CN101204761A - Solder alloy and method for manufacturing same - Google Patents
Solder alloy and method for manufacturing same Download PDFInfo
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- CN101204761A CN101204761A CNA2008100025982A CN200810002598A CN101204761A CN 101204761 A CN101204761 A CN 101204761A CN A2008100025982 A CNA2008100025982 A CN A2008100025982A CN 200810002598 A CN200810002598 A CN 200810002598A CN 101204761 A CN101204761 A CN 101204761A
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 86
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 85
- 239000000956 alloy Substances 0.000 title claims abstract description 85
- 238000000034 method Methods 0.000 title claims abstract description 38
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 85
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 78
- 239000000463 material Substances 0.000 claims abstract description 32
- 239000002184 metal Substances 0.000 claims abstract description 16
- 229910052751 metal Inorganic materials 0.000 claims abstract description 16
- 230000004927 fusion Effects 0.000 claims description 27
- 239000003795 chemical substances by application Substances 0.000 claims description 16
- 239000000203 mixture Substances 0.000 claims description 14
- 238000002844 melting Methods 0.000 claims description 12
- 230000008018 melting Effects 0.000 claims description 12
- 238000004458 analytical method Methods 0.000 claims description 9
- 238000005266 casting Methods 0.000 claims description 6
- 239000000446 fuel Substances 0.000 claims description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 230000001105 regulatory effect Effects 0.000 claims description 2
- 238000005476 soldering Methods 0.000 abstract 5
- 238000012360 testing method Methods 0.000 description 77
- 239000010949 copper Substances 0.000 description 13
- 229910020220 Pb—Sn Inorganic materials 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 11
- 238000003466 welding Methods 0.000 description 11
- 229910000765 intermetallic Inorganic materials 0.000 description 9
- 238000005259 measurement Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 238000007792 addition Methods 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 229910020836 Sn-Ag Inorganic materials 0.000 description 4
- 229910020988 Sn—Ag Inorganic materials 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000002596 correlated effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 229910021386 carbon form Inorganic materials 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Crucibles And Fluidized-Bed Furnaces (AREA)
- Furnace Details (AREA)
- Powder Metallurgy (AREA)
- Manufacture Of Alloys Or Alloy Compounds (AREA)
Abstract
The present invention provides a solder alloy and method for preparing. The solder alloy of the invention is adding carbon to lead-free soldering material on the condition of the high temperature. The high temperature is ranged 800-1200 Celsius degree, the carbon volume of addition is in the range of 0.01-0.7wt.%. The steps of the preparing method comprise, firstly, the lead-free soldering material forming solder alloy is put in the metal furnace, then the metal furnace is heated to the hight temperature state that is 800-1200 Celsius degree, making the lead-free soldering material dissolve, the carbon is further added therein, the mixing artile then flows to the mold and being cooled and solided after being mixing. The invention resolve the problem that the bond strength of the pre-lead-free soldering material is inferior to the solder alloy containing PB, also provides a lead-free soldering material alloy with high reliability.
Description
Technical field
What the present invention relates to is solder alloy, is exactly by add the manufacture method that carbon obtains the new solder alloy and makes this solder alloy in the scolder raw material specifically.
Background technology
As everyone knows, former solder alloy is representative with the Pb-Sn solder alloy mainly, but because there is the problem of plumbous harmfulness in this solder alloy, can impact environment, and its use is restricted.
Therefore, require to use the leadless welding alloy that does not contain harmful lead now.Up to now, the existing multiple relevant scheme of leadless welding alloy of using proposes (with reference to patent documentation 1～5), its typical case's representative, as the Sn-Ag that contains 3.5%Ag among the Sn is solder alloy, this Sn-Ag is that the solder alloy fusing point is lower, has only 221 ℃, now as the leadless welding alloy extensive use.
