CN101206992B - Even glue developing process capable of economizing time and equipment improved structure - Google Patents
Even glue developing process capable of economizing time and equipment improved structure Download PDFInfo
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- CN101206992B CN101206992B CN200610134922A CN200610134922A CN101206992B CN 101206992 B CN101206992 B CN 101206992B CN 200610134922 A CN200610134922 A CN 200610134922A CN 200610134922 A CN200610134922 A CN 200610134922A CN 101206992 B CN101206992 B CN 101206992B
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Abstract
The invention relates to a semiconductor chip processing technology, in particular to an improved structure of a coating and developing processing technology and the equipment thereof which can save time. The coating and developing equipment comprises a coating unit, a developing unit, a heat disc unit, a cold disc unit, a pretreatment tackifying unit, a box station, a box station robot, a processing robot, an aligning unit and a chip box; wherein, a transmission mechanism and a clamping mechanism are additionally arranged between the heat disc unit and the cold disc unit, and are responsible for sending chips after being heated on the heat disc to the cold disc to cool off, the transmission by the processing robot is not required; therefore the times of using the processing robot is reduced, the whole processing transmission time is reduced, and the working efficiency of the coating and developing equipment is enhanced.
Description
Technical field
The present invention relates to processing technology of semiconductor wafer, specifically a kind of can time-saving even glue developing process process and the improvement structure of equipment.
Background technology
In the prior art, gel developer (TRACK) generally all is made up of even glue unit, developing cell, heat dish unit, cold dish unit, preliminary treatment tackify unit, box station, box station robot, technology robot, centering unit etc.Referring to Fig. 4-2, its processing step is: box station robot takes out wafer and delivers to the centering unit from the wafer case at box station, the technology robot delivers to preliminary treatment tackify unit with wafer, then wafer is delivered to the cold dish unit, the technology robot takes out wafer and delivers to even glue unit, take out again and deliver to heat dish unit, the technology robot takes out wafer and delivers to the cold dish unit then, take out again and send the centering unit back to, back box station robot sends wafer the wafer case at box station back to from the centering unit, finishes a processes process that gel developer is general.The efficient of gel developer can make a decision by the time of finishing above-mentioned processes process, short then efficient height of time, time is long, and then efficient is low, the whole time is by the processes time, wafer delivery time between each unit is formed, and the processes time is determined by technology, generally can not arbitrarily reduce, delivery time can be transmitted number of times and reduces the time by improving transfer rate and reducing, but it is general all by the processing technology decision to transmit number of times.In the general processing technology, the technology robot delivers to the cold dish unit by the taking-up of technology robot after all wafer can being delivered to heat dish unit again, and the technology robot takes out wafer again and delivers to other unit from the cold dish unit afterwards, causes process time longer.
Along with scientific and technological progress, the processing technology of wafer becomes increasingly complex, and the number of times of delivering in the processes process in heat dish, the cold dish is also increasing, and this will increase the access times to the technology robot, and operating efficiency will reduce.Quantity that generally can be by increasing the technology robot or increase the processes efficient that whole gel developer improves wafer.But technology robot and gel developer all compare expensive, and cost increases a lot when raising the efficiency.The technology robot that uses in wafer process of import is all at 20 to 300,000 yuans, and the gel developer of import is also wanted 200～5,000,000 yuans at 5,000,000 to 8,000,000 yuans with the home products of class.
Summary of the invention
The object of the invention be to provide a kind of can time-saving even glue developing process process and the improvement structure of equipment.
To achieve these goals, technical solution of the present invention is as follows:
Can time-saving even glue developing process process:
1) by box station robot wafer is taken out from the wafer case at box station and deliver to the centering unit, the technology robot delivers to preliminary treatment tackify unit with wafer, then wafer is delivered to successively cold dish unit, even glue unit, heat dish unit, by heat dish unit wafer is heated;
2) clamp wafer by the fixture between heat dish and the cold dish unit and under the drive of connecting gear wafer is delivered to the cold dish unit, clamper unclamps wafer, and the cold dish unit cools off wafer;
3) connecting gear is delivered to clamper heat dish unit again;
4) send the wafer taking-up back to the centering unit by the technology robot;
5) by box station robot wafer is sent back to the wafer case at box station from the centering unit at last, finishes whole processes process.
