CN101246131B - Automatic shape inspection apparatus - Google Patents
Automatic shape inspection apparatus Download PDFInfo
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- CN101246131B CN101246131B CN2008100097463A CN200810009746A CN101246131B CN 101246131 B CN101246131 B CN 101246131B CN 2008100097463 A CN2008100097463 A CN 2008100097463A CN 200810009746 A CN200810009746 A CN 200810009746A CN 101246131 B CN101246131 B CN 101246131B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/958—Inspecting transparent materials or objects, e.g. windscreens
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
- G02B7/09—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8809—Adjustment for highlighting flaws
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- General Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Optics & Photonics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The invention provides an automatic appearance inspection device without losing the freedom of the photographic scaling factor and free of the restrain of the converter action caused by the existence of the sensor cable. The automatic appearance inspection device for automatic focusing before inspecting the appearance of the object work pieces (K) includes: a converter (53) keeping a plurality of object lens (11) and selecting one object lens used for inspection; a photographic unit (51) for photographing the image obtained by the selected object lens; a displacement sensor advance and retreat unit (13) leading the displacement sensor (12) to advance and retreat between the selected object lens and the object work pieces; a storing unit (81) for storing the object lens on the reference position (PB) of the object work pieces in advance beat for the focusing displacement as the reference position (LB); and an up and down driving unit (6) making the object lens best for focusing displacement along the up and down direction to drive the converter according to the displacement (LS) of the object work pieces measured by the displacement sensor and the reference displacement stored in the storing unit.
Description
Technical field
The present invention relates to automatic shape inspection apparatus.Relate in particular to be constituted as and be used to check the automatic shape inspection apparatus of focusing automatically before the shooting of object workpiece outward appearance.
Background technology
In the manufacturing process of semiconductor or FPD (Flat Panel Display, flat-panel monitor), need check automatically whether the figure that forms on silicon wafer or the glass plate has scar, spot, peel off, defective such as stain.This automatic shape inspection apparatus that is used to check possesses for example image unit such as metaloscope, CCD camera and image operation treating apparatus etc.The intensified image of the figure that is obtained by metaloscope is taken with image unit, is transformed into view data.Whether good the image operation treating apparatus carry out graphical appearance judgement according to this view data.Because the visual examination of figure is carried out with powerful object lens, generally be to carry out therefore automatically to defocused shooting.
As the invention of above-mentioned the sort of automatic shape inspection apparatus, the present inventor proposed for example application of patent documentation 1 in the past.Fig. 8 is the skeleton diagram of structure of the automatic shape inspection apparatus 1A of prior art.As shown in Figure 8, the automatic shape inspection apparatus 1A of prior art possesses the worktable 2 of inspection, shooting optical module 5A, shooting optical module driver element 6, control computer 8 and Flame Image Process computing machine 9 etc.Automatic shape inspection apparatus 1A is topmost to be characterised in that the object lens 11 that possess handover configurations shooting optical module 5A optionally and the displacement transducer 12 converter 53A to the same position.
If adopt automatic shape inspection apparatus 1A, shooting optical module driver element 6 according to displacement transducer 12 measure to the displacement LS of object workpiece K and be stored in basis displacement LB in the storage unit 81, focus automatically by making displacement LT between object lens 11 and the object workpiece K become basis displacement LB ground.Because displacement transducer 12 and object lens 11 can drive optionally handover configurations by the rotation of converter 53A to same position, so the displacement measurement position on the object workpiece K is consistent with focusing position.Therefore, the flatness that need not consider worktable 2 just can realize the automatic focusing that precision is good.
[patent documentation 1] TOHKEMY 2006-308484 communique
But the structure of automatic shape inspection apparatus 1A has but been installed displacement transducer 12 for the place that object lens 11 should be installed.That is, the object lens 11 that should have have reduced one, function nature variation on the freedom this point that has reduced the shooting multiplying power.
And, move with converter 53A owing to will be fetched into outside cable 136 among the automatic shape inspection apparatus 1A, so the rotation of converter 53A producing cable to twist from the signal of displacement transducer 12, the result has shortened the life-span of cable.And converter 53A self also might be to the rotation of certain direction more than 360 °, but are subjected to the restriction of existence of the cable of displacement transducer 12, limited its rotating range.
