two resonant member 66 on the less column shape mesa structure body 68.In manufacture process, fixed support body 38 and barrier film 72 (or the mesa structure body that prolongs) can comprise two layers 74 and 76, engage two layers 74 and 76, thereby form single fixed support body 38 and single mesa structure body 72.Pressure transducer 70 operates in the mode identical with pressure transducer shown in Figure 4.Yet as shown in the figure, in sensor 70, barrier film or rete 72 have groove 78 from the teeth outwards.These grooves 78 are similar to and allow barrier film 72 to move the wave pattern that is beneficial to higher differential pressure sensitivity.As previously mentioned, as shown in the figure, table top 68 can be placed in the groove 80 asymmetricly.The asymmetric placement of this table top has reduced line-pressure sensitivity.
In sensor 70, extend towards fixed support 38 CCTV.Thereby sensor 70 only has single flat rete 72, comprises the passage that resonant member 66 is passed in this single flat rete 72.Also can have vacuum chamber 44, resonant member 66 can laterally be slided in this vacuum chamber 44.
Should be noted in the discussion above that and to use for example manufacturing fixed support 38 such as silicon (Si), silit (SiC), gallium nitride (GaN) of semiconductor material, barrier film 40,42,60,62 and 72, table top 48,50,64 and 68, table top 52, brace summer 54, resonant member 46,56 and 66. Resonant member 46,56 and 66 comprises one or more pressure drags or the pressure-volume element that allows to measure strain.Yet, in other embodiments, also can use the combination of metal parts or metal and semiconductor device.
Although the embodiment of above diagram and explanation is only represented a limited number of embodiments, should understand easily and the invention is not restricted to disclosed embodiment.In addition, can improve the present invention to introduce the undeclared before this of any amount but change accordingly with design of the present invention and scope, variation, replacement or equivalent arrangements.For example, pressure transducer embodiment 12,36,58 and 70 can be used for severe rugged environment, and for example satellite, automation and aviation electronics are used.In addition, the sensor embodiment can be by drives well known by persons skilled in the art, and circuit can encourage the distortion and the pressure reduction of resonant member and related resonant member.
In addition, although various embodiments of the present invention are illustrated, should be understood that aspect of the present invention can only comprise some in the described embodiment.Thereby, should not think that the present invention is limited by above stated specification, and the present invention is only limited by the scope of claims.
Claims (20)
1. differential pressure induction system comprises:
Rete wherein has the passage that radially extends and comprises the one or more chambeies that radially are arranged on outside the described passage;
Be arranged in the described passage and with at least one resonant beam of required hunting of frequency; With
Sensor circuit is used for detecting the vibration of described at least one resonant beam that the described rete of indication is out of shape.
2. the differential pressure induction system of claim 1, wherein said at least one resonant beam is in the periphery of described rete at least one mesa supports by the periphery that is formed on described rete.
3. the differential pressure induction system of claim 2, wherein said at least one resonant beam is slidably disposed in described one or more chamber.
4. the differential pressure induction system of claim 2, wherein said at least one table top is arranged in described one or more chamber asymmetricly.
5. the differential pressure induction system of claim 1, wherein said rete comprises semiconductor material.
6. the differential pressure induction system of claim 1, wherein said one or more chambeies comprise vacuum pressure.
7. the differential pressure induction system of claim 1, wherein said at least one resonant beam are configured to by control circuit by external voltage or current impulse excitation.
8. the differential pressure induction system of claim 1, the resonant frequency of wherein said at least one resonant beam vibration changes according to the distortion of described rete.
9. the differential pressure induction system of claim 1, wherein said rete is configured to the distortion in the described rete is passed to described at least one resonant beam, to produce strain in described at least one resonant beam.
10. the differential pressure induction system of claim 1, wherein said at least one resonant beam comprises at least one pressure drag component.
11. the differential pressure induction system of claim 1, wherein said at least one resonant beam comprises at least one pressure-volume element.
12. a differential pressure pick-up comprises:
Fixed support;
Be connected to first rete and second rete of described fixed support, wherein said first rete and described second rete limit at least one chamber jointly therein;
Be arranged in the described chamber and with the resonant member of resonant frequency vibration; With
Be bonded on described first rete and described second rete and be connected to one or more table tops of described resonant member, the distortion that wherein said table top is configured to produce in described first rete passes to described second rete and described at least one resonant member.
13. the differential pressure pick-up of claim 12 comprises at least one table top that connects described first rete and described second rete, described resonant member is passed described at least one table top.
14. the differential pressure pick-up of claim 12, wherein said first rete and described second rete comprise semiconductor material.
15. the differential pressure pick-up of claim 12, wherein said chamber comprises vacuum pressure.
