CN101257737B - Miniature capacitance type microphone - Google Patents
Miniature capacitance type microphone Download PDFInfo
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- CN101257737B CN101257737B CN2008100146883A CN200810014688A CN101257737B CN 101257737 B CN101257737 B CN 101257737B CN 2008100146883 A CN2008100146883 A CN 2008100146883A CN 200810014688 A CN200810014688 A CN 200810014688A CN 101257737 B CN101257737 B CN 101257737B
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- base plate
- circuit board
- board frame
- wiring board
- circuit
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- 239000000758 substrate Substances 0.000 claims description 41
- 229910052751 metal Inorganic materials 0.000 claims description 34
- 239000002184 metal Substances 0.000 claims description 34
- 238000002955 isolation Methods 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 7
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 239000003990 capacitor Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 2
- 230000005236 sound signal Effects 0.000 abstract 1
- 230000007704 transition Effects 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 238000009413 insulation Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 230000003321 amplification Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Telephone Set Structure (AREA)
Abstract
The invention discloses minitype capacitor microphone which includes a circuit board baseplate provided with electronic components, a microphone protection structure composed of a circuit board frame and a base plate and provided with a capacitance component for acoustic-electric transition therein and an acoustic hole for picking up sound signals thereon. The circuit board frame is fixedly provided with a circuit for electrically communicating the capacitance component and the circuit board baseplate. The design reduces parts, eliminates an elastic device with reliability hidden danger, can reach smaller dimension, has simple assembly technique, is convenient to automation production, has well product reliability.
Description
Technical field
The present invention relates to a kind of mini microphone, relate to a kind of miniature capacitance type microphone specifically.
Background technology
Along with electronic products such as mobile phone, notebook, hearing aids are more and more littler to the dimensional requirement of inner body, take measurements greatly less, quality is better and lower-cost miniature capacitance type microphone is employed.At present, the miniature capacitance type microphone volume that has occurred on the market is generally on tens cubic millimeters size, under this size; If according to traditional miniature capacitance type microphone design, basic structure is that a metal shell and a wiring board form the protection structure, and inside is equipped with the plastic chamber that plays support, insulating effect; Inside cavity is equipped with the metal grating ring and is used for circuit turn-on, and grating ring connects pole plate, and pole plate forms capacitance component through an insulation diaphragm and vibrating diaphragm; Because the size of its inner body is big, quantity is more; Certainly will influence properties of product, say, exist contradictory relation between the size of product and the performance from technical standpoint.So; Have new design to propose to use an elastic sheet metal or spring to replace original grating ring, this can improve properties of product to a certain extent, and the elastic part size of this structure applications is minimum but the problem that exists is; Assembly technology is complicated, part production difficulty is big, cost is high, product reliability is not enough; And the difficulty of automated production strengthens, and this constructed products, the highly constrained further reduction of product total height of elastic part.
So, need design a kind of can reach lower size, assembly technology simple, be convenient to automated production, production cost is low, product reliability is good new construction miniature capacitance type microphone.
Summary of the invention
Technical problem to be solved by this invention provide a kind of can reach lower size, assembly technology simple, be convenient to automated production, production cost is low, product reliability is good miniature capacitance type microphone.
For solving the problems of the technologies described above; Technical scheme of the present invention is: miniature capacitance type microphone; The microphone protection structure that comprises wiring board substrate, circuit board frame and base plate composition that electronic devices and components are installed; Said protection inside configuration is equipped with the capacitance component that carries out the acoustic-electric conversion, and said protection structure is provided with the sound hole that is used to pick up voice signal, is installed with the circuit of said capacitance component of electric connection and said wiring board substrate on the said circuit board frame.
As a kind of improvement, the faying face between said wiring board substrate and the said circuit board frame is provided with the Anisotropically conductive layer.
As further improvement, the inboard, junction of the lower end of said circuit board frame and/or said base plate is provided with the step that fixedly holds said capacitance component.
As further improvement, said base plate is metal base plate or wiring board base plate.
As further improvement; Said capacitance component comprises back pole plate, vibrating diaphragm and is arranged at the isolation diaphragm between the two; Said back pole plate is electrically communicated to said wiring board substrate through the circuit that is arranged on said circuit board frame side surface or body interior, and said vibrating diaphragm is electrically communicated to said wiring board substrate through said base plate and another circuit that is arranged on said circuit board frame side surface or body interior.
