CN101224869A - Nano tin soldering method by using atomic force microscopy probe as welding gun - Google Patents
Nano tin soldering method by using atomic force microscopy probe as welding gun Download PDFInfo
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- CN101224869A CN101224869A CNA2008100327395A CN200810032739A CN101224869A CN 101224869 A CN101224869 A CN 101224869A CN A2008100327395 A CNA2008100327395 A CN A2008100327395A CN 200810032739 A CN200810032739 A CN 200810032739A CN 101224869 A CN101224869 A CN 101224869A
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Abstract
The invention relates to a nanometer tin soldering method which belongs to the technical field of nanometer and adopts an atomic force microprobe as a welding torch, specifically speaking: the atomic force microprobe, soldering tin material and welding mode are selected; an atomic force microscope is adopted to find a nanometer component to be welded, namely, to precisely position a welding point; soldering tin is dipped on a probe and then atomic force imaging scanning is carried out to find the original position which is the nanometer device selected in the second step, the height image is recorded and the scanning scope is shortened to lock the welding position on the nanometer component, then a bias voltage is applied on the probe of the atomic force microscope so that the probe can touch the surface of the nanometer component, then the scanning operation is kept and weld is carried out, then the bias voltage is removed and the normal atomic force microscope imaging state is returned after the welding operation is finished, the welding effect is inspected and the welding result is recorded; the nanometer welding operation on more than one places on the nanometer component is repeated and the welding result is recorded. The invention is a nanometer 'tin soldering technology' that is applied to the nanometer component and is precise in positioning, controllable in welding size, high in automation degree and strong in universality.
Description
Technical field
The present invention relates to a kind of welding method of field of nanometer technology, specifically be a kind of be the nano tin soldering method of welding gun based on the atomic force microprobe.
Background technology
Nano material preparation and device research is in recent years attracting the development of different field researcher's interest, especially nano-device to cause people's extensive concern especially always, becomes the main field of nanotechnology research gradually.Up to the present, people have developed several different methods and have synthesized the nano-component with different that form, shapes and controlled amount, as nanosphere, nanometer polyhedral, nano wire and nanometer rods, and nanotube and nanometer sheet etc.By functionalization, successfully make nano-component be assembled into various pattern at the substrate surface ad-hoc location to nano-component and substrate material surface.Yet that the nano-device manufacturing technology of existing " from bottom to top " must overcome is synthetic such as nano-component, the effective of nanometer assembling and nano-component and assembly and the external world such as is connected at a series of technical barriers.Though report is arranged during the research of nano photoelectronic devices and nano-sensor etc., but because above-mentioned technical bottleneck makes that the performance of these devices and sensor is extremely unstable, repeatability is very poor, and this has greatly restricted the further investigation of nano material and device performance and practical application.
Find through literature search prior art, in order to solve this technical barrier, people have attempted different nanometer solder technology, as Banhart etc. at " Nano Letter " (nanometer wall bulletin) (2001,1,329-332) delivered " The Formation of a Connection between Carbon Nanotubes in anElectron Beam " (adopting electron beam to realize connecting between CNT), by electron beam (welding gun) that electron microscope produced and the method that is present in electron microscope vacuum chamber interior or attached denier hydrocarbon (" the scolding tin ") reaction that is bonded at carbon nano tube surface formation graphite or amorphous carbon, between different CNTs, formed effective pad, but, since in the electron microscope vacuum chamber or the uncontrollability of the attached amount of hydrocarbons that is bonded at carbon nano tube surface etc. greatly restricted the generally use of this method in the nanometer welding.Recently, X Duan etc. go up (2005 in " J.Am.Chem.Soc. " (American Chemical Society), 127,8268-8269) delivered and be entitled as Nano-Welding by Scanning Probe Microscope (the nanometer welding technology of implementing based on PSTM), the silicon base surface that this technology adopts electric scanning probe technique to make to carry CNT oxidation fast forms the method for silica, successfully with CNT melting welding (welding) on the silicon base surface.Yet, this method only can be applicable to that oxidable base material and substrate and the redox potential of the nano material that will weld differ bigger system, simultaneously, because the variation of caused topochemistry of melting welding (oxidation) and physical property also will certainly influence the overall performance of device.