Yet, using Sn-Ag is that solder alloy is with former solder containing pb alloy phase ratio, Sn-Ag is that solder alloy exists the low shortcoming of bond strength, therefore, consider from security standpoint, requiring high field in conjunction with reliability (such as automotive field etc.), unleaded scheme is pushed late, the general solder alloy that contains Pb that still uses.But in view of the influence to environment, which kind of field all should be realized unleaded as early as possible.For this reason, develop that to be better than or to be not less than the lead-free solder that contains the Pb solder alloy in conjunction with reliability be imperative.
[patent documentation 1] Japan Patent spy opens the 2007-237252 communique
[patent documentation 2] Japan Patent spy opens the 2006-255784 communique
[patent documentation 3] Japan Patent spy opens the 2002-346788 communique
[patent documentation 4] Japan Patent spy opens the 2001-225188 communique
[patent documentation 5] Japanese patent laid-open 10-6075 communique
Summary of the invention
In view of foregoing problem, promptly before the bond strength of leadless welding alloy be inferior to the problem that contains the Pb solder alloy, the objective of the invention is to address these problems, improve leadless welding alloy in conjunction with reliability.
In order to reach aforementioned purpose, the solder alloy of this invention obtains by add carbon in the lead-free solder material under hot conditions.
Hot conditions when aforementioned solder alloy is made is preferably in 800～1200 ℃ of scopes.
And the carbon amount that aforementioned solder alloy adds when making is 0.01～0.7wt.%.
In order to reach aforementioned purpose, thereby the solder alloy manufacture method of this invention is heated to the fusion operation that the condition of high temperature makes this lead-free solder material fusion by the metal melting furnace that will drop into the lead-free solder material, add the carbon operation what in the lead-free solder material (the lead-free solder material of fusion) of aforementioned fusion operation fusion, add the carbon agent, the lead-free solder material of fusion and the fusion lead-free solder material that adds the agitating procedure that the carbon agent stirs and allow aforementioned agitating procedure form flowed in the casting mould with the mixture that adds the carbon agent cool off, the refrigerating work procedure that solidifies constitutes.
Hot conditions in the aforementioned fusion operation is preferably in 800～1200 ℃ of scopes.
And preferably to make the oxygen content of metal melting furnace exhaust outlet by the quantity delivered of regulating heating fuel in the aforementioned fusion operation be 0.
And aforementioned adding, add the carbon agent and be preferably 0.01～0.7wt.% with respect to the content of lead-free solder material in the carbon operation.
And the manufacture method of aforementioned solder alloy also can be by the fusion after the aforementioned refrigerating work procedure cooled and solidified there not being the analysis procedure that lead content material and the mixture that adds the carbon agent carry out the carbon component analysis, thereby on the carbon amount basis that aforementioned analysis procedure obtains, aforementioned mixture dropped into once more and add no lead content material therein when fusing in the metal melting furnace carbon amount is adjusted to the adjustment operation of necessary degree, and the mixture that allows aforementioned adjustment operation adjust after the carbon amount flows into the composition of refrigerating work procedure once more that carries out cooled and solidified in the casting mould once more.
The solder alloy of this invention is by the unleaded influence of having eliminated poisonous lead to environment, and the leadless welding alloy bond strength before having solved simultaneously is inferior to the problem that contains the Pb solder alloy, increased substantially bond strength and in conjunction with reliability.
In addition, utilize the manufacture method of the solder alloy that the present invention relates to, can be simply and obtain the leadless welding alloy that bond strength significantly improves efficiently.
Description of drawings
Fig. 1 is the fusing point test result of Sn-3.5wt.%Ag+0.03wt.%C (test specimen A);
Fig. 2 is the fusing point test result of Sn-0.35wt.%Ag (test specimen B);
Fig. 3 is the fusing point test result of Sn-0.7wt.%Cu+0.05wt.%C (test specimen C);
Fig. 4 is the fusing point test result of Sn-0.7wt.%Cu (test specimen D);
Fig. 5 is the measurement result of the resistivity of Pb-Sn solder alloy and various test specimens;
Fig. 6 is the measurement result of the Vickers hardness of Pb-Sn solder alloy and various test specimens;
Fig. 7 and Fig. 8 are respectively the yield stress of Pb-Sn solder alloy and various test specimens and the measurement result of tensile strength.