As further improvement, said capacitance component comprises back pole plate, diaphragm and is arranged at the isolation diaphragm between the two; Said back pole plate is electrically communicated to said wiring board substrate through the circuit that is arranged on said circuit board frame side surface or body interior; Said base plate is provided with the step that holds fixing said diaphragm, and the edge one of said diaphragm is fixed on the step of plate-like base plate, and is electrically communicated to said wiring board substrate through another circuit that is arranged on said base plate and circuit board frame side surface or body interior.
As further improvement; Said base plate is a metal base plate and as an electrode of capacitance component; Said base plate step set inside has isolation diaphragm and a vibrating diaphragm; Said capacitance component comprises said base plate, vibrating diaphragm and is arranged at the isolation diaphragm between the two; Said base plate is electrically communicated to said wiring board substrate through the circuit that is arranged on said circuit board frame side surface or body interior, and said vibrating diaphragm is electrically communicated to said wiring board substrate through another circuit that is arranged on said circuit board frame side surface or body interior.
Improvement of the present invention is; The circuit of said capacitance component of the electric connection on the said circuit board frame and said wiring board substrate perhaps runs through the metal aperture of said circuit board frame body interior for covering the metal level of said circuit board frame outer surface and inner surface.
Improvement of the present invention is that the inner surface of said circuit board frame or outer surface are provided with the shielded metal layer.
Improvement of the present invention is, is provided with the ACF rete between said base plate and the said circuit board frame.
In the present invention, the board substrate of being selected for use is generally resin material.
In the present invention; Circuit turn-on between the wiring board inside is the industry known technology; Generally through the surface at wiring board metal level being set planar circuit and arranges; Through the circuit turn-on that plated-through hole reaches the wiring board both sides being set at the circuit intralamellar part, do not influence creativeness of the present invention at this, be not described in detail.
In the present invention, the wiring board substrate outside generally is provided with and is used for the Reflow Soldering automatic chip mounting and is installed to the pad on the electronic product main circuit board or is used for the solder joint etc. that bonding wire connects usefulness, is the industry known technology, is not described in detail at this.
In the present invention, the outer shape of circuit board frame and inner space can be shapes such as square, circular, ellipse, and the shape of corresponding wiring board substrate and base plate and internal capacitance assembly can be done suitable adjustment.
Owing to adopted technique scheme; Miniature capacitance type microphone; The microphone protection structure that comprises wiring board substrate, circuit board frame and base plate composition that electronic devices and components are installed; Said protection inside configuration is equipped with the capacitance component that carries out the acoustic-electric conversion, and said protection structure is provided with the sound hole that is used to pick up voice signal, is installed with the circuit of said capacitance component of electric connection and said wiring board substrate on the said circuit board frame; This design has reduced part, has removed the elastic device with reliability hidden danger, can reach lower size, assembly technology simple, be convenient to automated production, production cost is low, product reliability good.
Description of drawings
Fig. 1 is the structural representation of the embodiment of the invention one;
Fig. 2 is the tangent plane sketch map of the embodiment of the invention one;
Fig. 3 is the structural representation of the embodiment of the invention two;
Fig. 4 is the tangent plane sketch map of the embodiment of the invention two;
Fig. 5 is the structural representation of the embodiment of the invention three;
Fig. 6 is the tangent plane sketch map of the embodiment of the invention three;
Fig. 7 is the structural representation of the embodiment of the invention four.
Embodiment
Embodiment one: like Fig. 1, shown in Figure 2; The external shape of the miniature capacitance type microphone that present embodiment provides and inner space all are square; Comprise a square wiring board substrate 1, a square frame shape circuit board frame 2 and the sandwich protection structure that square metal base plate 3 combines and forms, the protection inside configuration is equipped with capacitance component.Wiring board substrate 1 installed inside is useful on the electronic devices and components 11 of amplification signal, and set inside has Copper Foil and circuit, for known technology in the industry, no longer illustrates at this; The inside and outside both sides of circuit board frame 2 are provided with the two metal layers (Copper Foil 21 and 22) of mutually insulated, and the inboard at 23 places, lower end of circuit board frame 2 is provided with a step that can be used for locating; The edge of square metal base plate 3 is provided with step 31, and its inside is provided with the sound hole 32 that is used to pick up voice signal; Capacitance component comprises a pole plate 4, an insulation diaphragm 5 and a vibrating diaphragm 6; Wherein pole plate 4 forms a plane-parallel capacitor with vibrating diaphragm 6 through insulation diaphragm 5 at interval, and capacitance component is fixed on the lower end 23 formed steps of circuit board frame 2; The edge of vibrating diaphragm 6 directly is fixed on the step 31 of metal base plate 3; In this case study on implementation, the base material preferred resin material of wiring board substrate and circuit board frame, the preferred aluminum metal of metal base plate.
