CN101228626A - 用于管芯的封装 - Google Patents

用于管芯的封装 Download PDF

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CN101228626A
CN101228626A CNA2006800269948A CN200680026994A CN101228626A CN 101228626 A CN101228626 A CN 101228626A CN A2006800269948 A CNA2006800269948 A CN A2006800269948A CN 200680026994 A CN200680026994 A CN 200680026994A CN 101228626 A CN101228626 A CN 101228626A
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埃蒙·吉尔马丁
史蒂芬·戴维
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Filtronic PLC
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Abstract

一种用于管芯的封装，包括导热载体；所述载体上的介电框体，所述框体内具有用于容纳管芯的凹口；电绝缘盖子，适于被设置在所述框体上，以覆盖所述凹口，所述盖子的尺寸使得当所述盖子覆盖所述凹口时，所述盖子的一部分延伸至所述框体之外，从而产生至少一个突出部分；所述框体具有至少一个导电的框体路径；并且所述盖子具有相应的导电的盖子路径，所述盖子路径排列为当所述盖子被设置在所述框体上时，所述盖子路径的一部分覆盖在所述框体路径上，所述盖子路径延伸至所述框体之外的所述突出部分上。

Description

用于管芯的封装
技术领域
本发明涉及一种用于管芯的封装。更具体地，但不排他地，本发明涉及一种封装，其包括载体，在载体上的、具有用于管芯的凹口的框体，以及框体上的盖子。
背景技术
用于射频(RF)应用的功率封装是公知的。此类封装典型地包括由盖子所覆盖的载体上的管芯。在使用中，封装被置于印刷电路板(PCB)上或PCB内的孔中，并且封装内的管芯和PCB之间具有连接。已知产生这种连接的多种方法，包括使用翼形件、介电接头、球阵列或城堡形件。然而这些方法或者生产起来比较昂贵，或者在电上和机械上不可靠。
发明内容
因此，本发明的第一方面提供了一种用于管芯的封装，包括：
导热载体；
所述载体上的介电框体，所述框体内具有用于容纳管芯的凹口；
电绝缘盖子，适于被设置在所述框体上，以覆盖所述凹口，所述盖子的尺寸使得当所述盖子覆盖所述凹口时，所述盖子的一部分延伸至所述框体之外，从而产生至少一个突出部分；
所述框体具有至少一个导电的框体路径；并且
所述盖子具有相应的导电的盖子路径，所述盖子路径排列为当所述盖子被设置在所述框体上时，所述盖子路径的一部分覆盖在所述框体路径上，所述盖子路径延伸至所述框体之外的所述突出部分上。
根据本发明的封装比较廉价并且相对地易于生产。并且比较可靠。
所述框体路径可从所述凹口的临近处向外朝所述框体的边缘延伸。
所述封装可包括多个导电的框体路径。
优选地，所述封装包括多个导电的盖子路径，每个盖子路径被排列为当所述盖子被设置在所述框体上时，每个所述盖子路径与相应的框体路径电接触。
所述载体可为金属。
优选地，所述载体和所述框体中的至少一个可包括用于将所述盖子相对于所述框体进行定位的定位元件。
优选地，所述盖子包括其他定位元件。
所述封装还可在所述凹口内包括管芯，优选地，所述封装还包括在所述管芯和至少一个框体路径之间延伸的至少一个导电桥。
所述框体可包括用于容纳多个管芯的多个凹口。
所述盖子可接地。
本发明的另一方面提供了一种印刷电路板，其包括凹口和位于所述凹口内的、用于管芯的封装，用于管芯的所述封装包括：
导热载体；
所述载体上的介电框体，所述框体内具有用于容纳管芯的凹口；
电绝缘盖子，适于被设置在所述框体上，以覆盖所述凹口，所述盖子的尺寸使得当所述盖子覆盖所述凹口时，所述盖子的一部分延伸至所述框体之外，从而产生至少一个突出部分；
所述框体具有至少一个导电的框体路径；并且
所述盖子具有相应的导电的盖子路径，所述盖子路径排列为当所述盖子被设置在所述框体上时，所述盖子路径的一部分与所述框体路径邻接，从而在所述盖子路径和所述框体路径之间产生电接触，所述盖子路径延伸至所述框体之外的所述突出部分上。
附图说明
下面，将参照附图仅以实例的方式描述本发明，并且不具任何限制意义，在附图中：
图1以透视图示出了根据本发明的用于管芯的封装；
图2从上方和下方示出了已组装的封装；
图3示出了根据本发明的位于PCB的凹口内的封装；以及
图4以剖视图示出了根据本发明的封装的另一个实施方式。
具体实施方式
图1以分解视图示出了根据本发明的用于管芯的封装1，其包括管芯2。封装1包括导热载体3。本实施方式的载体3为铜制的。在其他实施方式中，可以使用诸如CuW、Al或CuMo的其他导热材料。可选地，对该载体镀金。
用环氧树脂(未示出)将框体4层压至载体。框体4是电绝缘的介电材料。本实施方式的框体4是陶瓷的。在可选的实施方式中，框体4可为诸如Duroid或R04350的聚四氟乙烯(PTFE)。在可选的实施方式中，框体4可被焊接至载体3。
框体4包括孔5，孔5向下延伸至载体3。半导体管芯2位于孔5内并且附接于载体3。在使用中，管芯2产生热量，这些热量由载体3带走。管芯2可在框体4之前或之后连接到载体3。
如图所示的多个导电的框体路径6位于框体4的上表面上。每个框体路径6从凹口5的临近处向外朝框体的边缘延伸。
当框体4和管芯2连接到载体3，则用传统的连接线(未示出)将管芯2电连接至框体路径6。如果需要，可就此对管芯2进行测试。
封装1还包括电绝缘盖子7。在盖子7的底面上有多个导电的盖子路径8。盖子7位于框体4上。当被正确设置时，盖子7覆盖凹口5，并且盖子路径8与框体路径6对齐，从而在两者之间形成电连接。在本实施方式中，由施加于框体路径6和盖子路径8的导电材料(未示出)将盖子7附接于框体4，以增强两者之间的电连接。
在可选的实施方式中(未示出)，框体4和盖子7均包括金属引导标签。将盖子7上的引导标签置于框体4上的引导标签上，以确保盖子7相对于框体4的位置正确。进而，可向标签加粘合剂，以增强盖子7和框体4之间的接合强度。如果使用了引导标签，则框体路径6和盖子路径8之间的粘合剂是可选的。两者之间的电接触可通过机械地促使路径6和路径8相接触而得到。
在另一实施方式中(未示出)，盖子7通过机械装置(如扣合啮合装置)连接至框体4。
图2a和图2b从上方和下方示出了已组装的封装1。如图所示，盖子7的尺寸略大于框体4和载体3，从而使其突出于框体4和载体3。如图所示，盖子路径8向外延伸到突出部分上。
图3以透视图示出了封装1，其位于印刷电路板(PCB)10的孔9中。孔9的深度对应于载体3和框体4的总高度，从而使得框体4的上表面和PCB10的上表面位于同一水平面。如图所示，盖子路径8在突出部分上的部分作为框体路径6和PCB10上的导电路径11之间的电桥(并因此作为管芯2和导电路径11之间的电桥)。
封装1和PCB10之间的电连接被结合至盖子7，并且由盖子7所覆盖和保护。因此连接点远比接头或层压管脚更加牢固和可靠，也更易于生产。
图4以剖视图示出了本发明的另一个实施方式。在本实施方式中，管芯2和框体4被直接连接至PCB10内的凹口9的底部。凹口9的底部作为载体3从半导体管芯2将热量传导走。盖子7在其底面具有凹口12，从而为框体4上的导电路径6和管芯2的连接线13之间的连接提供更大空间。
在另一个实施方式中，框体包括多个凹口，每个凹口均适于容纳至少一个管芯。
在可选的实施方式中，盖子被接地。
在可选的实施方式中，管芯不直接连接至框体上的导电路径，而是连接至片式电容器，而该片式电容器再连接至框体的导电路径。