Summary of the invention
The present invention is exactly in view of the above problems, its objective is that will provide a kind of does not lose the freedom of shooting multiplying power and be not subjected to the automatic shape inspection apparatus of the existence of displacement transducer cable to the restriction of converter action.
In order to achieve the above object, the automatic shape inspection apparatus of the 1st scheme (1), constitute in the mode of focusing automatically before the shooting of using in the visual examination of object workpiece (K), it is characterized in that possessing: the converter (53) that keeps a plurality of object lens (11) and select certain object lens (11) to be used to check; Take the image unit (51) of the picture that obtains by selected object lens (11); The displacement transducer advance and retreat unit (13) that displacement transducer (12) is advanced and retreat between selected object lens (11) and object workpiece (K); The optimum focusing displacement of the object lens (11) located of the reference position (PB) on the storage object workpiece (K) is as the storage unit (81) of basis displacement (LB) in advance; And, the displacement (LS) that measures according to displacement transducer (12) and be stored in basis displacement (LB) the storage unit (81) from this displacement transducer (12) to object workpiece (K), drive converter (53) along the vertical direction, so that object lens (11) are the above-below direction driver element (6) of optimum focusing displacement.
If the automatic shape inspection apparatus of employing scheme 1, displacement transducer advance and retreat unit (13) are taked structure that displacement transducer (12) is advanced and retreat between selected object lens of converter (53) (11) and object workpiece (K).Above-below direction driver element (6) is according to the displacement to object workpiece (K) (LS) that displacement transducer (12) is got the hang of down measure and be stored in basis displacement (LB) in the storage unit (81) and make displacement (LT) between object lens (11) and the object workpiece (K) become that benchmark is luxuriant to move (LB), by focusing so automatically.When focusing automatically displacement transducer (12) is kept out of the way.Because displacement transducer advance and retreat unit (13) are provided with respectively with converter (53), can not reduce the object lens (11) that should have, so the freedom of the multiplying power that can not reduce to make a video recording.And, because displacement transducer (12) is independent of converter (53), therefore the signal of displacement transducer (12) output being fetched into outside cable (136) can not twist because of converter (53) rotation, can prolong the life-span of cable (136), the restriction that not produced by the existence of the cable (136) of displacement transducer (12).
The automatic shape inspection apparatus of the 2nd scheme is formed with electroconductive member pattern (D) on object workpiece (K), displacement transducer (12) is capacitance displacement sensor (an electrostatic capacitance displacement transducer).
If adopt the automatic shape inspection apparatus of the 2nd scheme,, can obtain the high-speed displacement data by using capacitance displacement sensor as displacement transducer (12).And because capacitance displacement sensor (12) is little with respect to the measuring error of temperature change, and the measurement of passing in time deterioration is few, so good reliability.The automatic shape inspection of the semi-conductor chip that forms on semi-conductor chip that is particularly useful for forming on the semiconductor wafer or the substrate of FPD.
In addition, append in the scope of claim and each section of summary of the invention that parenthesized Reference numeral after each inscape represents be with embodiment described later in the corresponding relation of the concrete mode put down in writing.
The effect of invention:, the freedom that does not lose the shooting multiplying power can be provided and not be subjected to the automatic shape inspection apparatus of the existence of displacement transducer cable to the restriction of converter action if adopt the present invention.
Description of drawings
Fig. 1 is the front skeleton diagram of automatic shape inspection apparatus of the present invention.
Fig. 2 is the outward appearance skeleton view of converter.
Fig. 3 is the figure that sees range cells from the top.
Fig. 4 is the process flow diagram that the expression automatic shape inspection apparatus is checked the process of processing.
Fig. 5 checks the figure of the action of worktable when being the processing of expression displacement measurement.
Fig. 6 checks the figure of the action of worktable when being expression focusing, shooting.
Fig. 7 (A) (B) (C) is the figure that is used to illustrate automatic focusing action.
Fig. 8 is the front skeleton diagram of the automatic shape inspection apparatus of prior art.
Embodiment
Implement preferred configuration of the present invention with description of drawings below.Fig. 1 is the front skeleton diagram of automatic shape inspection apparatus 1 of the present invention, and Fig. 2 is the outward appearance skeleton view of converter 53, and Fig. 3 is the figure of the range cells 10 seen from the top.3 with orthogonal coordinate system among each figure are designated as X, Y, Z, and the XY plane is a surface level, and the Z direction is a vertical.