The specific embodiment
Maximum characteristics of the present invention are to obtain solder alloy by add carbon in the lead-free solder material under hot conditions.Below will introduce example of the present invention, but the present invention is not limited in the following stated content.
The so-called hot conditions of the present invention is meant that temperature preferably is controlled at 800～1200 ℃.When adding carbon in the lead-free solder material, if temperature belongs to low temperature environment less than 800 ℃, the carbon piece just can not decompose so, thereby can not obtain desirable solder alloy.Therefore, must under hot environment, add carbon, especially in the time of 1200 ℃, can obtain desirable carbon form.Though also reaching good effect above under 1200 ℃ the hot environment, nonsensical, can increase fuel cost on the contrary.
The carbon amount of adding in the lead-free solder material is preferably in 0.01～0.7wt.% scope.If the carbon amount below 0.01wt.%, just can not obtain desired binding intensity.On the other hand, the carbon addition is many more, and the intensity of the solder alloy that is obtained, hardness are just high more.But to the mensuration of the solder alloy intensity of different carbon additions, the result shows: when the carbon addition reaches 0.7wt.%, just can satisfy the maximum intensity requirement in present various fields in this invention process.Therefore, the present invention is defined as 0.7wt.% with the upper limit of carbon addition.
In a word, should be in conjunction with intensity and definite carbon addition such as hardness and electrical conductivity of scolder purposes, needs.
Below the present invention will be described by actual example.The solder alloy that the present invention who adopts in the experiment is correlated with is Sn-3.5wt.%Ag+0.03wt.%C (test specimen A) and Sn-0.7wt.%Cu+0.05wt.%C (test specimen C).
(test example 1)
At first test specimen 1 and test specimen 2 are carried out two X-ray analyses mensuration, confirm the carbon peak value of the two.
(test example 2)
Surface by SEM viewing test sample compares test specimen A and the Sn-3.5wt.%Ag (test specimen B) that does not add carbon then, found that the former surface evenly, and the latter shows to exist to doubt and is the black object of carbon.In addition, in comparison, found same result with test specimen C and Sn-0.7wt.%Cu (test specimen D).Can judge with this: because the fusing point of the carbon temperature (800～1200 ℃) when making test specimen A and test specimen C, carbon be not embedded in the test specimen under the fusion state.
(test example 3)
Then utilize DSC to measure the fusing point of various test specimens.Measurement result such as Fig. 1～shown in Figure 4.
The fusing point test result of (test specimen A) Sn-3.5wt.%Ag+0.03wt.%C as shown in Figure 1; The fusing point test result of (test specimen B) Sn-0.35wt.%Ag as shown in Figure 2; The fusing point test result of (test specimen C) Sn-0.7wt.%Cu+0.05wt.%C as shown in Figure 3; The fusing point test result of (test specimen D) Sn-0.7wt.%Cu as shown in Figure 4.
As depicted in figs. 1 and 2, as seen the fusing point of comparative test sample A and test specimen B does not almost change.And as shown in Figure 3 and Figure 4, equally as seen the fusing point of comparative test sample C and test specimen D does not almost change.With this decidable: add the fusing point that carbon does not influence solder alloy.This just carbon under the state that does not have fusion, be present in reason among test specimen A and the test specimen C.That is to say: under the fusing point of test specimen A and test specimen C, carbon does not take place a bit to change, and therefore compares with the fusing point of test specimen D with test specimen B, does not change.
(experimental example 4)
In order to combine with electronic unit, the resistivity of solder alloy is an important factors, therefore the resistivity of Pb-Sn solder alloy and aforementioned various test specimens is measured, and measurement result as shown in Figure 5.
As shown in Figure 5, as the test specimen B and the test specimen D of leadless welding alloy, resistivity is lower than leaded Pb-Sn solder alloy, and the result is good.And added the test specimen A of carbon and the resistivity of test specimen C is greatly improved especially.Also can find from this figure: the effect of adding carbon in Sn-3.5wt.%Ag is the most obvious.By adding carbon the reason of resistivity reduction is: the intermetallic compound of the adsorbable scolder of carbon that surface area is bigger, thus the generation of inhibition intermetallic compound makes the sectionalization of metal phase simultaneously.The improvement of resistivity also helps the improvement of scolder overall permanence, we can say that therefore adding carbon has obtained very desirable effect.
