CN101191885B - 阵列式相机模组 - Google Patents

阵列式相机模组 Download PDF

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CN101191885B
CN101191885B CN2006101570347A CN200610157034A CN101191885B CN 101191885 B CN101191885 B CN 101191885B CN 2006101570347 A CN2006101570347 A CN 2006101570347A CN 200610157034 A CN200610157034 A CN 200610157034A CN 101191885 B CN101191885 B CN 101191885B
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light
lens
image sensor
camera module
transmission unit
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CN101191885A (zh
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冯琛
李铭
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Yangxin Technology Co ltd
Hongfujin Precision Industry Shenzhen Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14618Containers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/55Optical parts specially adapted for electronic image sensors; Mounting thereof
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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Abstract

本发明提供一种阵列式相机模组,其包括依次堆叠设置的一影像感测装置、一透镜组及一通光装置,以及一个与影像感测装置电性连接的信号处理模块;其中,该影像感测装置具有一基座和位于基座中央的感测区,该透镜组及通光装置对应该感测区设置,该透镜组包括多个透镜及用于固持并承载该多个透镜的承载装置,该多个透镜按一定规律呈阵列分布于承载装置;该通光装置上开设呈阵列分布的多个透明进光部;该承载装置及通光装置的面积基本相等,且多个容置孔及进光部的分布相同且分别相对应,信号处理模块处理来自影像感测装置的影像。该阵列式相机模组具有厚度较小的优点。

Description

阵列式相机模组
技术领域
本发明是关于一种相机模组,尤其是关于一种厚度较小的阵列式相机模组。
背景技术
随着多媒体技术的发展,数码相机、摄像机越来越为广大消费者青睐,随着数码相机、摄像机的逐渐普及,消费者对数码相机、摄像机越来越追求其小型化,随之平板式超薄数码相机成为一种潮流。
同时,人们也希望能够在移动电话上实现撷取物体影像的功能,且获得清晰画面,而由于便携式电子装置例如移动电话的轻薄短小、携带方便,需要设计及制造出能够方便安装于移动电话内的数码相机模组。因移动电话体积较小,故对安装于其内的数码相机模组的体积提出了更高的要求,即这种移动电话用的数码相机模组体积需更小、更薄。
然而,由于传统的镜头模组采用多个透镜叠加放置的方式,通常需要占用较大的高度,而仅仅通过减小相机、摄像机或便携式电子装置本身的体积,不能完全满足用户对设备厚度的需求。因此,降低镜头模组的厚度成为一种需要。
发明内容
针对上述问题,有必要提供一种厚度较小的阵列式相机模组。
一种阵列式相机模组,其包括依次堆叠设置的一影像感测装置、一透镜组及一通光装置,以及一个与影像感测装置电性连接的信号处理模块;其中,该影像感测装置具有一基座和位于基座中央的感测区,该透镜组及通光装置对应该感测区设置,该透镜组包括多个透镜及用于固持并承载该多个透镜的承载装置,该多个透镜按一定规律呈阵列分布于承载装置;该通光装置上开设呈阵列分布的多个透明进光部;该承载装置及通光装置的面积基本相等,且多个容置孔及进光部的分布相同且分别相对应,信号处理模块处理来自影像感测装置的影像。
相较于现有技术,所述阵列式相机模组通过将透镜以阵列式分布,显著降低了相机模组的厚度。
附图说明
图1是本发明较佳实施方式的阵列式相机模组的组装示意图。
图2是本发明较佳实施方式的阵列式相机模组的分解示意图。
具体实施方式
请参阅图1及图2所示,本发明较佳实施方式的阵列式相机模组100包括自下而上依次堆叠设置的一影像感测装置10、一间隔装置12、一透镜组14及一通光装置16,以及与影像感测装置10电性连接的信号处理模块。
该影像感测装置10为一CMOS(Complementary Metal Oxide Semiconductor)影像感测器或CCD(Charge Coupled Device)影像感测器,其包括基座102及位于该基座102中央的感测区104。
该间隔装置12由一形状及大小分别与感测区104相同或大致相同的薄板加工而成,其上设有呈阵列分布的多个通光孔120,且该多个通光孔120均为通孔。为避免相邻通光孔120之间的连接部分对该阵列式相机模组100的光学性能造成影响,该多个通光孔120的一端开口较大,从而通光孔120横截面为梯形,相邻通光孔120开口较大一端的距离几乎为零。
该透镜组14包括多个透镜140及用于固持并承载该多个透镜140的一承载装置142。其中,该透镜140为球面或非球面的光学镜片;该承载装置142为一薄板,其上开设多个容置孔(图未标),该多个容置孔按一定规律呈阵列分布于承载装置142,且均为与透镜140大小相配合的通孔;该容置孔用于容置并固持透镜140,当透镜140置于该容置孔中,透镜140的光学性能不受影响。
该通光装置16为一薄板加工而成,其上开设呈阵列分布的多个进光部160,该多个进光部160为一喇叭状圆孔,其一端开口直径与镜片140的光学部分直径相当,另一端开口直径稍大。该多个进光部160也可以为透明材料制成,外界光线可通过该进光部160进入相机镜头。
所述间隔装置12、承载装置142及通光装置16的面积相等或基本相等,且所述通光孔120、容置孔及进光部160的分布相同,通光孔120的面积稍大于进光部160的面积,以使更多的光线进入。当通光装置16、透镜组14及间隔装置12堆叠放置时,通光装置16上进光部160开口较大的一侧向上,间隔装置16上通光孔120开口较大的一侧向下,通光孔120、固持于容置孔的透镜140及进光部160分别对应,且通光装置16与间隔装置12正对影像感测装置10的感测区104放置,从而从外界进入的光线可以透过透镜140射入影像感测装置10。影像感测装置10将来自多个透镜140的影像发送至信号处理模块,然后信号处理模块对该影像进行处理并合成为一体,形成一个完整的影像。
此外,所述各个进光部160及透镜140可以稍微偏置地对应所述通光孔120,以覆盖不同的视场。所述间隔装置12、承载装置142及通光装置16均可由塑胶材料制成,三者可通过环氧树脂粘合组装。所述透镜140可与承载装置142一体成型,从而可以省略承载装置142上的容置孔。可以理解,间隔装置12可以省略,承载装置142的厚度大于透镜140的厚度,而由透镜组14直接对应于感测区104即可。
综上所述,所述阵列式相机模组100通过将透镜140阵列式分布,与传统相机镜头中多层透镜结构相比,本发明显著降低了相机模组的厚度。