The improvement structure of gel developer: between heat dish unit and cold dish unit, add connecting gear and fixture; Described fixture is by clamper and gripper cylinder, and the working front edge of clamper has deep-slotted chip breaker, is used for holding chip, and gripper cylinder transmits seat and is installed together in order to the switching of control clamper in gripper cylinder and the connecting gear; Connecting gear is by base plate, transmission seat, transmission cylinder and guide rail, and described transmission seat is positioned on the slide block of guide rail, links to each other with gripper cylinder, and guide rail and base plate are affixed.
The present invention has following beneficial effect:
1. processing technology of the present invention adds clamping and connecting gear between heat dish and cold dish, the wafer of being responsible for delivering to after the heat dish heats is delivered to the cold dish cooling, and transmit without the technology robot, thereby can reduce the access times of technology robot, reduce the whole technology delivery time, improved the operating efficiency of gel developer.Available technology adopting technology robot transmits and to finish once the transmission of coiling cold dish from heat and need 10 seconds, then the technology delivery time will reduce 10 seconds to adopt the present invention, use 2 cover the present invention by every gel developer, can save altogether 20 seconds, need 240 seconds if a wafer is finished technological process, then can save for 8.3% time.
2. because the present invention has structurally added clamping and connecting gear, and not only simple in structure, cost is low, the more important thing is the quality time of saving into processing technology.
Description of drawings
Fig. 1 is an overall structure schematic diagram of the present invention.
Among the figure: 1-spares glue unit, 2-developing cell, 3-heat dish unit, 4-cold dish unit, 5-preliminary treatment tackify unit, 6-box station, 7-box station robot, 8-technology robot, 9-centering unit, 10-connecting gear, 11-fixture, 12-wafer case, 15-thimble.
Fig. 2-the 1st, preliminary treatment tackify unit takes out through the cold dish unit, even glue unit from delivering to wafer in the technology robot, delivers to the process condition of heat dish unit.
Fig. 2-the 2nd clamps the process condition that wafer heats wafer in heat dish unit by the fixture between heat dish and the cold dish unit.
Fig. 2-the 3rd clamps wafer is delivered to wafer the cold dish unit under the drive of connecting gear process condition by the fixture between heat dish and the cold dish unit.
Fig. 2-the 4th, fixture unclamp the process condition of wafer in the cold dish unit.
Fig. 2-the 5th, connecting gear deliver to fixture the process condition of heat dish unit again.
Fig. 3 is the present invention adds clamping and connecting gear between heat dish and cold dish an improvement structural representation.
Among the figure: 3-heat dish unit, 4-cold dish unit, 101-transmit seat, 102-transmits cylinder, 103-guide rail, 104 base plates, 111-clamper, 112-gripper cylinder.
Fig. 4-the 1st, the present invention can time-saving even glue developing process process flow chart.
Fig. 4-the 2nd, even glue developing process process flow chart in the prior art.
Fig. 5 is that the present invention adds the gel developer of clamping and connecting gear between heat dish and cold dish structure is always schemed.
Embodiment
Below in conjunction with drawings and Examples the present invention is described in detail.
Form by even glue unit 1, developing cell 2, heat dish unit 3, cold dish unit 4, preliminary treatment tackify unit 5, box station 6, box station robot 7, technology robot 8, centering unit 9, connecting gear 10, fixture 11, wafer case 12 etc. the structure (as Fig. 1) of the gel developer that the present invention adopts, but also can have all, but each unit can be at least one, promptly have a plurality of, as a plurality of even glue unit 1, a plurality of heat dishes unit 3, a plurality of cold dishes unit 4 etc.Require each element number of configuration according to different user and processing technology.