As shown in Figure 1, automatic shape inspection apparatus 1 by worktable 2, check that worktable driver element 3, position detection unit 4, shooting optical module 5, shooting optical module driver element 6, illumination light source 7, range cells 10, control computer 8 and Flame Image Process constitute with computing machine 9 etc.
Check that worktable 2 for loading the discoid worktable as the semiconductor wafer K that checks object, is provided with vacuum suction hole or suitable fixed part from the teeth outwards.Thus, can vacuum suction or fixedly semiconductor wafer K kept.In addition, be formed with a plurality of semi-conductor chips (semiconductor element) D on the surface of semiconductor wafer K.
Check worktable driver element 3 by check worktable 2 below the linear motor that sets along X, Y direction respectively and can drive DD (the Direct Drive that checks that worktable 2 rotates along θ direction around the rotary middle spindle J2 that checks worktable 2, directly drive) the motor formation, not only can make and check that worktable 2 moves along X, Y direction uniform velocity ground respectively, and inspection worktable 2 is rotated along the θ direction.Operating position detecting unit 4 adopts to detect checks the position of worktable 2 on X, Y, θ direction, and detected position signalling can be sent to the structure of control computer 8.
Shooting optical module 5 possesses to be checked with camera 51, metaloscope 52, converter 53 and converter driver element 54.Check to possess CCD imaging apparatuss 511 such as (Charge-Coupled-Device, charge-coupled image sensors) with camera 51, the view data that this imaging apparatus 511 can be obtained is transformed into digital signal and output.Metaloscope 52 is made of suitable catoptron and lens etc., so that the intensified image of the semi-conductor chip D that object lens 11 are obtained is imaged on check with on the imaging apparatus 511 of camera 51, and the flash irradiation that illumination light source 7 is provided is to semiconductor wafer K.
As shown in Figure 2, converter 53 is free around Z-axis J1 rotation, possesses 5 object lens 11A～11E.The multiplying power of object lens 11A is 10 times, and pixel resolution is in 1 μ m, and the depth of focus is about ± 3.5 μ m.The multiplying power of object lens 11B is 5 times, and the multiplying power of object lens 11C is 2 times, and the multiplying power of object lens 11D is 1 times, and the multiplying power of object lens 11E is 20 times.
By driving converter 53 rotations around the rotary middle spindle J1 of converter 53, converter driver element 54 can be optionally be configured among object lens 11A～11E any on the camera position P0.When object lens 11A is configured in camera position P0 when going up, can be by checking the intensified image of taking the semiconductor wafer K that obtains by object lens 11A with camera 51. Object lens 11B, 11C, 11D, 11E are too.Object lens 11D is actually flat glass, when in the monitor picture that is provided with in addition, carry out with visual identical state under affirmation the time select configuration object lens 11D.Object lens 11E is the highest at above-mentioned 5 object lens moderate multiplying factors, selects configuration object lens 11E when carrying out visual examination in above-mentioned monitor picture.In addition,, when needing to distinguish mutually in the explanation, add the letter that A～E is such at the end of numeral with other object lens for the Reference numeral of object lens, for example " 11A ", " 11B " etc., but in the time need not specially distinguishing, only be designated as object lens 11.
Shooting optical module driver element 6 is made of stepping motor etc., can drive shooting optical module 5 along the Z direction.Illumination light source 7 usefulness fiber optic cables 71 are connected with metaloscope 52, flash when checking with camera 51 shooting semiconductor wafer K.
As shown in Figure 3, range cells 10 possesses capacitance displacement sensor 12 and sensor drive mechanism 13.
Flame Image Process has storage unit 91 that possesses storer and the operation processing unit 92 that possesses CPU with computing machine 9, for obtain by check image when taking semi-conductor chip D with camera 51, by this image is implemented the computing machine that predetermined analyzing and processing is checked the outward appearance of semi-conductor chip D.
The following describes the inspection action of automatic shape inspection apparatus 1.Fig. 4 checks the process flow diagram of the process of processing for expression automatic shape inspection apparatus 1, check the figure of the action of worktable 2 during displacement that Fig. 5 measures semiconductor wafer for expression, Fig. 6 is the figure of expression focusing, the action of inspection worktable 2 when making a video recording, the figure that Fig. 7 focuses and moves automatically for expression.