When miniature capacitance type microphone is worked; Voice signal is 32 entering from the sound hole; Affact on the vibrating diaphragm 6 and cause vibrating diaphragm 6 vibration; Thereby and produce the signal of telecommunication between the pole plate 4, pole plate 4 is electrically communicated on the wiring board substrate 1 through the Copper Foil on the circuit board frame 2 21, vibrating diaphragm 6 is electrically communicated on the wiring board substrate 1 through metal base plate 3 and Copper Foil 22 on the circuit board frame 2 and keeps ground connection.
In this case study on implementation; The shape of each part is all comparatively regular, number of parts is few; And the part generation relatively moves in this structure space and possibility are all very little, and this just can guarantee reliability of products, and assembly technology is simple; Be easy to use automated production, enhance productivity; Through simplifying the internal structure of product, can be so that the height of product and the area of plane can reduce significantly, and do not sacrifice performance of products, can guarantee the needed product of better products performance inner space; The outside ground connection Copper Foil of circuit board frame can guarantee anti-preferably electromagnetic interference effect.
Embodiment two: like Fig. 3, shown in Figure 4; The external shape of the miniature capacitance type microphone that present embodiment provides is that square, inboard is shaped as circle; Comprise that (abbreviation of Anisotropic ConductiveFilm, Chinese implication are anisotropic conductive film, also are called anisotropic conductive for the shaped as frame circuit board frame 2 of a square wiring board substrate 1, a square-outside and round-inside, square metal base plate 3 and one deck ACF; Its main feature is through after the hot pressing; Can conduct electricity in a longitudinal direction, and can not conduct electricity in a lateral direction) film 7 combines and forms the protection structure, and the protection inside configuration is equipped with capacitance component.Wiring board substrate 1 installed inside is useful on the electronic devices and components 11 of amplification signal, and set inside has Copper Foil and circuit, for known technology in the industry, no longer illustrates at this; The set inside of circuit board frame 2 has and runs through up and down and two parts metal aperture 21 and 22 of mutually insulated; Metal aperture 21 is arranged on circuit board frame 2 internal diameters circle line with interior position, thereby makes things convenient for it to be communicated with capacitance component; Metal aperture 22 is arranged on four bights of circuit board frame 2, because the shape of circuit board frame 2 square-outside and round-insides makes that its space, four bights is comparatively abundant; There is a step that can be used for locating capacitance component at 23 places, lower end of circuit board frame 2; Square metal base plate 3 inside are provided with the sound hole 32 that is used to pick up voice signal; In this case study on implementation; Square metal base plate 3 also plays the effect of an electrode of capacitance component; Square metal base plate 3 and an insulation diaphragm 5 and the vibrating diaphragm 6 common plane-parallel capacitors that form; And vibrating diaphragm 6 also is fixed on the becket 61, becket 61 be fixed on the lower end 23 formed steps of circuit board frame 2 and with metal aperture 21 electric connections; Metal base plate 3 is electrically communicated on the wiring board substrate 1 through circuit board frame 2 inner metal aperture 22.
The miniature capacitance type microphone of this structure, its structure is further simplified, and has adopted one deck ACF film between wiring board and the wiring board; This film can play the effect of bonding and electric connection simultaneously; And more crucial be that this ACF film can reach the effect of vertical conduction, level insulation in narrow and small plane, comparatively be fit to electrical connection complicated between the two-layer wiring board; And the shown miniature capacitance type microphone of this case study on implementation; Its input signal circuit and earthed circuit all are arranged on the inside of circuit board frame, adopt the ACF film can better realize this reliability of products, and can enhance productivity; Certainly, adopt the other materials of similar ACF film function also can reach approximate effect equally.