(test example 5)
Then the Vickers hardness of Pb-Sn solder alloy and aforementioned various test specimens is measured, measurement result as shown in Figure 6.
As shown in Figure 6, comparative test sample A, test specimen B, test specimen C and test specimen D, as seen add carbon after hardness improve a lot.And with Pb-Sn solder alloy and test specimen A and test specimen C relatively, test specimen A and test specimen C are owing to added carbon, thereby hardness is higher than the Pb-Sn solder alloy.Cause this result's reason the same, thereby all be because the intermetallic compound of the bigger adsorbable scolder of carbon of surface area suppresses the generation of intermetallic compound, makes the cause of metal phase sectionalization simultaneously with the reduction of aforementioned resistivity.
(test example 6)
Usually, if solder alloy combines with copper base, the copper of substrate (Cu) can enter the solder alloy and the diffusion therein of separating because of hot melt, combines with solder alloy by alloying then.This alloy is called intermetallic compound (1MC) because its hardness, fragility and electrical conductivity are poor, will significantly reduce scolder in conjunction with reliability.If but do not have intermetallic compound, solder alloy just could not combine with substrate, therefore wishes that intermetallic compounds layer should be thin as far as possible, and could high strength bond.
By the SEM picture at viewing test sample A and copper base interface, can find that this interface is very fine and smooth, shape is even.Test specimen B is then different with the SEM picture at copper base interface, interface roughness, inhomogeneous, and have many rough shapes.As seen, B compares with test specimen, and the interfacial surface area between test specimen A and the copper base is bigger, in conjunction with more tight, firm.
In addition, by the enlarged image (mapping) of observing different interfaces, can clearly observe and utilize Cu that SEM can not see and the interface of Sn, and can read the mixed area of Cu and Sn, the material in this mixed area scope is exactly an intermetallic compound.B compares with test specimen, and the intermetallic compound area of test specimen A is bigger, as seen, has improved in conjunction with reliability by adding carbon.
(test example 7)
Also Pb-Sn solder alloy and all kinds of test specimen are carried out tension test in addition, measured the yield stress and the tensile strength of all kinds of solder alloys.Measurement result as shown in Figure 7 and Figure 8.
As shown in Figure 7 and Figure 8, test specimen A compares with test specimen B, and yield stress and the tensile strength of test specimen A all increase, and test specimen C compares with test specimen D, and yield stress and the tensile strength of test specimen C also increase.That is to say: the raising of yield stress and tensile strength is owing to add the result of carbon.Especially the tensile strength of test specimen A has surpassed the tensile strength of Pb-Sn solder alloy.
As previously mentioned, especially in conjunction with reliability, it is very effective to add carbon for the hardness of improving leadless welding alloy, tensile strength.
Make the method for the solder alloy that the present invention is correlated with according to implementing the example introduction by in the kupper solder material, adding carbon below.But scope involved in the present invention is not limited in these and implements example.
[enforcement example]
At first 96.5wt.%Sn-3wt.%Ag-0.5wt%Cu (being referred to as 305 alloys) lead-free solder material is dropped into metal melting furnace, this metal melting furnace is heated to 1000 ℃ high temperature, allow 305 alloys fusions (fusion operation).
At this moment, regulate the quantity delivered of heating fuel, making the exhaust outlet amount of oxygen of metal melting furnace is 0, allows fuel completing combustion.Otherwise will cause carbon burning, thereby reduce the efficient of adding carbon.
What then 0.5wt.% was added in 305 alloys (the fusing 305 alloys) lining of fusing in metal melting furnace in front fusion operation adds carbon agent (iron add carbon agent).(adding the carbon operation)
In metal melting furnace, stir fusion 305 alloys then and add the carbon agent, make it mix (agitating procedure).
