CN101222817A - Blind hole plate and its processing method - Google Patents
Blind hole plate and its processing method Download PDFInfo
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- CN101222817A CN101222817A CNA2007100100809A CN200710010080A CN101222817A CN 101222817 A CN101222817 A CN 101222817A CN A2007100100809 A CNA2007100100809 A CN A2007100100809A CN 200710010080 A CN200710010080 A CN 200710010080A CN 101222817 A CN101222817 A CN 101222817A
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- blind hole
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Abstract
The invention provides a blind orifice plate, wherein a welding disk on the top of a blind hole is provided with a through hole for relieving stress. The main method for processing the blind orifice plate is that: on the basis of the prior technology, only a part on a graphics film corresponding to the blind hole is made into a phonic zone which is smaller than the blind hole in diameter during the course of making graphics film. In the invention, the working procedure of 'processing-jacking hole with resin -curing-lapping' is deleted, the manufacturing circle is shortened and the processing cost is decreased correspondingly because the working procedure is reduced; after the process is reduced, the overall qualified product rate is improved. The invention is a modification on related design during the pre-production of film, which does not change the prior production technology; the operator can conduct normal operation according to the prior procedures, which avoids unnecessary accidents. The product of the invention can meet the requirements of consumers in terms of overall appearance and performance and the user is not affected to use the product.
Description
Technical field
The present invention relates to a kind of processing method of wiring board.
Background technology
Along with the continuous development of science and technology, closely-related with it wiring board kind is also in continuous increase.It is more popular in recent years one type that the wiring board (being called for short the blind hole plate) of blind hole is arranged.Processing to this kind wiring board can be continued to use traditional process, it is the corresponding multi-layer sheet that contains the blind hole part of processing earlier to the effect that, this multi-layer sheet is holed, and the hole carried out copper plating treatment, to contain porose multi-layer sheet then is laminated to other daughter board (Y layer) as daughter board (X layer), the resin that contains in the prepreg between the two is filled the hole in the porose daughter board (X layer), form blind hole, carry out electroless copper after then the multi-layer sheet behind the lamination being drilled through hole (X+Y layer), the mode by figure transfer forms final outer graphics at last.Because the contained resin liquefy of being heated in the lamination process prepreg, it can flow in the blind hole its filling by nature, but lamination process is inhaled vacuum, be equivalent to Copper Foil or pressure of release film to the blind hole top, because the prepreg resin content is limited, therefore the quantity not sufficient of filling can cause the Copper Foil at blind hole top or release film to produce depression like this.Remove Copper Foil or release film that anti-resin overflows behind the lamination, pit can appear in the plate face at blind hole top.After outer graphics formed, the relative plate face of the Copper Foil at blind hole top also was to be etat lacunaire.If be subjected to thermal shock (as the reflow ovens of client's welding), the resin expanded by heating produces strain in the blind hole, make the part projection of depression originally, the resin of elastic expansion retracts to previous status after temperature reduces, but the Copper Foil that plastic deformation takes place still keeps raised position, finally make the plate face bulge occur, the BGA position that evenness is had relatively high expectations exerts an influence, and can have influence on the subsides part that mounts factory when serious.For remedying the defective of traditional handicraft method, standard technology is to adopt filling holes with resin before lamination at present, its program is: use the mode of silk screen printing that the hole of daughter board (X layer) is filled up with resin before the lamination, prevented because the plate face depression that the resin lack of fill produces in the lamination process.The program of ensuing lamination and back is identical with the traditional handicraft method.Though it is smooth with the wiring board blind hole location plate face that said method processes, be subjected to can not produce plate face projection after the thermal shock, but also there is certain weak point, because of having increased pre-treatment, filling holes with resin, curing, grinding four procedures, make process-cycle, processing cost that in various degree raising all be arranged, and it is, bigger to the cost impact of entire product because the increase of flow process has also reduced the qualification rate of product.
Summary of the invention
The object of the present invention is to provide that a kind of technology is simple, cost is low, qualification rate is constant, satisfy the blind hole plate and the processing method thereof of the every performance requirement of product.
The present invention mainly is based on existing traditional handicraft method, just will the part corresponding on the figure film when the figure film production be made into transparent area less than blind hole diameter with blind hole, make on the blind hole plate of final acquisition and be provided with the through hole (being commonly called as the skylight) that is used to discharge stress, prevent because the hidden danger of quality that is heated and causes with blind hole top corresponding bonding pad.