Present embodiment adds clamping and connecting gear between the heat dish of gel developer and cold dish, be used to finish wafer coils cold dish from heat transmission action.Fig. 1 is the basic configuration of the present invention.Concrete structure is referring to Fig. 1,3,5, glue unit 1 is spared in disposing that the present invention is basic, developing cell 2, heat dish unit 3, cold dish unit 4, preliminary treatment tackify unit 5, box station 6, box station robot 7, technology robot 8, centering unit 9, connecting gear 10, fixture 11, wafer case 12, gripper cylinder 13, transmit cylinder 14, thimble 13, guide rail 16 is formed, wherein 4 wafer case can be placed in the box station, heat dish unit 3 is two, cold dish unit 4 is two, for overlapping placement up and down, only draw and connecting gear among Fig. 3, one of each of the upper strata that fixture is relevant.Improvement part of the present invention is: add connecting gear and fixture between cold-heated plate unit, wherein fixture is by clamper 111 and gripper cylinder 112, the working front edge of clamper 111 has deep-slotted chip breaker, be used for holding chip, gripper cylinder 112 transmits seat 101 and is installed together in order to the switching of control clamper 111 in gripper cylinder 112 and the connecting gear; Connecting gear is by base plate 104, transmission seat 101, transmission cylinder 102 and guide rail 103, and described transmission seat 101 is positioned on the slide block of guide rail 103, links to each other with gripper cylinder 112, and guide rail 103 is affixed with base plate 104.15 is thimble among Fig. 3, plays buffering and lift action when receiving wafer.
Referring to Fig. 1,4-1, the processes process is: box station robot 7 takes out wafer and delivers to centering unit 9 from the wafer case 12 at box station 6, technology robot 8 delivers to preliminary treatment tackify unit 5 with wafer, then wafer is delivered to cold dish unit 4, technology robot 8 takes out wafer and delivers to even glue unit 1, take out from even glue unit 1 again and deliver to heat dish unit 3 (as accompanying drawing 2-1), by the 3 pairs of wafer heating in heat dish unit, then after the clamper between heat dish and the cold dish unit 111 clamps wafer (as Fig. 2-2), under the drive that transmits cylinder 102, wafer is delivered to cold dish unit 4 (as Fig. 2-3), clamper 111 unclamps wafer (as accompanying drawing 2-4), the 4 pairs of wafers in cold dish unit cool off, connecting gear 10 is delivered to clamper 111 heat dish unit 3 (as accompanying drawing 2-5) again, technology robot 8 takes out wafer and sends centering unit 9 back to then, back box station robot 7 sends wafer the wafer case at box station 6 back to from centering unit 9, finishes whole processes process.
The present invention adds clamping and connecting gear between the heat dish of gel developer and cold dish, played time-saving effect during finishing wafer coils cold dish from heat transmission action.
Claims (4)
1. even glue developing processing method, it is as follows to it is characterized in that having step:
1) by box station robot wafer is taken out from the wafer case at box station and deliver to the centering unit, the technology robot delivers to preliminary treatment tackify unit with wafer, then wafer is delivered to successively cold dish unit, even glue unit, heat dish unit, by heat dish unit wafer is heated;
2) clamp wafer by the fixture between heat dish and the cold dish unit and under the drive of connecting gear wafer is delivered to the cold dish unit, clamper unclamps wafer, and the cold dish unit cools off wafer;
3) connecting gear is delivered to clamper heat dish unit again;
4) send the wafer taking-up back to the centering unit by the technology robot;
5) by box station robot wafer is sent back to the wafer case at box station from the centering unit at last, finish whole processes process.
2. the structure of a gel developer comprises that even glue unit (1), developing cell (2), heat dish unit (3), cold dish unit (4), preliminary treatment tackify unit (5), box station (6), box station robot (7), technology robot (8), centering unit (9), wafer case (12) is characterized in that: add connecting gear (10) and fixture (11) between heat dish unit (3) and cold dish unit (4).
3. press the structure of the described gel developer of claim 2, its spy is: wherein said fixture is by clamper (111) and gripper cylinder (112), the working front edge of clamper (111) has deep-slotted chip breaker, be used for holding chip, gripper cylinder (112) transmits seat (101) and is installed together in order to the switching of control clamper (111) in gripper cylinder (112) and the connecting gear.
4. press the structure of the described gel developer of claim 2, its spy is: wherein said connecting gear is by base plate (104), transmission seat (101), transmission cylinder (102) and guide rail (103), described transmission seat (101) is positioned on the slide block of guide rail (103), link to each other with gripper cylinder (112), guide rail (103) is affixed with base plate (104).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200610134922A CN101206992B (en) | 2006-12-20 | 2006-12-20 | Even glue developing process capable of economizing time and equipment improved structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200610134922A CN101206992B (en) | 2006-12-20 | 2006-12-20 | Even glue developing process capable of economizing time and equipment improved structure |
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| Publication Number | Publication Date |
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| CN101206992A CN101206992A (en) | 2008-06-25 |
| CN101206992B true CN101206992B (en) | 2010-05-12 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103199032A (en) * | 2012-01-04 | 2013-07-10 | 沈阳芯源微电子设备有限公司 | Gelatinized developing device with clustered structure |
| CN104167377B (en) * | 2013-05-20 | 2017-07-04 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Pallet cooling device, method, loading chamber and semiconductor equipment |
| CN105319871B (en) * | 2014-05-30 | 2021-05-14 | 盛美半导体设备(上海)股份有限公司 | Developing device and method for semiconductor substrate |
| CN109817544B (en) * | 2017-11-20 | 2021-04-27 | 沈阳芯源微电子设备股份有限公司 | Heating and cooling composite disc device for semiconductor equipment |
| CN108648991B (en) * | 2018-05-29 | 2020-11-13 | 徐州诚凯知识产权服务有限公司 | Wafer photoetching process |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5766824A (en) * | 1993-07-16 | 1998-06-16 | Semiconductor Systems, Inc. | Method and apparatus for curing photoresist |
| CN1808275A (en) * | 2005-01-21 | 2006-07-26 | 东京毅力科创株式会社 | Coating and developing apparatus and coating and developing method |
| CN1815368A (en) * | 2005-02-01 | 2006-08-09 | 东京毅力科创株式会社 | Coating and developing apparatus |
| CN200997394Y (en) * | 2006-12-20 | 2007-12-26 | 沈阳芯源先进半导体技术有限公司 | Economizing improved structure of glue-homogenizing developer |
-
2006
- 2006-12-20 CN CN200610134922A patent/CN101206992B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5766824A (en) * | 1993-07-16 | 1998-06-16 | Semiconductor Systems, Inc. | Method and apparatus for curing photoresist |
| CN1808275A (en) * | 2005-01-21 | 2006-07-26 | 东京毅力科创株式会社 | Coating and developing apparatus and coating and developing method |
| CN1815368A (en) * | 2005-02-01 | 2006-08-09 | 东京毅力科创株式会社 | Coating and developing apparatus |
| CN200997394Y (en) * | 2006-12-20 | 2007-12-26 | 沈阳芯源先进半导体技术有限公司 | Economizing improved structure of glue-homogenizing developer |
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Address after: 110168 No. 16 Feiyun Road, Hunnan District, Shenyang City, Liaoning Province Patentee after: Shenyang Core Source Microelectronic Equipment Co., Ltd. Address before: 110168 No. 16 Feiyun Road, Hunnan New District, Shenyang City, Liaoning Province Patentee before: Shenyang Siayuan Electronic Equipment Co., Ltd. |
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