Fusion 305 alloys after then the front agitating procedure being stirred flow into casting mould with the mixture that adds the carbon agent, make its cooling, solidify (refrigerating work procedure).
Fusion 305 alloys of its post analysis after the front refrigerating work procedure solidifies and the carbon element content that adds in the carbon agent composition.
On the basis of the carbon element content that the preceding paragraph analysis procedure obtains, aforementioned mixture dropped in the metal melting furnace once more fuse, simultaneously to wherein adding 305 alloys, carbon element content is adjusted to 0.1wt.% (adjustment operation) the most at last.
After preceding paragraph adjustment operation is adjusted carbon element content, once more mixture flowed into cooling in the casting mould, solidify (refrigerating work procedure once more).
Need only through above operation, added carbon in the lead-free solder material, the bond strength that has just solved former leadless welding alloy is inferior to the problem that contains the Pb solder alloy, just can produce in conjunction with the higher leadless welding alloy of reliability.
In this enforcement example, 305 alloys have been adopted in the lead-free solder material.But be not limited only to 305 alloys, such as also adopting 99.3wt.%Sn-0.7wt.%Cu.
In addition, in this enforcement example, temperature conditions is set at 1000 ℃, but is not limited only to 1000 ℃, as long as just can 800～1200 ℃ of scopes.
In this enforcement example, the carbon agent that adds of interpolation is 0.5wt.%, but is not limited only to 0.5wt.%, as long as just can in 0.01～0.7wt.% scope.
And in the adjustment operation in this enforcement example, carbon element content integral body is adjusted to 0.1wt.%, but be not limited only to 0.1wt.%, can suitably adjust carbon element content in conjunction with the final use of solder alloy.
But can utilize the field of the technology of the present invention thought all to be suitable for to matters this technological thought, the present invention is particularly useful in conjunction with the higher automotive field of reliability requirement etc., also has broad application prospects at other industrial circle.
Claims (9)
1. a solder alloy is characterized in that, makes by add carbon in the lead-free solder material under hot conditions.
2. solder alloy as claimed in claim 1 is characterized in that, described high temperature range is 800～1200 ℃.
3. as claim 1 or 2 described solder alloys, it is characterized in that the carbon addition is in 0.01～0.7wt.% scope.
4. the manufacture method of a solder alloy is characterized in that, described manufacture method comprises following operation:
The fusion operation: the metal melting furnace that has soon dropped into the lead-free solder material is heated to the condition of high temperature, makes this lead-free solder material fusion;
Add the carbon operation: promptly in the lead-free solder material of described fusion operation fusion, adding the carbon agent;
Agitating procedure: promptly be to the lead-free solder material of fusion and add the carbon agent and stir;
Refrigerating work procedure: promptly be that the fusion lead-free solder material that allows described agitating procedure form flows in the casting mould with the mixture that adds the carbon agent and cools off, solidifies.
5. the manufacture method of solder alloy as claimed in claim 4 is characterized in that, the high temperature range of described fusion operation is 800～1200 ℃.
6. as the manufacture method of claim 4 or 5 described solder alloys, it is characterized in that in the described fusion operation, by regulating the quantity delivered of heating fuel, the oxygen content that makes the metal melting furnace exhaust outlet is 0.
7. as the manufacture method of described any solder alloy of claim 4 to 6, it is characterized in that described adding in the carbon operation, adding the carbon agent is 0.01～0.7wt.% with respect to the content of lead-free solder material.
8. as the manufacture method of described any solder alloy of claim 4 to 7, it is characterized in that described manufacture method also comprises following operation:
Analysis procedure: promptly the fusion after the described refrigerating work procedure cooled and solidified is not had the lead content material and carry out the carbon component analysis with the mixture that adds the carbon agent;
Adjust operation: promptly on the carbon amount basis that described analysis procedure obtains, described mixture dropped in the metal melting furnace once more fuse, add no lead content material simultaneously therein, the carbon amount is adjusted to the degree of necessity;
Refrigerating work procedure once more: promptly be to allow described adjustment operation adjust mixture after the carbon amount flow in the casting mould once more and cool off, solidify.