Method of the present invention is specific as follows:
1. the multi-layer sheet of the corresponding blind hole number of plies of lamination,
2. on above-mentioned multi-layer sheet, hole, and hole wall carried out copper facing,
3. above-mentioned multi-layer sheet is carried out the secondary lamination as daughter board (X layer) and other daughter board (Y layer), between the two in the prepreg hole of resin after with copper facing fill, form blind hole,
4. drill through hole (X+Y layer) and electroless copper on the multi-layer sheet of blind hole containing,
5. make the film that figure transfer is used, will the part corresponding on the figure film be made into transparent area less than blind hole diameter with blind hole,
6. on the multiple-plate plate face of blind hole, paste photosensitive dry film,
7. the film plaster that will be used for figure transfer overlays on photosensitive dry film, the ultraviolet ray that discharges by exposure machine exposes to photosensitive dry film, dry film below transparent area polymerization reaction take place under action of ultraviolet radiation forms high molecular polymer, and the dry film below the shading region maintains the original state
8. process is developed on the plate face after the exposure, is not subjected to the light dry film to be developed liquid and dissolves, and what stay the blind hole top is the dry film that photopolymerization reaction takes place,
9. copper facing has part that dry film retains because non-conductive, does not plate copper, other no dry film part electrodepositable last layer copper; Plate one deck tin again in copper coatings, make the protective layer of electro-coppering when being used for etching work procedure,
10. spray liquid parting on above-mentioned plate face, it can will be stayed on the plate face, removes after comprising the dry film dissolving on the blind hole, exposes the copper under the dry film,
11. spray etching solution on above-mentioned plate face, the copper under the dry film is dissolved to be fallen, other position is owing to there be tin layer protection with the etching solution reaction, and copper is retained.
12. spray detin liquid on above-mentioned plate face, the tin layer in the copper facing is dissolved to be fallen, and forms final outer graphics.By the wiring board that said method obtains, its blind hole top corresponding bonding pad is provided with the through hole (being commonly called as the skylight) that discharges stress.
When the blind hole of said structure when being subjected to thermal shock, the elastic stress that the resin elastic expansion produces in the blind hole can discharge from the skylight on the pad, institute's copper facing paper tinsel is impacted very little, can not make it produce projection, therefore also can not influence and produce brilliant every performance.
The present invention has following advantage compared to existing technology:
1. the present invention has reduced " processing-filling holes with resin-curing-grinding " operation, has shortened the process-cycle, and because operation reduces the also corresponding minimizing of processing cost; After operation reduced, the defective item that corresponding operation produces also disappeared thereupon, and overall accepted product percentage is improved.
2. the present invention is the change of carrying out when making film early stage on the relevant design, and it does not change existing manufacturing technique, and operating personnel can prevent that unnecessary accident from taking place by original program normal running.
3. product of the present invention can satisfy requirement of client on outward appearance and properties of product, the client uses and is not affected.
Description of drawings
Fig. 1 is that the present invention is through holing and hole wall being carried out copper-plated multiple-plate cross section enlarged diagram.
Fig. 2 is the multiple-plate cross section enlarged diagram that contain blind hole of the present invention through the lamination gained.
Fig. 3 is the cross section enlarged diagram of the present invention through the blind hole plate of boring and chemical plating gained.
Fig. 4 is the cross section enlarged diagram that the present invention posts the blind hole plate of photosensitive dry film and film.
Fig. 5 is the cross section enlarged diagram that the blind hole plate of dry film is left at blind hole of the present invention top.
Fig. 6 be the present invention do not have the copper facing of dry film part and zinc-plated after the cross section enlarged diagram of blind hole plate.
Fig. 7 is the cross section enlarged diagram of the blind hole plate that obtains of the present invention.