Claims (6)

1.一种阵列式相机模组,其包括依次堆叠设置的一影像感测装置、一透镜组及一通光装置,以及一个与影像感测装置电性连接的信号处理模块;其中,该影像感测装置具有一基座和位于基座中央的感测区,该透镜组及通光装置对应该感测区设置,该透镜组包括多个透镜及用于固持并承载该多个透镜的承载装置,所述承载装置上开设多个用于容置并固持镜片的容置孔,其特征在于:该多个透镜按一定规律呈阵列分布于承载装置;该通光装置上开设呈阵列分布的多个透明进光部;该承载装置及通光装置的面积基本相等,且多个容置孔及进光部的分布相同且分别相对应,信号处理模块处理来自影像感测装置的影像;该阵列式相机模组还包括设置于影像感测装置和透镜组之间的间隔装置,该间隔装置、承载装置及通光装置的面积基本相等,该间隔装置上设有呈阵列分布的多个通光孔,且该多个通光孔、容置孔及进光部的分布相同且分别相对应,所述多个通光孔的一端开口较大,通光孔的横截面为梯形,相邻通光孔开口较大一端的距离几乎为零,所述进光部为一喇叭状圆孔,其一端开口直径与镜片的光学部分直径相当,另一端开口直径稍大,当通光装置、透镜组及间隔装置堆叠放置时,通光装置上进光部开口较大的一侧向上,间隔装置上通光孔开口较大的一侧向下,通光孔、固持于容置孔的透镜及进光部分别对应,且通光装置与间隔装置正对影像感测装置的感测区放置,从而从外界进入的光线可以透过透镜射入影像感测装置。
2.如权利要求1所述的阵列式相机模组,其特征在于:所述间隔装置的形状及大小分别与感测区大致相同。
3.如权利要求1所述的阵列式相机模组,其特征在于:所述各个进光部及透镜稍微偏置地对应通光孔。
4.如权利要求1所述的阵列式相机模组,其特征在于:所述影像感测装置为CMOS影像感测器或CCD影像感测器。
5.如权利要求1所述的阵列式相机模组,其特征在于:所述透镜与承载装置一体成型。
6.如权利要求1所述的阵列式相机模组,其特征在于:所述多个进光部为透明材料制成,外界光线可通过该进光部进入。
CN2006101570347A 2006-11-24 2006-11-24 阵列式相机模组 Expired - Fee Related CN101191885B (zh)

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CN101598844B (zh) * 2008-06-05 2011-11-30 鸿富锦精密工业(深圳)有限公司 相机模组
CN101852908B (zh) * 2009-03-30 2013-03-27 鸿富锦精密工业(深圳)有限公司 晶圆级镜头模组阵列
US8629389B2 (en) * 2009-07-29 2014-01-14 Geoffrey Louis Barrows Low profile camera and vision sensor
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CN102131043B (zh) * 2010-01-19 2013-11-06 鸿富锦精密工业(深圳)有限公司 相机模组
CN102790849A (zh) * 2011-05-20 2012-11-21 英属开曼群岛商恒景科技股份有限公司 图像传感器模块
CN103822770A (zh) * 2012-11-16 2014-05-28 鸿富锦精密工业(深圳)有限公司 摔落测试装置
CN103905713B (zh) * 2012-12-26 2018-02-27 联想(北京)有限公司 控制方法、控制装置和电子设备
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CN106027861B (zh) * 2016-05-23 2019-06-04 西北工业大学 基于微相机阵列的光场采集装置及数据处理方法
US20180131859A1 (en) * 2016-11-10 2018-05-10 Shafagh Bayat Thin Film Camera
TWI600321B (zh) * 2016-12-13 2017-09-21 財團法人工業技術研究院 複合陣列相機鏡頭模組
CN107450149A (zh) * 2017-08-31 2017-12-08 赣州光联电子科技有限公司 一种透镜安装固定装置及安装固定方法
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