As shown in Figure 4, the inspection department reason wafer that carries out of automatic shape inspection apparatus 1 loads step S1, worktable calibration steps S2, sensor and enters that step S3, displacement measurement step S4, interpolation calculation treatment step S5, sensor are made a concession step S5A, object lens are selected step S6, focusing/shootings/inspection step S7 and wafer unloading step S8 formation.
In wafer loading step S1, check that worktable 2 is by keeping this semiconductor wafer K in its surface vacuum absorption or the fixing carrying that does not have to represent with the semiconductor wafer K that the mechanical arm reception comes from figure.
In checking worktable calibration steps S2, make inspection worktable 2 rotate the control of small angle around its rotary middle spindle J2 according to necessity.Thus, can revise the assembly error of the θ direction of checking worktable 2, can guarantee to check that worktable 2 is respectively with the good depth of parallelism of the precision of X, Y direction and move.
Enter among the step S3 at sensor, the command signal that sensor drive mechanism 13 sends by control computer 8 is shunk pneumatic linear actuator 131.Thus, be positioned at the 1st arm member 132 of position shown in the solid line of Fig. 3 around counterclockwise rotating.Link with the rotation of the 1st arm member 132, the 2nd arm member 133 is also around counterclockwise rotating.So the capacitance displacement sensor 12 that is configured in retreating position P2 is configured to range finding position P1 (with reference to the dot-and-dash line part of Fig. 3).The angle that the 1st arm member 132 and the 2nd arm member 133 rotate is preferably respectively at 10 °～30 °.This is to make cable 136 deteriorations in order to prevent swing or to twist.
In displacement measurement step S4, check that worktable driver element 3 checks worktable 2 by the command signal that control computer 8 sends along X, Y direction horizontal drive, make and check that worktable 2 and capacitance displacement sensor 12 relative positions concern the path along dotted arrow B1 shown in Figure 5.Checking under the state that worktable 2 moves continuously along the Y direction that the displacement LS1 of each extraction point T1 is measured as extraction point T1 in a plurality of places of capacitance displacement sensor 12 on predetermined moment extraction semiconductor wafer K.The displacement LS1 that measures is stored in the storage unit 81 in the control computer 8 with position detection unit 4 positions of detected inspection worktable 2 on X, Y, θ direction.When the processing of the row of one on the Y direction finishes, make and check that worktable 2 moves predetermined distance along directions X, next column is carried out same processing.By carrying out such processing (S4A) successively, obtain the displacement LS1 that semiconductor wafer K goes up a plurality of extraction point T1.
In interpolation calculation treatment step S5, operation processing unit 82 bases in the control computer 8 are handled the displacement LS2 that obtains the non-extraction point T2 that does not measure among the displacement measurement step S4 based on the interpolation calculation of the displacement LS1 of above-mentioned extraction point T1.The displacement LS2 that handles the non-extraction point T2 that tries to achieve by interpolation calculation also is stored in the storage unit 81.In addition, non-extraction point T2 is a plurality of points uniformly-spaced to exist respectively between each extraction point T1, and these points are shooting point.
Make a concession among the step S5A at sensor, the command signal that sensor drive mechanism 13 sends by control computer 8 makes pneumatic linear actuator 131 elongations.Thus, being positioned at locational the 1st arm member 132 shown in the dot-and-dash line of Fig. 3 rotates around clockwise direction.Link with the rotation of the 1st arm member 132, the 2nd arm member 133 also rotates around clockwise direction.So the capacitance displacement sensor 12 that is configured on the range finding position P1 is configured on the retreating position P2.
Select among the step S6 at object lens, the command signal that converter driver element 54 sends by control computer 8 is configured to the object lens 11 of appointment on the camera position P0.Can be according to any object lens among the size selection object lens 11A～11E of the defective of wanting to check.