Embodiment
At first the multi-layer sheet 1 with the corresponding blind hole number of plies carries out lamination one time, holes on this multi-layer sheet then, and hole wall is carried out copper facing 2, as shown in Figure 1.Above-mentioned multi-layer sheet is carried out the secondary lamination as daughter board and other one deck daughter board 3, between the two in the prepreg hole of resin after with copper facing fill, form blind hole 4, as shown in Figure 2.Drill through hole 5 and electroless copper on the multi-layer sheet of blind hole containing, make the through hole that bored and wiring board both sides all with layer of copper 6, as shown in Figure 3.Make the film that figure transfer is used, will the part corresponding on the figure film be made into transparent area less than blind hole diameter with blind hole, on the multiple-plate plate face of blind hole, paste photosensitive dry film 7, the film 8 that will be used for figure transfer pastes at photosensitive dry film, as shown in Figure 4, the ultraviolet ray that discharges by exposure machine exposes to photosensitive dry film, dry film below transparent area polymerization reaction take place under action of ultraviolet radiation forms high molecular polymer, dry film below the shading region maintains the original state, process is developed on the plate face after the exposure, be not subjected to the light dry film to be developed liquid and dissolve, what stay the blind hole top is the dry film that photopolymerization reaction takes place, as shown in Figure 5.Because the part that has dry film to retain is non-conductive, does not plate copper, other no dry film parcel plating last layer copper 9; Plate one deck tin 10 again in copper coatings, make the protective layer of electro-coppering when being used for etching work procedure, as shown in Figure 6.Spray liquid parting on above-mentioned plate face, it can will be stayed on the plate face, removes after comprising the dry film dissolving on the blind hole, exposes the copper under the dry film.Spray etching solution on above-mentioned plate face, the copper under the dry film is dissolved to be fallen, and other position is owing to there be tin layer protection with the etching solution reaction, and copper is retained.Spray detin liquid on above-mentioned plate face, the tin layer in the copper facing is dissolved to be fallen, and forms final outer graphics.By the wiring board that said method obtains, its blind hole top corresponding bonding pad is provided with the through hole (being commonly called as the skylight) that discharges stress, as shown in Figure 7.
Claims (2)
1. blind hole plate is characterized in that: the blind hole top pads is provided with the through hole that discharges stress.
2. the processing method of a blind hole plate,
The multi-layer sheet of the corresponding blind hole number of plies of a lamination,
B holes, and hole wall is carried out copper facing,
C carries out the secondary lamination with above-mentioned multi-layer sheet as daughter board (X layer) and other daughter board (Y layer), between the two in the prepreg hole of resin after with copper facing fill, form blind hole,
D drills through hole (X+Y layer) and electroless copper containing on the multi-layer sheet of blind hole,
E makes the film that figure transfer is used,
F pastes photosensitive dry film on the multiple-plate plate face of blind hole,
The film plaster that g will be used for figure transfer overlays on photosensitive dry film, with ultraviolet ray photosensitive dry film exposed,
H removes with developer solution and is not subjected to the light dry film,
The i electro-coppering plates one deck tin again in copper coatings
J removes dry film on the plate face with liquid parting,
K removes the copper of no dry film and tin covering with etching solution,
The tin layer of l in the detin liquid removal copper facing,
It is characterized in that: will the part corresponding on the figure film be made into transparent area less than blind hole diameter with blind hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100100809A CN101222817A (en) | 2007-01-13 | 2007-01-13 | Blind hole plate and its processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100100809A CN101222817A (en) | 2007-01-13 | 2007-01-13 | Blind hole plate and its processing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101222817A true CN101222817A (en) | 2008-07-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007100100809A Pending CN101222817A (en) | 2007-01-13 | 2007-01-13 | Blind hole plate and its processing method |
Country Status (1)
| Country | Link |
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| CN (1) | CN101222817A (en) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101848606A (en) * | 2010-04-21 | 2010-09-29 | 华为技术有限公司 | Method for manufacturing printed circuit board and printed circuit board |