Embodiment three: like Fig. 5, shown in 6; The main difference of miniature capacitance type microphone that present embodiment provides and case study on implementation two has 2 points; The one, capacitance component is pole plate 4, is fixed on the vibrating diaphragm 6 on the becket 61 and is arranged on insulation diaphragm 5 compositions between the two, is fixed on the lower end 23 formed steps of circuit board frame 2; The 2nd, the arranged outside of circuit board frame 2 be used to resist the Copper Foil 24 of electromagnetic interference.This capacitance component is designed to traditional Element Design, relatively easy production, and Copper Foil 24 can be so that the ability reinforcement of miniature capacitance type microphone opposing electromagnetic interference.
Embodiment four: as shown in Figure 7; The main difference of miniature capacitance type microphone that present embodiment provides and case study on implementation three is that base plate 3 is to adopt wiring board to make; And the edge of base plate 3 is provided with sidewall 31 upwards, and the inwall of circuit board frame 2 is up and down concordant, and the thickness of the sidewall 31 of base plate 3 is less than the sidewall thickness of circuit board frame 2; Thereby the lower end at circuit board frame 2 forms step, and capacitance component is arranged in the step.The miniature capacitance type microphone of this design; Pole plate 4 is electrically communicated on the wiring board substrate 1 through metal aperture 21 and ACF film 7; Vibrating diaphragm 6 is electrically communicated on the wiring board substrate 1 to metal aperture 22 and through ACF film 7 through base plate 3 inner circuit communications; Base plate 3 inner circuit design are known technology, no longer detail.This design and in the lower end of circuit board frame 2 step to be set be Approximate Design, the effect that is reached also is the same, all is in order to be convenient to the fixing of capacitance component.
Claims (7)
1. miniature capacitance type microphone; The microphone protection structure that comprises wiring board substrate, circuit board frame and base plate composition that electronic devices and components are installed; Said protection inside configuration is equipped with the capacitance component that carries out the acoustic-electric conversion; Said protection structure is provided with the sound hole that is used to pick up voice signal, it is characterized in that:
The inboard, junction of the lower end of said circuit board frame and/or said base plate is provided with the step that fixedly holds said capacitance component, and said base plate is metal base plate or wiring board base plate;
Be installed with the circuit of said capacitance component of electric connection and said wiring board substrate on the said circuit board frame;
Said capacitance component comprises back pole plate, vibrating diaphragm and is arranged at the isolation diaphragm between the two; Said back pole plate is electrically communicated to said wiring board substrate through the circuit that is arranged on said circuit board frame side surface or body interior, and said vibrating diaphragm is electrically communicated to said wiring board substrate through said base plate and another circuit that is arranged on said circuit board frame side surface or body interior.
2. miniature capacitance type microphone as claimed in claim 1 is characterized in that: the faying face between said wiring board substrate and the said circuit board frame is provided with the Anisotropically conductive layer.
3. according to claim 1 or claim 2 miniature capacitance type microphone, it is characterized in that: the inner surface of said circuit board frame or outer surface are provided with the shielded metal layer.
4. according to claim 1 or claim 2 miniature capacitance type microphone is characterized in that: be provided with the Anisotropically conductive rete between said base plate and the said circuit board frame.
5. miniature capacitance type microphone; The microphone protection structure that comprises wiring board substrate, circuit board frame and base plate composition that electronic devices and components are installed; Said protection inside configuration is equipped with the capacitance component that carries out the acoustic-electric conversion; Said protection structure is provided with the sound hole that is used to pick up voice signal, it is characterized in that:
The inboard, junction of the lower end of said circuit board frame and/or said base plate is provided with the step that fixedly holds said capacitance component, and said base plate is metal base plate or wiring board base plate;
Be installed with the circuit of said capacitance component of electric connection and said wiring board substrate on the said circuit board frame;
Said capacitance component comprises back pole plate, diaphragm and is arranged at the isolation diaphragm between the two; Said back pole plate is electrically communicated to said wiring board substrate through the circuit that is arranged on said circuit board frame side surface or body interior; Said base plate is provided with the step that holds fixing said diaphragm, and the edge one of said diaphragm is fixed on the step of plate-like base plate, and is electrically communicated to said wiring board substrate through another circuit that is arranged on said base plate and circuit board frame side surface or body interior.