Summary of the invention
The present invention is directed to the problem that exists in the existing nanometer welding, providing a kind of is the nano tin soldering method of welding gun based on the atomic force microprobe.The present invention utilizes " welding gun " of atomic force microprobe as nano tin soldering, but the metal organic acid salt conduct " scolding tin " of selecting for use colloidal sol, metal nanoparticle precursor, salting liquid, conducting polymer monomer or light to decompose is to a kind of accurate positioning, that welding spot size is controlled, nanometer that automaticity is high, that universality is strong " soldering " technology of nano-component enforcement.
The present invention is achieved by the following technical solutions, the present invention includes following steps:
The first step adopts prior art, according to the nano-component of implementing welding and the physical property of base material, selects atomic force microprobe, soldering tin material and bond pattern.
Described selection atomic force microprobe principle is meant: the finishing of nanotube or nano wire organic polymer is arranged through silanization and to(for) substrate surface, select less NSC-18 or NSC-35 (production of the U.S. Veeco company) probe of force constant, substrate is a monocrystalline silicon piece, gold, silver nano wire nanotube or nanotube are soldered elements, can select NSC11 (production of U.S. Veeco company) probe.
Described atomic force microprobe can be single probe, also can be array probe, and implementing welding can be that same probe also can be respectively two kinds of different probes with the needle point of imaging.
Described selection soldering tin material is meant: scolding tin is the homogeneity welding, selects for use with nano-component and forms identical material as scolding tin enforcement welding.Alternative in the present invention scolding tin scope is wider, specifically can be metal nanoparticle solution, semiconductor colloidal sol, conducting polymer monomer, silver ammino solution or photodegradable metal organic salt solution etc.Such as adopting ZnO colloidal sol to weld ZnO nano wire, TiO as scolding tin
2Colloidal sol had so both guaranteed to form the unicity of the material of nano-device as scolding tin welding TiO2 nanotube, can guarantee the good combination of soldered elements, substrate and scolding tin again.
Described nanoparticles solution can be a particle diameter at 5nm to place an order metal nanoparticle solution such as disperseing gold, silver and platinum.
Described semiconductor colloidal sol can be TiO
2Or semiconductor colloidal sol such as ZnO.
Described conducting polymer monomer can be pyrroles, thiophene or aniline etc.
Described photodegradative metal organic salt solution is polyacrylic acid platinum or palladium salting liquid etc.
Described selection bond pattern comprises contact and contactless two kinds having the nano-component of organic polymer can select noncontact mode for substrate surface through silanization and finishing.
Second step, adopt AFM (AFM) to find and will weld nano-component, and the height image of record nano-component, accurately locate intending pad.
The 3rd step, dip on the probe get scolding tin after, the atomic force image scanning finds original position (i.e. the nano-device of selecting in second step), and writes down height image; The scope of dwindling scanning is locked in the position that nano-component will weld, on the AFM probe, apply bias voltage, make probe touch the nano-component surface, keep scanning 3min-5min, implement welding, after welding is finished, remove bias voltage and return normal AFM image formation state, detect welding result, and the record welding result.
The 4th step repeated for the 3rd step and implement many places nanometer welding on nano-component, and the result of record welding.
Compared with prior art, the invention has the advantages that accurate positioning, universality strong (being directed to base material and nano-component), not damaged, programme-control, thereby help industrialization.With " welding gun " of AFM probe as nanometer level, the nano-component that can weld is as required selected different " scolding tin " for use with the characteristic of base material, can implement harmless nano tin soldering to multiple nano wire (nanotube) with important application prospect.