| CN102196665A (en) * | 2010-03-04 | 2011-09-21 | 柏承科技(昆山)股份有限公司 | Blind hole structure of printed circuit board and processing technology of blind hole structure |
| CN102215641A (en) * | 2011-05-04 | 2011-10-12 | 深圳市博敏电子有限公司 | Manufacturing process of high-density printed board with holes in pads |
| CN102802360A (en) * | 2012-08-17 | 2012-11-28 | 大连太平洋电子有限公司 | Anti-breakdown isolated laser hole blasting method in PCB processing |
| CN102811565A (en) * | 2011-06-03 | 2012-12-05 | 联能科技（深圳）有限公司 | Circuit board and manufacturing method thereof |
| CN103079361A (en) * | 2011-10-26 | 2013-05-01 | 健鼎（无锡）电子有限公司 | Method for plugging high-density through holes |
| CN103118506A (en) * | 2013-01-22 | 2013-05-22 | 金悦通电子（翁源）有限公司 | Electroplating hole filling method for via hole on bonding pad |
| CN103813652A (en) * | 2012-11-08 | 2014-05-21 | 深南电路有限公司 | Processing method of blind hole |
| CN103813655A (en) * | 2012-11-09 | 2014-05-21 | 镇江华扬信息科技有限公司 | Manufacturing method for improving reliability of printed circuit board (PCB) including bonding pad structure |
| CN104284512A (en) * | 2013-07-09 | 2015-01-14 | 华通电脑股份有限公司 | Multi-layer circuit board with back drill depth detection structure and back drill depth monitoring method thereof |
| CN104411105A (en) * | 2014-11-21 | 2015-03-11 | 深圳崇达多层线路板有限公司 | Method for improving excessive circuit etching of circuit board |
| CN104735926A (en) * | 2013-12-18 | 2015-06-24 | 深南电路有限公司 | Resin hole filling method for circuit board |
| CN106231821A (en) * | 2016-08-10 | 2016-12-14 | 胜宏科技（惠州）股份有限公司 | A kind of four layers of pcb board processing technology |
| CN106257971A (en) * | 2015-06-18 | 2016-12-28 | 深圳市华祥电路科技有限公司 | Multilayer blind plate and manufacture method thereof |
| CN111836483A (en) * | 2020-07-08 | 2020-10-27 | 苏州浪潮智能科技有限公司 | PCB processing method based on crimping holes and PCB |
-
2007
- 2007-01-13 CN CNA2007100100809A patent/CN101222817A/en active Pending
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102196665A (en) * | 2010-03-04 | 2011-09-21 | 柏承科技(昆山)股份有限公司 | Blind hole structure of printed circuit board and processing technology of blind hole structure |
| CN101848606B (en) * | 2010-04-21 | 2012-05-23 | 华为技术有限公司 | Method for manufacturing printed circuit board and printed circuit board |
| CN101848606A (en) * | 2010-04-21 | 2010-09-29 | 华为技术有限公司 | Method for manufacturing printed circuit board and printed circuit board |
| CN102215641A (en) * | 2011-05-04 | 2011-10-12 | 深圳市博敏电子有限公司 | Manufacturing process of high-density printed board with holes in pads |
| CN102811565B (en) * | 2011-06-03 | 2015-05-20 | 联能科技（深圳）有限公司 | Circuit board and manufacturing method thereof |
| CN102811565A (en) * | 2011-06-03 | 2012-12-05 | 联能科技（深圳）有限公司 | Circuit board and manufacturing method thereof |
| CN103079361B (en) * | 2011-10-26 | 2016-08-31 | 健鼎（无锡）电子有限公司 | The method for plugging of high density through hole |
| CN103079361A (en) * | 2011-10-26 | 2013-05-01 | 健鼎（无锡）电子有限公司 | Method for plugging high-density through holes |
| CN102802360B (en) * | 2012-08-17 | 2014-10-01 | 大连太平洋电子有限公司 | Anti-breakdown isolated laser hole blasting method in PCB processing |
| CN102802360A (en) * | 2012-08-17 | 2012-11-28 | 大连太平洋电子有限公司 | Anti-breakdown isolated laser hole blasting method in PCB processing |
| CN103813652A (en) * | 2012-11-08 | 2014-05-21 | 深南电路有限公司 | Processing method of blind hole |
| CN103813655A (en) * | 2012-11-09 | 2014-05-21 | 镇江华扬信息科技有限公司 | Manufacturing method for improving reliability of printed circuit board (PCB) including bonding pad structure |
| CN103118506A (en) * | 2013-01-22 | 2013-05-22 | 金悦通电子（翁源）有限公司 | Electroplating hole filling method for via hole on bonding pad |
| CN104284512A (en) * | 2013-07-09 | 2015-01-14 | 华通电脑股份有限公司 | Multi-layer circuit board with back drill depth detection structure and back drill depth monitoring method thereof |
| CN104735926A (en) * | 2013-12-18 | 2015-06-24 | 深南电路有限公司 | Resin hole filling method for circuit board |
| CN104735926B (en) * | 2013-12-18 | 2017-12-29 | 深南电路有限公司 | A kind of filling holes with resin method for circuit board |
| CN104411105A (en) * | 2014-11-21 | 2015-03-11 | 深圳崇达多层线路板有限公司 | Method for improving excessive circuit etching of circuit board |
| CN106257971A (en) * | 2015-06-18 | 2016-12-28 | 深圳市华祥电路科技有限公司 | Multilayer blind plate and manufacture method thereof |
| CN106231821A (en) * | 2016-08-10 | 2016-12-14 | 胜宏科技（惠州）股份有限公司 | A kind of four layers of pcb board processing technology |
| CN106231821B (en) * | 2016-08-10 | 2019-02-22 | 胜宏科技（惠州）股份有限公司 | A kind of four layers of pcb board manufacture craft |
| CN111836483A (en) * | 2020-07-08 | 2020-10-27 | 苏州浪潮智能科技有限公司 | PCB processing method based on crimping holes and PCB |
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