6. miniature capacitance type microphone; The microphone protection structure that comprises wiring board substrate, circuit board frame and base plate composition that electronic devices and components are installed; Said protection inside configuration is equipped with the capacitance component that carries out the acoustic-electric conversion; Said protection structure is provided with the sound hole that is used to pick up voice signal, it is characterized in that:
The inboard, junction of the lower end of said circuit board frame and/or said base plate is provided with the step that fixedly holds said capacitance component;
Be installed with the circuit of said capacitance component of electric connection and said wiring board substrate on the said circuit board frame;
Said base plate is a metal base plate and as an electrode of capacitance component; Said base plate step set inside has isolation diaphragm and a vibrating diaphragm; Said capacitance component comprises said base plate, vibrating diaphragm and is arranged at the isolation diaphragm between the two; Said base plate is electrically communicated to said wiring board substrate through the circuit that is arranged on said circuit board frame side surface or body interior, and said vibrating diaphragm is electrically communicated to said wiring board substrate through another circuit that is arranged on said circuit board frame side surface or body interior.
7. miniature capacitance type microphone; The microphone protection structure that comprises wiring board substrate, circuit board frame and base plate composition that electronic devices and components are installed; Said protection inside configuration is equipped with the capacitance component that carries out the acoustic-electric conversion; Said protection structure is provided with the sound hole that is used to pick up voice signal, it is characterized in that:
The inboard, junction of the lower end of said circuit board frame and/or said base plate is provided with the step that fixedly holds said capacitance component, and said base plate is metal base plate or wiring board base plate;
Be installed with the circuit of said capacitance component of electric connection and said wiring board substrate on the said circuit board frame;
The circuit of said capacitance component of the electric connection on the said circuit board frame and said wiring board substrate perhaps runs through the metal aperture of said circuit board frame body interior for covering the metal level of said circuit board frame outer surface and inner surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100146883A CN101257737B (en) | 2008-03-01 | 2008-03-01 | Miniature capacitance type microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100146883A CN101257737B (en) | 2008-03-01 | 2008-03-01 | Miniature capacitance type microphone |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101257737A CN101257737A (en) | 2008-09-03 |
| CN101257737B true CN101257737B (en) | 2012-07-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008100146883A Active CN101257737B (en) | 2008-03-01 | 2008-03-01 | Miniature capacitance type microphone |
Country Status (1)
| Country | Link |
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| CN (1) | CN101257737B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102158786A (en) * | 2011-05-21 | 2011-08-17 | 创达电子(潍坊)有限公司 | Electret condenser microphone |
| CN110856063A (en) * | 2019-10-29 | 2020-02-28 | 歌尔科技有限公司 | Microphone electrostatic protection structure and electronic equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1653850A (en) * | 2002-04-05 | 2005-08-10 | 松下电器产业株式会社 | Capacitor sensor |
| CN1741684A (en) * | 2005-09-16 | 2006-03-01 | 潍坊共达电讯有限公司 | Electret capacitor microphone |
| EP1718108A1 (en) * | 2005-04-25 | 2006-11-02 | BSE Co., Ltd. | Dual base of an electret condenser microphone and electret condenser microphone using the same |
| EP1725071A2 (en) * | 2005-05-19 | 2006-11-22 | Seung Taek Lee | Condenser microphone with air ventilation system |
| CN2854992Y (en) * | 2005-12-14 | 2007-01-03 | 潍坊歌尔电子有限公司 | Mini-electret capacitor microphone |
-
2008
- 2008-03-01 CN CN2008100146883A patent/CN101257737B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1653850A (en) * | 2002-04-05 | 2005-08-10 | 松下电器产业株式会社 | Capacitor sensor |
| EP1718108A1 (en) * | 2005-04-25 | 2006-11-02 | BSE Co., Ltd. | Dual base of an electret condenser microphone and electret condenser microphone using the same |
| EP1725071A2 (en) * | 2005-05-19 | 2006-11-22 | Seung Taek Lee | Condenser microphone with air ventilation system |
| CN1741684A (en) * | 2005-09-16 | 2006-03-01 | 潍坊共达电讯有限公司 | Electret capacitor microphone |
| CN2854992Y (en) * | 2005-12-14 | 2007-01-03 | 潍坊歌尔电子有限公司 | Mini-electret capacitor microphone |
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| CN101257737A (en) | 2008-09-03 |
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Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
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Effective date of registration: 20200612 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |