CN101256354B - Moulding-die and method for manufacturing the same - Google Patents
Moulding-die and method for manufacturing the same Download PDFInfo
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- CN101256354B CN101256354B CN2008100916991A CN200810091699A CN101256354B CN 101256354 B CN101256354 B CN 101256354B CN 2008100916991 A CN2008100916991 A CN 2008100916991A CN 200810091699 A CN200810091699 A CN 200810091699A CN 101256354 B CN101256354 B CN 101256354B
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Abstract
The invention discloses a die mold and the manufacturing method thereof, the die mold comprises a metal substrate and an amorphous metal layer covering the metal substrate, the amorphous metal layer is provided with multiple micro-structures. The thickness of the metal substrate ranges from 0.1mm to 2mm, and the thickness of the amorphous metal layer ranges from 0.01mm to 1mm.Accoring to the invention, the manufacturing procedures are simplified, and then the manufacturing cost of the mold is reduced.
Description
Technical field
The present invention is relevant for a kind of mould, particularly about a kind of pressing mold (stamper).
Background technology
In recent years, because the photoelectricity correlation technique is constantly weeded out the old and bring forth the new, add the arrival of digital times, so LCD develops vigorously on the consumption market constantly.LCD (LiquidCrystal Displayer; LCD) have that high image quality, volume are little, in light weight, low voltage drive, low consumpting power and advantages of wide application range; Therefore be widely used in consumer electronics or computer products such as Portable TV, mobile phone, notebook computer and console display, and replace cathode-ray tube (CRT) (Cathode Ray Tube gradually; CRT), become the main flow of display.
Module backlight is one of key part and component of LCD, because liquid crystal itself can't be luminous, therefore general LCD need be installed module backlight mostly, can show the image that naked eyes perceive.In addition, in order to make the briliancy of image more even, the fabricator usually can be installed optical element additional in above-mentioned module backlight, and for example LGP, diffusion barrier or brightness enhancement film etc. are with briliancy and the distribution of suitably adjusting emergent ray.
In general, commercial optical element is to utilize the pressing mold massive duplication to form mostly.Known pressing mold is made by the single metal plate material mostly, but because this sheet metal has the thick problem of structure crystal grain, therefore is difficult to be processed to form careful microstructure in the above.So; For the employed pressing mold of optical element; The fabricator need be applied to the worker's method of casting toward contact can satisfy optical element requirement dimensionally, for example utilizes this grand master pattern to cast again and obtains pressing mold to produce grand master pattern prior to making microstructure on the substrate with lithographic process.Yet this practice not only manufacturing course is very complicated, and the employed grand master pattern of casting also can't continue should be used for making optical element, also causes a kind of waste virtually.
Along with the size of optical element is more and more meticulousr, the manufacturing cost of pressing mold is also slowly surging to the degree that can't ignore.Therefore, how to reduce the manufacturing course and the cost of pressing mold, become the required problem of strictly facing of related industry gradually.
Summary of the invention
The object of the present invention is to provide a kind of manufacturing approach of pressing mold, it can simplify the manufacturing course of pressing mold, and and then reduces the manufacturing cost of pressing mold.
Another object of the present invention is to provide a kind of pressing mold, the manufacturing course that this pressing mold can be simplified produces careful microstructure, and then reduces the manufacturing cost of pressing mold.
The objective of the invention is such realization, a kind of manufacturing approach of pressing mold comprises the following step:
(1) form metal substrate, the thickness of this metal substrate is between about 0.1mm～2mm;
(2) on metal substrate, form the amorphous metal layer, the thickness of this amorphous metal layer is between about 0.01mm～1mm.
(3) on the amorphous metal layer, form a plurality of microstructures.
A kind of pressing mold of the present invention comprises a metal substrate and an amorphous metal layer that covers metal substrate, has microstructure on the amorphous metal layer.Wherein, the thickness of metal substrate is between about 0.1mm～2mm, and the thickness of amorphous metal layer is between about 0.01mm～1mm.
From the above mentioned, the present invention can produce the pressing mold with careful microstructure by the manufacturing course of simplifying, and then reduces the manufacturing cost of pressing mold.