Description of drawings
Fig. 1 implements the schematic diagram of nano tin soldering for adopting the AFM scan-probe, and wherein a is a microelectrode, and b is a silicon base, and c is nano-component (nanotube, a nano wire), and d is the AFM probe, and e is a scolding tin.
Fig. 2 adopts the AFM probe to realize 2 * 2 dot matrix solder joint schematic diagrames as welding gun on silicon chip with ZnO colloidal sol as scolding tin
Fig. 3 adopts the AFM probe as welding gun zinc oxide nanowire to be implemented the welding schematic diagram with ZnO colloidal sol as scolding tin
The specific embodiment
Below in conjunction with accompanying drawing embodiments of the invention are elaborated: present embodiment is being to implement under the prerequisite with the technical solution of the present invention, provided detailed embodiment and concrete operating process, but protection scope of the present invention is not limited to following embodiment.
As shown in Figure 1, implement the schematic diagram of nano tin soldering for adopting the AFM scan-probe, wherein a is a microelectrode, and b is a silicon base, and c is nano-component (nanotube, a nano wire), and d is the AFM probe, and e is a scolding tin.Below describe the implementation process of embodiment in detail.
Embodiment 1: with ZnO colloidal sol is scolding tin, implements the nanometer welding and obtain 2 * 2 arrays on silicon chip
(1) preparation of scolding tin: with Zn (OAc)
22H
2O is as the presoma of zinc oxide.Zn (OAc)
22H
2O is dissolved in the isopropyl alcohol, drips the redistilled water of trace under the effect of stabilizing agent diethanol amine, fully stir hydrolysis after, make transparent ZnO colloidal sol, the solubility of colloidal sol is 0.5mol/L.
(2) nanometer scolding tin dips in and gets: get the above-mentioned zinc oxide colloidal sol of 10 μ L with liquid-transfering gun, drop on the mica sheet of new cleavage, the AFM probe dips in gets scolding tin, and needle point left standstill 5 minutes.
(3) welding is implemented: adopt the contact mode imaging technique, select certain regional imaging and document image on the silicon chip of anticipating.Dwindling sweep limits to 50nm, on probe, apply certain bias voltage then, make the needle point contact surface, keep sweep speed at 1Hz/s, scanning 5min implements the nanometer welding.After welding is finished, remove bias voltage, AFM returns to the result of normal range (NR) scanning inspection soldering, and the record height image.
(4) change the scanning center position, repeating step (3), multiple welding obtains 2 * 2 nano tin soldering dot matrix.What provide as Fig. 2 is to adopt single AFM probe contact mode to implement 2 * 2 array ZnO colloidal sol solderings on silicon chip.The whole operation process keeps room temperature at 20 ℃, and humidity is 30%.
(5) scolding tin solidification process: the nano-device that welding finishes is transferred in the constant temperature vacuum drying chamber, 120 ℃, solidified 3 hours, remove the organic molecule in the colloidal sol, and make mutual physics or chemical action between ZnO colloidal sol, nanotube and the substrate three, form firm node.
Embodiment 2 is the welding of scolding tin to zinc oxide nanowire with ZnO colloidal sol
The scolding tin of the preparation of scolding tin and AFM probe dip in get with example 1 basic identical.Whether at first will detect before implementing soldering and be spin-coated on zinc oxide nanowire on the silicon chip is single dispersion.Choose a zinc oxide nanowire as the object that we will implement to weld, obtain its height image.After the AFM probe dips in scolding tin, leave standstill 20 minutes after, AFM scanning is found and will be welded zinc oxide nanowire, the record height image.Implement welding process and still adopt contact mode, specific operation process is as described in embodiment 1 step (3).Fig. 3 is for adopting the AFM picture of AFM probe to single ZnO nano wire welding.On scheming, can see, the pad accurate positioning, the amount control ratio of scolding tin is better.
Embodiment 3 is a scolding tin with the silver ammino solution, adopts AFM probe noncontact mode to implement the nanometer welding
With traditional silver mirror reaction is theoretical foundation, and technology is implemented to go up the introducing gas-phase reaction and simplified practical operation.
Specific implementation process is as follows:
(1) preparation of scolding tin: NH with 2%
4The OH aqueous solution dropwise joins 2% AgNO
3In the solution, obtain silver ammino solution, regulate pH to 10, as the scolding tin of nanometer welding with NaOH.With the silicon chip is substrate, and the monodispersed SWNT that is placed on the silicon chip is a welding object, and AFM raps mode imaging to intending the CNT imaging of welding.
(2) nanometer scolding tin dips in and gets: selecting the NSC11 needle point is welding gun, dip in get an amount of scolding tin (silver ammino solution) after, left standstill 3 minutes, rap imaging under the pattern, find former CNT.
(4) welding: CNT need locate on the welding position, on needle point, apply bias voltage and make needle point touch the surface, sweep limits is reduced to 100nm, keep scanning mode 5 minutes, and removed bias voltage, inserting needle again, switch to the normal scan state, scanning detects the result of soldering.
(5) repetitive operation (4) is after 2 of welding on the carbon pipe, the sample that welds transferred to rapidly be equipped with in advance in the 8% formalin culture dish, the outstanding formalin top that is placed on of sample, put into the constant temperature and humidity incubator after placing the atmosphere sealing of formaldehyde, maintain the temperature at 25 ℃, reaction time is taken out back 100 ℃ of following vacuum drying 4h at 3h.AFM finds the nanotube that has welded, and record height photo, realizes harmless nano tin soldering.
Claims (10)
1. one kind is the nano tin soldering method of welding gun based on the atomic force microprobe, it is characterized in that, may further comprise the steps:
The first step according to the nano-component of implementing welding and the physical property of base material, is selected atomic force microprobe, soldering tin material and bond pattern;
Second step, adopt AFM to find the nano-component that will weld, and the height image of record nano-component, accurately locate intending pad;
The 3rd step, dip on the probe get scolding tin after, the nano-device that the atomic force image scanning finds original position to select in i.e. second step, and record height image, the scope of dwindling scanning is locked in the position that nano-component will weld, and applies bias voltage on atomic force microscope probe, makes probe touch the nano-component surface, keep scanning, implement welding, after welding is finished, remove bias voltage and return normal AFM image formation state, detect welding result, and the record welding result;
The 4th step repeated for the 3rd step and implement many places nanometer welding on nano-component, and the result of record welding.
2. according to claim 1 is the nano tin soldering method of welding gun based on the atomic force microprobe, it is characterized in that, described selection atomic force microprobe, be meant: the finishing of nanotube or nano wire organic polymer is arranged through silanization and to(for) substrate surface, select little NSC-18 or the NSC-35 probe of force constant, for substrate is monocrystalline silicon piece, and gold, silver nano wire, nanotube or nanotube are selected the NSC11 probe.
3. according to claim 1 and 2 is the nano tin soldering method of welding gun based on the atomic force microprobe, it is characterized in that described atomic force microprobe is single probe, or array probe, the needle point of implementing welding and imaging is a same probe, or is respectively two kinds of probes.
4. according to claim 1 is the nano tin soldering method of welding gun based on the atomic force microprobe, it is characterized in that, described selection soldering tin material, be meant: scolding tin is the homogeneity welding, selecting for use with nano-component and form identical material as scolding tin enforcement welding, specifically is metal nanoparticle solution, semiconductor colloidal sol, conducting polymer monomer, silver ammino solution or photodegradable metal organic salt solution.
5. according to claim 4 is the nano tin soldering method of welding gun based on the atomic force microprobe, it is characterized in that, described nanoparticles solution is particle diameter monodispersed gold, silver or platinum metal nano-particle solution below 5nm.