In focusing/shooting/inspection step S7, inspection worktable driver element 3 is checked worktable 2 by the command signal that control computer 8 sends along X, Y direction horizontal drive, makes the path of the relative position relation of inspection worktable 2 and object lens 11 along dotted arrow B2 shown in Figure 6.Checking under the state that worktable 2 moves continuously along the Y direction that shooting optical module driver element 6 pictures drive shooting optical module 5 along Z-direction as shown in Figure 7, making the displacement LT between object lens 11 and the semiconductor wafer K be basis displacement LB always.That is, drive shooting optical module 5 along the Z direction, make displacement LT consistent with basis displacement LB according to storing the basis displacement LB in the storage unit 81 in advance into and handling the displacement LS2 that tries to achieve by interpolation calculation.(LS2+ α-LB) moves for example to carry out displacement shown in image pattern 7 (B) and Fig. 7 (C) like that.Wherein, α represents to be configured in the object lens 11 on the camera position P0 and is configured in distance on the vertical direction between the capacitance displacement sensor 12 of range finding on the P1 of position.Thus, can carry out only focusing to semi-conductor chip D.To defocused, when illumination light source 7 flashes, check with camera 51 and take semi-conductor chip D.Whether good the image input picture that photographs is handled with computing machine 9, carry out the judgement of its outward appearance by Flame Image Process.Whether good judgement (being yes among the S7A) to all non-extraction point T2 carry out being undertaken by such focusing, shooting and Flame Image Process finishes the visual examination that semiconductor wafer K goes up all semi-conductor chip D that form.
In wafer unloading step S8, discharge the semiconductor wafer K that checks out from vacuum suction or fixing, transfer to carrying with on the mechanical arm.After, receive new semiconductor wafer K, handle by order same as described above.
The structure that automatic shape inspection apparatus 1 adopts sensor drive mechanism 13 that capacitance displacement sensor 12 can be advanced and retreat between object lens 11 that converter 53 is selected and object workpiece K.Shooting optical module driver element 6 is according to the displacement LS and the basis displacement LB that is stored in the storage unit 81 to the object workpiece K that measure under the state that capacitance displacement sensor 12 enters, make the displacement LT between object lens 11 and the object workpiece K become basis displacement LB, by like this semi-conductor chip D being focused automatically.When focusing automatically capacitance displacement sensor 12 is kept out of the way.Because sensor drive mechanism 13 was arranged with converter in 53 minutes, can not reduce the object lens 11 that should have, therefore can not reduce the freedom of shooting multiplying power.And, because displacement transducer 12 is independent of converter 53, therefore in the future the signal of autobiography sensor driving mechanism 13 is fetched into outside cable 136 and can twist because of converter 53 rotations, can prolong the life-span of cable 136, the existence of cable 136 that is not subjected to capacitance displacement sensor 12 is to the restriction of converter 53 action.
Owing in displacement measurement step S4 and interpolation calculation treatment step S5, proceed to the measurement of the displacement of the extraction point T1 on the semiconductor wafer K, the displacement LS1 to extraction point T1 that utilization measures handles the displacement LS2 that predicts non-extraction point T2 by interpolation calculation, promptly arrive the displacement LS2 of the semi-conductor chip D of shooting when checking, therefore do not need displacement measurement is carried out in all checkpoints, can shorten beat (at interval) time.And owing to do not make during displacement measurement and during focusing yet and check that worktable 2 and shooting optical module 5 stop along relatively moving of XY direction, therefore also can shorten pitch time in view of this point.
And,, therefore can obtain displacement data at a high speed owing to use capacitance displacement sensor 12.For example can reach the sample rate about 10kHz.Therefore, even in the speed of checking worktable 2 during, also can obtain the extraction point T1 that enough carries out the quantity that interpolation calculation handles near the 500mm/sec left and right sides.And because capacitance displacement sensor 12 is little for the measuring error of temperature change, and the deterioration that passing is in time measured is little, so good reliability.
More than example of the present invention is illustrated, but above disclosed example example just after all, scope of the present invention is not subjected to the restriction of these examples.Scope of the present invention is with the scope record of claim, and comprises and the meaning of the scope equalization of claim and all changes in the scope.For example, the direction of 3 axles of orthogonal coordinate system not necessarily XY plane is a surface level, and the Z direction is that vertical is also passable.And the sequential scheduling of each step also can aim according to the present invention suitably change during the method that interpolation calculation is handled, the form of checking worktable 2 actions, inspection were handled.