Description of drawings
Fig. 1-5 is the manufacturing process sectional view according to the pressing mold of one embodiment of the invention.
Drawing reference numeral:
110: metal substrate
120: the amorphous metal layer
130: microstructure
140: metal pattern
TM: thickness
TA: thickness
Embodiment
The following embodiment of the present invention will propose a kind of manufacturing approach of pressing mold, and the manufacturing course that it can be simplified produces the pressing mold with careful microstructure.
Fig. 1-5 is the manufacturing process sectional view according to the pressing mold of one embodiment of the invention.Shown in Fig. 1-5, a kind of manufacturing approach of pressing mold comprises the following step:
(1) form metal substrate 110, the thickness T M of this metal substrate 110 is preferably about 0.2mm～1mm between about 0.1mm～2mm.(as shown in Figure 1)
(2) on metal substrate 110, form amorphous metal layer 120, the thickness T A of this amorphous metal layer 120 is preferably about 0.05mm～0.3mm between about 0.01mm～1mm.(as shown in Figure 2)
(3) on amorphous metal layer 120, form a plurality of microstructures 130.(as shown in Figure 3)
In above-mentioned steps (1), the material of metal substrate 110 (for example: the stainless steel that meets SUS304 of JIS or SUS430) can be nickel or stainless steel.Should be appreciated that, more than the material of being lifted be merely illustration, other proper metal material also can be used for implementing metal substrate 110.
When the material of metal substrate 110 was stainless steel, the fabricator can prior to formation one pre-nickel plating on the metal substrate 110, and then comply with following mode implementation step (2) in implementation step (2) before.
(2.1) plating bath is provided, this plating bath comprises the nickel of the about 5～6g/l of concentration and the sodium dihydric hypophosphite of the about 25～35g/l of concentration, and the potential of hydrogen of plating bath (pH) is between about 4～5, and the temperature of plating bath is between about 84 ℃～88 ℃.
(2.2) metal substrate 110 is soaked in the plating bath, with the one amorphous ni-p alloy coating of electroless plating on pre-nickel plating (amorphous metal layer 120).
That is to say that above-mentioned amorphous ni-p alloy coating (amorphous metal layer 120) can comprise the phosphorus of about 10wt%～12wt%, to guarantee the amorphous kenel of amorphous ni-p alloy coating (amorphous metal layer 120).Should be appreciated that, more than the parameter of being lifted all be merely illustration, be not in order to restriction the present invention, be familiar with this art and should look needs at that time, the embodiment of elasticity set-up procedure (2).For instance, when the material of metal substrate 110 was nickel, the fabricator can omit the formation step of pre-nickel plating, and direct electroless plating amorphous ni-p alloy coating (concrete process parameter like step (2.1) with shown in the step (2.2)) on metal substrate 110.
In addition, though in the above-described embodiments, the material of amorphous metal layer 120 is the amorphous nickel-phosphorus alloy, and so this does not limit the present invention, and the material of amorphous metal layer 120 also can be other proper metal, for example amorphous copper.
In addition, in order to ensure the quality of amorphous metal layer 120, the fabricator can clean processing procedure to metal substrate 110 earlier in step (2) before, to remove the grease and the oxide on metal substrate 110 surfaces.Wherein, the concrete grammar of the grease on removal metal substrate 110 surfaces can be: in regular turn metal substrate 110 is carried out ultrasonic heat degreasing processing procedure and electrolytic degreasing processing procedure.The concrete grammar of removing the oxide on metal substrate 110 surfaces then can be: metal substrate 110 is carried out the hydrochloric acid activation processing procedure.
Because produced like this amorphous metal layer 120 has lower hardness; And do not have a thick problem of crystal grain; Therefore step (3) can be directly on amorphous metal layer 120; Mode with machining (for example: cut, impression processing, sandblast processing or Laser Processing) or chemical etching (comprising electrochemical etching) forms careful microstructure 130.In addition, the fabricator also can depending on the circumstances or the needs of the situation carry out the processing of multiple microstructure, and need not let all microstructures all adopt with a kind of design or processing mode on the amorphous metal layer.In addition, if the fabricator adopts the mode of machining to form microstructure 130, then the tool of fixing metal substrate 110 may be selected to be magnet base or vacuum cup.
In addition,, the gross thickness of the made structure of step (3) uses because less than 3mm, therefore can directly bringing when pressing mold, and the processing of need not casting in addition.Certainly, if situation needs, the made structure of step (3) other the metal pattern of processing that also can be used to cast.In this case, the fabricator can be in step (3) afterwards, earlier with the passivation processing procedure oxide layers of growing up in amorphous metal layer 120 surface, again with electroforming or there is not the mode of electroforming, on amorphous metal layer 120, forms metal pattern 140 (as shown in Figure 4).Afterwards, the fabricator can copy to (as shown in Figure 5) on the metal pattern 140 with microstructure 130 as long as this metal pattern 140 is separated with amorphous metal layer 120.
The present invention also provides by the made pressing mold of above-mentioned manufacturing approach, and its structure is as shown in Figure 3.Particularly, the pressing mold of Fig. 3 can comprise a metal substrate 110 and an amorphous metal layer 120, has a plurality of microstructures 130 on the amorphous metal layer 120.Wherein, the thickness of metal substrate 110 is preferably about 0.2mm～1mm between about 0.1mm～2mm.Amorphous metal layer 120 covers metal substrate 110, and the thickness of this amorphous metal layer 120 is preferably about 0.05mm～0.3mm between about 0.01mm～1mm.
Though the present invention discloses with specific embodiment; But it is not in order to limit the present invention; Any those skilled in the art; The displacement of the equivalent assemblies of under the prerequisite that does not break away from design of the present invention and scope, having done, or, all should still belong to the category that this patent is contained according to equivalent variations and modification that scope of patent protection of the present invention is done.
Claims (20)
1. the manufacturing approach of a pressing mold, this method comprises:
Form a metal substrate, wherein the thickness of this metal substrate is between 0.1mm～2mm;
On this metal substrate, form an amorphous metal layer, this amorphous metal layer is an amorphous ni-p alloy coating or an amorphous copper layer; Wherein the thickness of this amorphous metal layer is between 0.01mm～1mm;
On this amorphous metal layer, form a plurality of microstructures.
2. the manufacturing approach of pressing mold as claimed in claim 1 is characterized in that this method also comprises:
Before forming this amorphous metal layer, remove the grease or the oxide of this metallic substrate surfaces.
3. the manufacturing approach of pressing mold as claimed in claim 1, it is characterized in that: the material of this metal substrate is a stainless steel.
4. the manufacturing approach of pressing mold as claimed in claim 3 is characterized in that this method also comprises:
Before forming this amorphous metal layer, on this metal substrate, form a pre-nickel plating.
5. the manufacturing approach of pressing mold as claimed in claim 4 is characterized in that the step that forms this amorphous metal layer comprises:
Electroless plating one an amorphous ni-p alloy coating or an amorphous copper layer on this pre-nickel plating.
6. the manufacturing approach of pressing mold as claimed in claim 5, it is characterized in that: this amorphous ni-p alloy coating comprises the phosphorus of 10wt%～12wt%.
7. the manufacturing approach of pressing mold as claimed in claim 5 is characterized in that the step of this amorphous ni-p alloy coating of electroless plating comprises:
One plating bath is provided, and wherein this plating bath comprises the nickel of concentration 5～6g/l and the sodium dihydric hypophosphite of concentration 25～35g/l, and the acidity-basicity ph of this plating bath is between 4～5, and the temperature of this plating bath is then between 84 ℃～88 ℃;
This metal substrate is soaked in this plating bath.
8. the manufacturing approach of pressing mold as claimed in claim 1, it is characterized in that: the material of this metal substrate is a nickel.
9. the manufacturing approach of pressing mold as claimed in claim 8 is characterized in that the step that forms this amorphous metal layer comprises:
Electroless plating one an amorphous ni-p alloy coating or an amorphous copper layer on this metal substrate.
10. the manufacturing approach of pressing mold as claimed in claim 9, it is characterized in that: this amorphous ni-p alloy coating comprises the phosphorus of 10wt%～12wt%.
11. the manufacturing approach of pressing mold as claimed in claim 9 is characterized in that the step of this amorphous ni-p alloy coating of electroless plating comprises:
One plating bath is provided, and wherein this plating bath comprises the nickel of concentration 5～6g/l and the sodium dihydric hypophosphite of concentration 25～35g/l, and the acidity-basicity ph of this plating bath is between 4～5, and the temperature of this plating bath is then between 84 ℃～88 ℃;
This metal substrate is soaked in this plating bath.
12. the manufacturing approach of pressing mold as claimed in claim 1 is characterized in that this method also comprises:
After forming said microstructure, on this amorphous metal layer, form a metal pattern;
Separate this metal pattern and this amorphous metal layer.
13. the manufacturing approach of pressing mold as claimed in claim 12 is characterized in that this method also comprises: before on this amorphous metal layer, forming this metal pattern, on this amorphous metal layer, form an oxide layer.
14. the manufacturing approach of pressing mold as claimed in claim 1 is characterized in that: the thickness of this amorphous metal layer is between 0.05mm～0.3mm.
15. the manufacturing approach of pressing mold as claimed in claim 1 is characterized in that: the thickness of this metal substrate is between 0.2mm～1mm.
16. a pressing mold is characterized in that this pressing mold comprises:
One metal substrate, the thickness of this metal substrate is between 0.1mm～2mm;
One amorphous metal layer covers this metal substrate, and the material of this amorphous metal layer is a nickel-phosphorus alloy or copper; Wherein the thickness of this amorphous metal layer is between 0.01mm～1mm, and has a plurality of microstructures on this amorphous metal layer.
17. pressing mold as claimed in claim 16 is characterized in that: the material of this metal substrate is stainless steel or nickel.
18. pressing mold as claimed in claim 16 is characterized in that: this nickel-phosphorus alloy comprises the phosphorus of 10wt%～12wt%.
19. pressing mold as claimed in claim 16 is characterized in that: the thickness of this amorphous metal layer is between 0.05mm～0.3mm.
20. pressing mold as claimed in claim 16 is characterized in that: the thickness of this metal substrate is between 0.2mm～1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100916991A CN101256354B (en) | 2008-04-14 | 2008-04-14 | Moulding-die and method for manufacturing the same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100916991A CN101256354B (en) | 2008-04-14 | 2008-04-14 | Moulding-die and method for manufacturing the same |
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| CN101256354A CN101256354A (en) | 2008-09-03 |
| CN101256354B true CN101256354B (en) | 2012-05-23 |
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| CN2008100916991A Expired - Fee Related CN101256354B (en) | 2008-04-14 | 2008-04-14 | Moulding-die and method for manufacturing the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102152540A (en) * | 2010-11-16 | 2011-08-17 | 胡军辉 | Composite material of amorphous metal and plastics, composite shell and preparation method of composite material |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1469364A (en) * | 2002-07-04 | 2004-01-21 | �ձ������ȷ湫˾ | Transparent press mould of moulded optical multilayer recording medium |
| CN1661477A (en) * | 2004-02-27 | 2005-08-31 | 鸿富锦精密工业（深圳）有限公司 | Method for fabricating pressing mold |
| CN1786746A (en) * | 2004-12-07 | 2006-06-14 | 泰山Lcd株式会社 | Producing method of stamper for light guide plate |
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- 2008-04-14 CN CN2008100916991A patent/CN101256354B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1469364A (en) * | 2002-07-04 | 2004-01-21 | �ձ������ȷ湫˾ | Transparent press mould of moulded optical multilayer recording medium |
| CN1661477A (en) * | 2004-02-27 | 2005-08-31 | 鸿富锦精密工业（深圳）有限公司 | Method for fabricating pressing mold |
| CN1786746A (en) * | 2004-12-07 | 2006-06-14 | 泰山Lcd株式会社 | Producing method of stamper for light guide plate |
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| CN101256354A (en) | 2008-09-03 |
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Granted publication date: 20120523 Termination date: 20210414 |