6. according to claim 4 is the nano tin soldering method of welding gun based on the atomic force microprobe, it is characterized in that, described semiconductor colloidal sol is TiO
2Or ZnO semiconductor colloidal sol.
7. according to claim 4 is the nano tin soldering method of welding gun based on the atomic force microprobe, it is characterized in that, described conducting polymer monomer is pyrroles, thiophene, aniline.
8. according to claim 4 is the nano tin soldering method of welding gun based on the atomic force microprobe, it is characterized in that, described photodegradative metal organic salt solution is polyacrylic acid platinum or palladium salting liquid.
9. according to claim 1 is the nano tin soldering method of welding gun based on the atomic force microprobe, it is characterized in that described selection bond pattern comprises contact and contactless two kinds.
10. according to claim 1 is the nano tin soldering method of welding gun based on the atomic force microprobe, it is characterized in that, described maintenance scanning, and its retention time is 3min-5min.
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Cited By (8)
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| CN101857189A (en) * | 2010-05-31 | 2010-10-13 | 哈尔滨工业大学 | Method for connecting carbon nano tube and metal |
| CN101481086B (en) * | 2009-01-22 | 2011-03-23 | 上海交通大学 | Non-damaged in situ construction method for nano-node |
| CN102344115A (en) * | 2011-09-28 | 2012-02-08 | 清华大学 | Micronscale/nanoscale connection method based on dip-pen principle |
| CN102581460A (en) * | 2012-03-09 | 2012-07-18 | 常州萨恩斯机电设备有限公司 | Nanoscale resistance spot welding device and nanoscale resistance spot welding method |
| CN102826587A (en) * | 2012-09-07 | 2012-12-19 | 天津大学 | Method for self assembling ZnO nanowire cluster structure at top end of metal needle point |
| CN103215575A (en) * | 2013-04-26 | 2013-07-24 | 中国矿业大学(北京) | Novel welding method for metal nanowire |
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| CN1194427C (en) * | 2003-07-10 | 2005-03-23 | 上海大学 | Manufacturing method of stannic dioxide nano sensor |
| JP3757971B2 (en) * | 2003-10-15 | 2006-03-22 | カシオ計算機株式会社 | Manufacturing method of semiconductor device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101481086B (en) * | 2009-01-22 | 2011-03-23 | 上海交通大学 | Non-damaged in situ construction method for nano-node |
| CN101857189A (en) * | 2010-05-31 | 2010-10-13 | 哈尔滨工业大学 | Method for connecting carbon nano tube and metal |
| CN101857189B (en) * | 2010-05-31 | 2013-03-20 | 哈尔滨工业大学 | Method for connecting carbon nano tube and metal |
| CN102344115A (en) * | 2011-09-28 | 2012-02-08 | 清华大学 | Micronscale/nanoscale connection method based on dip-pen principle |
| CN102581460A (en) * | 2012-03-09 | 2012-07-18 | 常州萨恩斯机电设备有限公司 | Nanoscale resistance spot welding device and nanoscale resistance spot welding method |
| CN102581460B (en) * | 2012-03-09 | 2015-05-13 | 常州萨恩斯机电设备有限公司 | Nanoscale resistance spot welding device and nanoscale resistance spot welding method |
| CN102826587A (en) * | 2012-09-07 | 2012-12-19 | 天津大学 | Method for self assembling ZnO nanowire cluster structure at top end of metal needle point |
| CN103215575A (en) * | 2013-04-26 | 2013-07-24 | 中国矿业大学(北京) | Novel welding method for metal nanowire |
| CN103296204A (en) * | 2013-06-09 | 2013-09-11 | 南昌大学 | Pressure response memory device based on individual one-dimensional nanostructured materials and production method |
| CN108406169A (en) * | 2018-02-02 | 2018-08-17 | 北京交通大学 | A kind of welding point and welding method of the low resistance yttrium system high-temperature superconducting body based on nanometer silver solder |
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