Claims (2)
1. an automatic shape inspection apparatus (1), constitute in the mode of focusing automatically before the shooting of using in the visual examination of object workpiece (K), it is characterized in that possessing: the converter (53) that keeps a plurality of object lens (11) and select certain object lens (11) to be used to check; Take the image unit (51) of the picture that obtains by selected object lens (11); The displacement transducer advance and retreat unit (13) that displacement transducer (12) is advanced and retreat between selected object lens (11) and object workpiece (K); The optimum focusing displacement of the object lens (11) located of the reference position (PB) on the storage object workpiece (K) is as the storage unit (81) of basis displacement (LB) in advance; And, the displacement (LS) that measures according to displacement transducer (12) and be stored in basis displacement (LB) the storage unit (81) from this displacement transducer (12) to object workpiece (K), drive converter (53) along the vertical direction, so that object lens (11) are the above-below direction driver element (6) of optimum focusing displacement.
2. automatic shape inspection apparatus as claimed in claim 1 wherein, is formed with electroconductive member pattern (D) on object workpiece (K), displacement transducer (12) is a capacitance displacement sensor.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007032553A JP4257863B2 (en) | 2007-02-13 | 2007-02-13 | Automatic visual inspection equipment |
| JP032553/2007 | 2007-02-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101246131A CN101246131A (en) | 2008-08-20 |
| CN101246131B true CN101246131B (en) | 2010-11-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008100097463A Expired - Fee Related CN101246131B (en) | 2007-02-13 | 2008-02-13 | Automatic shape inspection apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4257863B2 (en) |
| KR (1) | KR100954360B1 (en) |
| CN (1) | CN101246131B (en) |
| TW (1) | TW200842348A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP4960912B2 (en) * | 2008-03-19 | 2012-06-27 | 東レエンジニアリング株式会社 | Automatic visual inspection apparatus and automatic visual inspection method |
| CN102221562B (en) * | 2010-03-16 | 2013-12-25 | 松下电器产业株式会社 | Pattern checking method and pattern checking device |
| JP5300885B2 (en) * | 2010-03-16 | 2013-09-25 | パナソニック株式会社 | Pattern inspection method and pattern inspection apparatus |
| WO2016103728A1 (en) * | 2014-12-26 | 2016-06-30 | シスメックス株式会社 | Cell imaging device, cell imaging method, and sample cell |
| CN105259178B (en) * | 2015-11-20 | 2019-03-15 | 云南卡索实业有限公司 | A kind of shearing class linear trace laser detection system |
| CN108007932A (en) * | 2016-10-27 | 2018-05-08 | 台耀科技股份有限公司 | A kind of optical detection apparatus |
| CN109060835A (en) * | 2018-08-24 | 2018-12-21 | 奇瑞万达贵州客车股份有限公司 | A kind of appearance inspection device of chip |
| CN111580336B (en) * | 2020-04-21 | 2022-06-07 | 福建福光股份有限公司 | Focusable camera inspection jig |
| IL301222A (en) * | 2020-09-28 | 2023-05-01 | Asml Netherlands Bv | Metrology tool with position control of projection system |
| CN114384091B (en) * | 2021-12-16 | 2024-06-18 | 苏州镁伽科技有限公司 | Automatic focusing device, panel detection equipment and method thereof |
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| CN101019058A (en) * | 2004-09-16 | 2007-08-15 | 奥林巴斯株式会社 | Observation apparatus with focal position control mechanism |
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2007
- 2007-02-13 JP JP2007032553A patent/JP4257863B2/en not_active Expired - Fee Related
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2008
- 2008-02-04 KR KR1020080011191A patent/KR100954360B1/en not_active IP Right Cessation
- 2008-02-12 TW TW097104875A patent/TW200842348A/en unknown
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101019058A (en) * | 2004-09-16 | 2007-08-15 | 奥林巴斯株式会社 | Observation apparatus with focal position control mechanism |
Non-Patent Citations (3)
| Title |
|---|
| JP特开2001-143991A 2001.05.25 |
| JP特开2005-70225A 2005.03.17 |
| JP特开2006-162250A 2006.06.22 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4257863B2 (en) | 2009-04-22 |
| JP2008196976A (en) | 2008-08-28 |
| TW200842348A (en) | 2008-11-01 |
| KR100954360B1 (en) | 2010-04-26 |
| CN101246131A (en) | 2008-08-20 |
| KR20080075778A (en) | 2008-08-19 |
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