16. the differential pressure pick-up of claim 12, wherein said resonant member are configured to by control circuit by external voltage or current impulse excitation.
17. the differential pressure pick-up of claim 12, the resonant frequency of wherein said resonant member changes according to the distortion that produces in described first rete and described second rete.
18. the differential pressure pick-up of claim 12, the distortion that produces in wherein said first rete and described second rete produces strain in described resonant member.
19. the differential pressure pick-up of claim 12, wherein said one or more table tops are arranged in the described chamber asymmetricly.
20. a method of making differential pressure pick-up comprises:
First rete that comprises first passage is set in fixed support;
Second rete that comprises second channel is set in described fixed support, make described first rete and described second rete form film and described first passage and described second channel and form close passage, described close passage extends to the periphery of described film; With
Be mounted slidably at least one resonant beam in etched one or more chambeies in described close passage and in the periphery of described film, wherein one or more columns support described at least one resonant beam in described one or more chambeies of the outer part office of described film.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/241,049 | 2005-09-30 | ||
US11/241,049 US7490519B2 (en) | 2005-09-30 | 2005-09-30 | System and method for sensing differential pressure |
Publications (1)
Publication Number | Publication Date |
---|---|
CN101273254A true CN101273254A (en) | 2008-09-24 |
Family
ID=37441801
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNA2006800350441A Pending CN101273254A (en) | 2005-09-30 | 2006-09-12 | System and method for sensing differential pressure |
Country Status (6)
Country | Link |
---|---|
US (1) | US7490519B2 (en) |
EP (1) | EP1934571B1 (en) |
KR (1) | KR101346455B1 (en) |
CN (1) | CN101273254A (en) |
NO (1) | NO20081430L (en) |
WO (1) | WO2007040929A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102374919A (en) * | 2010-08-09 | 2012-03-14 | 精工爱普生株式会社 | Pressure sensor |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3969442B2 (en) * | 2005-09-26 | 2007-09-05 | エプソントヨコム株式会社 | Pressure sensor |
GB2470399B (en) * | 2009-05-21 | 2013-11-27 | Ge Infrastructure Sensing Inc | A sensor arranged to measure more than one characteristic of a fluid |
GB2470398B (en) * | 2009-05-21 | 2014-03-19 | Ge Infrastructure Sensing Inc | A resonant sensor for measuring the pressure of a fluid |
US10148131B2 (en) | 2011-05-27 | 2018-12-04 | uBeam Inc. | Power density control for wireless power transfer |
US9537322B2 (en) | 2011-05-27 | 2017-01-03 | uBeam Inc. | Sub-apertures with interleaved transmit elements for wireless power transfer |
US9831920B2 (en) | 2011-05-27 | 2017-11-28 | uBeam Inc. | Motion prediction for wireless power transfer |
US9722671B2 (en) | 2011-05-27 | 2017-08-01 | uBeam Inc. | Oscillator circuits for wireless power transfer |
US9819399B2 (en) | 2011-05-27 | 2017-11-14 | uBeam Inc. | Beam interaction control for wireless power transfer |
US9094110B2 (en) | 2011-05-27 | 2015-07-28 | uBeam Inc. | Sender transducer for wireless power transfer |
JP5915103B2 (en) * | 2011-11-11 | 2016-05-11 | セイコーエプソン株式会社 | Physical quantity detector |
US8752433B2 (en) * | 2012-06-19 | 2014-06-17 | Rosemount Inc. | Differential pressure transmitter with pressure sensor |
FR2995995B1 (en) * | 2012-09-26 | 2014-09-19 | Sagem Defense Securite | PRESSURE SENSOR BASED ON NANOJAUGES COUPLEES WITH A RESONATOR |
GB2508908B (en) | 2012-12-14 | 2017-02-15 | Gen Electric | Resonator device |
US9707593B2 (en) | 2013-03-15 | 2017-07-18 | uBeam Inc. | Ultrasonic transducer |
US10099253B2 (en) | 2014-12-10 | 2018-10-16 | uBeam Inc. | Transducer with mesa |
US9736579B2 (en) | 2015-05-20 | 2017-08-15 | uBeam Inc. | Multichannel waveform synthesis engine |
KR102163052B1 (en) * | 2015-06-30 | 2020-10-08 | 삼성전기주식회사 | Pressure sensor element and method for manufacturing same |
TWI602084B (en) * | 2017-03-15 | 2017-10-11 | 宏碁股份有限公司 | Pressure identification system and pressure identification method |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1603823A (en) | 1977-05-02 | 1981-12-02 | Kent Ltd G | Differential pressure sensing device |