Claims (13)

1.一种用于管芯的封装，包括：
导热载体；
所述载体上的介电框体，所述框体内具有用于容纳管芯的凹口；
电绝缘盖子，适于被设置在所述框体上，以覆盖所述凹口，所述盖子的尺寸使得当所述盖子覆盖所述凹口时，所述盖子的一部分延伸至所述框体之外，从而产生至少一个突出部分；
所述框体具有至少一个导电的框体路径；并且
所述盖子具有相应的导电的盖子路径，所述盖子路径排列为当所述盖子被设置在所述框体上时，所述盖子路径的一部分覆盖在所述框体路径上，所述盖子路径延伸至所述框体之外的所述突出部分上。
2.如权利要求1所述的封装，其中所述框体路径从所述凹口的临近处向外朝所述框体的边缘延伸。
3.如权利要求1或2中的任一项所述的封装，包括多个导电的框体路径。
4.如权利要求3所述的封装，包括多个导电的盖子路径，每个盖子路径被排列为当所述盖子被设置在所述框体上时，每个所述盖子路径与相应的框体路径电接触。
5.如权利要求1至4中的任一项所述的封装，其中所述载体为金属。
6.如权利要求1至5中的任一项所述的封装，其中所述载体和所述框体中的至少一个包括用于将所述盖子相对于所述框体进行定位的定位元件。
7.如权利要求6所述的封装，其中所述盖子包括其他定位元件。
8.如权利要求1至7中的任一项所述的封装，其在所述凹口内还包括管芯，所述封装还包括在所述管芯和至少一个框体路径之间延伸的至少一个导电桥。
9.如权利要求1至8中的任一项所述的封装，其中所述框体包括用于容纳多个管芯的多个凹口。
10.如权利要求1至9中的任一项所述的封装，其中所述盖子接地。
11.一种印刷电路板，具有凹口和位于所述凹口内的、如权利要求1至10中任一项所述的用于管芯的封装。
12.基本如前所描述的用于管芯的封装。
13.参照附图基本如前所描述的用于管芯的封装。
CNA2006800269948A 2005-07-23 2006-07-24 用于管芯的封装 Pending CN101228626A (zh)

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GB0515219A GB2433832B (en) 2005-07-23 2005-07-23 A package for a die
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JPH1098122A (ja) * 1996-09-24 1998-04-14 Matsushita Electron Corp 半導体装置
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GB2433832B (en) 2010-11-17
GB0515219D0 (en) 2005-08-31
EP1908104A1 (en) 2008-04-09
GB2433832A (en) 2007-07-04
US20090294975A1 (en) 2009-12-03
WO2007012833A1 (en) 2007-02-01

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