9. solder alloy that the manufacture method of utilizing described any solder alloy of claim 4 to 8 is made.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007321086 | 2007-12-12 | ||
| JP2007321086 | 2007-12-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101204761A true CN101204761A (en) | 2008-06-25 |
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ID=39565355
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008100025982A Pending CN101204761A (en) | 2007-12-12 | 2008-01-10 | Solder alloy and method for manufacturing same |
| CN2008801202944A Expired - Fee Related CN101952080B (en) | 2007-12-12 | 2008-12-11 | Solder alloy and process for producing the same |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008801202944A Expired - Fee Related CN101952080B (en) | 2007-12-12 | 2008-12-11 | Solder alloy and process for producing the same |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20100296965A1 (en) |
| JP (1) | JP5408589B2 (en) |
| CN (2) | CN101204761A (en) |
| WO (1) | WO2009075314A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102625857A (en) * | 2009-09-07 | 2012-08-01 | 株式会社白金 | Copper alloy and method for producing same |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013018010A (en) * | 2011-07-07 | 2013-01-31 | Fuji Electric Co Ltd | Lead-free solder |
| CN102251140B (en) * | 2011-07-15 | 2012-10-03 | 广州先金新材料科技有限公司 | Gold-tin solder protective smelting method |
| WO2019017182A1 (en) * | 2017-07-21 | 2019-01-24 | 大豊工業株式会社 | Sliding member and sliding bearing |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4695428A (en) * | 1986-08-21 | 1987-09-22 | J. W. Harris Company | Solder composition |
| US5127969A (en) * | 1990-03-22 | 1992-07-07 | University Of Cincinnati | Reinforced solder, brazing and welding compositions and methods for preparation thereof |
| US5089356A (en) * | 1990-09-17 | 1992-02-18 | The Research Foundation Of State Univ. Of New York | Carbon fiber reinforced tin-lead alloy as a low thermal expansion solder preform |
| JP3226213B2 (en) * | 1996-10-17 | 2001-11-05 | 松下電器産業株式会社 | Solder material and electronic component using the same |
| CN1144649C (en) * | 1999-06-11 | 2004-04-07 | 日本板硝子株式会社 | Lead-free solder |
| US6805974B2 (en) * | 2002-02-15 | 2004-10-19 | International Business Machines Corporation | Lead-free tin-silver-copper alloy solder composition |
| JP4514581B2 (en) * | 2004-10-06 | 2010-07-28 | 忠正 藤村 | Lead-free solder composite powder and lead-free solder solder paste |
| JP2007237212A (en) * | 2006-03-07 | 2007-09-20 | Alps Electric Co Ltd | Solder adhesive and electronic component packaging structure using the solder adhesive |
-
2008
- 2008-01-10 CN CNA2008100025982A patent/CN101204761A/en active Pending
- 2008-12-11 US US12/735,038 patent/US20100296965A1/en not_active Abandoned
- 2008-12-11 WO PCT/JP2008/072480 patent/WO2009075314A1/en active Application Filing
- 2008-12-11 JP JP2009545442A patent/JP5408589B2/en not_active Expired - Fee Related
- 2008-12-11 CN CN2008801202944A patent/CN101952080B/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102625857A (en) * | 2009-09-07 | 2012-08-01 | 株式会社白金 | Copper alloy and method for producing same |
| RU2510420C2 (en) * | 2009-09-07 | 2014-03-27 | Сирогане Ко., Лтд. | Copper alloy and method of its production |
| CN102625857B (en) * | 2009-09-07 | 2014-12-31 | 株式会社白金 | Copper alloy and method for producing same |
| US9033023B2 (en) | 2009-09-07 | 2015-05-19 | Shirogane Co., Ltd. | Copper alloy and copper alloy manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2009075314A1 (en) | 2011-04-28 |
| CN101952080A (en) | 2011-01-19 |
| JP5408589B2 (en) | 2014-02-05 |
| US20100296965A1 (en) | 2010-11-25 |
| WO2009075314A1 (en) | 2009-06-18 |
| CN101952080B (en) | 2013-11-20 |
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