JPS62127492A (en) * | 1985-11-26 | 1987-06-09 | Shigeo Hoshino | Electroplating method using carbon fiber |
US4930043A (en) * | 1989-02-28 | 1990-05-29 | United Technologies | Closed-loop capacitive accelerometer with spring constraint |
GB2229816B (en) | 1989-03-31 | 1992-11-18 | Stc Plc | Pressure sensor |
US5165289A (en) * | 1990-07-10 | 1992-11-24 | Johnson Service Company | Resonant mechanical sensor |
FR2674627B1 (en) * | 1991-03-27 | 1994-04-29 | Commissariat Energie Atomique | RESONANT PRESSURE SENSOR. |
KR0163443B1 (en) * | 1991-07-04 | 1999-03-30 | 나까오 다께시 | Pressure measuring apparatus |
US5583294A (en) | 1994-08-22 | 1996-12-10 | The Foxboro Company | Differential pressure transmitter having an integral flame arresting body and overrange diaphragm |
US6021675A (en) * | 1995-06-07 | 2000-02-08 | Ssi Technologies, Inc. | Resonating structure and method for forming the resonating structure |
GB9524624D0 (en) * | 1995-12-01 | 1996-01-31 | Weston Aerospace Ltd | Pressure sensor |
US5796007A (en) * | 1996-09-23 | 1998-08-18 | Data Instruments, Inc. | Differential pressure transducer |
US6581469B2 (en) * | 2001-01-12 | 2003-06-24 | Endress + Hauser Gmbh Co. | Differential pressure sensor and method of differential pressure measurement |
US7017420B2 (en) * | 2001-06-08 | 2006-03-28 | Silex Microsystems Ab | Miniaturized pressure sensor |
DE10130375B4 (en) * | 2001-06-23 | 2009-01-29 | Abb Ag | Differential Pressure Sensor |
CN1189727C (en) | 2002-09-28 | 2005-02-16 | 中国科学院电子学研究所 | Beam-film separated arrangement resonant beam pressure sensor |
-
2005
- 2005-09-30 US US11/241,049 patent/US7490519B2/en active Active
-
2006
- 2006-09-12 WO PCT/US2006/035609 patent/WO2007040929A1/en active Application Filing
- 2006-09-12 CN CNA2006800350441A patent/CN101273254A/en active Pending
- 2006-09-12 KR KR1020087007612A patent/KR101346455B1/en not_active IP Right Cessation
- 2006-09-12 EP EP06790213.0A patent/EP1934571B1/en active Active
-
2008
- 2008-03-18 NO NO20081430A patent/NO20081430L/en not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102374919A (en) * | 2010-08-09 | 2012-03-14 | 精工爱普生株式会社 | Pressure sensor |
Also Published As
Publication number | Publication date |
---|---|
US20070074578A1 (en) | 2007-04-05 |
NO20081430L (en) | 2008-04-30 |
KR101346455B1 (en) | 2014-01-02 |
WO2007040929A1 (en) | 2007-04-12 |
EP1934571A1 (en) | 2008-06-25 |
KR20080063293A (en) | 2008-07-03 |
EP1934571B1 (en) | 2018-12-26 |
US7490519B2 (en) | 2009-02-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101273254A (en) | System and method for sensing differential pressure | |
US11035709B2 (en) | CMOS thermal fluid flow sensing device employing a flow sensor and a pressure sensor on a single membrane | |
US11226251B2 (en) | Method of making a dual-cavity pressure sensor die | |
US20200319040A1 (en) | Microelectromechanical scalable bulk-type piezoresistive force/pressure sensor | |
CN101970339B (en) | Device for measuring pressure, variation in acoustic pressure, a magnetic field, acceleration, vibration, or the composition of a gas | |
US11255740B2 (en) | Pressure gauge chip and manufacturing process thereof | |
US6598481B1 (en) | Quartz pressure transducer containing microelectronics | |
CN102239396B (en) | Method and apparatus for pressure measurement using fill tube | |
CN110501098B (en) | High-sensitivity micro-pressure sensor based on double-pressure membrane and weak coupling resonance system | |
CN102239397A (en) | Method and apparatus for pressure measurement using magnetic property | |
CN1176693A (en) | Pressure sensors and pressure transmitters | |
MX2012010549A (en) | Resonant frequency based pressure sensor. | |
JP4864438B2 (en) | System and method for sensing pressure | |
Zeng et al. | MEMS pressure sensors for high-temperature high-pressure downhole applications | |
US8943900B2 (en) | Method and apparatus for differential pressure measurement | |
CN107192481A (en) | A kind of FBAR micropressure sensors based on lateral field excitation shear wave modes | |
JPH02189434A (en) | Bore-hole type axial direction strain gage | |
SU551586A1 (en) | A device for recording pressure pulses | |
UA82072U (en) | Multi-channel device for water level and temperature measurement |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C12 | Rejection of a patent application after its publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20080924 |